JPH07112285A - Laser beam mask marker - Google Patents

Abstract

PURPOSE:To provide the laser beam mask marker capable of marking different pictures at the same time, respectively on one work or plural works at the higher speed with high accuracy. CONSTITUTION:In the laser beam mask marker which marks a picture on the work surface 13 by raster-irradiating a picture plane 82 of a liquid-crystal mask 8 with a laser beam L1 from a laser beam oscillator 1 and irradiating the work surface 13 with its transmitted laser beam L2, a laser beam absorber 81 is provided on a frame plane of the upstream beam side picture plane 82 of the liquid-crystal mask 8 and optical path deflection means which deflects a laser beam irradiation optical path at any time from the picture plane 82 to the laser beam absorber 81 and further, from the laser beam absorber 81 to the picture plane 82 is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser mask marker for marking a product number, a manufacturing date, a lot number, a serial number, etc. on a product thereof in a semiconductor manufacturing industry at high speed and with high accuracy, and particularly to one or The present invention relates to a laser mask marker suitable for marking different images on a plurality of works at the same time.

[0002]

2. Description of the Related Art Heretofore, attention has been paid to the high energy density of a laser beam, the translucency of a liquid crystal mask, and the high-speed controllability thereof, and laser light from a laser oscillator is raster-irradiated to the image surface of the liquid crystal mask. There is a laser mask marker that irradiates the surface of the work with a transmitted laser beam with high accuracy to mark the image in units of several tens of milliseconds (see Japanese Patent Laid-Open No. 42379/1993). This is a YAG laser oscillator with a Q switch, a first deflector that deflects the laser light from the YAG laser oscillator at high speed so that the laser light is raster-irradiated to the image plane of the liquid crystal mask, and an image for marking is displayed. Liquid crystal mask, and a second deflector that deflects the transmitted laser light so that the laser light transmitted through the liquid crystal mask (that is, containing image information) is applied to a predetermined portion of the surface of the work to mark the image. And the work feeder that conveys the works one after another to the marking position and that carries out after the marking is completed, and these controls (Q switch control, the first deflector and the second deflector) that are electrically connected to these drive systems. It is composed of a deflector and a work feeder, and a controller for synchronizing the liquid crystal mask image display control). still,
The Q switch control densifies the laser light during laser light oscillation, and also performs laser oscillation during work transfer that does not require laser irradiation, when changing the display image on the liquid crystal mask, and during waiting times such as emergencies. Controlling the stop (or weakening the energy density of the laser light below the threshold for marking the work).

[0003]

Recently, laser mask markers are required to have high-speed and highly accurate marking performance. The above-mentioned conventional YAG laser mask marker itself has these performances well, but each component is specified, and
Since the optimum operation programs for these elements are also fixed, it is naturally difficult to expect higher performance.

In particular, the above-mentioned conventional YAG laser mask marker has a drawback that different images cannot be simultaneously printed on one or a plurality of works. That is, the laser light from the YAG laser oscillator is dispersed, and a plurality of mark parts (each mark part is composed of a liquid crystal mask, a first deflector, a second deflector, a work feeder, a controller, etc.) are used. As described above, even if different images are printed on one or a plurality of works at the same time, the Q switch control of the YAG laser oscillator is controlled only for one mark part, and therefore each mark part is controlled. Cannot be marked except in the true identical condition (for example, the condition that the same image is marked on one or a plurality of works at the same time, that is, the condition that there is no difference in the identity between the mark parts). This is because, in reality, such an exact same state is impossible. That is, in such a case, according to the conventional YAG laser mask marker described above, when trying to mark different images on one or a plurality of works at the same time, the same number of YAG laser mask markers as the number of markings are required. This is an economic disadvantage, such as an increase in installation location and cost.

The present invention has been made in view of the above problems of the prior art.
It is an object of the present invention to provide a laser mask marker that can print different images on one or a plurality of works at the same time with higher speed and higher accuracy.

[0006]

In order to achieve the above object, a laser mask marker according to the present invention will be described with reference to FIG. 1. Laser light L1 from a laser oscillator 1 is applied to an image plane of a liquid crystal mask 8. In the laser mask marker for marking the image on the work surface 13 by irradiating the work surface 13 with the laser light L2 radiated to the raster 82, the frame surface of the image surface 82 on the upstream light side of the liquid crystal mask 8 A laser light absorber 81 is provided on the
From the laser light absorber 81 to the laser light absorber 81
From the image plane 82 to the image plane 82, an optical path deflecting means for deflecting the laser irradiation optical path at a proper time is provided.

In order to mark different images on one or a plurality of works at the same time, the main part of the first structure can be used as follows. That is, referring to FIG. 4, the laser light L1 from one laser oscillator 1 is dispersed, and each image plane 82 of the plurality of liquid crystal masks 8 is raster-irradiated, and each transmitted laser light L2 is transmitted. By irradiating at least one work surface 13, the work surface 13
In the laser mask marker for engraving each of the above images,
The laser light absorber 81 is provided on the frame surface of the upstream light side image surface 82 of each liquid crystal mask 8, and each image surface 82
From the laser light absorber 81 to the laser light absorber 81, and from the laser light absorber 81 to the image surface 82, the laser mask marker is configured to appropriately deflect the laser irradiation optical paths.

In the above-mentioned first structure or second structure,
The laser light absorber 81 may be a laser light scattering reflector.

In order to achieve the above object, the laser mask marker according to the present invention will be described with reference to FIG.
In the laser mask marker for marking the image on the work surface 13 by irradiating the work surface 13 with the transmitted laser light L2, the laser light shield 20 is provided in the irradiation light path of the laser light L1. In addition to the provision, the configuration may be such that a shading device control means for driving the laser shading device 20 at a proper time is provided.

In order to mark different images on one or a plurality of works at the same time, the above-mentioned structure can also be structured by using the main part thereof. That is, referring to FIG. 8, the laser light L1 from one laser oscillator 1 will be described.
By irradiating each of the image surfaces 82 of the liquid crystal masks 8 with each other and irradiating each of the transmitted laser beams L2 to at least one work surface 13,
In the laser mask marker for engraving each of the above images,
This is a laser mask marker having a configuration in which a laser light shield 20 is provided in the irradiation light path of each laser light L1 and a light shield control means for driving each laser light shield 20 at a proper time is provided.

[0011]

According to the first structure, the laser light absorber 81 absorbs the emitted laser light. The optical path deflecting means causes the laser light L1 to be raster-irradiated from the image surface 82 to the laser light absorber 81 at a suitable time, for example, at the start of the waiting time, and at the end of the waiting time, the laser light L1 is emitted from the laser light absorber 81 to the image surface. 82 is raster-irradiated. That is, the irradiation optical path is deflected.

According to the second configuration, one laser oscillator 1
The laser light L1 from is split into the number of mark portions. Each laser light absorber 81 absorbs each laser light with which they are irradiated. The optical path deflecting means is independent for each mark part,
At an appropriate time, for example, at the start of a waiting time peculiar to a mark portion, the laser light L1 is emitted from the image surface 82 to the laser light absorber 8
1 is raster-irradiated, and at the end of the waiting time peculiar to each mark portion, the laser light L1 is raster-irradiated from the laser light absorber 81 to the image surface 82.

According to the third structure, in the case of the first structure, the laser light scattering reflector 81 scatters and reflects the laser light irradiated thereon, and in the case of the second structure, each laser light scattering reflector 8 is provided.
Reference numeral 1 scatters and reflects each laser beam individually irradiated.

According to the fourth configuration, the light shield control means drives the laser light shield 20 at a suitable time, for example, at the start of the waiting time to cut off the optical path of the laser L1 to the liquid crystal mask 8,
At the end of the waiting time, the laser light shield 20 is driven and opened, and the liquid crystal mask 8 is irradiated with the laser light L1.

According to the fifth configuration, one laser oscillator 1
The laser light L1 from is split into the number of mark portions. The light-shielding device control means is independently timely for each mark portion, that is,
At the start of the waiting time peculiar to each mark portion, the laser light shield 20 is driven to shut off the laser beam to the liquid crystal mask 8, and at the end of the waiting time peculiar to each mark portion, the laser light shield 20 is driven. The liquid crystal mask 8 is irradiated with the laser light L1.

[0016]

The most preferred embodiment of the present invention will be described below.
In addition, in order to simplify the description, the same reference numerals are given to the same constituent members in the respective drawings, and duplicate description will be omitted.

FIG. 1 shows a first embodiment. First, the overall configuration will be described. The laser beam L1 from the YAG laser oscillator 1 with a Q switch is condensed by the beam expander 5 and is applied to the galvano scanner mirror 6Y. Then, the light is reflected here, is condensed and deflected by the lens 7, and is irradiated onto the polygon mirror 6X which is rotating at a constant speed and a high speed. Then, the light is reflected here and is irradiated onto the image surface 82 of the liquid crystal mask 8. As described above with reference to FIG. 2, the rotation of the polygon mirror 6X causes the laser beam Lr (= L1) to be deflected to the scanning line (X direction) at high speed. When the galvano scanner mirror 6Y is rotated by a fine movement angle in this state, the scanning line of the irradiation target by the polygon mirror 6X shifts to the scanning line of the next row (Y direction, that is, line feed). Thus, raster irradiation is to irradiate the entire image surface 82 in the XY directions. The first deflector described in the above-mentioned conventional YAG laser mask marker refers to the Galvano scanner mirror 6Y and the polygon mirror 6X in a narrow sense.
In a broad sense, all of the components that contribute to the raster irradiation are, for example, the beam expander 5, the lens 7, the galvano-scanner mirror 6Y, the polygon mirror 6X, the controller 17 described later, and the program related to the raster irradiation. Next, the laser light L2 that has passed through the image surface 82 of the liquid crystal mask 8 is condensed by the lens 9 and is applied to the galvano scanner mirror 10. It is reflected here, and is collectively deflected by the lens 11,
It is deflected again by the lens 12 and irradiated on the work surface 13 on the work feeder 15. In the above, the galvano scanner mirror 10 and the lens 12 irradiate the laser beam L2 to the optimum marking area on the work surface 13. The second deflector described in the YAG laser mask marker of the prior art refers to the galvanometer scanner mirror 10 and the lens 12 in a narrow sense, but in a broad sense, the irradiation optical path of the laser beam L2 is appropriately changed. For example, the lens 11, the galvano-scanner mirror 10, the lens 12, and the controller 1 described later
7 and programs related to changing the irradiation area. Next, the controller 17 will be described in detail. Signal lines S1 to S8 and S11 are connected to the controller 17. The signal line S1 outputs a drive and stop signal for line feed to the Galvano scanner mirror 6Y of the first deflector and origin return (return to the laser absorber direction described later), and the signal line S2 is the position sensor 1
The work position signal from 6 is input, the signal line S3 outputs the drive and stop signals to the work feeder drive motor 14, and the signal line S4 mainly outputs the drive and stop signals to the lens 12 of the second deflector, The signal line S5 mainly outputs drive and stop signals to the galvanometer scanner mirror 10 of the second deflector, the signal line S6 outputs an image display and erase or switching signal to the liquid crystal mask 8, and the signal line S7 is the first. Mainly applies the rotation and stop signals to the polygon mirror 6X of the deflector, and outputs the signal line S8.
Inputs and outputs various commands to and from the external terminal 18, and the signal line S1
1 is a laser start / stop signal to the YAG laser mask marker and Q
The switch signal is being output. That is, with the above configuration,
The image plane 82 of the liquid crystal mask 8 is raster-irradiated with the laser beam L1 from the laser oscillator 1, and the work surface 13 is irradiated with the transmitted laser beam L2 to mark the image on the work surface 13.

By the way, in the first embodiment, a laser light absorber 81, for example, a colored ceramic is provided on the upper frame surface in the figure of the outer peripheral frame of the image surface 82 on the incident side of the laser light L1 of the liquid crystal mask 8. The “upper frame surface” here is the “upper frame” in the figure, but to be exact, it is the “outer peripheral frame surface of the liquid crystal mask 8” along the scanning line of the first row at the time of raster irradiation. Frame surface "
Refers to. The laser light absorber 81 has, as a light receiving surface, a length corresponding to the scanning line width and a width corresponding to the beam diameter of the laser light L1. Laser light absorber 8 on the upper frame
1 is provided because it is closest to the origin (that is, the scanning line in the first row) in raster irradiation. The controller 17 then controls the first deflector from the image plane 82 to the laser beam absorber 81 and from the laser beam absorber 81 to the image plane 82.
The laser irradiation optical path is deflected in a timely manner, for example, when the work is transported without laser irradiation. That is, in this embodiment, the controller 17 and the first deflectors 6X and 6Y.
And the hardware including the signal lines S1 and S7, and the liquid crystal mask 8
The optical path deflecting means is constituted by a software program for executing the above-mentioned deflection operation during the waiting time or the like.

Next, the operation of the first embodiment will be described. First, the overall configuration will be described. The controller 17 divides the whole image to be marked on the work surface 13 into a plurality of images in advance and stores the divided images, and sequentially displays each divided image on the liquid crystal mask 8.
By irradiating the laser beam L1 each time and irradiating the optimum area on the work surface 13 with the second deflector, the whole image is synthesized and imprinted on the work surface 13.

The details will be described with reference to the flowchart example of FIG. The controller 17 inputs and stores the entire image as dot information of 0 and 1 in a predetermined address group of the main memory (1). Next, the whole image information is divided into a plurality of divided image information (2). Next step (10b), (10
According to a) and (8), the work is previously in the marking position, the second deflector faces the marking direction of the first marking division image, and
The Galvano scanner mirror 6Y of the first deflector faces the laser beam absorber 81 and is in a fixed state (3). Next, the laser beam L1 is oscillated and the polygon mirror 6X of the first deflector is rotated (4). Next, the first divided image information for marking is extracted into the temporary memory (5) and displayed on the image surface 82 of the liquid crystal mask 8 (6). Here, the galvano-scanner mirror 6Y of the first deflector is driven to irradiate the image surface with the laser beam L1 in a raster manner, thereby marking the divided image on the region of the work surface 13 defined by the second deflector. Yes (7). When the raster irradiation is completed, the galvano-scanner mirror 6Y of the first deflector is moved to the laser absorber 8 again.
Fix in the direction of 1 (8). Next, the next divided image for marking is extracted, the temporary memory is rewritten with this divided image, and the second deflector is fixed in the marking direction of the divided image on the work (10b). Thereafter, the above steps (6) to (10b) are repeated until all the divided images are combined and stamped on the predetermined area of the work surface 13. When the composite marking of the entire image is completed, the second deflector is fixed in the marking direction of the first divided image for marking (10a). If there is a next work, the work feeder 13 is driven to convey and fix the next work to the marking position (11b). When there is no next work, not only laser oscillation but also each drive system is stopped (11a). As described above, the galvano-scanner mirror 6Y of the first deflector is the laser absorber during the waiting time such as when changing the marking division image on the liquid crystal mask 8, when transferring the work, and during the waiting time such as an emergency although not described in the above flow. It has stopped in the direction 81. Even during this stop, since the polygon mirror 6X is rotating and the laser beam L1 is oscillating, as shown in FIGS. 1 and 2, the laser absorber 81 is raster-irradiated in the X direction. Has been done.

Next, the effect of the first embodiment will be described. First
The embodiment uses a YAG laser with a Q switch, but this Q switch control operates during the waiting time to increase the density and pulse the laser light. This is a completely different point compared to the conventional YAG laser mask marker. That is, in the conventional YAG laser mask marker, in order to maintain high speed and high accuracy, the synchronous control of the first deflector and the Q switch during the waiting time can be performed programmatically or mechanically (mechanical response of each element). However, according to the above-mentioned embodiment, since this synchronous control is eliminated, it is easier (that is, faster,
In addition, it is possible to engrave with high accuracy.

Items of other aspects relating to the first embodiment will be listed. (1) The laser oscillator is not limited to the YAG laser oscillator with a Q switch, and may be a CW oscillation laser or a pulse oscillation laser.

(2) The second deflector may be omitted. The second deflector of the first embodiment is for compositely marking the divided images on the surface of the work, and the laser mask marker is such that the marking is completed only by marking one image of the liquid crystal mask 8 on the work surface 13. Then, the second deflector is not necessary (of course, the operation flow in such an example of the mode is as shown in FIG.
Needless to say, it is completely different from the flowchart in. Incidentally, in the laser mask marker that does not irradiate the image plane 82 with the laser light L1 in a raster manner, the first mask deflector for raster irradiation is not necessary at all (however, a simple deflector for collective irradiation is required. However, in this case, the laser light absorber 81 needs to have a large area corresponding to at least the image surface 82 (that is, it is disadvantageous in terms of area). Further, raster irradiation is intermittent irradiation to the same place, but batch irradiation is continuous irradiation to the same place, so there is a disadvantage that the heat load of the laser light absorber 81 becomes severe. By the way, in the case of the raster irradiation, the thermal load on the laser light absorber 81 is increased by widening the laser light absorber 81 and driving the Galvano scanner mirror 6Y of the first deflector in a plurality of stages within this width. May be smaller.

(3) The laser light absorber 81 may be a laser light scattering reflector. Note that these need not be limited to being provided on the upper frame surface of the image surface 82 as in the first embodiment, and may be provided on the upper, lower, left, and right frame surfaces (that is, the entire surface) in the drawing, for example. This is because the laser beam Lr (= L1) at the time of line feed in the raster irradiation is shown in an enlarged manner in FIG.
This is because it is difficult to irradiate the right and left frames without irradiating only the lower frame, as shown by the dotted lines of the left and right frames in FIG. Incidentally, regardless of the first
In the embodiment, the laser light absorber 81 is provided only on the upper frame surface compared to the upper frame surface which is irradiated with the laser beam Lw (= L1) during the waiting time. This is because the frame surface and the lower frame have few opportunities for laser irradiation, that is, the heat load is small. Of course, the laser light absorber 81 or the laser light scattering reflector 81 can be provided not only on the frame surface of the liquid crystal mask 8 but also on a supporting member or the like separately provided at another position close to the laser light path. It will be uneconomical.

Next, a second embodiment will be described with reference to FIG. This is to enable different images to be stamped on a plurality of works at the same time without changing the main configuration of the first embodiment. Note that, as described above, in the same figure, the same components as those in the previous figure are designated by the same reference numerals, and a duplicate description will be omitted.

In the second embodiment, two mark portions A1 corresponding to the liquid crystal mask, the first deflector, the second deflector, the work feeder and the controller (hereinafter referred to as mark portions) of the first embodiment are provided. , A2, one laser oscillating section B is connected by optical fibers 4 and 4. Laser oscillator B
Is composed of a YAG laser oscillator 1 with a Q switch, an optical shaper 2, a beam splitter 3, and a controller 19. That is, the laser light Lo from one laser oscillator 1 with a Q switch is shaped into a shape that is easily incident on the optical fibers 4 and 4 by the optical shaper 2, and then is split by the beam splitter 3 to form each optical fiber 4. 4 and through these, the beams enter the beam expanders 5 and 5 of the marks A1 and A2. After that, the route to the work surfaces 13 and 13 is the same as that shown in the first embodiment. Of course, the operation flow is not different from the flow of FIG. 3 described above, but there are some changes in the hardware aspect in charge of the operation. That is, the additional controller 1
Reference numeral 9 denotes communication lines S9 and S9 for the controllers 17 and 17 for the marks A1 and A2, and a signal line S10 for the YAG laser oscillator 1 with a Q switch, which is replaced by the signal line S11 of the first embodiment. Are connected with each controller 17, 1
Laser oscillation is performed when a laser oscillation signal is input from any one of 7 and laser stop is performed when a laser stop signal is input from both controllers 17, 17.
In addition, Q switch control for pulse oscillation is performed.

In the second embodiment shown in FIG. 4, the mark portion A1 is used for marking, that is, the laser light L1 is applied to the image surface 82 in a raster manner, while the mark portion A2 is used for waiting time. That is, the laser irradiation of the laser light absorber 81 of the laser L2 is shown. That is, according to the second embodiment, as described above, different images can be stamped on a plurality of works at the same time without changing the main configuration of the first embodiment.

Another aspect of the second embodiment will be described. For example, by sharing the work feeder 15 (that is, one work) and further deflecting the second deflector of either one of the mark portions A1 and A2,
It is possible to irradiate and mark two workpieces with two identical or different images. As another mode example, the number of mark portions A is not limited to two. Further, the other mode examples (1), (2) and (3) according to the first embodiment can be applied as they are.

According to the above, higher speed, higher accuracy,
Further, different images can be stamped on one or a plurality of works at the same time.

Next, a third embodiment will be described with reference to FIG. As described above, in the same figure, the same components as those in the previous figure are designated by the same reference numerals, and the duplicated description will be omitted.

In the third embodiment, the laser beam L1 is used during the waiting time.
Is raster-irradiated to the laser light absorber 81 (that is,
It is said that the laser light L1 is diverted from the image plane 82).
Unlike the embodiment (and the second embodiment), the laser light shield 20 provided in the irradiation optical path of the laser light L1 blocks the laser light L1 from the root. Therefore, as a configuration,
In addition to the laser shading device 20, it is necessary to provide a shading device control means for driving the laser shading device 20 in a timely manner (that is, mainly during waiting time). That is, according to this embodiment, it is possible to obtain the same final effect as that of the first embodiment. As shown in FIG. 6, the laser light L1 being engraved irradiates the entire image surface except the laser light L1 which is out of the image surface at the time of line feed, as in the irradiation laser light Lr in FIG.

In the above, the laser light shield 20 is composed of, for example, a light shield plate having the same material as the laser light scattering reflector 81 of the first embodiment, and a motor or the like for rotating or rotating the light shield plate. The light shield control means includes a hardware surface including a signal line S12 that outputs a drive and stop signal to the motor and a controller 17, and steps (3), (61) and (8) in the flowchart of FIG. And a soft surface of the laser shading device, the laser shading device 20 is driven and the laser optical path is shut off during a waiting time or the like based on a synchronization signal from the shading device control means. The flowchart of FIG. 7 differs from the flowchart of FIG. 3 in that the steps (3), (61), and (8) and the operation (4) of the galvanometer scanner mirror 6Y of the first deflector are performed. Apart from being different, these are not much different. The example of the flowchart of FIG. 7 describes all the steps as in the example of the flowchart of FIG. 3, so refer to the same for details.

Another mode example according to the third embodiment will be described. The laser oscillator 1 is not limited to the YAG laser oscillator with a Q switch, and may be a CW oscillation laser, a pulse oscillation laser, a raster irradiation type, or a collective irradiation type. If it is a collective irradiation type, it is not necessary to include the raster first deflector. When the marking is completed by marking one image on the surface of the work by the laser irradiation system of collective irradiation type, it is not necessary to provide not only the raster first deflector but also the second deflector. Needless to say, the operation flow in the mode example is completely different from the flowchart in FIG. The laser light scattering reflector may be replaced with a laser light absorber. However, in this case, the heat load is severe. The reason is as follows. Laser shader 20
Completely blocks the laser light L1, but it is necessary to reduce the inertia (that is, downsizing) of the laser light scattering reflector and its base in order to secure the responsiveness. It is desirable to install the laser light shield 20 at a position before the laser light L1 is expanded. However, in this case, the laser energy density with which the laser light scattering reflector of the laser light shield device 20 is irradiated increases regardless of whether it is a CW oscillation laser, pulse oscillation, raster irradiation type, or batch irradiation type. Therefore, the use of the laser absorber is not advantageous in terms of heat load.

According to the above, not only can the marking be performed at higher speed and with higher accuracy, but it is not necessary to limit to the raster irradiation as in the second embodiment.

Next, a fourth embodiment will be described with reference to FIG. This is without changing the main configuration of the third embodiment described above.
In addition, this embodiment is similar to the one shown in FIG. 4, in which different images can be stamped on a plurality of works at the same time. As mentioned above, in the figure,
The same components as those in the above-mentioned drawings are designated by the same reference numerals, and duplicate description will be omitted.

Similar to the second embodiment, the fourth embodiment has two
One laser oscillating unit B for each mark A1 and A2
Are connected by optical fibers 4 and 4. Laser oscillator B
Is a YAG laser oscillator with a Q switch 1, an optical shaping device 2,
It is composed of a beam splitter 3 and a controller 19.
That is, the laser beam Lo from one laser oscillator 1 with a Q switch is shaped by the optical shaping device 2 into a shape that is easily incident on the optical fibers 4 and 4, and then is split by the beam splitter 3.
The light enters each optical fiber 4 and 4, and passes through each mark A.
It is incident on the beam expanders 5 and 5 of A1 and A2. After that, the route to the work surfaces 13 and 13 is the same as that shown in the third embodiment. Of course, the operation flow is the same as that shown in FIG. 7, but it is slightly different in terms of hardware. That is, the additional controller 19 is connected to the controllers 17 and 17 of the marks A1 and A2 via the communication lines S9 and S9, respectively, and Q
It is connected to the YAG laser oscillator 1 with a switch by a signal line S10 which is a substitute for the signal line S11 of the third embodiment, and laser oscillation is generated when a laser oscillation signal is input from either one of the controllers 17 and 17. Do both controllers 1
When a laser stop signal is input from 7 and 17, the laser is stopped. Q for pulse oscillation
Switch control is performed.

Incidentally, in the fourth embodiment shown in FIG. 8, the mark portion A1 is used for marking, that is, when the laser beam L1 is applied to the image surface 82 in raster, while the mark portion A2 is used for waiting time. That is, the laser shader 2 by the shader control means
0 indicates that the laser light path is 0. That is, according to the fourth embodiment, as described above, different images can be stamped on a plurality of works at the same time without changing the main configuration of the third embodiment.

Another aspect of the fourth embodiment will be described. Similar to the second embodiment, for example, the work feeder 15 is common, that is, one work is provided, and the mark portions A1 and A2 are provided.
By further deflecting either one of the second deflectors, it is possible to irradiate and mark two identical or different images on one work. Further, the number of mark portions A is not limited to two. Another aspect example is the same as the other aspect example according to the third embodiment.

According to the fourth embodiment, similar to the second embodiment, it is possible to print different images on one or a plurality of works at the same time with higher speed and higher accuracy. Further, unlike the second embodiment, no trouble occurs in raster irradiation.

[0040]

As described above, according to the laser mask marker of the present invention, higher speed and higher accuracy,
Furthermore, it can be a laser mask marker that can mark different images on one or a plurality of works at the same time.

[Brief description of drawings]

FIG. 1 is an overall external view of a laser mask marker according to a first embodiment.

FIG. 2 is a diagram illustrating raster irradiation in the first and second embodiments.

FIG. 3 is a flowchart for explaining an operation example of the first embodiment and the second embodiment.

FIG. 4 is an overall external view of a laser mask marker according to a second embodiment.

FIG. 5 is an overall external view of a laser mask marker according to a third embodiment.

FIG. 6 is a diagram illustrating raster irradiation in a third embodiment and a fourth embodiment.

FIG. 7 is a flow chart for explaining an operation example of the third and fourth embodiments.

FIG. 8 is an overall external view of a laser mask marker according to a fourth embodiment.

[Explanation of symbols]

1 ... Laser oscillator, 13 ... Work surface, 20 ... Laser light shield, 8 ... Liquid crystal mask, 81 ... Laser light absorber, 82 ... Image plane, L1 ... Laser light, L2 ... Transmission laser light.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Koji Yosita 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture Komatsu Seisakusho Laboratory (72) Inventor Misao Kato 1200 Manda, Hiratsuka-shi Kanagawa Seisakusho Research In-house

Claims (5)

[Claims] 1. A laser beam L1 from a laser oscillator 1 is raster-irradiated onto an image surface 82 of a liquid crystal mask 8 and the transmitted laser beam L2 is irradiated onto a work surface 13 to imprint the image on the work surface 13. In the laser mask marker, the laser light absorber 81 is provided on the frame surface of the image surface 82 on the upstream light side of the liquid crystal mask 8, and the image surface 82 is transferred to the laser light absorber 81 and the image is transferred from the laser light absorber 81. A laser mask marker characterized by comprising an optical path deflecting means for deflecting the laser irradiation optical path to the surface 82 in a timely manner. 2. Laser light L from one laser oscillator 1
1 is dispersed, each image surface 82 of the plurality of liquid crystal masks 8 is raster-irradiated, and each transmitted laser beam L2 is irradiated to at least one work surface 13, so that each image is formed on the work surface 13. In the laser mask marker to be engraved, the laser light absorber 81 is provided on the frame surface of the upstream light side image surface 82 of each liquid crystal mask 8, and from each image surface 82 to each laser light absorber 81, and each A laser mask marker characterized by comprising optical path deflecting means for deflecting each laser irradiation optical path from the laser light absorber 81 to each image surface 82 in a timely manner. 3. The laser mask marker according to claim 1, wherein the laser light absorber 81 is a laser light scattering reflector. 4. A laser beam L1 from a laser oscillator 1 is irradiated onto an image surface 82 of the liquid crystal mask 8 and its transmitted laser beam L2 is irradiated.
In the laser mask marker for marking the image on the work surface 13 by irradiating the work surface 13, the laser light shield 20 is provided in the irradiation optical path of the laser light L1 and the laser light shield 20 is driven at an appropriate time. A laser mask marker characterized by comprising a light-shielding device control means. 5. A laser beam L from one laser oscillator 1.
1 is dispersed, each image surface 82 of the plurality of liquid crystal masks 8 is irradiated, and each transmitted laser beam L2 is irradiated to at least one work surface 13, whereby the work surface 1
In the laser mask marker for engraving the images in FIG. 3, laser shields 20 are provided in the irradiation optical paths of the laser lights L1, and a shield control means for driving the laser shields 20 is provided. A laser mask marker characterized by a configuration.