JPH07111332B2 - Appearance inspection method for thin plates - Google Patents

Appearance inspection method for thin plates

Info

Publication number
JPH07111332B2
JPH07111332B2 JP4075104A JP7510492A JPH07111332B2 JP H07111332 B2 JPH07111332 B2 JP H07111332B2 JP 4075104 A JP4075104 A JP 4075104A JP 7510492 A JP7510492 A JP 7510492A JP H07111332 B2 JPH07111332 B2 JP H07111332B2
Authority
JP
Japan
Prior art keywords
thin plate
light
reference pattern
image
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4075104A
Other languages
Japanese (ja)
Other versions
JPH0626843A (en
Inventor
徹也 北城
滋雄 山井
基 上山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP4075104A priority Critical patent/JPH07111332B2/en
Publication of JPH0626843A publication Critical patent/JPH0626843A/en
Publication of JPH07111332B2 publication Critical patent/JPH07111332B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Input (AREA)
  • Image Processing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Image Analysis (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、薄板状物即ちICリー
ドフレームやTAB(Tape Automated
bonding)用テープ等の外観検査方法に関するも
のである。詳しくは、第1に薄板状物特にリードピンの
変形の有無を判別する検査方法に関するものであり、第
2に上記リードピンの変形の有無に加えて、表面および
裏面の状態即ちリードフレーム等のキズ・ピット・ピン
ホール・ムラ・シミ・汚れの有無や光沢の良否等をも判
別する検査方法に関するものであり、第3に上記リード
ピンの変形および表面および裏面の状態の良否等に加え
て、ピン保持用の接着剤やテープの固定位置の良否をも
判別する検査方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin plate, that is, an IC lead frame or a TAB (Tape Automated).
The present invention relates to a method of inspecting the appearance of a tape for bonding. More specifically, firstly, the present invention relates to an inspection method for determining the presence or absence of deformation of a thin plate, especially a lead pin, and secondly, in addition to the presence or absence of deformation of the lead pin, the state of the front surface and the back surface, that is, scratches on the lead frame and the like. The present invention relates to an inspection method for determining the presence / absence of pits, pinholes, unevenness, stains, stains, and the quality of gloss. Thirdly, in addition to the above-mentioned deformation of lead pins and the quality of the front and back surfaces, pin holding The present invention relates to an inspection method for determining whether or not a fixing position of a tape adhesive or a tape is good or bad.

【0002】[0002]

【従来の技術】リードフレーム等の薄板状物の外観検査
方法は、かつては人間の眼による目視検査が行われてい
た。しかし、近時の半導体素子の高密度化に伴いリード
フレーム等も多ピン化し、また生産コストの低減・量産
化・品質の均質化等の要求を受けて、リードフレーム等
の外観検査も、自動化・高速化・高精度化が必要となっ
た。そこで近時は、リードフレーム等の外観検査手段と
して、CCD(電荷結合素子)を用いたテレビカメラ方
式が多く利用されている。
2. Description of the Related Art In the past, visual inspection by a human eye was used as a visual inspection method for thin plate-like objects such as lead frames. However, due to the recent increase in the density of semiconductor elements, leadframes are becoming more and more pins, and in response to demands for production cost reduction, mass production, and homogenization of quality, the appearance inspection of leadframes is also automated.・ Higher speed and higher accuracy are required. Therefore, recently, a television camera system using a CCD (charge coupled device) is often used as a visual inspection means for a lead frame or the like.

【0003】その概略を述べれば、リードフレーム等の
薄板状物を、検査位置へ移送させて検査要求信号を出力
し、CCDテレビカメラによってその外観を撮影し、そ
れを画像処理して得た画像パターンを、予めCADシス
テムで設計した比較照合用の基準パターンと比較照合す
ることにより、リードピンの変形の有無、表・裏面のキ
ズ・汚れその他の各項目の良否を判別するようにしてい
る(例えば特開平2−226481号公報参照)。
The outline thereof is as follows: A thin plate-like object such as a lead frame is transferred to an inspection position, an inspection request signal is output, its appearance is photographed by a CCD television camera, and an image obtained by image processing the image is obtained. By comparing and collating the pattern with a reference pattern for comparison and collation designed in advance by a CAD system, it is possible to determine whether the lead pin is deformed or not, and whether or not each item such as scratches and stains on the front and back surfaces is good or bad (for example, See Japanese Patent Application Laid-Open No. 2-226481).

【0004】[0004]

【発明が解決しようとする課題】ところが上記の外観検
査手段は、通常1箇所に設けた1台のCCDテレビカメ
ラにより撮影し、画像処理して得た画像パターンを検査
パターンと比較照合して判別している。そのため、薄板
状物のリードピンの変形、表・裏面の状態の良否やピン
固定用接着剤等の固定位置の良否の判別は、各々別個に
行わざるを得なかった。
However, the above-mentioned appearance inspection means is normally discriminated by comparing and collating the image pattern obtained by image-taking by one CCD television camera provided at one place and image-processing. is doing. Therefore, the deformation of the lead pin of the thin plate-like object, the quality of the front and back surfaces, and the quality of the fixing position of the pin fixing adhesive or the like have to be determined separately.

【0005】またリードピンの変形の内で、Z方向即ち
リードフレーム等の厚み方向へのリードピンの変形の有
無の判別は、X方向即ちリードフレーム等の長手方向
や、Y方向即ちリードフレーム等の幅方向ヘのリードピ
ンの変形と異なり、上記1台のCCDテレビカメラで1
方向からのみ撮影して判別することは不可能である。そ
れには複数台のCCDテレビカメラが必要となるし、複
数台のCCDテレビカメラを用いると、各々で得た情報
を画像処理して比較照合すべき画像パターンを得るの
に、時間を多く要することになる。そこで従来は、Z方
向へのリードピンの変形の判別は目視によっているが、
一度に大量のリードフレーム等の検査は難しいし、同一
基準で行われず個人差が出がちであった。
Among the deformations of the lead pins, the presence or absence of deformation of the lead pin in the Z direction, that is, the thickness direction of the lead frame or the like is determined in the X direction, that is, the longitudinal direction of the lead frame or the like, or the Y direction, that is, the width of the lead frame or the like. Unlike the deformation of the lead pin toward the direction, 1 with the above CCD TV camera
It is impossible to determine by shooting only from the direction. This requires a plurality of CCD TV cameras, and when using a plurality of CCD TV cameras, it takes a lot of time to image-process the information obtained by each and obtain an image pattern to be compared and collated. become. Therefore, conventionally, the determination of the deformation of the lead pin in the Z direction is made by visual inspection.
It is difficult to inspect a large number of lead frames at a time, and individual differences tend to occur because the same standard is not used.

【0006】さらに、CCDテレビカメラの焦点深度は
一般に浅いため、例えばリードフレーム等の表・裏面の
キズと付着物との判別を正確に行うことができない。キ
ズのあるものは不良品だが、付着物なら洗浄して良品と
なるので、そのいずれに当たるのかの判別は最終的には
目視検査に頼らざるを得ず、精度と検査時間の面で問題
点があった。
Further, since the depth of focus of a CCD television camera is generally shallow, it is not possible to accurately distinguish, for example, from scratches on the front and back surfaces of a lead frame or the like and deposits. A scratched product is a defective product, but if it is an adhered substance, it will be cleaned and it will be a good product.Therefore, it is necessary to rely on visual inspection to determine which one will hit, and there is a problem in terms of accuracy and inspection time. there were.

【0007】しかもCCDテレビカメラの画素子は、レ
ーザービームの画素と比べて大きいので解像度が悪い。
そのため微細な凹凸や汚れに関するデーターを得ること
が難しく、正確に判定することができなかった。CCD
テレビカメラの走査位置を少しずらして繰り返し検査す
る方法もあるが、それでは検査時間が2倍近くかかって
しまう。また、CCDテレビカメラの画素子面積を小さ
くすることが考えられるが、それでは光感度が低下して
光電変換する積分時間が長くかかり、やはり検査時間が
長くかかるという問題点があった。
Moreover, since the image element of the CCD television camera is larger than the pixel of the laser beam, the resolution is poor.
Therefore, it is difficult to obtain data on fine irregularities and stains, and accurate determination cannot be performed. CCD
There is also a method of repeatedly inspecting by slightly shifting the scanning position of the TV camera, but that would take nearly twice as long as the inspection time. Further, it is conceivable to reduce the area of the image element of the CCD television camera, but this has a problem that the photosensitivity is lowered and the integration time for photoelectric conversion is long, and the inspection time is also long.

【0008】本発明は、上記従来のICリードフレーム
やTAB用テープ等の薄板状物の外観検査手段がもつ問
題点を解決しようとするものである。即ち本発明の第1
の目的は、薄板状物特に多ピン化するリードフレーム等
のリードピンのZ方向への変形の有無を正確に判別する
検査方法を提供することである。第2の目的は、上記変
形の有無の判別に加えて表・裏面の状態の良否をも正確
に判別する検査方法を提供することである。第3の目的
は、上記変形の有無および表・裏面の状態の良否の判別
に加えて、ピン保持用接着剤等の固定位置の良否をも正
確に判別する検査方法を提供することである。
The present invention is intended to solve the problems of the conventional visual inspection means for thin plate-like objects such as IC lead frames and TAB tapes. That is, the first aspect of the present invention
It is an object of the invention to provide an inspection method for accurately determining the presence or absence of deformation in the Z direction of a lead pin such as a thin plate-like lead frame having a multi-pin structure. A second object is to provide an inspection method for accurately determining the quality of the front and back surfaces in addition to the determination of the presence or absence of the deformation. A third object is to provide an inspection method for accurately determining whether or not the fixing position of the pin holding adhesive or the like is good, in addition to the presence or absence of the deformation and the quality of the front and back surfaces.

【0009】[0009]

【課題を解決するための手段】[Means for Solving the Problems]

1)本発明に係る薄板状物の外観検査方法の第1は、薄
板状物1が外観検査位置を通過時に、該薄板状物1の表
・裏両側からレーザービーム光2を、その表・裏面と直
交する線zの前または後方から一定角度θで、かつ搬送
方向と直角方向へ定速で反復照射して、表面3および裏
面4を各々走査し、表側および裏側からの各透過光2a
を、裏側および表側の各受光センサー8で受け電気信号
に変えて画像処理し、該両2次元画像についての位相差
から3次元情報を得て、予め入力した基準パターンとの
比較照合で、Z方向へのリードピン6の変形の有無を判
別するようにしたものである(図1および図2参照)。
1) The first aspect of the appearance inspection method for a thin plate-like object according to the present invention is that when the thin plate-like object 1 passes an appearance inspection position, a laser beam 2 is emitted from both front and back sides of the thin plate-like object 1. The front surface 3 and the back surface 4 are each scanned by repeatedly irradiating the front surface 3 and the back surface 4 at a constant angle θ from the front or rear of the line z orthogonal to the back surface and at a constant speed in the direction perpendicular to the transport direction, and the transmitted light 2a from the front side and the back side, respectively.
Is converted into a received electric signal by each of the light receiving sensors 8 on the back side and the front side, image processing is performed, three-dimensional information is obtained from the phase difference between the two two-dimensional images, and Z comparison is performed with a previously input reference pattern. The presence or absence of deformation of the lead pin 6 in the direction is determined (see FIGS. 1 and 2).

【0010】 2)本発明に係る薄板状物の外観検査方
法の第2は、薄板状物1が外観検査位置を通過時に、該
薄板状物1の表・裏両側からレーザービーム光2を、そ
の表・裏面と直交する線zの前または後方から一定角度
θで、かつ搬送方向と直角方向へ定速で反復照射して、
表面3および裏面4を各々走査し、表側および裏側から
の各透過光2aを、裏側および表側の各受光センサー8
で受け電気信号に変えて画像処理し、該両2次元画像に
ついての位相差から3次元情報を得て、予め入力した基
準パターンとの比較照合で、Z方向へのリードピン6の
変形の有無を判別し、かつ、表面3および裏面4からの
各反射光2bを、表側および裏側の各受光センサー8で
受け電気信号に変えて画像処理し、該各2次元画像を予
め入力した基準パターンと比較照合して、表面3および
裏面4の状態の良否を判別するようにしたものである
(図1および図3参照)。
2) The second aspect of the appearance inspection method for a thin plate-like object according to the present invention is that when the thin plate-like object 1 passes the appearance inspection position, laser beam light 2 is emitted from both front and back sides of the thin plate-like object 1. Repeated irradiation is performed at a constant angle θ from the front or the rear of the line z orthogonal to the front and back surfaces and at a constant speed in the direction perpendicular to the transport direction,
The front surface 3 and the back surface 4 are respectively scanned, and the transmitted light 2a from the front side and the back side is detected by the respective light receiving sensors 8 on the back side and the front side.
Then, the image is converted into a received electric signal and image processing is performed, three-dimensional information is obtained from the phase difference between the two two-dimensional images, and the presence or absence of deformation of the lead pin 6 in the Z direction is checked by comparing and collating with a previously input reference pattern. discriminated, and compares each reflected light 2b from the surface 3 and the back 4, and image processing is changed to an electrical signal received by the front and back of the light receiving sensor 8, the reference pattern which enter the respective two-dimensional image in advance The collation is performed to determine the quality of the front surface 3 and the back surface 4 (see FIGS. 1 and 3).

【0011】 3)本発明に係る薄板状物の外観検査方
法の第3は、薄板状物1が外観検査位置を通過時に、該
薄板状物1の表・裏両側からレーザービーム光2を、そ
の表・裏面と直交する線zの前または後方から一定角度
θで、かつ搬送方向と直角方向へ定速で反復照射して、
表面3および裏面4を各々走査し、表側および裏側から
の各透過光2aを、裏側および表側の各受光センサー8
で受け電気信号に変えて画像処理し、該両2次元画像に
ついての位相差から3次元情報を得て、予め入力した基
準パターンとの比較照合で、Z方向へのリードピン6の
変形の有無を判別し、かつ、表面3および裏面4からの
各反射光2bを、表側および裏側の各受光センサー8で
受け電気信号に変えて画像処理し、該各2次元画像を予
め入力した基準パターンと比較照合して、表面3および
裏面4の状態の良否を判別するとともに、上記表・裏側
からの各透過光2a、または表・裏面からの各反射光2
bを、各受光センサー8で受け電気信号に変えて画像処
理し、該各2次元画像を予め入力した基準パターンと比
較照合して、ピン固定用接着剤7等の位置の良否を判別
するようにしたものである(図1・図2および図3参
照)。
3) A third aspect of the appearance inspection method for a thin plate-like object according to the present invention is that when the thin plate-like object 1 passes an appearance inspection position, a laser beam 2 is emitted from both front and back sides of the thin plate-like object 1. Repeated irradiation is performed at a constant angle θ from the front or the rear of the line z orthogonal to the front and back surfaces and at a constant speed in the direction perpendicular to the transport direction,
The front surface 3 and the back surface 4 are respectively scanned, and the transmitted light 2a from the front side and the back side is detected by the respective light receiving sensors 8 on the back side and the front side.
Then, the image is converted into a received electric signal and image processing is performed, three-dimensional information is obtained from the phase difference between the two two-dimensional images, and the presence or absence of deformation of the lead pin 6 in the Z direction is checked by comparing and collating with a previously input reference pattern. discriminated, and compares each reflected light 2b from the surface 3 and the back 4, and image processing is changed to an electrical signal received by the front and back of the light receiving sensor 8, the reference pattern which enter the respective two-dimensional image in advance By comparing, the quality of the states of the front surface 3 and the back surface 4 is determined, and the transmitted light 2a from the front and back sides, or the reflected light 2 from the front and back surfaces, respectively.
b is converted into an electric signal received by each light receiving sensor 8 and image-processed, and each two-dimensional image is compared and collated with a previously input reference pattern to determine the quality of the position of the pin fixing adhesive 7 or the like. (See FIGS. 1, 2 and 3).

【0012】上記構成において、薄板状物1とはICリ
ードフレームやTAB用テープ等をいう。X方向とは上
記薄板状物1の長手方向、Y方向とは薄板状物1の幅方
向、Z軸方向とは薄板状物1の厚み方向を各々意味す
る。
In the above structure, the thin plate-like material 1 means an IC lead frame, a TAB tape or the like. The X direction means the longitudinal direction of the thin plate 1, the Y direction means the width direction of the thin plate 1, and the Z-axis direction means the thickness direction of the thin plate 1.

【0013】上記の変形とは、特にリードピン6のX・
Y・Z方向への変形をいう。なお、変形にはエッチング
不良、プレス不良等をも含むものとする。また表面3お
よび裏面4の状態とは、薄板状物1の表・裏各面のキズ
・ピット・ピンホール・ムラ・シミ・汚れ等の有無や光
沢の良否の他に、メッキ部分のムラ・シミ・汚れ・異物
の付着等の有無、さらにはメッキの寸法位置・光沢等の
良否をも含む。ピン固定用接着剤7等の位置とは、リー
ドピン6を保持用する接着剤7やテープの固定位置をい
う。
The above-mentioned deformation is especially X.
Deformation in the Y and Z directions. Note that the deformation includes etching defects, press defects, and the like. Also, the states of the front surface 3 and the back surface 4 include the presence / absence of scratches, pits, pinholes, unevenness, stains, stains, etc. on the front and back surfaces of the thin plate-like object 1 and unevenness of the plated portion. It also includes the presence / absence of stains / dirt / adhesion of foreign matter, and the quality of the plating's dimensional position and gloss. The position of the pin fixing adhesive 7 or the like means the fixing position of the adhesive 7 for holding the lead pin 6 or the tape.

【0014】上記表側からのレーザービーム光2の照射
と、裏側からのレーザービーム光2の照射は、一方から
の透過光2aが他方の反射光2bと干渉しないように、
定速で反復するタイミングをずらしてある。上記各レー
ザービーム光2を受ける各受光センサー8は、各透過光
2aまたは反射光2bを受光しそれを電気信号に変換す
るものである。
The irradiation of the laser beam 2 from the front side and the irradiation of the laser beam 2 from the back side are performed so that the transmitted light 2a from one side does not interfere with the reflected light 2b of the other side.
The timing to repeat at a constant speed is staggered. Each light receiving sensor 8 which receives each laser beam light 2 receives each transmitted light 2a or reflected light 2b and converts it into an electric signal.

【0015】受光センサー8からの電気信号を画像処理
し、予め入力した基準パターンと比較照合して判別する
ため、コンピューターによる画像処理ユニット(図示
略)が設けてある。2次元画像または2次元画像の位相
差から得た3次元情報を、予め入力した基準パターンと
比較照合して、リードピン6の変形の有無、表面3・裏
面4の状態の良否、ピン固定用接着剤7等の固定位置の
良否等を判別可能なソフトウエアを組み込んでおく。
An image processing unit (not shown) by a computer is provided for performing image processing of the electric signal from the light receiving sensor 8 and comparing and comparing with a previously inputted reference pattern to make a determination. The two-dimensional image or three-dimensional information obtained from the phase difference of the two-dimensional image is compared and collated with the reference pattern input in advance, and the presence or absence of deformation of the lead pin 6, the quality of the front surface 3 and the back surface 4, the adhesion for pin fixing Software that can determine the quality of the fixed position of the agent 7 etc. is installed.

【0016】図において、9は薄板状物のピン間等の間
隙、10は集光レンズ、11はポリゴンミラー、12は
fθレンズ、13はミラー、14は拡散板を示す。
In the figure, 9 is a gap between pins of a thin plate-like object, 10 is a condenser lens, 11 is a polygon mirror, 12 is an fθ lens, 13 is a mirror, and 14 is a diffusion plate.

【0017】[0017]

【作用】ICリードフレームまたはTAB用テープ等の
薄板状物1を外観検査位置へ搬送させ、該薄板状物1が
外観検査位置を通過時に、薄板状物1の表・裏両側から
レーザービーム光2を照射させる。該レーザービーム光
2の照射は、薄板状物1の表・裏面と直交する線zの前
または後方から一定角度θで、かつ搬送方向(図では薄
板状物の長手方向)と直角の方向(図では薄板状物の幅
方向)へ定速で反復して行われ、表・裏側の各受光セン
サー8で受光する(図1参照)。
Function: The thin plate 1 such as an IC lead frame or TAB tape is conveyed to the visual inspection position, and when the thin plate 1 passes the visual inspection position, laser beam light is emitted from both front and back sides of the thin plate 1. Irradiate 2. The irradiation of the laser beam 2 is carried out at a constant angle θ from the front or back of a line z orthogonal to the front and back surfaces of the thin plate-shaped object 1 and a direction perpendicular to the conveying direction (longitudinal direction of the thin plate-shaped object in the figure) ( In the drawing, the thin plate-shaped material is repeatedly performed at a constant speed in the width direction), and light is received by each of the light receiving sensors 8 on the front and back sides (see FIG. 1).

【0018】a)まず、上記1)に記載の薄板状物の変
形、特にリードピンの変形の有無を判別する場合(図2
参照) 上記薄板状物1の表・裏両側からのレーザービーム光2
の照射により、薄板状物1は表面3および裏面4から各
々走査される。照射されたレーザービーム光2の内で、
薄板状物1のピン間その他の空9を通過した各透過光2
aは、各々裏側または表側の各受光センサー8で受光さ
れる。この際、上記の如く表側からのレーザービーム光
2の照射と、裏側からのレーザービーム光2の照射との
タイミングをずらしてあるので、表側からの透過光2a
が裏側の反射光2bと干渉することはない。
A) First, in the case of determining whether or not the deformation of the thin plate-like material described in 1) above, especially the deformation of the lead pin, is determined (FIG. 2).
See) Laser beam light 2 from both front and back sides of the thin plate 1
The thin plate-like object 1 is scanned from the front surface 3 and the back surface 4 by the irradiation. Within the irradiated laser beam 2,
Each transmitted light 2 that has passed through the space 9 between the pins of the thin plate-shaped object 1 and the other space 9
The light a is received by the respective light receiving sensors 8 on the back side or the front side. At this time, since the irradiation of the laser beam light 2 from the front side and the irradiation of the laser beam light 2 from the back side are shifted as described above, the transmitted light 2a from the front side is
Does not interfere with the reflected light 2b on the back side.

【0019】上記の裏・表側の各受光センサー8で受光
された各透過光2aは、直ちに電気信号に変えられ画像
処理ユニットで画像処理され、2次元画像が得られる。
この2次元画像を、予め入力してあるX・Y方向への変
形の有無判別用の基準パターンと比較照合することによ
り、X方向・Y方向ヘのリードピン6の変形の有無が判
別される。さらに上記各2次元画像は、薄板状物1の表
・裏両側から照射された別個のレーザービーム光2の各
透過光2aによるものであるから、両2次元画像間には
位相差が生じている。そのためこの位相差から3次元情
報が得られることになり、該3次元情報を、予め入力し
てあるZ方向ヘの変形の有無判別用の基準パターンと比
較照合することで、Z方向へのリードピン6の変形の有
無が判別される。
The transmitted light 2a received by each of the back and front light receiving sensors 8 is immediately converted into an electric signal and image-processed by an image processing unit to obtain a two-dimensional image.
By comparing and collating this two-dimensional image with a reference pattern for determining the presence or absence of deformation in the X and Y directions, which is input in advance, it is determined whether or not the lead pin 6 is deformed in the X and Y directions. Further, since each of the above two-dimensional images is due to each transmitted light 2a of the separate laser beam light 2 emitted from both front and back sides of the thin plate-like object 1, there is a phase difference between both two-dimensional images. There is. Therefore, three-dimensional information is obtained from this phase difference, and the three-dimensional information is compared and collated with a reference pattern for determining the presence / absence of deformation in the Z direction, which has been input in advance, to thereby lead pin in the Z direction. The presence or absence of deformation of No. 6 is determined.

【0020】b)次に、上記2)に記載の薄板状物の表
・裏面の状態の良否をも判別する場合(図3参照) 上記の透過光2aにより薄板状物1の変形の有無が判別
されるが、それに加えて、表・裏両側から照射されたレ
ーザービーム光2は、薄板状物1の表・裏面でリードピ
ン6等により反射され、その各反射光2bが表・裏側の
各受光センサー8で受光される。これを上記と同様に電
気信号に変え、画像処理して得た各2次元画像を、表・
裏面の状態の良否判別用として予め入力してある基準パ
ターンと比較対照することで、薄板状物1の表面3およ
び裏面4の状態、即ちリードフレーム等のキズ・ピット
・ピンホール・ムラ・シミ・汚れの有無や光沢の良否等
も判別されることになる。
B) Next, in the case of judging the quality of the front and back surfaces of the thin plate-like article described in 2) above (see FIG. 3), it is determined whether the thin plate-like article 1 is deformed by the transmitted light 2a. In addition to that, the laser beam light 2 emitted from both the front and back sides is reflected by the lead pins 6 and the like on the front and back sides of the thin plate-like object 1, and the reflected light 2b is reflected on each of the front and back sides. The light is received by the light receiving sensor 8. This is converted into an electrical signal in the same manner as above, and each two-dimensional image obtained by image processing is displayed on the table.
The state of the front surface 3 and the back surface 4 of the thin plate-like object 1, that is, scratches, pits, pinholes, unevenness, stains, etc. of the lead frame are compared by comparing with a reference pattern that has been input in advance for determining the quality of the back surface. -The presence / absence of dirt and the quality of gloss are also determined.

【0021】c)さらに、上記3)に記載のピン固定用
接着剤等の固定位置の良否をも判別する場合(図2・図
3参照) 上記各透過光2aにより薄板状物1の変形の有無が判別
され、各反射光2bにより薄板状物1の表・裏面の状態
の良否が判別されるが、それに加えて、上記各透過光2
aまたは各反射光2bから得られた各2次元画像を、固
定用接着剤7等の位置判別用として予め入力した基準パ
ターンと比較照合する。これにより、ピン固定用接着剤
7またはテープの固定位置の良否も判別されることにな
る。
C) Furthermore, in the case of determining whether the fixing position of the pin fixing adhesive or the like described in 3) is good or bad (see FIGS. 2 and 3), the thin plate 1 is deformed by the transmitted light 2a. The presence or absence is determined, and the quality of the front and back surfaces of the thin plate 1 is determined by each reflected light 2b.
Each two-dimensional image obtained from a or each reflected light 2b is compared and collated with a reference pattern input in advance for position determination of the fixing adhesive 7 or the like. As a result, the quality of the fixing position of the pin fixing adhesive 7 or the tape is also determined.

【0022】上記いずれの場合も、レーザービーム光に
より走査して得た透過光2aまたは反射光2bによる情
報を、画像処理ユニットが2次元画像または3次元情報
として、予め入力してある基準パターンと比較照合して
判別するものである。そのため判別の精度は、従来のC
CDテレビカメラ方式や目視検査と異なり、高精度で処
理され、かつ大量の検査でも個人差が出ず正確である。
In any of the above cases, the information based on the transmitted light 2a or the reflected light 2b obtained by scanning with the laser beam light is used as a two-dimensional image or three-dimensional information by the image processing unit as a reference pattern which is input in advance. It is determined by comparing and collating. Therefore, the accuracy of discrimination is C
Unlike the CD TV camera system and visual inspection, it is processed with high accuracy, and even in a large amount of inspection, there is no individual difference and it is accurate.

【0023】特にレーザービーム光2による画素は、C
CDテレビカメラの画素子と異なり小さく解像度がよ
く、かつCCDDテレビカメラのように焦点深度が浅い
と言う欠点もないので、微細な凹凸や汚れに等に関する
情報も正確に得られ、例えば薄板状物1の表裏面のキズ
と汚れの違い等についても正確に判定される。またCC
Dテレビカメラと異なり光感度の低下もないので、検査
時間が短縮されている。しかも、一時に、薄板状物の変
形特にリードピンの変形の有無、表裏面の状態の良否、
ピン固定用接着剤の固定位置の良否等の全ての検査を行
うことが可能である。
Particularly, the pixel by the laser beam 2 is C
Unlike a picture element of a CD TV camera, it has a small size and a good resolution, and since it does not have the drawback of a shallow depth of focus unlike a CCDD TV camera, it can accurately obtain information about fine irregularities and stains. The difference between scratches and dirt on the front and back of No. 1 can be accurately determined. Also CC
Unlike D TV cameras, there is no reduction in light sensitivity, so inspection time is shortened. Moreover, the deformation of the thin plate-like material, especially the deformation of the lead pins, the quality of the front and back surfaces,
It is possible to perform all the inspections such as the quality of the fixing position of the pin fixing adhesive.

【0024】[0024]

【実施例】図1・図2・図3は、本発明に係る薄板状物
の外観検査方法を実施例を示すものであり、システムは
外観検査位置を移動する薄板状物1にレーザービーム光
2を照射する走査ユニットと、受光ユニットと、画像処
理ユニットとで構成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1, FIG. 2 and FIG. 3 show an embodiment of the appearance inspection method of a thin plate-like object according to the present invention, in which a laser beam light is applied to the thin plate-like object 1 which moves the appearance inspection position. It is composed of a scanning unit that irradiates two, a light receiving unit, and an image processing unit.

【0025】上記走査ユニットは、表面3を上に裏面4
を下にして移動する薄板状物1の上側と下側に各々、発
光器5としてのレーザーダイオードと、レーザービーム
光2を集光させる集光レンズ10と、レーザービーム光
2を薄板状物1の表・裏面で反復走査させるため一定速
度で回転するポリゴンミラー11と、その反復走査の振
幅を薄板状物1の幅以上にするfθレンズ12と、レー
ザービーム光2を薄板状物1の表・裏面の垂線zに対し
一定角度θ、例えば15度で照射させるためのミラー1
3とを設けてある。
In the scanning unit, the front surface 3 faces upward and the back surface 4 faces.
The laser diode as the light emitter 5, the condenser lens 10 for condensing the laser beam light 2, and the laser beam light 2 on the upper and lower sides of the thin plate-like object 1 which moves with the laser beam light 2 down. The polygon mirror 11 that rotates at a constant speed for repeatedly scanning the front and back surfaces of the thin plate 1, the fθ lens 12 that makes the amplitude of the repeated scanning equal to or larger than the width of the thin plate 1, and the laser beam light 2 on the surface of the thin plate 1.・ Mirror 1 for irradiating the back surface with a constant angle θ with respect to the perpendicular z, for example, 15 degrees
3 and 3 are provided.

【0026】受光ユニットも、上記走査ユニットと同様
に薄板状物1の上側と下側に各々、レーザービーム光2
の透過光2aや反射光2bを拡散させる拡散板14と、
拡散後の透過光2aや反射光2bを受光し電気信号に変
えるため、受光センサー8としてのディテクターを設け
てある。
Similarly to the scanning unit, the light receiving unit also has laser beam light 2 on the upper side and the lower side of the thin plate-like object 1, respectively.
A diffuser plate 14 for diffusing the transmitted light 2a and the reflected light 2b of
A detector as a light receiving sensor 8 is provided in order to receive the diffused transmitted light 2a and the reflected light 2b and convert them into electric signals.

【0027】画像処理ユニットはコンピューターを用い
ており、上記の如く受光センサー8からの電気信号を画
像処理し予め入力した基準パターンと比較照合して判別
するためのもので、2次元画像または2次元画像の位相
差から得た3次元情報を、予め入寮した基準パターンと
比較照合して、リードピン6の変形の有無、表面3・裏
面4の状態の良否、ピン固定用接着剤7等の固定位置の
良否等を判別可能なソフトウエアを組み込んである。な
お比較照合用の基準パターンの入力は、CADによるパ
ターン入力でもよいし、シルエット入力でもよい。
A computer is used as the image processing unit, and as described above, the electric signal from the light receiving sensor 8 is subjected to image processing and compared with a reference pattern inputted in advance to make a determination, and is a two-dimensional image or a two-dimensional image. The three-dimensional information obtained from the phase difference of the image is compared and collated with the reference pattern that has been moved in beforehand, and the presence or absence of deformation of the lead pin 6, the quality of the condition of the front surface 3 and the back surface 4, the fixing position of the pin fixing adhesive 7, etc. Incorporates software that can determine the quality of each item. The reference pattern for comparison and matching may be input by CAD or a silhouette.

【0028】図示実施例では、外観検査位置を通過する
際の該薄板状物1は、表面3・裏面4が上・下関係にあ
るが、それに限らず表面3・裏面4が左・右関係になる
ような横長垂直状であってもよい。いずれの場合も、レ
ーザービーム光2は、薄板状物1の表・裏両面から各々
照射するものとし、発光器5は薄板状物1の表・裏各側
にに設けてもよいが、1つの発光器5からのレーザービ
ーム光2を、ハーフミラーで分割して各側から照射する
ようにしてもよい。
In the illustrated embodiment, the thin plate-like object 1 when passing through the appearance inspection position has a front surface 3 and a back surface 4 in an upper / lower relationship, but the present invention is not limited to this, and the front surface 3 / rear surface 4 has a left / right relationship. It may have a horizontally long vertical shape. In either case, the laser beam 2 is emitted from both the front and back sides of the thin plate 1, and the light emitters 5 may be provided on both sides of the thin plate 1. The laser beam light 2 from one light emitter 5 may be divided by a half mirror and irradiated from each side.

【0029】また図示実施例では、薄板状物1をその長
手方向に搬送しているが、幅方向に搬送してもよく、そ
の場合にレーザービーム光2の反復照射は薄板状物1の
長手方向に行われる。
In the illustrated embodiment, the thin plate 1 is conveyed in the longitudinal direction, but it may be conveyed in the width direction, in which case the repeated irradiation of the laser beam 2 causes the thin plate 1 to be elongated. Done in the direction.

【0030】[0030]

【発明の効果】以上で明らかな如く、本発明に係る薄板
状物の外観検査方法は、次の効果を奏する。 イ)薄板状物の変形、特にリードピンの変形の有無を、
X方向・Y方向に限らず、Z方向についても正確に判別
できる。即ち、従来の1台のCCDテレビカメラ方式で
は、X・Y方向についての変形の有無の判別は可能であ
ったが、Z方向について検査が不可能であり、複数台の
CCDテレビカメラを設けて、複雑な画像処理を必要と
した。これに対して、本発明に係る薄板状物の外観検査
方法は、薄板状物の表・裏側からの各レーザービーム光
の各透過光に基づいて画像処理するので、2次元画像に
おける位相差から3次元情報を得られることになり、そ
れを基準パターンと比較照合することで容易・迅速かつ
正確に、リードピンのZ方向への変形を判別できるよう
になる。
As is apparent from the above, the appearance inspection method for a thin plate according to the present invention has the following effects. A) Check for deformation of the thin plate, especially for the lead pin.
Not only in the X and Y directions, but also in the Z direction can be accurately determined. That is, in the conventional one CCD TV camera system, it is possible to determine the presence or absence of deformation in the X and Y directions, but it is impossible to inspect in the Z direction, and a plurality of CCD TV cameras are provided. , Required complex image processing. On the other hand, in the appearance inspection method for a thin plate-like object according to the present invention, image processing is performed based on each transmitted light of each laser beam light from the front and back sides of the thin plate-like object. It becomes possible to obtain three-dimensional information, and by comparing and collating it with the reference pattern, the deformation of the lead pin in the Z direction can be easily, quickly and accurately determined.

【0031】ロ)上記薄板状物の変形の有無に加えて、
薄板状物の表・裏面の状態の良否も正確に判別できる。
即ち、従来のCCDテレビカメラ方式では、焦点深度が
一般に浅いため、薄板状物の表・裏面でキズか付着物か
の判別を正確に行えなかった。またCCDテレビカメラ
の画素子が比較的大きいので、解像度が悪く微細な凹凸
や汚れ等に関する情報が得られず、表・裏面の状態の良
否を正確に判別するのが難しかった。これに対して、本
発明に係る外観検査方法は、レーザービーム光を薄板状
物の表・裏側から反復走査して、各反射光により情報を
得るものである。そのため解像度がよいし、微細な凹凸
や汚れ等に関して高密度な情報が得られることになり、
これを基準パターンと比較照合することで、表・裏面の
状態の良否を正確に、例えばキズと汚れの違いについて
も判別できるようになる。また最終検査を目視に頼る必
要がなくなるので、外観検査の時間短縮もできる。
B) In addition to the presence or absence of deformation of the thin plate-like material,
It is possible to accurately determine the quality of the front and back surfaces of the thin plate.
That is, in the conventional CCD television camera system, the depth of focus is generally shallow, so that it is not possible to accurately determine whether the thin plate-shaped object is a scratch or an adhered object on the front and back surfaces. Further, since the image element of the CCD television camera is relatively large, it is difficult to accurately determine the quality of the front and back surfaces because the resolution is poor and information about fine irregularities and stains cannot be obtained. On the other hand, in the appearance inspection method according to the present invention, laser beam light is repeatedly scanned from the front and back sides of the thin plate-like object to obtain information from each reflected light. Therefore, the resolution is good, and high-density information about fine irregularities and stains can be obtained,
By comparing this with the reference pattern, it becomes possible to accurately determine the quality of the state of the front and back surfaces, for example, the difference between scratches and stains. Further, since it is not necessary to rely on visual inspection for the final inspection, the time required for the visual inspection can be shortened.

【0032】ハ)上記薄板状物の変形の有無や、表・裏
面の状態の良否に加えて、ピン固定接着剤等の固定位置
の良否も同時に判別可能である。即ち、従来の従来のC
CDテレビカメラ方式では、薄板状物の変形特にリード
ピンの変形の有無、表・裏面の状態の良否、ピン固定接
着剤等の固定位置の良否等の判別は、同時に行うことが
できず、各々別個に検査せざるを得なかった。これに対
して、本発明に係る外観検査方法は、表・表側からの各
透過光、または表・裏面の各反射光を、各受光センサー
受け画像処理して各2次元画像を得て、基準パターンと
比較照合することでピン固定用接着剤等の位置の良否を
も判別することができる。そのため、一度に、薄板状物
の変形の有無や、表・裏面の状態の良否やピン固定用接
着剤等の固定位置の良否について判別することもできる
ようになる。
(C) In addition to the presence or absence of deformation of the thin plate-like object and the quality of the front and back surfaces, the quality of the fixing position of the pin fixing adhesive or the like can be determined at the same time. That is, the conventional C
In the CD TV camera system, it is not possible to simultaneously judge whether the thin plate-like object is deformed, especially whether the lead pin is deformed, whether the condition of the front and back surfaces is good, or whether the fixing position of the pin fixing adhesive etc. is good. I had no choice but to inspect. On the other hand, in the appearance inspection method according to the present invention, each transmitted light from the front surface / front surface or each reflected light on the front surface / back surface is subjected to image processing by each light receiving sensor to obtain each two-dimensional image, and a reference image is obtained. By comparing and collating with the pattern, the quality of the position of the pin fixing adhesive or the like can be determined. Therefore, it is possible to determine whether or not the thin plate-like object is deformed, whether the front and back surfaces are in good condition, or whether the fixing position of the pin fixing adhesive or the like is good.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る薄板状物の外観検査方法の実施例
で、要部の一部縦断斜視図である。
FIG. 1 is a partially longitudinal perspective view of a main part in an embodiment of a method for inspecting the appearance of a thin plate-like material according to the present invention.

【図2】図1で示す実施例で、リードピンの変形の有無
を検査時の一部縦断正面図である。
FIG. 2 is a partially longitudinal front view of the embodiment shown in FIG. 1 when inspecting the lead pin for deformation.

【図3】図1で示す実施例で、薄板状物の表・裏面の良
否を検査時の一部縦断正面図である。
FIG. 3 is a partially longitudinal front view of the embodiment shown in FIG. 1 at the time of inspecting the quality of the front and back surfaces of the thin plate-like object.

【符号の説明】[Explanation of symbols]

1−薄板状物 2−レーザービーム光 2a
−透過光 2b−反射光 3−表面 4−
裏面 5−発光器 6−リードピン 7−
ピン固定用接着剤 8−受光センサー 9−空隙 10−
集光レンズ 11−ポリゴンミラー 12−fθレンズ 13
−ミラー 14−拡散板 z−直交する線 θ
−一定角度
1-Thin plate 2-Laser beam light 2a
-Transmitted light 2b-Reflected light 3-Surface 4-
Back side 5-Light emitter 6-Lead pin 7-
Pin fixing adhesive 8-Light receiving sensor 9-Void 10-
Condensing lens 11-Polygon mirror 12-fθ lens 13
-Mirror 14-diffuser z-orthogonal line θ
-Constant angle

フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H01L 21/66 J 7630−4M 23/50 C Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI Technical display location H01L 21/66 J 7630-4M 23/50 C

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】薄板状物1が外観検査位置を通過時に、該
薄板状物1の表・裏両側からレーザービーム光2を、そ
の表・裏面と直交する線zの前または後方から一定角度
θで、かつ搬送方向と直角方向へ定速で反復照射して、
表面3および裏面4を各々走査し、 表側と裏側からの各透過光2aを、裏側と表側の各受光
センサー5で受け電気信号に変えて画像処理し、該両2
次元画像についての位相差から3次元情報を得て、予め
入力した基準パターンとの比較照合で、Z方向へのリー
ドピン6の変形の有無を判別することを特徴とする、薄
板状物の外観検査方法。
1. When the thin plate 1 passes through a visual inspection position, a laser beam 2 is emitted from both the front and back sides of the thin plate 1, and a predetermined angle from the front or rear of a line z orthogonal to the front and back. Repeatedly irradiate at a constant speed in the direction perpendicular to the transport direction at θ.
The front surface 3 and the back surface 4 are each scanned, and the transmitted light 2a from the front side and the back side is converted into electric signals received by the respective light receiving sensors 5 on the back side and the front side, and image processing is performed.
Appearance inspection of a thin plate-like object, characterized in that three-dimensional information is obtained from the phase difference of the three-dimensional image, and whether or not the lead pin 6 is deformed in the Z direction is determined by comparing and collating with a previously input reference pattern. Method.
【請求項2】薄板状物1が外観検査位置を通過時に、該
薄板状物1の表・裏両側からレーザービーム光2を、そ
の表・裏面と直交する線zの前または後方から一定角度
θで、かつ搬送方向と直角方向へ定速で反復照射して、
表面3および裏面4を各々走査し、 表側と裏側からの各透過光2aを、裏側と表側の各受光
センサー5で受け電気信号に変えて画像処理し、該両2
次元画像についての位相差から3次元情報を得て、予め
入力した基準パターンとの比較照合で、Z方向へのリー
ドピン6の変形の有無を判別し、かつ、 表面3と裏面4からの各反射光2bを、表側と裏
側の各受光センサー5で受け電気信号に変えて画像処理
し、該各2次元画像を予め入力した基準パターンと比較
照合して、表面3と裏面4の各状態の良否を判別する
うにしたことを特徴とする、薄板状物の外観検査方法。
2. A laser beam 2 is emitted from both front and back sides of the thin plate 1 when the thin plate 1 passes an appearance inspection position, and a predetermined angle is applied from the front or rear of a line z orthogonal to the front and back. Repeatedly irradiate at a constant speed in the direction perpendicular to the transport direction at θ.
The front surface 3 and the back surface 4 are each scanned, and the transmitted light 2a from the front side and the back side is converted into electric signals received by the respective light receiving sensors 5 on the back side and the front side, and image processing is performed.
The three-dimensional information is obtained from the phase difference of the three-dimensional image, the presence or absence of deformation of the lead pin 6 in the Z direction is determined by comparison and collation with a previously input reference pattern, and each reflection from the front surface 3 and the back surface 4 is performed. The light 2b is received by each of the light-receiving sensors 5 on the front side and the back side, converted into an electric signal and image-processed, and each two-dimensional image is compared and collated with a previously input reference pattern to determine whether the states of the front surface 3 and the back surface 4 are good or bad. to determine the
A method for inspecting the appearance of a thin plate-shaped product, characterized by being
【請求項3】薄板状物1が外観検査位置を通過時に、該
薄板状物1の表・裏両側からレーザービーム光2を、そ
の表・裏面と直交する線zの前または後方から一定角度
θで、かつ搬送方向と直角方向へ定速で反復照射して、
表面3および裏面4を各々走査し、 表側と裏側からの各透過光2aを、裏側と表側の各受光
センサー5で受け電気信号に変えて画像処理し、該両2
次元画像についての位相差から3次元情報を得て、予め
入力した基準パターンとの比較照合で、Z方向へのリー
ドピン6の変形の有無を判別し、かつ、 表面3と裏面4からの各反射光2bを、表側と裏
側の各受光センサー5で受け電気信号に変えて画像処理
し、該各2次元画像を予め入力した基準パターンと比較
照合して、表面3と裏面4の各状態の良否を判別すると
ともに、 上記表・裏側からの各透過光2a、または表・裏面から
の各反射光2bを、各受光センサー5で受け電気信号に
変えて画像処理し、該各2次元画像を予め入力した基準
パターンと比較照合して、ピン固定用接着剤7等の位置
の良否を判別するようにしたことを特徴とする、薄板状
物の外観検査方法。
3. A laser beam 2 is emitted from both front and back sides of the thin plate 1 when the thin plate 1 passes an appearance inspection position, and a constant angle is applied from the front or rear of a line z orthogonal to the front and back. Repeatedly irradiate at a constant speed in the direction perpendicular to the transport direction at θ.
The front surface 3 and the back surface 4 are each scanned, and the transmitted light 2a from the front side and the back side is converted into electric signals received by the respective light receiving sensors 5 on the back side and the front side, and image processing is performed.
The three-dimensional information is obtained from the phase difference of the three-dimensional image, the presence or absence of deformation of the lead pin 6 in the Z direction is determined by comparison and collation with a previously input reference pattern, and each reflection from the front surface 3 and the back surface 4 is performed. The light 2b is received by each of the light-receiving sensors 5 on the front side and the back side, converted into an electric signal and image-processed, and each two-dimensional image is compared and collated with a previously input reference pattern to determine whether the states of the front surface 3 and the back surface 4 are good or bad. In addition to determining the above, each transmitted light 2a from the front and back sides, or each reflected light 2b from the front and back sides is received by each light receiving sensor 5 and converted into an electric signal for image processing, and each two-dimensional image is processed in advance. A method for inspecting the appearance of a thin plate-like object, characterized in that the quality of the position of the pin fixing adhesive 7 or the like is determined by comparing and collating with the input reference pattern.
JP4075104A 1992-02-13 1992-02-13 Appearance inspection method for thin plates Expired - Fee Related JPH07111332B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4075104A JPH07111332B2 (en) 1992-02-13 1992-02-13 Appearance inspection method for thin plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4075104A JPH07111332B2 (en) 1992-02-13 1992-02-13 Appearance inspection method for thin plates

Publications (2)

Publication Number Publication Date
JPH0626843A JPH0626843A (en) 1994-02-04
JPH07111332B2 true JPH07111332B2 (en) 1995-11-29

Family

ID=13566533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4075104A Expired - Fee Related JPH07111332B2 (en) 1992-02-13 1992-02-13 Appearance inspection method for thin plates

Country Status (1)

Country Link
JP (1) JPH07111332B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100453710B1 (en) * 2002-02-09 2004-10-20 국방과학연구소 Surface measurement apparatus and method thereof
JP2021060345A (en) * 2019-10-09 2021-04-15 オムロン株式会社 Sheet inspection device

Also Published As

Publication number Publication date
JPH0626843A (en) 1994-02-04

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