JPH0710947U - Terminal connection structure - Google Patents
Terminal connection structureInfo
- Publication number
- JPH0710947U JPH0710947U JP3875692U JP3875692U JPH0710947U JP H0710947 U JPH0710947 U JP H0710947U JP 3875692 U JP3875692 U JP 3875692U JP 3875692 U JP3875692 U JP 3875692U JP H0710947 U JPH0710947 U JP H0710947U
- Authority
- JP
- Japan
- Prior art keywords
- terminal member
- case
- connection structure
- terminal
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】
【目的】 端子接続構造のリードワイヤの接続強度を増
加する。
【構成】 本考案による端子接続構造では、ケース
（3）の支持壁（3c）に形成された嵌合溝（3c）は幅広
の底部（3d）と、底部（3d）から離間した位置において
内側に突出する突起部（3e）をそれぞれ備えた一対の対
向側部（3f）とを有する。端子部材（4）は支持壁（3
c）の嵌合溝（3c）の底部（3d）と突起部(3e)との間に
嵌合される幅広の係止部（4a）と、突起部（3e）を収容
する切欠部（4b）とを備えている。端子部材（4）と回
路基板（2）はリードワイヤ（6）により接続される。ケ
ース（3）に対して端子部材（4）が係合状態で埋設され
ているので、端子部材（4）に切断等の機械加工を施し
ても、端子部材（4）とケース（3）間に超音波振動を吸
収する間隙が生じない。したがって、端子部材（4）と
回路基板（2）とをリードワイヤ（6）で接続するとき、
リードワイヤ（6）は端子部材（4）に対して十分に大き
な接着強度で接続される。
(57) [Abstract] [Purpose] To increase the connection strength of the lead wire of the terminal connection structure. [Structure] In the terminal connection structure according to the present invention, the fitting groove (3c) formed in the supporting wall (3c) of the case (3) is located inside the wide bottom portion (3d) and at a position separated from the bottom portion (3d). And a pair of opposing side portions (3f) each having a protruding portion (3e) protruding to the. The terminal member (4) is attached to the support wall (3
A wide locking portion (4a) fitted between the bottom portion (3d) of the fitting groove (3c) and the protrusion portion (3e) of (c), and a notch portion (4b) for accommodating the protrusion portion (3e). ) And. The terminal member (4) and the circuit board (2) are connected by a lead wire (6). Since the terminal member (4) is embedded in the case (3) in an engaged state, even if the terminal member (4) is machined such as cut, the space between the terminal member (4) and the case (3) There is no gap for absorbing ultrasonic vibration. Therefore, when connecting the terminal member (4) and the circuit board (2) with the lead wire (6),
The lead wire (6) is connected to the terminal member (4) with a sufficiently large adhesive strength.
Description
【０００１】[0001]
本考案はリードワイヤにより電子部品の端子を接続する端子接続構造に関する ものである。 The present invention relates to a terminal connection structure for connecting terminals of electronic parts with lead wires.
【０００２】[0002]
従来の自動車用のハイブリッドＩＣは、図５に示すように金属製の放熱板（1 ）と、放熱板（1）に固着された回路基板（2）と、放熱板（1）及び回路基板（2 ）を包囲する樹脂製且つ絶縁性のケース（3）と、ケース（3）の上部にケース（ 3）の一部として固着された樹脂製の蓋（9）と、板状且つ金属製の端子部材（4 ）と、回路基板（2）上の電極（7）と端子部材（4）とを電気的に接続する金属 製の接続部材（5）を備えている。接続部材（5）と端子部材（4）は半田付け又 は溶接で接続されている。ケース（3）は枠壁（3a）及び枠壁（3a）を有する。 端子部材（4）は、ケース（3）の枠壁（3a）に形成された開口部（3b）を貫通す る。 As shown in FIG. 5, a conventional hybrid IC for an automobile has a metal heat sink (1), a circuit board (2) fixed to the heat sink (1), a heat sink (1) and a circuit board (1). 2) A resin and insulating case (3) that surrounds 2), a resin lid (9) fixed to the upper part of the case (3) as a part of the case (3), and a plate-shaped and metal case. The terminal member (4) is provided with a metal connecting member (5) for electrically connecting the electrode (7) on the circuit board (2) and the terminal member (4). The connection member (5) and the terminal member (4) are connected by soldering or welding. The case (3) has a frame wall (3a) and a frame wall (3a). The terminal member (4) penetrates the opening (3b) formed in the frame wall (3a) of the case (3).
【０００３】[0003]
ところで、この種のハイブリッドＩＣでも、生産性の向上を図るため端子部材 （4）と回路基板（2）上の電極（7）とを接続部材（5）に代わりアルミニウム等 のリードワイヤで接続することが近年試みられている。電極（7）と端子部材（4 ）とをリードワイヤを接続するときは、開口部（3b）内に支持した端子部材（4 ）を所定の長さに切断した後、リードワイヤに超音波振動を加えて端子部材（4 ）及び回路基板（2）上の電極（7）にこの端部を押し潰さなければならない。従 来では、リードワイヤに超音波振動が充分に伝達されず、端子部材（4）に対し て十分に大きな接着強度でリードワイヤを接続できない欠点があった。 Even in this type of hybrid IC, in order to improve productivity, the terminal member (4) and the electrode (7) on the circuit board (2) are connected by a lead wire such as aluminum instead of the connecting member (5). Has been attempted in recent years. When connecting the lead wire to the electrode (7) and the terminal member (4), cut the terminal member (4) supported in the opening (3b) to a specified length, and then ultrasonically vibrate the lead wire. This end must be crushed by the terminal member (4) and the electrode (7) on the circuit board (2). Conventionally, ultrasonic vibrations are not sufficiently transmitted to the lead wire, and the lead wire cannot be connected to the terminal member (4) with sufficiently large adhesive strength.
【０００４】 そこで、本考案はリードワイヤを端子部材に十分な接着強度で接続できる端子 接続構造を提供することを目的とする。Therefore, an object of the present invention is to provide a terminal connection structure capable of connecting a lead wire to a terminal member with sufficient adhesive strength.
【０００５】[0005]
本考案による端子接続構造では、枠壁及び該枠壁から内側に突出する支持壁を 有する絶縁性のケースと、該ケース内に配置された回路基板と、前記ケースの枠 壁を貫通し且つ前記ケースの外側から内側に延びて配置された板状の金属製の端 子部材とを備え、回路基板と端子部材が電気的に接続される。ケースの支持壁に 形成された嵌合溝は幅広の底部と、底部から離間した位置において内側に突出す る突起部を備えた一対の対向側部とを有する。端子部材は支持壁の嵌合溝の底部 と突起部との間に嵌合される幅広の係止部と、突起部を収容する切欠部とを備え る。端子部材と回路基板はリードワイヤにより接続される。嵌合溝は凸形断面又 はあり溝形断面を備える。端子部材の上面は支持壁の上面と実質的に同一平面で ある。リードワイヤは一対の対向側部の突起部間において端子部材と接続される 。 In the terminal connection structure according to the present invention, an insulating case having a frame wall and a support wall protruding inward from the frame wall, a circuit board arranged in the case, and a frame wall penetrating the frame wall of the case and The circuit board and the terminal member are electrically connected to each other by including a plate-shaped metal terminal member arranged so as to extend from the outside to the inside of the case. The fitting groove formed in the support wall of the case has a wide bottom portion and a pair of opposing side portions having a protrusion protruding inward at a position separated from the bottom portion. The terminal member includes a wide locking portion that is fitted between the bottom of the fitting groove of the support wall and the protrusion, and a notch that accommodates the protrusion. The terminal member and the circuit board are connected by a lead wire. The mating groove has a convex cross section or a grooved cross section. The upper surface of the terminal member is substantially flush with the upper surface of the support wall. The lead wire is connected to the terminal member between the pair of protrusions on the opposite side portions.
【０００６】[0006]
ケースの嵌合溝内に装着された端子部材の移動（振動）は突起部により防止さ れるので、端子部材に切断等の機械加工を施しても、端子部材と支持壁間に超音 波振動を吸収する間隙が生じない。したがって、端子部材と回路基板とをリード ワイヤで接続するとき、リードワイヤは端子部材に対して十分に大きな接着強度 で接続される。 Movement (vibration) of the terminal member mounted in the fitting groove of the case is prevented by the protrusions, so even if the terminal member is machined such as cut, ultrasonic vibration is generated between the terminal member and the support wall. There is no gap that absorbs. Therefore, when connecting the terminal member and the circuit board with the lead wire, the lead wire is connected to the terminal member with a sufficiently large adhesive strength.
【０００７】[0007]
以下、本考案による端子接続構造の実施例を図１〜図４について説明する。こ れらの図面では図５及び図６に示す部分と同一の箇所には同一の符号を付し、説 明を省略する。 Hereinafter, an embodiment of a terminal connection structure according to the present invention will be described with reference to FIGS. In these drawings, the same parts as those shown in FIGS. 5 and 6 are designated by the same reference numerals, and the description thereof will be omitted.
【０００８】 本考案の端子接続構造は、従来のものと端子部材の取付構造が異なる。図１〜 図３に示すように、本実施例による端子接続構造では、ケース（3）の支持壁（3 c）に形成された凸形断面の嵌合溝（3d）は幅広の底部（3e）と、底部（3e）か ら離間した位置において内側に突出する突起部（3f）をそれぞれ備えた一対の対 向側部（3g）とを有する。端子部材（4）は支持壁（3c）の嵌合溝（3d）の底部 （3e）と突起部（3f）との間に嵌合される幅広の係止部（4a）と、突起部（3f） を収容する切欠部（4b）とを備えている。突起部（3f）は支持壁（3c）の全突出 長さの一部に形成される。切欠部（4b）は突起部（3f）に対応させて端子部材（ 4）の長さ方向に形成されている。端子部材（4）と回路基板（2）上の電極とは 公知のワイヤボンディング法で結線されたリードワイヤ（6）により接続される 。図示の実施例では、端子部材（4）の一方の主面は支持壁（3c）の上面と実質 的に同一平面である。リードワイヤ（6）は一対の対向側部（3f）の突起部（3e ）間において端子部材（4）の一方の主面に圧着接続されている。The terminal connection structure of the present invention differs from the conventional one in the mounting structure of the terminal member. As shown in FIGS. 1 to 3, in the terminal connection structure according to the present embodiment, the fitting groove (3d) having a convex cross section formed on the support wall (3c) of the case (3) has a wide bottom (3e). ) And a pair of opposite side portions (3g) each having a protrusion (3f) protruding inward at a position separated from the bottom (3e). The terminal member (4) has a wide locking portion (4a) fitted between the bottom portion (3e) of the fitting groove (3d) of the support wall (3c) and the protruding portion (3f), and the protruding portion (4a). And a cutout (4b) for accommodating 3f). The protruding portion (3f) is formed on a part of the entire protruding length of the support wall (3c). The notch (4b) is formed in the length direction of the terminal member (4) so as to correspond to the protrusion (3f). The terminal member (4) and the electrode on the circuit board (2) are connected by a lead wire (6) connected by a known wire bonding method. In the illustrated embodiment, one main surface of the terminal member (4) is substantially flush with the upper surface of the support wall (3c). The lead wire (6) is crimp-connected to one main surface of the terminal member (4) between the protrusions (3e) of the pair of opposing side parts (3f).
【０００９】 本実施例では、端子部材(4)がケース（3）の嵌合溝（3d）に装着されて、その 長さ方向、幅方向及び厚み方向への移動（振動）が及び突起部（3e）によって防 止されている。このため、端子部材（4）と支持壁（3c）間に超音波振動を吸収 する間隙が生じない。したがって、端子部材（4）と回路基板（2）上の電極とを リードワイヤ（6）で接続するとき、リードワイヤ（6）は端子部材（4）に対し て十分に大きな接着強度で接続される。In this embodiment, the terminal member (4) is mounted in the fitting groove (3d) of the case (3), and the movement (vibration) in the length direction, the width direction and the thickness direction of the terminal member (4) and the protruding portion Prevented by (3e). Therefore, there is no gap between the terminal member (4) and the support wall (3c) that absorbs ultrasonic vibrations. Therefore, when connecting the terminal member (4) and the electrode on the circuit board (2) with the lead wire (6), the lead wire (6) is connected to the terminal member (4) with sufficiently large adhesive strength. It
【００１０】 本考案の実施態様は前記の実施例に限定されず、変更が可能である。例えば、 嵌合溝（3c）は図４Ａに示すように、あり溝形断面で形成してもよい。また、図 ４Ｂ、図４Ｃ及び図４Ｄに示すように、支持壁（3c）の上面から突出させてもよ い。また、切欠部（4b）を複数個離間させて間欠的に設けることもできる。この 場合、リードワイヤ（6）は対向する突起部(3f)の間又は隣り合う切欠部(4b)の 間に形成された間欠部分に接続するのが望ましい。The embodiment of the present invention is not limited to the above-mentioned embodiment, but can be modified. For example, the fitting groove (3c) may be formed with a dovetail groove-shaped cross section as shown in FIG. 4A. Further, as shown in FIGS. 4B, 4C and 4D, it may be projected from the upper surface of the support wall (3c). It is also possible to provide a plurality of notches (4b) spaced apart and to provide them intermittently. In this case, it is desirable that the lead wire (6) be connected to an intermittent portion formed between the protruding portions (3f) facing each other or between the notch portions (4b) adjacent to each other.
【００１１】[0011]
前述のように、本考案によれば、間隙が生ずることなく端子部材をケースに固 着できるので、リードワイヤを十分な接着強度で端子部材に接続することができ 、電子部品の品質を向上することができるとともに、リードワイヤを使用するこ とにより生産性の向上を図ることができる。 As described above, according to the present invention, since the terminal member can be fixed to the case without forming a gap, the lead wire can be connected to the terminal member with sufficient adhesive strength and the quality of the electronic component is improved. In addition, the productivity can be improved by using the lead wire.
【図１】 本考案による端子接続構造を示す電子部品の
部分断面図FIG. 1 is a partial sectional view of an electronic component showing a terminal connection structure according to the present invention.
【図２】 本考案による端子接続構造を示す電子部品の
部分平面図FIG. 2 is a partial plan view of an electronic component showing a terminal connection structure according to the present invention.
【図３】 図１のＡ−Ａ線に沿う断面図FIG. 3 is a sectional view taken along the line AA of FIG.
【図４】 本考案による端子構造の変形実施例を示す断
面図FIG. 4 is a sectional view showing a modified embodiment of the terminal structure according to the present invention.
【図５】 従来の端子接続構造を示すハイブリッドＩＣ
の部分断面図FIG. 5 is a hybrid IC showing a conventional terminal connection structure.
Partial cross section of
（2）・・回路基板、（3）・・ケース、（3a）・・枠
壁、（3b）・・支持壁、（3c）・・開口部 、（3d）・
・嵌合溝、（3e）・・底部、（3f）・・突起部、（4）
・・端子部材、（4a）・・係止部、（4b）・・切欠部、
（6）・・リードワイヤ、（9）・・蓋(2) ・ ・ Circuit board, (3) ・ ・ Case, (3a) ・ ・ Frame wall, (3b) ・ ・ Support wall, (3c) ・ ・ Opening part, (3d) ・
・ Mating groove, (3e) ・ ・ Bottom, (3f) ・ ・ Projection, (4)
..Terminal members, (4a) .. Locking parts, (4b) .. Notches,
(6) ・ ・ Lead wire, (9) ・ ・ Lid
Claims (4)
壁を有する絶縁性のケースと、該ケース内に配置された
回路基板と、前記ケースの枠壁を貫通し且つ前記ケース
の外側から内側に延びて配置された板状の金属製の端子
部材とを備え、前記回路基板と前記端子部材が電気的に
接続された端子接続構造において、 前記ケースの支持壁に形成された嵌合溝は幅広の底部
と、該底部から離間した位置において内側に突出する突
起部を備えた一対の対向側部とを有し、 前記端子部材は前記支持壁の嵌合溝の底部と前記突起部
との間に嵌合される幅広の係止部と、前記突起部を収容
する切欠部とを備え、 前記端子部材と回路基板はリードワイヤにより接続され
たことを特徴とする端子接続構造。1. An insulating case having a frame wall and a support wall protruding inward from the frame wall, a circuit board arranged in the case, and an outer side of the case penetrating the frame wall of the case. A plate-shaped metal terminal member arranged to extend inwardly from the circuit board, and in a terminal connection structure in which the circuit board and the terminal member are electrically connected, a fitting formed on a support wall of the case The groove has a wide bottom portion, and a pair of opposing side portions having a protrusion protruding inward at a position separated from the bottom portion, and the terminal member has a bottom portion of the fitting groove of the support wall and the protrusion portion. A terminal connection structure comprising: a wide locking portion fitted between the terminal member and the circuit board; and a notch portion for accommodating the protruding portion, wherein the terminal member and the circuit board are connected by a lead wire.
である「請求項１」に記載の端子接続構造。2. The terminal connection structure according to claim 1, wherein the fitting groove has a convex cross section or a dovetail groove cross section.
と実質的に同一平面である「請求項１」に記載の端子接
続構造。3. The terminal connection structure according to claim 1, wherein an upper surface of the terminal member is substantially flush with an upper surface of the support wall.
の突起部間において前記端子部材と接続された「請求項
１」に記載の端子接続構造。4. The terminal connection structure according to claim 1, wherein the lead wire is connected to the terminal member between the protrusions on the pair of opposed side portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992038756U JP2578530Y2 (en) | 1992-06-08 | 1992-06-08 | Terminal connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992038756U JP2578530Y2 (en) | 1992-06-08 | 1992-06-08 | Terminal connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0710947U true JPH0710947U (en) | 1995-02-14 |
| JP2578530Y2 JP2578530Y2 (en) | 1998-08-13 |
Family
ID=12534139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1992038756U Expired - Fee Related JP2578530Y2 (en) | 1992-06-08 | 1992-06-08 | Terminal connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2578530Y2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002134642A (en) * | 2000-10-20 | 2002-05-10 | Keihin Corp | Wire bonding terminal structure |
| JP2004022811A (en) * | 2002-06-17 | 2004-01-22 | Mitsubishi Electric Corp | Insert molding case and semiconductor device |
| JP2014157925A (en) * | 2013-02-15 | 2014-08-28 | Fuji Electric Co Ltd | Semiconductor device |
| WO2018047659A1 (en) * | 2016-09-07 | 2018-03-15 | 三菱電機株式会社 | Power semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5963447U (en) * | 1982-10-20 | 1984-04-26 | 松下電器産業株式会社 | hybrid integrated circuit |
| JPS60200544A (en) * | 1984-03-23 | 1985-10-11 | Fujitsu Ltd | Hybrid integrated circuit element |
-
1992
- 1992-06-08 JP JP1992038756U patent/JP2578530Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5963447U (en) * | 1982-10-20 | 1984-04-26 | 松下電器産業株式会社 | hybrid integrated circuit |
| JPS60200544A (en) * | 1984-03-23 | 1985-10-11 | Fujitsu Ltd | Hybrid integrated circuit element |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002134642A (en) * | 2000-10-20 | 2002-05-10 | Keihin Corp | Wire bonding terminal structure |
| JP2004022811A (en) * | 2002-06-17 | 2004-01-22 | Mitsubishi Electric Corp | Insert molding case and semiconductor device |
| JP2014157925A (en) * | 2013-02-15 | 2014-08-28 | Fuji Electric Co Ltd | Semiconductor device |
| WO2018047659A1 (en) * | 2016-09-07 | 2018-03-15 | 三菱電機株式会社 | Power semiconductor device |
| JPWO2018047659A1 (en) * | 2016-09-07 | 2018-11-22 | 三菱電機株式会社 | Power semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2578530Y2 (en) | 1998-08-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |