JPH09186473A - Fixing structure of printed board - Google Patents
Fixing structure of printed boardInfo
- Publication number
- JPH09186473A JPH09186473A JP34280195A JP34280195A JPH09186473A JP H09186473 A JPH09186473 A JP H09186473A JP 34280195 A JP34280195 A JP 34280195A JP 34280195 A JP34280195 A JP 34280195A JP H09186473 A JPH09186473 A JP H09186473A
- Authority
- JP
- Japan
- Prior art keywords
- board
- frame
- printed circuit
- circuit board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器のプリン
ト基板の固定構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board fixing structure for electronic equipment.
【０００２】[0002]
【従来の技術】以下、従来のプリント基板の固定構造に
ついて説明する。2. Description of the Related Art A conventional fixing structure for a printed circuit board will be described below.
【０００３】図４は、従来のプリント基板の固定構造の
分解斜視図であり、図５は、フレームにプリント基板が
組み込まれたときの斜視図である。また、図６は、さら
に半田付けされたときの半田付け部の断面図である。FIG. 4 is an exploded perspective view of a conventional printed circuit board fixing structure, and FIG. 5 is a perspective view when the printed circuit board is incorporated in a frame. Further, FIG. 6 is a cross-sectional view of the soldered portion when it is further soldered.
【０００４】図４において、１はフレームであり、２は
基板受け部、３は基板押さえ部である。４は、このフレ
ーム１に組み込まれるプリント基板であり、５は、この
プリント基板４に設けられた銅箔であり、プリント基板
４をフレーム１に半田接続するためのものである。In FIG. 4, 1 is a frame, 2 is a substrate receiving portion, and 3 is a substrate pressing portion. Reference numeral 4 is a printed circuit board incorporated in the frame 1, 5 is a copper foil provided on the printed circuit board 4, and is for connecting the printed circuit board 4 to the frame 1 by soldering.
【０００５】また、基板受け部２はフレーム１を突き出
し成形して設け、基板押さえ部３はトリミング加工して
設けていた。Further, the substrate receiving portion 2 is provided by projecting the frame 1, and the substrate pressing portion 3 is provided by trimming processing.
【０００６】以上のように構成されたプリント基板の固
定構造において、以下その組立について説明する。The assembly of the printed circuit board fixing structure configured as described above will be described below.
【０００７】すなわち、図４に示す様に、プリント基板
４をフレーム１に設けられた基板受け部２に載置し、図
５に示すように基板押さえ部３をフレーム１の内側へ押
し曲げることにより、プリント基板４を基板受け部２と
基板押さえ部３との間で押さえ固定していた。そしてそ
の後、図６に示すように押し曲げられた基板押さえ部３
と、この基板押さえ部３近傍に位置するプリント基板４
に設けられた銅箔５とを半田付け６にて固定していた。That is, as shown in FIG. 4, the printed board 4 is placed on the board receiving portion 2 provided on the frame 1, and the board pressing portion 3 is pushed and bent inward of the frame 1 as shown in FIG. Thus, the printed circuit board 4 is pressed and fixed between the substrate receiving portion 2 and the substrate pressing portion 3. Then, after that, as shown in FIG. 6, the substrate pressing portion 3 is bent and bent.
And the printed circuit board 4 located in the vicinity of the substrate pressing portion 3.
The copper foil 5 provided on the above was fixed by soldering 6.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、上記の
従来の構成では、図５に見られるように、プリント基板
４を基板押さえ部３と基板受け部２との上下方向のみに
よる固定であり、水平方向の固定は、半田付け６のみに
よる固定となっていた。このことは、水平方向には、フ
レーム１とプリント基板４との熱膨張や熱収縮による歪
をうけ、クラックの発生原因となるものであった。ま
た、基板押さえ部３と半田付け６により接続される銅箔
５はプリント基板４の端面にまで形成されているので、
図６にみられるように、外部からの応力を半田付け部７
が直接うけることになるので、半田付け部７に半田クラ
ックが発生しやすいという問題を有していた。However, in the above-mentioned conventional structure, as shown in FIG. 5, the printed circuit board 4 is fixed only by the vertical direction between the substrate pressing portion 3 and the substrate receiving portion 2, and the horizontal position is maintained. The direction was fixed only by soldering 6. This causes distortion in the horizontal direction due to thermal expansion and thermal contraction between the frame 1 and the printed circuit board 4, causing cracks. Moreover, since the copper foil 5 connected to the board pressing portion 3 by the soldering 6 is formed up to the end surface of the printed board 4,
As shown in FIG. 6, external stress is applied to the soldering portion 7
Therefore, there is a problem that solder cracks easily occur in the soldering portion 7.
【０００９】本発明は上記従来の問題を解決するもの
で、フレームとプリント基板の半田付け部の半田クラッ
クを防止することを目的とする。The present invention solves the above-mentioned conventional problems, and an object of the present invention is to prevent solder cracks in the soldering portions of the frame and the printed circuit board.
【００１０】[0010]
【課題を解決するための手段】この目的を達成するため
に本発明のプリント基板の固定構造は、金属製のフレー
ムと、このフレーム内に装着されるとともに電子部品が
実装されたプリント基板とからなり、前記フレーム側面
には突き出し成形してなる基板受け部と、この基板受け
部の略中央部に立設された基板係止部を有し、前記プリ
ント基板には前記基板係止部が貫通する孔を設け、この
孔に前記基板係止部を挿入して半田付けしたものであ
る。この構成により、フレームとプリント基板の半田付
け部の半田クラックを防止することができる。To achieve this object, a printed circuit board fixing structure of the present invention comprises a metal frame and a printed circuit board mounted in the frame and having electronic components mounted thereon. In addition, the side surface of the frame has a board receiving part formed by extrusion molding and a board locking part standing upright in the substantially central part of the board receiving part, and the board locking part penetrates the printed circuit board. A hole is provided, and the board engaging portion is inserted into this hole and soldered. With this configuration, it is possible to prevent solder cracks in the soldering portions of the frame and the printed circuit board.
【００１１】[0011]
【発明の実施の形態】本発明の請求項１に記載の発明
は、金属製のフレームと、このフレーム内に装着される
とともに電子部品が実装されたプリント基板とからな
り、前記フレーム側面には突き出し成形してなる基板受
け部と、この基板受け部の略中央部に立設された基板係
止部を有し、前記プリント基板には前記基板係止部が貫
通する孔を設け、この孔に前記基板係止部を挿入して半
田付けしたプリント基板の固定構造であり、基板係止部
をプリント基板の孔に挿入するので、基板係止部をひね
り固定することができ、孔と基板係止部のスキマがなく
なり、フレームとプリント基板との熱膨張や熱収縮差に
よる水平方向の歪をうけにくい。BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention comprises a metal frame and a printed circuit board mounted in the frame and having electronic components mounted thereon, and a side surface of the frame. The printed circuit board has a board receiving portion formed by extrusion molding and a board locking portion provided upright in a substantially central portion of the board receiving portion. The printed board is provided with a hole through which the board locking portion passes. It is a printed circuit board fixing structure in which the board engaging portion is inserted into and soldered to the board. Since the board engaging portion is inserted into the hole of the printed board, the board engaging portion can be twisted and fixed, and the hole and the board Clearance of the locking part is eliminated, and horizontal distortion due to thermal expansion and thermal contraction difference between the frame and the printed circuit board is less likely to occur.
【００１２】請求項２に記載の発明は、プリント基板上
に設けられ、基板係止部が挿入される孔の周りに設けら
れた銅箔は、フレームとの間に間隔を有する請求項１に
記載のプリント基板の固定構造であり、基板係止部が挿
入される孔の周りに設けられた銅箔はフレームとの間に
間隔を有しており、基板端面とフレーム側面とが直接に
接して半田付けされないので、外部からの応力を半田付
け部が直接うけない。According to a second aspect of the present invention, the copper foil provided on the printed circuit board and provided around the hole into which the board engaging portion is inserted has a space from the frame. In the printed circuit board fixing structure described above, the copper foil provided around the hole into which the board locking portion is inserted has a gap between the frame and the board end surface and the frame side surface are in direct contact with each other. Since it is not soldered, the soldering part is not directly subjected to external stress.
【００１３】請求項３に記載の発明は、基板係止部に対
向するフレーム側面部に開口部を設けた請求項１に記載
のプリント基板の固定構造であり、フレーム側面部に開
口部があるので外部からの応力を吸収しやすい。According to a third aspect of the present invention, there is provided a printed circuit board fixing structure according to the first aspect, wherein an opening is provided in a side surface of the frame facing the board locking portion. Therefore, it is easy to absorb external stress.
【００１４】請求項４に記載の発明は、基板係止部が上
方に向かって広がったテーパーを有する請求項１に記載
のプリント基板の固定構造であり、基板係止部が上方に
向かって広がったテーパーを有するので、基板係止部を
ひねり固定する事により、プリント基板の水平方向と上
下方向の固定を同時に行うことができ、フレームとプリ
ント基板との熱膨張や熱収縮差による歪を水平方向と上
下方向の両方向に渡ってうけにくい。According to a fourth aspect of the invention, there is provided a printed circuit board fixing structure according to the first aspect, in which the board engaging portion has a taper that expands upward, and the board engaging portion expands upward. Since it has a taper, the printed circuit board can be fixed horizontally and vertically by twisting and fixing the board locking part, and the distortion due to the thermal expansion and thermal contraction difference between the frame and the printed circuit board can be kept horizontal. Difficult to receive in both the vertical and vertical directions.
【００１５】請求項５に記載の発明の基板受け部は、フ
レームに対して略平行とするとともに、この平行部分の
略中央に基板係止部を設けた請求項１に記載のプリント
基板の固定構造であり、基板係止部が基板受け部の平行
部分の略中央に設けられており、基板係止部は湾曲して
いないので、基板係止部をひねる応力が小さくでき、か
つ、挿入される孔も湾曲孔でなく、簡単な角孔でよい。
また、基板受け部は、フレームに対して、略平行に設け
られているので、プリント基板の設計自由度が大きくな
る。According to a fifth aspect of the present invention, the board receiving portion is substantially parallel to the frame, and the board locking portion is provided substantially at the center of the parallel portion. The structure is such that the board locking part is provided in the approximate center of the parallel part of the board receiving part, and the board locking part is not curved, so the stress that twists the board locking part can be reduced and the board locking part can be inserted. The hole to be used is not a curved hole but may be a simple square hole.
Further, since the board receiving portion is provided substantially parallel to the frame, the degree of freedom in designing the printed board is increased.
【００１６】以下、本発明の実施の形態について、図１
から図３を用いて説明する。図１は、本発明のプリント
基板の固定構造の分解斜視図である。図２は、本発明の
プリント基板の固定構造のフレーム１１にプリント基板
１６が組み込まれたときの斜視図である。図３は、さら
に半田付けされたときの断面図である。Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. FIG. 1 is an exploded perspective view of a printed circuit board fixing structure of the present invention. FIG. 2 is a perspective view when the printed circuit board 16 is incorporated in the frame 11 of the printed circuit board fixing structure of the present invention. FIG. 3 is a cross-sectional view when further soldered.
【００１７】図１から図３において、１１はフレームで
あり、１２はこのフレーム１１の側面に突き出し成形し
て設けられた基板受け部である。１３は、この基板受け
部の略中央部に立設された基板係止部である。１４は、
基板係止部１３に対向するフレーム１１の側面に設けら
れた開口部である。この基板係止部１３には上方に向か
って広がったテーパー１５が設けられている。１６は、
フレーム１１内に装着されるプリント基板であり、１７
は、このプリント基板１６に設けられるとともに、基板
係止部１３が貫通する孔である。１８は、この孔１７の
周りに設けられた銅箔であり、プリント基板１６の端面
との間に略１mm間隔を有している。In FIGS. 1 to 3, 11 is a frame, and 12 is a substrate receiving portion provided on the side surface of the frame 11 by extrusion molding. Reference numeral 13 denotes a board engaging portion which is erected at a substantially central portion of the board receiving portion. 14 is
It is an opening provided on the side surface of the frame 11 facing the substrate locking portion 13. The board locking portion 13 is provided with a taper 15 that widens upward. 16 is
A printed circuit board mounted in the frame 11,
Is a hole provided in the printed board 16 and through which the board locking portion 13 penetrates. Reference numeral 18 is a copper foil provided around the hole 17 and has a space of approximately 1 mm from the end face of the printed board 16.
【００１８】以上のように構成されたプリント基板の固
定構造について、図１〜図３を用いて、その組立を説明
する。Assembling of the printed circuit board fixing structure configured as described above will be described with reference to FIGS.
【００１９】まず、金属製フレーム１１内にプリント基
板１６を固定するときに、フレーム１１の基板受け部１
２に設けられた基板係止部１３をプリント基板１６内に
設けられた孔１７に挿入する。そして、この基板係止部
１３をひねり、プリント基板１６をフレーム１１内に仮
固定する。このあと、孔１７の周りに設けられた銅箔１
８と基板係止部１３とを半田付け１９により固定する。First, when fixing the printed circuit board 16 in the metal frame 11, the board receiving portion 1 of the frame 11 is fixed.
The board locking portion 13 provided on the second board 2 is inserted into the hole 17 provided in the printed board 16. Then, the printed circuit board 16 is temporarily fixed in the frame 11 by twisting the board engaging portion 13. After this, the copper foil 1 provided around the hole 17
8 and the board engaging portion 13 are fixed by soldering 19.
【００２０】つまり、基板係止部１３が孔１７内でひね
られることによって、基板係止部１３の端面が孔１７の
端面と接するので、基板係止部１３と孔１７との水平方
向のスキマがなくなる。このスキマがなくなることによ
って、半田付け部２０は、フレーム１１とプリント基板
１６との熱膨張や熱収縮差による水平方向の歪をうけな
くなるので、フレーム１１とプリント基板１６の半田付
け部２０の半田クラックを防止することができる。That is, since the end surface of the board engaging portion 13 comes into contact with the end surface of the hole 17 when the board engaging portion 13 is twisted in the hole 17, a horizontal gap between the board engaging portion 13 and the hole 17 is formed. Disappears. By eliminating this gap, the soldering portion 20 is not subject to horizontal distortion due to the difference in thermal expansion and thermal contraction between the frame 11 and the printed circuit board 16, so that the soldering portion 20 of the frame 11 and the printed circuit board 16 is soldered. It is possible to prevent cracks.
【００２１】また、同時に、前記ひねりによって基板係
止部１３の上方に向かって広がったテーパー１５はプリ
ント基板１６を基板受け部１２の方向に押さえつけるの
で、基板係止部１３とプリント基板１６のスキマがなく
なる。このスキマがなくなることによって、半田付け部
２０は、フレーム１１とプリント基板１６との熱膨張や
熱収縮差による上下方向の歪をうけないので、フレーム
１１とプリント基板１６の半田付け部の半田クラックを
防止することができる。At the same time, the taper 15 which spreads upwards from the board engaging portion 13 by the above-mentioned twist presses the printed board 16 toward the board receiving portion 12, so that the gap between the board engaging portion 13 and the printed board 16 is reduced. Disappears. By eliminating this gap, the soldering portion 20 is not subject to vertical strain due to the difference in thermal expansion and thermal contraction between the frame 11 and the printed circuit board 16, and therefore solder cracks in the soldered portion between the frame 11 and the printed circuit board 16 are not caused. Can be prevented.
【００２２】なお、プリント基板１６の孔１７の周りに
設けられた銅箔１８は、フレーム１１との間に間隔Ａ
（本実施の形態では略１mm）を有するので、半田付け部
２０はフレーム１１と接することなく、間隔Ａをおいて
半田付けされる。この為、外部からの応力がフレーム１
１に加わったとしても半田付け部２０がフレーム１１と
接していないので、その応力をうけず、半田付け部２０
の半田クラックを防止することができる。The copper foil 18 provided around the holes 17 of the printed circuit board 16 has a space A between the copper foil 18 and the frame 11.
Since the soldering portion 20 has a length of about 1 mm in this embodiment, the soldering portion 20 is soldered at a distance A without contacting the frame 11. Therefore, external stress is applied to the frame 1.
Since the soldering portion 20 is not in contact with the frame 11 even if the soldering portion 20 is applied to
It is possible to prevent the solder crack.
【００２３】また、同時に、基板係止部１３が対向する
フレーム１１の側面部に開口部１４を設けているので、
外部からの応力がフレーム１１に加わっても、開口部１
４で応力による歪を吸収するので、半田付け部２０はそ
の応力をうけず、半田付け部２０の半田クラックを防止
することができる。At the same time, since the opening portion 14 is provided in the side surface portion of the frame 11 facing the substrate locking portion 13,
Even if external stress is applied to the frame 11, the opening 1
Since the strain due to the stress is absorbed in 4, the soldering portion 20 does not receive the stress, and the solder crack of the soldering portion 20 can be prevented.
【００２４】ここで、基板係止部１３が基板受け部１２
の平行部の略中央部に設けられており、基板係止部１３
は湾曲せず、基板係止部１３を挿入する孔１７も湾曲孔
でなく単純な角孔となるので、プリント基板１６の金型
が複雑にならず、単純化でき、金型コストが低減でき
る。Here, the board engaging portion 13 is replaced by the board receiving portion 12.
Is provided substantially in the center of the parallel portion of the board locking portion 13
Is not curved, and the hole 17 for inserting the substrate locking portion 13 is not a curved hole but a simple square hole. Therefore, the mold of the printed circuit board 16 is not complicated and can be simplified, and the mold cost can be reduced. .
【００２５】また、基板係止部１３が湾曲していない板
形状であるので、ひねりのための応力が小さくなり、ひ
ねり動作が容易に行われる。Further, since the board engaging portion 13 has a plate shape which is not curved, the stress for twisting is reduced, and the twisting operation is easily performed.
【００２６】以上のように本実施の形態によれば、プリ
ント基板１６の銅箔１８とフレーム１１の基板係止部１
３との半田付け部２０の半田クラックを防止することが
できる。As described above, according to this embodiment, the copper foil 18 of the printed board 16 and the board engaging portion 1 of the frame 11 are provided.
It is possible to prevent a solder crack in the soldering portion 20 with the solder 3.
【００２７】[0027]
【発明の効果】以上のように本発明によれば、金属製の
フレームと、このフレーム内に装着されるとともに電子
部品が実装されたプリント基板とからなり、前記フレー
ム側面には突き出し成形してなる基板受け部と、この基
板受け部の略中央部に設けられた基板係止部を有し、前
記プリント基板には前記基板係止部が貫通する孔を設
け、この孔に前記基板係止部を挿入して半田付けしたも
のであり、基板係止部をプリント基板の孔に挿入し、基
板係止部をひねり固定することにより、孔と基板係止部
のスキマがなくなるので、フレームとプリント基板との
熱膨張や熱収縮差による水平方向の歪をうけず、プリン
ト基板の銅箔とフレームの基板係止部との半田付け部の
半田クラックを防止することができる。As described above, according to the present invention, a metal frame and a printed circuit board mounted on the frame and having electronic components mounted thereon are formed by extrusion molding on the side surface of the frame. A board receiving portion and a board locking portion provided at a substantially central portion of the board receiving portion. The printed board has a hole through which the board locking portion passes, and the board locking portion is provided in the hole. The parts are inserted and soldered.By inserting the board locking part into the hole of the printed circuit board and twisting and fixing the board locking part, there is no gap between the hole and the board locking part. It is possible to prevent solder cracks in the soldering portion between the copper foil of the printed board and the board engaging portion of the frame without being subjected to horizontal distortion due to thermal expansion or thermal contraction difference with the printed board.
【図１】本発明の一実施の形態によるプリント基板の固
定構造の要部分解斜視図FIG. 1 is an exploded perspective view of a main part of a printed circuit board fixing structure according to an embodiment of the present invention.
【図２】同、フレームにプリント基板が組み込まれたと
きの要部斜視図FIG. 2 is a perspective view of an essential part when the printed circuit board is incorporated in the frame.
【図３】同、半田付けされたときの要部断面図FIG. 3 is a sectional view of the main part when soldered.
【図４】従来のプリント基板の固定構造の要部分解斜視
図FIG. 4 is an exploded perspective view of a main part of a conventional printed circuit board fixing structure.
【図５】同、要部斜視図FIG. 5 is a perspective view of relevant parts.
【図６】同、要部断面図FIG. 6 is a sectional view of a main part of the same
１１ フレーム １２ 基板受け部 １３ 基板係止部 １６ プリント基板 １７ 孔 １８ 銅箔 11 frame 12 board receiving part 13 board engaging part 16 printed board 17 hole 18 copper foil
Claims (5)
装着されるとともに電子部品が実装されたプリント基板
とからなり、前記フレーム側面には突き出し成形してな
る基板受け部と、この基板受け部の略中央部に立設され
た基板係止部を有し、前記プリント基板には前記基板係
止部が貫通する孔を設け、この孔に前記基板係止部を挿
入して半田付けしたプリント基板の固定構造。1. A substrate receiving part formed of a metal frame and a printed circuit board mounted in the frame and having electronic components mounted thereon, the board receiving part formed on the side surface of the frame by extrusion molding, and the substrate receiving part. A printed circuit board having a board locking portion that is erected approximately in the center of the printed circuit board, a hole through which the board locking portion penetrates, and the board locking portion is inserted into this hole and soldered. Board fixing structure.
が挿入される孔の周りに設けられた銅箔は、フレームと
の間に間隔を有する請求項１に記載のプリント基板の固
定構造。2. The printed circuit board fixing structure according to claim 1, wherein the copper foil provided on the printed circuit board and provided around the hole into which the board locking portion is inserted has a space from the frame. .
開口部を設けた請求項１に記載のプリント基板の固定構
造。3. The printed circuit board fixing structure according to claim 1, wherein an opening is provided in a side surface of the frame facing the board locking portion.
ーパーを有する請求項１に記載のプリント基板の固定構
造。4. The printed circuit board fixing structure according to claim 1, wherein the board locking portion has a taper that widens upward.
するとともに、この平行部分の略中央に基板係止部を設
けた請求項１に記載のプリント基板の固定構造。5. The printed circuit board fixing structure according to claim 1, wherein the board receiving portion is substantially parallel to the frame, and the board locking portion is provided substantially at the center of the parallel portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34280195A JPH09186473A (en) | 1995-12-28 | 1995-12-28 | Fixing structure of printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34280195A JPH09186473A (en) | 1995-12-28 | 1995-12-28 | Fixing structure of printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09186473A true JPH09186473A (en) | 1997-07-15 |
Family
ID=18356609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34280195A Pending JPH09186473A (en) | 1995-12-28 | 1995-12-28 | Fixing structure of printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09186473A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999027762A3 (en) * | 1997-11-25 | 1999-10-07 | Lk Products Oy | A frame structure to equipment operating at high frequencies |
| CN103346136A (en) * | 2013-06-05 | 2013-10-09 | 吉林华微斯帕克电气有限公司 | Power module and packaging method thereof |
| JP2014502426A (en) * | 2010-12-08 | 2014-01-30 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electric circuit device and method of manufacturing electric circuit device |
-
1995
- 1995-12-28 JP JP34280195A patent/JPH09186473A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999027762A3 (en) * | 1997-11-25 | 1999-10-07 | Lk Products Oy | A frame structure to equipment operating at high frequencies |
| JP2014502426A (en) * | 2010-12-08 | 2014-01-30 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electric circuit device and method of manufacturing electric circuit device |
| CN103346136A (en) * | 2013-06-05 | 2013-10-09 | 吉林华微斯帕克电气有限公司 | Power module and packaging method thereof |
| CN103346136B (en) * | 2013-06-05 | 2016-01-27 | 吉林华微斯帕克电气有限公司 | Power model and method for packing thereof |
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