JPH07109039B2 - Multilayer composite coating treatment method - Google Patents
Multilayer composite coating treatment methodInfo
- Publication number
- JPH07109039B2 JPH07109039B2 JP61149026A JP14902686A JPH07109039B2 JP H07109039 B2 JPH07109039 B2 JP H07109039B2 JP 61149026 A JP61149026 A JP 61149026A JP 14902686 A JP14902686 A JP 14902686A JP H07109039 B2 JPH07109039 B2 JP H07109039B2
- Authority
- JP
- Japan
- Prior art keywords
- bright
- semi
- treatment method
- coating treatment
- composite coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Casings For Electric Apparatus (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】 〔概要〕 多層複合化被膜処理方法であって、Al素材の表面のAl2O
3膜被覆に孔明けし、半光沢Niを孔から突出しない程度
まで成長させた後、半光沢Niの上に光沢Niを重ねてメッ
キし、Ni配線を安定化することを可能とする。A DETAILED DESCRIPTION OF THE INVENTION [Overview] multilayer composite coating treatment method, the surface of the Al material Al 2 O
It is possible to stabilize the Ni wiring by making holes in the three- layer coating and growing semi-glossy Ni to the extent that it does not protrude from the holes, and then plating glossy Ni over semi-glossy Ni by plating.
本発明は、Al素材にAl2O3膜を形成し、更にNi配線をメ
ッキして形成する多層複合化被膜処理方法に関し、詳し
くは、Niメッキの方法に関するものである。TECHNICAL FIELD The present invention relates to a multilayer composite coating treatment method of forming an Al 2 O 3 film on an Al material and further plating Ni wiring, and more particularly to a Ni plating method.
電算機の筐体（又は、フレーム及びカバー類等）とし
て、Al素材に多層複合化被膜処理によりNi配線を局部的
に形成することが行われている。As a casing (or a frame, a cover, etc.) of a computer, Ni wiring is locally formed on an Al material by a multilayer composite coating treatment.
そこで、従来この種の被膜処理は第２図に示すように行
っている。即ち、Al素材１の表面に陽極酸化法で絶縁性
のAl2O3膜２を被覆し、このAl2O3膜２の所定の個所にAl
素材１に達する孔３を、例えばレーザ加工により明け
る。そして、Niメッキ工程では半光沢Niメッキ液の浴槽
に入れて、電流密度と時間を定め、孔３内部に半光沢Ni
4を析出させて、Ni配線５を形成するようになってい
る。Therefore, conventionally, this type of coating treatment is performed as shown in FIG. In other words, by coating an Al 2 O 3 film 2 of insulating by anodic oxidation on the surface of the Al raw material 1, Al in a predetermined location of the the Al 2 O 3 film 2
The hole 3 reaching the material 1 is opened by, for example, laser processing. Then, in the Ni plating process, the bath is filled with a semi-bright Ni plating solution, the current density and time are determined, and the semi-bright Ni plating is performed inside the holes 3.
4 is deposited to form the Ni wiring 5.
〔発明が解決しようとする問題点〕 ところで、上記従来の方法によると、半光沢Ni4を最後
迄成長させるため、端部4aが図示のように半球状に析出
する。従って、障害物に衝突し易くなり、且つ衝突時に
容易に座屈破損してLSIショート等の原因になる。[Problems to be Solved by the Invention] By the way, according to the above-mentioned conventional method, since the semi-gloss Ni4 is grown to the end, the end 4a is deposited in a hemispherical shape as shown in the drawing. Therefore, it becomes easy to collide with an obstacle, and buckles and breaks easily at the time of collision, which causes an LSI short circuit or the like.
本発明は、このような点に鑑みて創作されたもので、Ni
配線を安定的に形成することが可能な多層複合化被膜処
理方法を提供することを目的としている。The present invention was created in view of such points, and Ni
It is an object of the present invention to provide a multilayer composite coating treatment method capable of stably forming wiring.
上記目的を達成するため、本発明は実施例に対応した第
１図に示すように、 Al素材１の表面のAl2O3膜に孔３を明け、該孔３に半光
沢Ni4を析出する処理方法において、 半光沢Ni4を孔から突出しない程度まで成長させ、 次いで、半光沢Ni4の上に光沢Ni6を重ねてメッキする多
層複合化被膜処理方法を提供することにより達成され
る。In order to achieve the above object, according to the present invention, as shown in FIG. 1 corresponding to the embodiment, holes 3 are formed in the Al 2 O 3 film on the surface of the Al raw material 1, and semi-gloss Ni 4 is deposited in the holes 3. In the treatment method, it is achieved by providing a multi-layer composite coating treatment method in which semi-bright Ni4 is grown to the extent that it does not protrude from the holes, and then bright Ni6 is overlaid and plated on the semi-bright Ni4.
上記方法により、半光沢Ni4と光沢Ni6によりNi配線５が
形成され、端部6aは光沢Ni6の組成で平滑化する。By the above method, the Ni wiring 5 is formed by the semi-bright Ni4 and the bright Ni6, and the end portion 6a is smoothed with the composition of the bright Ni6.
こうして本発明では、Ni配線端部6aが平滑化して座屈等
を防ぐことが可能となる。Thus, in the present invention, the Ni wiring end portion 6a can be smoothed and buckling or the like can be prevented.
以下、本発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図において、Niメッキ工程について説明すると、Ｉ
とIIの二段階工程になっている。Ｉのメッキ工程では第
２図と同様にAl素材１のAl2O3膜２に孔３を明けたもの
を半光沢Niメッキ液に入れ、電流や時間を定めて孔３内
部の途中迄半光沢Ni4を析出して成長させる。次いで、I
Iのメッキ工程で上述のものを光沢Niメッキ液に入れ、
半光沢Ni4の上に重ねて光沢Ni6を析出させ、その組成に
より平滑化した端部6aを形成する。Referring to FIG. 1, the Ni plating process will be described.
It is a two-step process of and II. In the plating process of I, the Al 2 O 3 film 2 of the Al material 1 having the holes 3 formed therein is placed in a semi-bright Ni plating solution as in FIG. Precipitate and grow bright Ni4. Then I
In the plating process of I, put the above into the bright Ni plating solution,
Gloss Ni6 is deposited on the semi-gloss Ni4 to form a smoothed end portion 6a according to its composition.
こうして、半光沢Ni4と光沢Ni6でNi配線５を形成するの
である。In this way, the Ni wiring 5 is formed from the semi-bright Ni4 and the bright Ni6.
以上述べてきたように、本発明によれば、 Al基材の表面のAl2O3膜に穿孔した孔内に、半光沢Niを
孔から突出しない程度まで成長させた後、半光沢Niの上
に光沢Niを重ねてメッキするため、多層複合化でNi配線
を形成する場合に、端部が平滑化するので座屈等の不具
合を生じなくなる。As described above, according to the present invention, after the semi-bright Ni is grown to the extent that it does not protrude from the holes in the holes drilled in the Al 2 O 3 film on the surface of the Al substrate, Since glossy Ni is overlaid and plated, the edges are smoothed when Ni wiring is formed in a multi-layered composite, so that problems such as buckling do not occur.
また、Al2O3膜に孔を明ける工程自体が、後に続く半光
沢Niを成長させる工程の洗浄工程ともなり、Niメッキ層
の密着性を高めて膜信頼性を向上させ、かつ、Ni配線の
形成の効率を向上させることができるという効果を有す
るものである。Also, the process of making holes in the Al 2 O 3 film itself becomes a cleaning process in the process of growing the semi-bright Ni that follows, improving the adhesion of the Ni plating layer and improving the film reliability, and the Ni wiring. This has the effect of improving the efficiency of formation of.
さらに、半光沢Niに対し同種類の光沢Niを用い、その組
成により平滑化する方法であるから、実施が容易であ
り、違和感も生じない。Furthermore, since it is a method of using the same type of glossy Ni as the semi-glossy Ni and smoothing it by the composition, it is easy to carry out and no discomfort occurs.
第１図は本発明の方法の実施例を示す図、 第２図は従来例を示す図である。 第１図において、 １はAl素材、 ２はAl2O3膜、 ３は孔、 ４は半光沢Ni、 ６は光沢Niである。FIG. 1 is a diagram showing an embodiment of the method of the present invention, and FIG. 2 is a diagram showing a conventional example. In FIG. 1, 1 is an Al material, 2 is an Al 2 O 3 film, 3 is a hole, 4 is semi-bright Ni, and 6 is bright Ni.
Claims (1)
2O3膜に孔を明け、該孔に半光沢Niを析出する処理方法
において、 半光沢Niを孔から突出しない程度まで成長させ、 次いで、半光沢Niの上に光沢Niを重ねてメッキする多層
複合化被膜処理方法。1. An Al formed on the surface of an Al material by an anodic oxidation method.
2 In a treatment method in which a hole is formed in an O 3 film and semi-bright Ni is deposited in the hole, the semi-bright Ni is grown to such an extent that it does not protrude from the hole, and then the bright Ni is layered and plated on the semi-bright Ni. Multi-layer composite coating treatment method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61149026A JPH07109039B2 (en) | 1986-06-25 | 1986-06-25 | Multilayer composite coating treatment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61149026A JPH07109039B2 (en) | 1986-06-25 | 1986-06-25 | Multilayer composite coating treatment method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS637394A JPS637394A (en) | 1988-01-13 |
| JPH07109039B2 true JPH07109039B2 (en) | 1995-11-22 |
Family
ID=15466044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61149026A Expired - Lifetime JPH07109039B2 (en) | 1986-06-25 | 1986-06-25 | Multilayer composite coating treatment method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07109039B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0820871B2 (en) * | 1989-01-19 | 1996-03-04 | ヤマハ株式会社 | Electronic musical instrument |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158890A (en) * | 1980-05-13 | 1981-12-07 | Corona Kogyo Kk | Colorful aluminum having bright plated surface and its production |
| JPS59211599A (en) * | 1984-04-24 | 1984-11-30 | Yoshio Koike | Product provided with specular surface by plating using aluminum as raw material and its production |
-
1986
- 1986-06-25 JP JP61149026A patent/JPH07109039B2/en not_active Expired - Lifetime
Non-Patent Citations (1)
| Title |
|---|
| 日本めっき技術研究会編「現場技術者のための実用めっき」（昭５３−９−２５）槇書店Ｐ．２４８−２５４，１６３−１６８ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS637394A (en) | 1988-01-13 |
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