JPH07107658B2 - Electronic device cooling system - Google Patents

Electronic device cooling system

Info

Publication number
JPH07107658B2
JPH07107658B2 JP1079274A JP7927489A JPH07107658B2 JP H07107658 B2 JPH07107658 B2 JP H07107658B2 JP 1079274 A JP1079274 A JP 1079274A JP 7927489 A JP7927489 A JP 7927489A JP H07107658 B2 JPH07107658 B2 JP H07107658B2
Authority
JP
Japan
Prior art keywords
electronic device
cooled
cooling
unit
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1079274A
Other languages
Japanese (ja)
Other versions
JPH02257207A (en
Inventor
司 水野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1079274A priority Critical patent/JPH07107658B2/en
Publication of JPH02257207A publication Critical patent/JPH02257207A/en
Publication of JPH07107658B2 publication Critical patent/JPH07107658B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、電子計算機等の電子装置の放熱に利用される
冷却装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device used for heat dissipation of an electronic device such as an electronic computer.

(従来の技術) 近年、電子計算機等の電子装置においては、装置の高性
能化のためにディジタル集積回路の高集積化と実装の高
密度化が進められており、これに伴い装置内の発熱密度
も急速に上昇しつつある。これに対処するため、電子装
置の冷却方式も従来の空冷方式から強制循環式の液冷方
式へと移行している。
(Prior Art) In recent years, in electronic devices such as electronic computers, higher integration of digital integrated circuits and higher packaging density have been promoted in order to improve the performance of the devices. Density is also rising rapidly. In order to deal with this, the cooling method of electronic devices is also shifting from the conventional air cooling method to the forced circulation type liquid cooling method.

この液冷方式では、電子装置に冷媒を送り出すと共にこ
の電子装置から戻ってくる温度の上昇した冷媒を冷却し
再び電子装置へ環流させる冷媒の強制循環が行われる。
この冷却装置に故障が発生して冷却機能が停止すると、
電子装置がその動作温度の上昇によって機能が劣化した
り破壊されたりするおそれがある。
In this liquid cooling system, the coolant is sent to the electronic device, and at the same time, the coolant having a raised temperature returned from the electronic device is cooled and forcedly circulated to the electronic device so as to be circulated again.
If this cooling device fails and the cooling function stops,
There is a risk that the electronic device may deteriorate in function or be destroyed due to the increase in operating temperature.

このような冷却装置の障害による電子装置の劣化や破壊
を防ぐために、冷却装置の状態を常時監視すると共に異
常を検出すると直ちに電子装置の電源回路に給電動作の
停止を指令する保安対策が講じられている。
In order to prevent deterioration or destruction of the electronic device due to such a failure of the cooling device, safety measures are taken to constantly monitor the state of the cooling device and immediately instruct the power supply circuit of the electronic device to stop the power supply operation when an abnormality is detected. ing.

すなわち、第3図のブロック図に示すように、集積回路
を主体に構成される被冷却部11と、電源部12と、運転制
御部13と、被冷却部11のディジタル集積回路にデータを
ロードしたりそこからデータを待避させる外部記憶部14
とを備える電子装置10に対し、熱交換器31a,タンク31b,
循環ポンプ31c及び冷媒の管路31dから成る冷却機構と、
監視・制御部32と、内部監視・制御線33と、保安信号線
34とを備える冷却装置30が設置される。
That is, as shown in the block diagram of FIG. 3, data is loaded into a cooled part 11 mainly composed of an integrated circuit, a power supply part 12, an operation control part 13, and a digital integrated circuit of the cooled part 11. External storage unit 14 that saves or saves data from there
With respect to the electronic device 10 including the heat exchanger 31a, the tank 31b,
A cooling mechanism including a circulation pump 31c and a refrigerant conduit 31d,
Monitoring / control section 32, internal monitoring / control line 33, security signal line
A cooling device 30 including 34 and 34 is installed.

冷却装置30内の監視・制御部32は、熱交換器31aや循環
ポンプ31cなど冷却機構各部の動作状態を内部監視・制
御線33を介して監視しつつこれらの動作を制御すると共
に、これらに制御の困難な動作の異常が発生したことを
検出すると直ちに保安信号線34上に電源切断指令を送出
する。電子装置10内の運転制御部13は、上記保安信号線
34上に電源切断指令が出現すると、電源部12に指令を発
することにより被冷却部11に対する動作電力の供給を停
止させる。
The monitoring / control unit 32 in the cooling device 30 controls the operations while monitoring the operating states of the respective parts of the cooling mechanism such as the heat exchanger 31a and the circulation pump 31c via the internal monitoring / control line 33, and controls them. Immediately after detecting the occurrence of an abnormal operation that is difficult to control, a power-off command is sent to the security signal line 34. The operation control unit 13 in the electronic device 10 uses the security signal line
When a power-off command appears on 34, the power-supply unit 12 is commanded to stop the supply of operating power to the cooled unit 11.

(発明が解決しようとする課題) 上記従来の冷却装置では、冷却機構に異常が発生すると
直ちに電子装置の集積回路への給電を停止させている。
このため、異常発生時に被冷却部11内の論理集積回路や
記憶集積回路において処理中あるいは保持中のデータが
破壊されてしまい、異常回復後のデータの復旧に多大の
労力と時間を費やさなければならないという問題があ
る。
(Problems to be Solved by the Invention) In the above-described conventional cooling device, as soon as an abnormality occurs in the cooling mechanism, power supply to the integrated circuit of the electronic device is stopped.
Therefore, when an abnormality occurs, the data being processed or held in the logic integrated circuit or the memory integrated circuit in the cooled portion 11 is destroyed, and great effort and time must be spent to recover the data after the abnormality recovery. There is a problem of not becoming.

(課題を解決するための手段) 本発明に係わる電子装置の冷却装置は、電子装置の被冷
却部の動作温度を検出して監視・制御部に通知する温度
センサとを備えると共に、この制御・監視部は、冷却機
構の動作の異常を検出した場合において上記温度センサ
による検出温度が所定の上限値以下であるときには電子
装置にその被冷却部から外部記憶装置へのデータの待避
を指令し、冷却機構の異常を検出した場合において上記
温度センサによる検出温度が上記所定の上限値を越えた
ときには電子装置にその電源部による被冷却部への動作
電力の供給の停止を指令する手段を備えている。
(Means for Solving the Problem) A cooling device for an electronic device according to the present invention includes a temperature sensor that detects an operating temperature of a cooled part of the electronic device and notifies the monitoring / controlling part of the operating temperature. The monitoring unit instructs the electronic device to save the data from the cooled unit to the external storage device when the temperature detected by the temperature sensor is equal to or lower than a predetermined upper limit value when the operation abnormality of the cooling mechanism is detected, When an abnormality of the cooling mechanism is detected and the temperature detected by the temperature sensor exceeds the predetermined upper limit value, a means for instructing the electronic device to stop the supply of operating power to the cooled portion by the power supply unit is provided. There is.

すなわち、本発明の冷却装置によれば、冷却系統の熱的
な時定数が一般にディジタル集積回路の動作所要時間に
比較して大きな値であることに着目し、冷却機構に異常
が発生してから動作の停止が必要になる上限温度に達す
るまでの間隙を利用して、被冷却部のディジタル集積回
路で処理中あるいは保持中のデータを時期ディスク等の
外部記憶装置に待避させることにより、異常回復後にお
けるデータの復旧の労力と時間を節減するように構成さ
れている。
That is, according to the cooling device of the present invention, attention is paid to the fact that the thermal time constant of the cooling system is generally a large value as compared with the time required for the operation of the digital integrated circuit. Abnormal recovery by saving the data being processed or held in the digital integrated circuit of the cooled part to the external storage device such as a timed disk by using the gap until the upper limit temperature at which operation must be stopped is reached It is designed to save the effort and time of later data recovery.

以下、本発明の作用を実施例と共に詳細に説明する。Hereinafter, the operation of the present invention will be described in detail with reference to Examples.

(実施例) 第1図は本発明に係わる電子装置の冷却装置の構成を冷
却対象の電子装置と共に示すブロック図である。
(Embodiment) FIG. 1 is a block diagram showing a configuration of a cooling device for an electronic device according to the present invention together with an electronic device to be cooled.

冷却対象の電子装置10は、論理回路や記憶回路などのデ
ィジタル集積回路を主体に構成される被冷却部11と、こ
の被冷却部11に動作用の直流電力を供給する電源部12
と、この電源部12や被冷却部11などの運転状態を制御す
る運転制御部13と、被冷却部10に処理対象のデータをロ
ードしたりそこで処理中あるいは保持中のデータを待避
させる磁気ディスク装置などから成る外部記憶部14を備
えている。
The electronic device 10 to be cooled includes a cooled part 11 mainly composed of a digital integrated circuit such as a logic circuit and a storage circuit, and a power supply part 12 for supplying DC power for operation to the cooled part 11.
And an operation control unit 13 that controls the operating states of the power supply unit 12 and the cooled unit 11, and a magnetic disk that loads data to be processed into the cooled unit 10 and saves data that is being processed or held there. An external storage unit 14 including a device and the like is provided.

この電子装置10に対する冷却装置20は、熱交換器21a,タ
ンク21b,循環ポンプ21c及び冷媒の管路21dから成る冷却
機構と、監視・制御部22と、内部監視・制御線23と、保
安信号線24とに加えて、電子装置10の被冷却部11内に設
置されその動作温度を検出する温度センサ25と、この温
度センサ25の検出温度を監視・制御部22に伝達する信号
線26と、電子装置10の運転制御部13にデータの待避指令
を発する制御信号線27とを備えている。
The cooling device 20 for the electronic device 10 includes a cooling mechanism including a heat exchanger 21a, a tank 21b, a circulation pump 21c, and a refrigerant conduit 21d, a monitoring / control unit 22, an internal monitoring / control line 23, and a safety signal. In addition to the line 24, a temperature sensor 25 installed in the cooled portion 11 of the electronic device 10 for detecting its operating temperature, and a signal line 26 for transmitting the detected temperature of the temperature sensor 25 to the monitoring / controlling portion 22. The operation control unit 13 of the electronic device 10 is provided with a control signal line 27 for issuing a data save command.

冷却装置内10内の監視・制御部22は、第2図のブロック
図に示すように、マイクロプロセッサ22aと、入力ポー
ト22bと、出力ポート22cとから構成されている。
As shown in the block diagram of FIG. 2, the monitoring / control unit 22 in the cooling device 10 is composed of a microprocessor 22a, an input port 22b, and an output port 22c.

マイクロプロセッサ22aは、内部監視・制御線23と出力
ポート22bとを介して熱交換器21aや循環ポンプ21cなど
の冷却機構の動作状態を監視すると共に、出力ポート22
cと監視・制御線23とを介してこの冷却機構の各部の動
作を制御する。なお、タンク21bは、冷媒の温度変化に
伴う体積の膨張・縮小を吸収するためのものである。ま
た、マイクロプロセッサ22aは、温度センサ25から信号
線26上に出力される被冷却部11の動作温度を検出し、こ
の動作温度が制御目標値よりも上昇していれば、熱交換
器21aの二次冷却水の流量を増加させたり冷却機構のポ
ンプ21cの送液量を増加させるなどして冷却機能を強化
する。
The microprocessor 22a monitors the operating state of the cooling mechanism such as the heat exchanger 21a and the circulation pump 21c via the internal monitoring / control line 23 and the output port 22b, and at the same time outputs the output port 22
The operation of each part of this cooling mechanism is controlled via c and the monitoring / control line 23. The tank 21b is for absorbing the expansion and contraction of the volume due to the temperature change of the refrigerant. Further, the microprocessor 22a detects the operating temperature of the cooled portion 11 output from the temperature sensor 25 on the signal line 26, and if this operating temperature is higher than the control target value, the heat exchanger 21a The cooling function is strengthened by increasing the flow rate of the secondary cooling water or increasing the liquid feed amount of the pump 21c of the cooling mechanism.

マイクロプロセッサ22aは、冷却機構内の熱交換器21aへ
の二次冷却水の供給停止やポンプの動作停止など制御の
困難な動作の異常が発生したことを検出すると、信号線
26から読取った動作温度が所定の上限値を越えているか
否かを判定する。マイクロプロセッサ22aは、この動作
温度が上記所定の上限値を越えていなければ出力ポート
22cと制御線26を介して電子装置10の運転制御部13にデ
ータの待避指令を送出する。この指令を受けた運転制御
部13は、被冷却部11を構成する論理集積回路や記憶集積
回路に通常の動作を停止して外部記憶部14へのデータの
待避を指令する。
When the microprocessor 22a detects that an abnormal operation which is difficult to control such as supply stop of the secondary cooling water to the heat exchanger 21a in the cooling mechanism and operation stop of the pump has occurred, the signal line is detected.
It is determined whether the operating temperature read from 26 exceeds the predetermined upper limit value. If the operating temperature does not exceed the above specified upper limit value, the microprocessor 22a
A data save command is sent to the operation control unit 13 of the electronic device 10 via the control line 26 and the control line 26. Upon receiving this command, the operation control unit 13 commands the logical integrated circuit and the memory integrated circuit forming the cooled unit 11 to stop the normal operation and save the data to the external storage unit 14.

引き続き、マイクロプロセッサ22aは、正常時よりも読
取り周期を短縮するなどして温度センサ25から出力され
る被冷却部11の動作温度を読取り、これが所定の上限値
を越えたか否かを判定する。マイクロプロセッサ22a
は、この動作温度が所定の上限値を越えた場合には、出
力ポート22cと保安信号線24とを介してデータ処理装置1
0の運転制御部13に電源の切断指令を出力する。この電
源切断指令を受けた運転制御部13は、冷却部11に対する
動作電力の供給の停止を電源部12に指令する。
Subsequently, the microprocessor 22a reads the operating temperature of the cooled portion 11 output from the temperature sensor 25 by shortening the reading cycle as compared with the normal time, and determines whether or not the operating temperature exceeds a predetermined upper limit value. Microprocessor 22a
When the operating temperature exceeds a predetermined upper limit value, the data processing device 1 is connected via the output port 22c and the security signal line 24.
A power-off command is output to the operation control unit 13 of 0. The operation control unit 13 receiving this power-off command instructs the power supply unit 12 to stop the supply of operating power to the cooling unit 11.

以上、電子装置10内の運転制御部13を介して異常発生時
の動作を制御する構成を例示した。しかしながら、その
ような運転制御部13を介さずに、被冷却部11にデータの
待避の開始を直接指令したり、電源部12に給電の停止を
直接指令したりする構成であってもよい。
The configuration for controlling the operation when an abnormality occurs via the operation control unit 13 in the electronic device 10 has been illustrated above. However, the configuration may be such that the cooled portion 11 is directly instructed to start saving data, and the power supply portion 12 is directly instructed to stop the power supply, without using the operation control portion 13.

また、被冷却部に設置する温度センサが1個である場合
を例示したが、一般的には複数個の温度センサが設置で
きる。
Moreover, although the case where one temperature sensor is installed in the cooled portion is illustrated, generally, a plurality of temperature sensors can be installed.

(発明の効果) 以上詳細に説明したように、本発明に係わる電子装置の
冷却装置は、冷却機構の熱的な時定数が一般にディジタ
ル集積回路の動作所要時間に比較して大きな値であるこ
とに着目し、冷却機構に異常が発生してから被冷却部の
動作温度が所定の上限温度に達するまでの間隙を利用し
て磁気ディスク等の外部記憶装置にデータを待避させる
構成であるから、異常回復後におけるデータの復旧の労
力と時間とが大幅に節減されるという効果が奏される。
(Effects of the Invention) As described in detail above, in the cooling device for an electronic device according to the present invention, the thermal time constant of the cooling mechanism is generally a large value as compared with the time required for operation of the digital integrated circuit. Focusing on the above, since it is a configuration for saving data to an external storage device such as a magnetic disk using a gap from when an abnormality occurs in the cooling mechanism until the operating temperature of the cooled portion reaches a predetermined upper limit temperature, The effect that the labor and time for data recovery after abnormal recovery is significantly reduced is achieved.

また、本発明の冷却装置は電子装置内の被冷却部の動作
温度を直接読取るための温度センサを備えているので、
これを利用することにより正常時において高精度のフィ
ードバック温度制御を行うことができる。
In addition, since the cooling device of the present invention includes a temperature sensor for directly reading the operating temperature of the cooled portion in the electronic device,
By utilizing this, it is possible to perform highly accurate feedback temperature control during normal operation.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の一実施例に係わる冷却装置の構成を冷
却対象の電子装置と共に示すブロック図、第2図は第1
図の監視・制御部22の構成の一例を示すブロック図、第
3図は従来例に係わる電冷却装置の構成を冷却対象の電
子装置と共に示すブロック図である。 10……冷却対象の電子装置、11……被冷却部、12……電
源部、14……外部記憶部、20……冷却装置、21a……熱
交換器、21c……ポンプ、22……監視・制御部、23……
内部監視・制御線、24……保安信号線、25……温度セン
サ、27……データの待避指令を送出する制御線。
FIG. 1 is a block diagram showing a configuration of a cooling device according to an embodiment of the present invention together with an electronic device to be cooled, and FIG.
FIG. 3 is a block diagram showing an example of the configuration of the monitoring / control unit 22 in FIG. 3, and FIG. 3 is a block diagram showing the configuration of a conventional electric cooling device together with an electronic device to be cooled. 10 ... Electronic device to be cooled, 11 ... Cooled part, 12 ... Power supply part, 14 ... External storage part, 20 ... Cooling device, 21a ... Heat exchanger, 21c ... Pump, 22 ... Monitoring / control section, 23 ……
Internal monitoring / control line, 24 ... Security signal line, 25 ... Temperature sensor, 27 ... Control line for sending data save command.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】ディジタル集積回路を主体に構成される被
冷却部と、この被冷却部に動作電力を供給する電源部
と、この被冷却部内のデータを待避させるための外部記
憶部とを備えた電子装置に対する冷却装置であって、 前記電子装置の被冷却部に冷媒を循環させる放熱機能を
有する冷却機構と、この冷却機構の動作を監視し制御す
る監視・制御部と、前記電子装置の被冷却部の動作温度
を検出し前記冷却・監視部に通知する温度センサとを備
え、 前記制御・監視部は、前記冷却機構の動作の異常を検出
した場合において前記温度センサによる検出温度が所定
の上限値以下であるときには前記電子装置にその被冷却
部から外部記憶装置へのデータの待避を指令し、前記冷
却機構の異常を検出した場合において前記温度センサに
よる検出温度が前記所定の上限値を越えたときには前記
電子装置にその電源部による被冷却部への動作電力の供
給の停止を指令する手段を備えたことを特徴とする電子
装置の冷却装置。
1. A cooled unit mainly comprising a digital integrated circuit, a power supply unit for supplying operating power to the cooled unit, and an external storage unit for saving data in the cooled unit. A cooling device for an electronic device, wherein the electronic device has a cooling mechanism that radiates a refrigerant through a cooled portion of the electronic device, a monitoring / control unit that monitors and controls the operation of the cooling mechanism, A temperature sensor for detecting the operating temperature of the cooled part and notifying the cooling / monitoring part, and the control / monitoring part detects a temperature detected by the temperature sensor when an abnormality in the operation of the cooling mechanism is detected. When it is less than or equal to the upper limit value, the electronic device is instructed to save the data from the cooled part to the external storage device, and when the abnormality of the cooling mechanism is detected, the temperature detected by the temperature sensor is Serial predetermined cooling device of an electronic device when exceeding the upper limit, characterized in that it comprises means for commanding the stopping of the supply of operating power to the object to be cooled by the power supply unit to the electronic device.
JP1079274A 1989-03-29 1989-03-29 Electronic device cooling system Expired - Lifetime JPH07107658B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1079274A JPH07107658B2 (en) 1989-03-29 1989-03-29 Electronic device cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1079274A JPH07107658B2 (en) 1989-03-29 1989-03-29 Electronic device cooling system

Publications (2)

Publication Number Publication Date
JPH02257207A JPH02257207A (en) 1990-10-18
JPH07107658B2 true JPH07107658B2 (en) 1995-11-15

Family

ID=13685287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1079274A Expired - Lifetime JPH07107658B2 (en) 1989-03-29 1989-03-29 Electronic device cooling system

Country Status (1)

Country Link
JP (1) JPH07107658B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104964367A (en) * 2015-07-16 2015-10-07 浪潮(北京)电子信息产业有限公司 Cold and hot water flow circulation method and system

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10310282A1 (en) 2003-03-07 2004-09-16 Rittal Gmbh & Co. Kg Liquid cooling system
JP2007199782A (en) * 2006-01-23 2007-08-09 Fujitsu Ltd Communication apparatus operation controller, communication system, and communication apparatus operation control method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104964367A (en) * 2015-07-16 2015-10-07 浪潮(北京)电子信息产业有限公司 Cold and hot water flow circulation method and system

Also Published As

Publication number Publication date
JPH02257207A (en) 1990-10-18

Similar Documents

Publication Publication Date Title
JPS61216011A (en) Control system for cooling system of electronic equipment
EP0466102A1 (en) Liquid cooling apparatus
WO1992010032A1 (en) Temperature-sensing control system and method for integrated circuits
JPH07107658B2 (en) Electronic device cooling system
JPS632160A (en) Auxiliary memory device for control computer
JP2581367B2 (en) Electronic equipment unit
JP2656581B2 (en) Cooling system
JP2004132686A (en) Automatic control system for liquid cooler
JP3165001B2 (en) Multiprocessor electronic device
JPS61125634A (en) System for monitoring and controlling abnormality
JP2778655B2 (en) Cooling system
JP2941286B2 (en) Power control method
JPH01269113A (en) Cooler
JP2604920B2 (en) Cooling abnormality detection circuit for information processing equipment
JPS62202977A (en) Controller for refrigerant feeder
JPH031064A (en) Freezing preventive control system of cooling device
JPH1027039A (en) Cooling device for computer system
JP2541473B2 (en) Air cooler
JPH0728561A (en) Heating suppression system
JP3444928B2 (en) Cooling device operation control system
JP2009014375A (en) Electronic device, printing apparatus and drive operation forcibly-deactivating method
JPH05265601A (en) Power supply control system for water cooling type electronic apparatus
JPH07105531B2 (en) Operation control method for superconducting device
JPS629163A (en) Heat pump for air-conditioning
JPH05259678A (en) Cooler