JP2778655B2 - Cooling system - Google Patents

Cooling system

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Publication number
JP2778655B2
JP2778655B2 JP2319757A JP31975790A JP2778655B2 JP 2778655 B2 JP2778655 B2 JP 2778655B2 JP 2319757 A JP2319757 A JP 2319757A JP 31975790 A JP31975790 A JP 31975790A JP 2778655 B2 JP2778655 B2 JP 2778655B2
Authority
JP
Japan
Prior art keywords
liquid
temperature
electronic circuit
cooling
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2319757A
Other languages
Japanese (ja)
Other versions
JPH04192398A (en
Inventor
裕康 宮崎
充男 小宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Information Technology Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Information Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Information Technology Co Ltd filed Critical Hitachi Ltd
Priority to JP2319757A priority Critical patent/JP2778655B2/en
Publication of JPH04192398A publication Critical patent/JPH04192398A/en
Application granted granted Critical
Publication of JP2778655B2 publication Critical patent/JP2778655B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、冷却装置に関し、特に、電子回路装置から
の発熱を冷却する冷却装置において、電子回路装置の起
動時の結露による誤動作を防止する冷却装置に関するも
のである。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device, and more particularly, to a cooling device for cooling heat generated from an electronic circuit device, which prevents malfunction due to dew condensation at the time of starting the electronic circuit device. The present invention relates to a cooling device.

〔従来の技術〕[Conventional technology]

電子回路装置の設置環境においては、電子回路装置の
起動前の状態では、結露が生じる場合がある。この場
合、結露状態となっている電子回路装置に電源を給電す
ると、結露状態によっては回路が短絡して誤動作を起こ
す恐れがある。
In an installation environment of an electronic circuit device, dew condensation may occur before the electronic circuit device is started. In this case, when power is supplied to an electronic circuit device in a dew state, the circuit may be short-circuited and malfunction may occur depending on the dew state.

これに対しては、電子回路の起動を行う場合、例え
ば、特開昭59−119426号公報に記載のように、結露検出
部を電子回路の近傍に共存して設け、結露状態を直接検
出することにより、電子回路の設置環境が結露状態であ
る場合には、一定時間だけ電子回路の電源を投入しない
ことで、電子回路の保護を行う電子回路の起動方法が提
案されている。
On the other hand, when starting the electronic circuit, for example, as described in JP-A-59-119426, a dew condensation detecting unit is provided in the vicinity of the electronic circuit to directly detect the dew state. Accordingly, a method of starting an electronic circuit that protects the electronic circuit by not turning on the power of the electronic circuit for a certain period of time when the installation environment of the electronic circuit is in a dew state has been proposed.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

ところで、上述の従来の技術による電子回路の起動方
法は、結露状態を直接検出する結露検出部を電子回路の
近傍に共存して設けることにより、電子回路の設置環境
が結露状態である場合を検出し、電子回路の給電装置の
通電による結露状態が解消されるまでの一定時間だけ、
電子回路への電源を投入しないことにより、電子回路の
保護を行う方法となっている。
By the way, the above-described method of starting an electronic circuit according to the related art detects a case where the installation environment of the electronic circuit is in a dew state by providing a dew detection unit for directly detecting a dew state in the vicinity of the electronic circuit. Then, for a certain period of time until the dew condensation state due to energization of the power supply device of the electronic circuit is eliminated,
By turning off the power to the electronic circuit, the electronic circuit is protected.

しかしながら、このような電子回路の起動方法では、
結露状態の予測という点について考慮されておらず、結
露状態になってしまってから、電子回路の保護動作を開
始するという問題がある。
However, in such a method of starting an electronic circuit,
There is a problem in that the prediction of the dew condensation state is not taken into consideration, and the protection operation of the electronic circuit is started after the dew condensation state occurs.

また、結露検出部を電子回路の近傍に共存して設けな
ければならず、更に、実際に結露により不都合の生ずる
電子部品の熱容量と結露検出部の熱容量とが大きく異な
る場合には、結露検出部が結露状態を検出する前に、電
子部品が結露状態になってしまい、この状態で電子回路
の電源が投入されると、短絡等の障害が発生する等の問
題がある。
In addition, the dew condensation detecting section must be provided in the vicinity of the electronic circuit, and if the heat capacity of the electronic component, which actually causes inconvenience due to dew condensation, greatly differs from the heat capacity of the dew detecting section, Before detecting the dew condensation state, the electronic components become dew condensation state, and when the power of the electronic circuit is turned on in this state, there is a problem that a failure such as a short circuit occurs.

本発明は、これらの問題点を解決するためになされた
ものである。
The present invention has been made to solve these problems.

本発明の目的は、電子回路装置からの発熱を冷却する
冷却装置において、電子回路装置の起動時の結露による
誤動作を防止する冷却装置を提供することにある。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a cooling device for cooling heat generated from an electronic circuit device, which prevents a malfunction due to dew condensation at the time of starting the electronic circuit device.

〔課題を解決するための手段〕[Means for solving the problem]

上記目的を達成するために、本発明の冷却装置は、液
体が内部を通過する熱吸収体と、液体循環ポンプと、液
体空気熱交換器と、これらの間を結合する液体パイプと
から構成され、前記熱吸収体を電子回路装置の発熱体に
接触させて、電子回路装置からの発熱を冷却する冷却装
置において、電子回路装置の環境温度を監視する第1の
温度センサと、液体の温度を監視する第2の温度センサ
と、第1の温度センサおよび第2の温度センサからの出
力を比較し、電子回路装置の起動時に液体温度が環境温
度よりも低い場合に、液体循環ポンプおよび液体空気熱
交換器を動作させ、液体温度が環境温度を越えた状態に
おいて電子回路装置に対する給電を許可する信号を送出
する制御装置とを備えることを特徴とする。
In order to achieve the above object, the cooling device of the present invention includes a heat absorber through which a liquid passes, a liquid circulation pump, a liquid-air heat exchanger, and a liquid pipe connecting between them. A cooling device for cooling the heat generated from the electronic circuit device by bringing the heat absorber into contact with a heating element of the electronic circuit device; a first temperature sensor for monitoring an environmental temperature of the electronic circuit device; The second temperature sensor to be monitored is compared with the outputs from the first temperature sensor and the second temperature sensor. If the liquid temperature is lower than the ambient temperature when the electronic circuit device is started, the liquid circulation pump and the liquid air A control device for operating the heat exchanger and transmitting a signal permitting power supply to the electronic circuit device when the liquid temperature exceeds the ambient temperature.

〔作用〕[Action]

これによれば、冷却装置において、第1の温度センサ
と、第2の温度センサと、制御装置とが備えられる。
According to this, in the cooling device, the first temperature sensor, the second temperature sensor, and the control device are provided.

冷却装置は、液体が内部を通過する熱吸収体と、液体
循環ポンプと、液体空気熱交換器と、これらの間を結合
する液体パイプとから構成され、前記熱吸収体を電子回
路装置の発熱体に接触させて、電子回路装置からの発熱
を冷却する。
The cooling device is composed of a heat absorber through which the liquid passes, a liquid circulation pump, a liquid-air heat exchanger, and a liquid pipe connecting between the heat absorber and the heat absorber of the electronic circuit device. The heat generated from the electronic circuit device is cooled by contact with the body.

第1の温度センサは、冷却装置で冷却する電子回路装
置の循環温度を監視する。第2温度センサは、当該冷却
装置の液体パイプ内をを循環する液体の温度を監視す
る。そして、制御装置が、第1の温度センサおよび第2
の温度センサからの出力を比較し、電子回路装置の起動
時に液体温度が環境温度よりも低い場合に、液体循環ポ
ンプおよび液体空気熱交換器を動作させ、液体温度が環
境温度を越えた状態において電子回路装置に対する給電
を許可する信号を送出する。
The first temperature sensor monitors a circulation temperature of the electronic circuit device cooled by the cooling device. The second temperature sensor monitors the temperature of the liquid circulating in the liquid pipe of the cooling device. Then, the control device controls the first temperature sensor and the second temperature sensor.
Comparing the outputs from the temperature sensors, when the liquid temperature is lower than the ambient temperature when the electronic circuit device is started, the liquid circulation pump and the liquid air heat exchanger are operated, and when the liquid temperature exceeds the ambient temperature, A signal for permitting power supply to the electronic circuit device is transmitted.

すなわち、液体循環ポンプ,液体空気熱交換器,熱吸
収体,および結合パイプを有し、電子回路装置を冷却す
る冷却装置は、通常の動作時には、冷却媒体の液体の温
度が環境温度よりも低い場合は冷却の運転を行なわない
が、電子回路装置の起動時には、液体温度と電子装置の
環境温度とを比較して、液体温度が環境温度よりも低い
場合に液体循環ポンプおよび液体空気熱交換器を動作さ
せる。
That is, a cooling device that has a liquid circulation pump, a liquid air heat exchanger, a heat absorber, and a connection pipe and cools an electronic circuit device has a temperature of a liquid of a cooling medium lower than an ambient temperature during a normal operation. In this case, the cooling operation is not performed, but when the electronic circuit device is started, the liquid temperature is compared with the environmental temperature of the electronic device, and when the liquid temperature is lower than the environmental temperature, the liquid circulation pump and the liquid air heat exchanger are used. To work.

これにより、通常の冷却とは逆の熱交換が行なわれ、
冷却装置の液体パイプ内をを循環する液体の温度が環境
温度にまで上昇するように動作し、液体温度が環境温度
よりも低い場合に、電子回路装置の発熱体に接触してい
る熱吸収体のの配置位置の過冷却状態による結露の発生
を防止する。また、電子回路装置において結露が生じる
状態を未然に防止することができる。
As a result, heat exchange reverse to normal cooling is performed,
The heat absorber that operates so that the temperature of the liquid circulating in the liquid pipe of the cooling device rises to the ambient temperature, and when the liquid temperature is lower than the ambient temperature, the heat absorber that is in contact with the heating element of the electronic circuit device Prevents the occurrence of dew condensation due to the supercooled state of the position of the. Further, it is possible to prevent the occurrence of dew condensation in the electronic circuit device.

〔実施例〕〔Example〕

以下、本発明の一実施例を図面を用いて具体的に説明
する。
Hereinafter, an embodiment of the present invention will be specifically described with reference to the drawings.

第1図は、本発明の一実施例に係る冷却装置の全体構
成を示すブロック図である。
FIG. 1 is a block diagram showing the overall configuration of a cooling device according to one embodiment of the present invention.

冷却装置は、電子回路装置のプリント基板1のの発熱
体に接触して配設されている冷却部(いわゆる液冷用熱
伝導モジュール)、すなわち冷却媒体の液体が内部を通
過する熱吸収体2と、液体循環ポンプ3と、液体空気熱
交換器の熱交換器本体4およびブロワー5と、これらの
間を結合する液体パイプ6とから構成されている。
The cooling device is a cooling unit (a so-called liquid cooling heat conduction module) disposed in contact with a heating element of the printed circuit board 1 of the electronic circuit device, that is, a heat absorber 2 through which liquid of a cooling medium passes. , A liquid circulation pump 3, a heat exchanger body 4 and a blower 5 of a liquid-air heat exchanger, and a liquid pipe 6 connecting them.

冷却装置は、熱吸収体2を電子回路装置のプリント基
板1に配設された電子回路の液冷用熱伝導モジュール等
に接触させて、電子回路装置が動作する場合に発熱する
熱を、冷却媒体の液体を循環させて、熱吸収体2から除
去する動作を行う。冷却装置の液体循環冷却系統は、プ
リント基板1に搭載した液冷用熱伝導モジュールを取付
けた熱吸収体2→液体空気熱交換器4→液体循環ポンプ
3→熱吸収体2の循環系統として液体パイプ6により結
合されて構成されている。また、冷却装置には、環境温
度を監視する第1温度監視部7と、液体循環冷却系統の
液体温度を監視する第2温度監視部8と、第1温度監視
部7の出力と第2温度御監視部8の出力とを比較して、
制御信号を出力するマイクロプロセッサ9と、液体循環
ポンプ3とブロワー5を制御する冷却制御部10とが設け
られている。冷却装置により冷却される電子回路装置
は、プリント基板1の電子回路と、当該電子回路に電圧
を供給する直流安定化電源11と、プリント基板1と直流
安定化電源11とを接続する給電ライン部12とで構成され
ている。
The cooling device cools the heat generated when the electronic circuit device operates by bringing the heat absorber 2 into contact with a liquid-cooling heat conducting module of the electronic circuit provided on the printed circuit board 1 of the electronic circuit device. An operation of circulating the liquid of the medium and removing it from the heat absorber 2 is performed. The liquid circulating cooling system of the cooling device includes a heat absorber 2 having a liquid cooling heat conduction module mounted on a printed circuit board 1, a liquid air heat exchanger 4, a liquid circulation pump 3, and a liquid circulation system of the heat absorber 2. They are connected by a pipe 6. The cooling device includes a first temperature monitoring unit 7 for monitoring an environmental temperature, a second temperature monitoring unit 8 for monitoring a liquid temperature of a liquid circulation cooling system, and an output of the first temperature monitoring unit 7 and a second temperature. By comparing with the output of the monitoring unit 8,
A microprocessor 9 for outputting a control signal and a cooling control unit 10 for controlling the liquid circulation pump 3 and the blower 5 are provided. The electronic circuit device cooled by the cooling device includes an electronic circuit of the printed circuit board 1, a stabilized DC power supply 11 for supplying a voltage to the electronic circuit, and a power supply line unit connecting the printed circuit board 1 and the stabilized DC power supply 11. It consists of 12 and.

マイクロプロセッサ9が、第1温度監視部7の出力を
温度監視信号線14で受け、第2温度監視部8の出力を温
度監視信号線14で受けて、比較演算を行い、冷却制御部
10に対する制御信号を冷却制御線15に送出し、また、直
流安定化電源11に対する制御信号を電源制御線18から送
出する。冷却制御部10は、マイクロプロセッサ9からの
制御信号を受けて、液体循環ポンプ3および液体空気熱
交換器のブロワー5を制御する信号を制御線15,16を介
して送出する。
The microprocessor 9 receives the output of the first temperature monitoring unit 7 on the temperature monitoring signal line 14 and receives the output of the second temperature monitoring unit 8 on the temperature monitoring signal line 14, performs a comparison operation, and performs a cooling operation.
A control signal to the cooling control line 15 is transmitted to the cooling control line 15, and a control signal to the stabilized DC power supply 11 is transmitted from the power supply control line 18. The cooling controller 10 receives a control signal from the microprocessor 9 and sends out signals for controlling the liquid circulation pump 3 and the blower 5 of the liquid-air heat exchanger via control lines 15 and 16.

マイクロプロセッサ9は、電子回路装置の起動時に、
第1温度監視部7および第2温度監視部8により、それ
ぞれ電子装置の環境温度および液体温度を監視し、2つ
の温度を比較する。このとき、第2温度監視部8の出力
値が第2温度監視部7の出力値より小さい場合、つま
り、液体温度が環境温度よりも低い場合には、電子回路
装置内の結露の発生する可能性があるので、マイクロプ
ロセッサ9は、電子回路装置(プリント基板1)への給
電を禁止する制御信号を電源制御線18を介して直流安定
化電源11に送出する。また、冷却制御部10に対する冷却
制御線15には、液体循環ポンプ3およびブロワー5を動
作させる信号を送出する。これにより、冷却制御部10
は、液体循環ポンプ3およびブロワー5を動作させる。
When the electronic circuit device starts up, the microprocessor 9
The first temperature monitor 7 and the second temperature monitor 8 monitor the environmental temperature and the liquid temperature of the electronic device, respectively, and compare the two temperatures. At this time, when the output value of the second temperature monitoring unit 8 is smaller than the output value of the second temperature monitoring unit 7, that is, when the liquid temperature is lower than the environmental temperature, condensation in the electronic circuit device may occur. Therefore, the microprocessor 9 sends a control signal for inhibiting power supply to the electronic circuit device (printed circuit board 1) to the DC stabilized power supply 11 via the power supply control line 18. Further, a signal for operating the liquid circulation pump 3 and the blower 5 is transmitted to the cooling control line 15 for the cooling control unit 10. Thereby, the cooling control unit 10
Operates the liquid circulation pump 3 and the blower 5.

このため、ポンプ自身のモータの発熱、シャフト等か
らの熱により、液体温度が上昇する。また液体空気熱交
換器4にブロワー5により環境温度の送風が与えられる
ことにより、通常の冷却状態とは逆の熱の移動が行なわ
れる。すなわち、高い環境温度の空気で低い液体温度を
上昇させる熱交換が行なわれる。これらの相乗効果によ
って加熱された液体温度が、環境温度と同じ温度になる
まで、または環境温度を越える温度になるまで、冷却制
御部に制御信号を送出し運転を行う。
For this reason, the temperature of the liquid increases due to heat generated by the motor of the pump itself and heat from the shaft and the like. In addition, the blower 5 supplies the air at the ambient temperature to the liquid-air heat exchanger 4, so that heat is transferred in a direction opposite to the normal cooling state. That is, heat exchange is performed by raising the low liquid temperature with air at a high ambient temperature. The control signal is sent to the cooling control unit to perform the operation until the temperature of the liquid heated by these synergistic effects reaches the same temperature as the ambient temperature or exceeds the ambient temperature.

これは、マイクロプロセッサ9が、内蔵されたタイマ
ーにより一定時間毎に第1温度監視部7および第2温度
監視部8を監視して運転を行い、液体温度が環境温度と
同じ温度になった場合、または環境温度を越える温度に
なった場合、電子回路装置内の結露の恐れが無いと判断
されるで、マイクロプロセッサ9は、冷却制御部10に対
して、液体循環ポンプ3およびブロワー5の動作を中止
させる制御信号を送出する。また、このとき、直流安定
化電源11に対しては、電子回路装置への給電を許可する
制御信号を電源制御線18を介して直流安定化電源11に送
出する。これにより、電子回路装置は、結露に対する不
都合を防止した状態で、電源が投入され、正常起動に移
行する。
This is because the microprocessor 9 monitors the first temperature monitoring unit 7 and the second temperature monitoring unit 8 at regular time intervals by a built-in timer to perform operation, and the liquid temperature becomes equal to the ambient temperature. Or when the temperature exceeds the ambient temperature, it is determined that there is no risk of dew condensation in the electronic circuit device, and the microprocessor 9 instructs the cooling control unit 10 to operate the liquid circulation pump 3 and the blower 5. Is transmitted. At this time, a control signal for permitting power supply to the electronic circuit device is sent to the stabilized DC power supply 11 via the power control line 18. As a result, the electronic circuit device is turned on and shifts to a normal start-up in a state where inconvenience due to dew condensation is prevented.

このように、本実施例によれば、特に、結露状態を直
接検出する結露検出部を持たずに、電子回路装置におけ
る設置環境が結露状態になることを予測して保護を行う
ことができる。
As described above, according to the present embodiment, it is possible to perform protection by predicting that the installation environment in the electronic circuit device will be in a dew condensation state without having a dew condensation detection unit that directly detects the dew condensation state.

以上、本発明を実施例にもとづき具体的に説明した
が、本発明は、前記実施例に限定されるものではなく、
その要旨を逸脱しない範囲において種々変更可能である
ことは言うまでもない。
As mentioned above, although the present invention was explained concretely based on an example, the present invention is not limited to the above-mentioned example.
It goes without saying that various changes can be made without departing from the scope of the invention.

〔発明の効果〕〔The invention's effect〕

以上、説明したように、本発明によれば、電子回路装
置を冷却する冷却装置において、冷却媒体の液体の温度
を監視し、電子回路装置の環境温度を監視して、電子装
置の起動時に液体温度が環境温度よりも低い場合には、
冷却装置を運転して液体温度を環境温度にまで上昇さ
せ、電子回路装置内の結露に対する不都合を防止する。
このとき、液体温度が環境温度を下回っている間は、電
子回路装置に対する給電を許可しない制御を行うことに
より、電子回路装置内の結露に対する不都合を防止する
ことができる。
As described above, according to the present invention, in the cooling device for cooling the electronic circuit device, the temperature of the liquid of the cooling medium is monitored, the environmental temperature of the electronic circuit device is monitored, and the liquid is cooled when the electronic device is started. If the temperature is lower than the ambient temperature,
The cooling device is operated to raise the liquid temperature to the ambient temperature, thereby preventing inconvenience due to dew condensation in the electronic circuit device.
At this time, while the liquid temperature is lower than the environmental temperature, by performing control not to permit power supply to the electronic circuit device, it is possible to prevent inconvenience due to dew condensation in the electronic circuit device.

【図面の簡単な説明】[Brief description of the drawings]

第1図は、本発明の一実施例に係る冷却装置の全体構成
を示すブロック図である。 図中、1……プリント基板、2……熱吸収体、3……液
体循環用ポンプ、4……液体空気熱交換器、5……ブロ
ワー、6……パイプ、7……第1温度監視部、8……第
2温度監視部、9……マイクロプロセッサ、10……冷却
制御部、11……直流安定化電源、12……給電ライン部、
13……温度監視線、14……温度監視線、15……冷却制御
線、16,17……制御線、18……電源制御線。
FIG. 1 is a block diagram showing the overall configuration of a cooling device according to one embodiment of the present invention. In the drawing, 1 ... printed circuit board, 2 ... heat absorber, 3 ... liquid circulation pump, 4 ... liquid air heat exchanger, 5 ... blower, 6 ... pipe, 7 ... first temperature monitoring , 8... Second temperature monitoring unit, 9... Microprocessor, 10... Cooling control unit, 11... DC stabilized power supply, 12.
13 ... temperature monitoring line, 14 ... temperature monitoring line, 15 ... cooling control line, 16, 17 ... control line, 18 ... power supply control line.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平2−127716(JP,A) 特開 昭63−211799(JP,A) (58)調査した分野(Int.Cl.6,DB名) H05K 7/20 G06F 1/00 F25D 21/04──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-127716 (JP, A) JP-A-63-211799 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) H05K 7/20 G06F 1/00 F25D 21/04

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】液体が内部を通過する熱吸収体と、液体循
環ポンプと、液体空気熱交換器と、これらの間を結合す
る液体パイプとから構成され、前記熱吸収体を電子回路
装置の発熱体に接触させて、電子回路装置からの発熱を
冷却する冷却装置において、電子回路装置の環境温度を
監視する第1の温度センサと、液体の温度を監視する第
2の温度センサと、第1の温度センサおよび第2の温度
センサからの出力を比較し、電子回路装置の起動時に液
体温度が環境温度よりも低い場合に、液体循環ポンプお
よび液体空気熱交換器を動作させ、液体温度が環境温度
を越えた状態において電子回路装置に対する給電を許可
する信号を送出する制御装置とを備えることを特徴とす
る冷却装置。
A liquid circulation pump, a liquid-air heat exchanger, and a liquid pipe connecting the liquid absorber and a liquid pipe, and the heat absorber is connected to an electronic circuit device. A first temperature sensor for monitoring an environmental temperature of the electronic circuit device, a second temperature sensor for monitoring a temperature of the liquid, and a second temperature sensor for monitoring a temperature of the liquid. The outputs from the first temperature sensor and the second temperature sensor are compared, and when the liquid temperature is lower than the ambient temperature when the electronic circuit device is started, the liquid circulation pump and the liquid air heat exchanger are operated, and the liquid temperature is reduced. A cooling device for transmitting a signal for permitting power supply to the electronic circuit device when the temperature exceeds the ambient temperature.
JP2319757A 1990-11-22 1990-11-22 Cooling system Expired - Lifetime JP2778655B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2319757A JP2778655B2 (en) 1990-11-22 1990-11-22 Cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2319757A JP2778655B2 (en) 1990-11-22 1990-11-22 Cooling system

Publications (2)

Publication Number Publication Date
JPH04192398A JPH04192398A (en) 1992-07-10
JP2778655B2 true JP2778655B2 (en) 1998-07-23

Family

ID=18113838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2319757A Expired - Lifetime JP2778655B2 (en) 1990-11-22 1990-11-22 Cooling system

Country Status (1)

Country Link
JP (1) JP2778655B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002074032A1 (en) * 2001-03-02 2002-09-19 Sanyo Electric Co., Ltd. Electronic device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0575284A (en) * 1991-09-11 1993-03-26 Koufu Nippon Denki Kk Cooling device
CN105658018B (en) * 2014-08-14 2018-07-10 上海绿凡电力科技有限公司 A kind of two-phase cooling system based on R134a

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002074032A1 (en) * 2001-03-02 2002-09-19 Sanyo Electric Co., Ltd. Electronic device
US6967842B2 (en) 2001-03-02 2005-11-22 Sanyo Electric Co., Ltd. Electronic device
KR100909544B1 (en) * 2001-03-02 2009-07-27 산요덴키가부시키가이샤 Electronic device

Also Published As

Publication number Publication date
JPH04192398A (en) 1992-07-10

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