JPH04146694A - Electronic equipment cooling device - Google Patents
Electronic equipment cooling deviceInfo
- Publication number
- JPH04146694A JPH04146694A JP27031290A JP27031290A JPH04146694A JP H04146694 A JPH04146694 A JP H04146694A JP 27031290 A JP27031290 A JP 27031290A JP 27031290 A JP27031290 A JP 27031290A JP H04146694 A JPH04146694 A JP H04146694A
- Authority
- JP
- Japan
- Prior art keywords
- coolant
- refrigerant
- cooling
- heat exchanger
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 56
- 239000003507 refrigerant Substances 0.000 claims description 46
- 230000005494 condensation Effects 0.000 abstract description 9
- 238000009833 condensation Methods 0.000 abstract description 9
- 239000002826 coolant Substances 0.000 abstract 10
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器用冷却装置に関し、さらに詳しくは、
液体冷媒を用いた電子機器の結露防止を図った冷却装置
に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a cooling device for electronic equipment, and more specifically,
The present invention relates to a cooling device that uses liquid refrigerant to prevent condensation in electronic devices.
従来知られている電子機器の冷却装置の概略が第3図に
示されており、電子機器21に冷却装置31が付属装備
されている。電子機器21には発熱部23を冷却するた
めの制御部22が設けてあって、発熱部23において発
生する熱量の大小により制御部22が制御信号を冷却装
置31に制御信号系26を介して供給すると共に、発熱
部23に冷却管24を介して供給される冷媒の流量が制
御される。発熱部23をもつ電子機器21内の温度は気
温センサ25により検出されて、制御信号系26と共に
温度信号系27を経て冷却装置31に供給される。A conventionally known cooling device for an electronic device is schematically shown in FIG. 3, in which a cooling device 31 is attached to the electronic device 21. The electronic device 21 is provided with a control section 22 for cooling the heat generating section 23, and the control section 22 sends a control signal to the cooling device 31 via the control signal system 26 depending on the amount of heat generated in the heat generating section 23. At the same time, the flow rate of the refrigerant supplied to the heat generating section 23 via the cooling pipe 24 is controlled. The temperature inside the electronic device 21 having the heat generating section 23 is detected by the air temperature sensor 25 and is supplied to the cooling device 31 via the temperature signal system 27 together with the control signal system 26 .
そして、冷却装置31には電子機器21との間で循環管
路28を経由して送入、送出される冷媒を冷却する熱交
換器37と共に循環管路28と連結される冷媒冷却管路
39が設けてあり、この冷媒冷却管路41は三方弁36
を介して、一方は熱交換器37に、他方はこの熱交換器
37をバイパスして冷媒槽34に接続されている。冷媒
槽34は冷媒の体積変化を吸収するためのもので、ポン
プ35を経て冷媒40を前記循環管路28に供給するた
めの供給管路42に接続されている。この冷媒40の供
給管路42には冷媒の温度を検出するための冷媒温度セ
ンサ39が取付けられており、この冷媒温度センサ39
の出力信号は制御部32に送られると共に、制御部32
からの制御信号を入力できるようになっている。ポンプ
35.三方弁36も冷媒温度センサ39と共に制御部3
2からの制御信号で制御信号系43を介して制御されて
いる。The cooling device 31 includes a heat exchanger 37 that cools the refrigerant that is sent to and from the electronic device 21 via the circulation line 28, and a refrigerant cooling line 39 connected to the circulation line 28. is provided, and this refrigerant cooling pipe line 41 is connected to a three-way valve 36.
One side is connected to the heat exchanger 37, and the other side is connected to the refrigerant tank 34 via the heat exchanger 37. The refrigerant tank 34 is for absorbing changes in the volume of the refrigerant, and is connected to a supply pipe 42 for supplying the refrigerant 40 to the circulation pipe 28 via a pump 35. A refrigerant temperature sensor 39 for detecting the temperature of the refrigerant is attached to the supply pipe 42 of the refrigerant 40.
The output signal of is sent to the control section 32, and the output signal of the control section 32
It is possible to input control signals from the Pump 35. The three-way valve 36 is also connected to the control unit 3 together with the refrigerant temperature sensor 39.
It is controlled by a control signal from 2 via a control signal system 43.
また、熱交換器37は制御B部32から制御信号系44
を介して制御B駆動される冷却ファン38をもち、冷媒
40が初期の温度になるように駆動されるようになって
いる。Further, the heat exchanger 37 is connected to the control signal system 44 from the control section B 32.
It has a cooling fan 38 which is driven by control B via the cooling fan 38, and is driven so that the refrigerant 40 reaches an initial temperature.
そして、発熱部23の発熱温度が設定温度に達したこと
が検出されると、ポンプ35ならびに冷却ファン38が
制御部32からの駆動開始信号を受けて運転を開始する
。冷媒温度センサ39により検出される温度が電子機器
21内の気温センサ25により検出された温度と比較さ
れ、両温度差が結露しない温度範囲では三方弁36は熱
交換器37への通路を開いて冷媒を冷却ファンの冷却風
により冷却する。結露条件の温度差が生じた時は、三方
弁36は熱交換器37への通路を閉じ、バイパス管路を
開いて熱交換器37において冷媒を過冷却しないように
なっている。When it is detected that the heat generation temperature of the heat generating section 23 has reached the set temperature, the pump 35 and the cooling fan 38 receive a drive start signal from the control section 32 and start operating. The temperature detected by the refrigerant temperature sensor 39 is compared with the temperature detected by the air temperature sensor 25 in the electronic device 21, and the three-way valve 36 opens the passage to the heat exchanger 37 in a temperature range where the difference between the two temperatures does not cause condensation. The refrigerant is cooled by the cooling air from the cooling fan. When a temperature difference occurs under condensation conditions, the three-way valve 36 closes the passage to the heat exchanger 37 and opens the bypass line to prevent the refrigerant from being overcooled in the heat exchanger 37.
上述のような電子機器用冷却装置にあっては、電子機器
内の空気温度は冷媒温度とは無関係に変化し、電子機器
内における結露を防ぐためには電子機器内の気温に追従
して冷媒温度を制御する手段が不可欠であって、電子機
器の付属部分によって電子機器のコストを押上げている
問題があった。In the above-mentioned cooling device for electronic equipment, the air temperature inside the electronic equipment changes independently of the refrigerant temperature, and in order to prevent condensation inside the electronic equipment, the refrigerant temperature should be adjusted to follow the air temperature inside the electronic equipment. A means for controlling the electronic equipment is essential, and there is a problem in that the cost of the electronic equipment is increased by the attached parts of the electronic equipment.
本発明は、電子機器内に発熱部の発熱を吸収することが
できる熱交換器をはじめとして、冷却ファンなどを装備
して、電子機器内の気温が冷媒より低い温度となるよう
にすることで、制御系が簡単で、かつ確実に結露を防止
することができる冷却装置を提供することを、その目的
とするものである。The present invention has been developed by equipping an electronic device with a heat exchanger capable of absorbing heat generated by a heat generating part, a cooling fan, etc., so that the temperature inside the electronic device is lower than that of the refrigerant. The object of the present invention is to provide a cooling device that has a simple control system and can reliably prevent condensation.
本発明では、電子機器内の発熱部を冷却する冷媒と、こ
の冷媒を配管を介して前記発熱部内に送り込み送り出す
冷却機構とを備え、この冷却機構が、前記冷媒を空冷す
る空冷式の熱交換器と、この熱交換器に併設された冷却
ファンと、この冷却ファンを駆動制御し前記冷媒を所定
の温度に設定する冷媒用冷却度制御部とを備えて成る電
子機器用冷却装置において、前記冷却機構の冷却ファン
及び熱交換器を、前記電子機器内の発熱部の下方に装備
する、という構成を採っている。これにより、前述した
目的を達成しようとするものである。The present invention includes a refrigerant that cools a heat generating part in an electronic device, and a cooling mechanism that sends this refrigerant into the heat generating part through piping, and this cooling mechanism is an air-cooled heat exchanger that air-cools the refrigerant. A cooling device for an electronic device comprising a cooling fan attached to the heat exchanger, and a refrigerant cooling degree control unit that controls driving of the cooling fan and sets the refrigerant to a predetermined temperature. A configuration is adopted in which a cooling fan and a heat exchanger of the cooling mechanism are installed below a heat generating part within the electronic device. This aims to achieve the above-mentioned objective.
本発明の電子機器用冷却装置によれば、電子機器内に冷
媒を冷却する空気が満たされ、冷媒温度より機器空気温
度が低くなって結露が発生しない。According to the electronic device cooling device of the present invention, the electronic device is filled with air for cooling the refrigerant, and the device air temperature is lower than the refrigerant temperature, so that no dew condensation occurs.
以下、本発明の実施例を添付した図面の第1図に基づい
て説明する。この第1図において、符号1は電子機器全
体を示し、そのハウジング内には発熱部7.熱交換器2
.冷却ファン8.冷媒ポンプ4が配置され、これらは制
御信号系3を介して電気機器内に装備した制御部9に回
路上接続されている。また、冷媒10を循環させる循環
ポンプ4と、冷媒の体積変化を吸収する冷媒タンク5は
循環管路6により接続されている。この循環ポンプ4と
、前記冷却ファン8も制御信号系3により制御部9に回
路上接続されている。Embodiments of the present invention will be described below with reference to FIG. 1 of the accompanying drawings. In FIG. 1, reference numeral 1 designates the entire electronic device, and inside the housing there is a heat generating section 7. heat exchanger 2
.. Cooling fan 8. A refrigerant pump 4 is arranged, and these are connected via a control signal system 3 to a control unit 9 installed in the electrical equipment. Further, a circulation pump 4 that circulates the refrigerant 10 and a refrigerant tank 5 that absorbs changes in the volume of the refrigerant are connected by a circulation pipe 6. The circulation pump 4 and the cooling fan 8 are also connected to the control section 9 via the control signal system 3 in a circuit.
そして、発熱部7が設定温度に達すると、ここで発生し
た熱は冷媒10により吸収され、この冷媒10が熱交換
器2において冷却ファン8により送風される冷却風によ
り冷却される。これらの制御は温度検出を行った結果、
制御部9から制御信号系3を介して冷却ファン8.循環
ポンプ4に対して運転開始信号が送信されることで行わ
れる。When the heat generating section 7 reaches the set temperature, the heat generated here is absorbed by the refrigerant 10, and this refrigerant 10 is cooled by the cooling air blown by the cooling fan 8 in the heat exchanger 2. These controls are performed as a result of temperature detection.
A cooling fan 8. This is done by sending an operation start signal to the circulation pump 4.
この制御により強制的に循環される冷媒10は、再び電
子機器lの発熱部7において熱を吸収する。The refrigerant 10 that is forcibly circulated under this control absorbs heat again in the heat generating section 7 of the electronic device l.
そして、電子機器lのハウジング内には冷媒を冷却する
空気が充満し、この空気自体が熱を吸収した冷媒より温
度が低(なり、熱交換器2などにおいて結露することが
ない。The housing of the electronic device 1 is filled with air that cools the refrigerant, and this air itself has a lower temperature than the refrigerant that has absorbed heat, so that no condensation occurs in the heat exchanger 2 or the like.
添付した図面の第2図では、前記第1の実施例を基本部
として、3個の増設された電子機器1を備える電子機器
に冷却装置を通用したものであり、冷媒タンク5.循環
ポンプ4.制御部9は共用されている。In FIG. 2 of the attached drawings, the first embodiment is used as a basic part, and a cooling device is used for an electronic device including three additional electronic devices 1, and a refrigerant tank 5. Circulation pump 4. The control unit 9 is shared.
以上のように、本発明の電子機器用冷却装置によれば、
電子機器を構成するハウジング内に冷媒の熱交換器、冷
却ファンさらには制御部などを装備して冷却ファンによ
る冷却風が電子機器内に充満する構成としたから、その
充満した空気温度は冷媒温度より低い状態となって、電
子機器内において結露の発生を有効に防止することがで
きるという従来にない優れた電子機器用冷却装置を提供
することができる。As described above, according to the cooling device for electronic equipment of the present invention,
The housing that makes up the electronic device is equipped with a refrigerant heat exchanger, a cooling fan, and a control unit, so that the electronic device is filled with cooling air from the cooling fan, so the temperature of the filled air is equal to the refrigerant temperature. It is possible to provide an unprecedented and excellent cooling device for electronic equipment that can effectively prevent dew condensation from occurring within the electronic equipment.
第1図は本発明の一実施例を示す構成図、第2図は他の
実施例を示す構成図、第3図は従来例を示す構成図であ
る。
1・・・・・・電子機器、2・・・・・・熱交換器、3
・・・・・・制御信号系、4・・・・・・循環ポンプ、
5・・・・・・冷媒タンク、6・・・・・・循環管路、
7・・・・・・発熱体、8・・・・・・冷却ファン、9
・・・・・・制御部、10・・・・・・冷媒。
出願人 甲府日本電気株式会社
代理人 弁理士 高 橋 勇FIG. 1 is a block diagram showing one embodiment of the present invention, FIG. 2 is a block diagram showing another embodiment, and FIG. 3 is a block diagram showing a conventional example. 1...Electronic equipment, 2...Heat exchanger, 3
...Control signal system, 4...Circulation pump,
5...refrigerant tank, 6...circulation pipe,
7... Heating element, 8... Cooling fan, 9
. . . Control unit, 10 . . . Refrigerant. Applicant Kofu NEC Co., Ltd. Agent Patent Attorney Isamu Takahashi
Claims (1)
媒を配管を介して前記発熱部内に送り込み送り出す冷却
機構とを備え、この冷却機構が、前記冷媒を空冷する空
冷式の熱交換器と、この熱交換器に併設された冷却ファ
ンと、この冷却ファンを駆動制御し前記冷媒を所定の温
度に設定する冷媒用冷却度制御部とを備えて成る電子機
器用冷却装置において、 前記冷却機構の冷却ファン及び熱交換器を、前記電子機
器内の発熱部の下方に装備したことを特徴とする電子機
器用冷却装置。(1). The cooling mechanism includes a refrigerant that cools a heat generating part in an electronic device, and a cooling mechanism that sends this refrigerant into the heat generating part through piping, and this cooling mechanism includes an air-cooled heat exchanger that air cools the refrigerant, and A cooling device for an electronic device comprising a cooling fan attached to a heat exchanger, and a refrigerant cooling degree control unit that drives and controls the cooling fan and sets the refrigerant to a predetermined temperature. A cooling device for electronic equipment, characterized in that a fan and a heat exchanger are installed below a heat generating part in the electronic equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2270312A JP2894817B2 (en) | 1990-10-08 | 1990-10-08 | Cooling device for electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2270312A JP2894817B2 (en) | 1990-10-08 | 1990-10-08 | Cooling device for electronic equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04146694A true JPH04146694A (en) | 1992-05-20 |
JP2894817B2 JP2894817B2 (en) | 1999-05-24 |
Family
ID=17484522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2270312A Expired - Fee Related JP2894817B2 (en) | 1990-10-08 | 1990-10-08 | Cooling device for electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2894817B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010026840A1 (en) * | 2008-09-02 | 2010-03-11 | 株式会社ラスコ | Heat exchanging device |
JP2012002496A (en) * | 2010-05-19 | 2012-01-05 | Orion Machinery Co Ltd | Polyphyletic cooling system |
JP2017191431A (en) * | 2016-04-13 | 2017-10-19 | 富士通株式会社 | Data center and control method of data center |
US20180209668A1 (en) * | 2015-07-21 | 2018-07-26 | Samsung Electronics Co., Ltd. | Air conditioner and control method thereof |
CN110012651A (en) * | 2019-05-17 | 2019-07-12 | 烟台工程职业技术学院(烟台市技师学院) | The liquid cooling circulation cooling cabinet for having siphonic effect |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02106896U (en) * | 1989-02-09 | 1990-08-24 |
-
1990
- 1990-10-08 JP JP2270312A patent/JP2894817B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02106896U (en) * | 1989-02-09 | 1990-08-24 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010026840A1 (en) * | 2008-09-02 | 2010-03-11 | 株式会社ラスコ | Heat exchanging device |
CN101960239A (en) * | 2008-09-02 | 2011-01-26 | 株式会社拉斯科 | Heat exchanging device |
JP5594597B2 (en) * | 2008-09-02 | 2014-09-24 | 株式会社ラスコ | Cooling system |
JP2012002496A (en) * | 2010-05-19 | 2012-01-05 | Orion Machinery Co Ltd | Polyphyletic cooling system |
US20180209668A1 (en) * | 2015-07-21 | 2018-07-26 | Samsung Electronics Co., Ltd. | Air conditioner and control method thereof |
US10852010B2 (en) * | 2015-07-21 | 2020-12-01 | Samsung Electronics Co., Ltd. | Air conditioner and control method thereof |
US11175052B2 (en) | 2015-07-21 | 2021-11-16 | Samsung Electronics Co., Ltd. | Air conditioner and control method thereof |
US11193677B2 (en) | 2015-07-21 | 2021-12-07 | Samsung Electronics Co., Ltd. | Air conditioner and control method thereof |
JP2017191431A (en) * | 2016-04-13 | 2017-10-19 | 富士通株式会社 | Data center and control method of data center |
CN110012651A (en) * | 2019-05-17 | 2019-07-12 | 烟台工程职业技术学院(烟台市技师学院) | The liquid cooling circulation cooling cabinet for having siphonic effect |
Also Published As
Publication number | Publication date |
---|---|
JP2894817B2 (en) | 1999-05-24 |
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Legal Events
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