JPH07106202A - Substrate packaging structure of solid electrolytic capacitor - Google Patents

Abstract

PURPOSE:To avoid the package of a solid electrolytic capacitor having inverted pole thereof when said capacitor is to be packaged on a printed circuit board. CONSTITUTION:An insulating plate 15 is fixed to the lower surface of a solid electrolytic capacitor 10 and then the first two electrode films 19a, 19b conductive to one pole of the solid electrolytic capacitor 10 are provided on one end part on the lower surface of the insulating plate 15 while the second electrode film conductive to the other pole of said capacitor 10 is provided on the other end part of the lower surface of the insulating plate 15. On the other hand, the first two electrodes pads 23a, 23b against which the first two electrode films 19a, 19b abut and the second electrode pad 24 against which the second electrode film abuts are provided on a printed substrate 22 so that the interval L1 between the first two electrode pads 23a, 23b may be wider than the width W1 of the second electrode film while the interval L2 between the first two electrodes may be wider than the width W2 of the second electrode pad.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-type solid electrolytic capacitor, such as a tantalum solid electrolytic capacitor or an aluminum solid electrolytic capacitor, which has a small size and a large capacity, and is configured to be applied to surface mounting. The present invention relates to a structure when an electrolytic capacitor is mounted on a substrate such as a printed circuit board by soldering.

[0002]

2. Description of the Related Art Conventionally, a surface-mounting type solid electrolytic capacitor of this type is described in, for example, Japanese Patent Publication No. 30977/1991, and as shown in FIGS. Anode rod 1b protruding from the piece 1a
Is fixed to one lead terminal 2 of the pair of left and right metal plate lead terminals 2, 3, while the chip piece 1a
Is directly connected to the other lead terminal 3 or is connected via a safety fuse wire (not shown) against temperature or overcurrent, and the whole of them is connected to the mold part 4 made of synthetic resin. The lead terminals 2 and 3 are packaged so as to project from the left and right side surfaces 4a and 4b of the mold portion, and the lead terminals 2 and 3 are substantially flush with the bottom surface 4c of the mold portion 4. The lead terminals 2 and 3 are bent into a shape and soldered to the electrode pads A1 and A2 on the printed circuit board A.

By the way, this solid electrolytic capacitor is polar, and if it is mounted on an electric circuit on a printed circuit board or the like with the anode side and the cathode side reversed, the insulation will be destroyed, and When the current flows, a failure occurs in the solid electrolytic capacitor and the electric circuit to which the solid electrolytic capacitor is applied.

[0004]

However, in the conventional solid electrolytic capacitor, as described above, it is said that both lead terminals 2 and 3 have the same shape and project from the left and right side surfaces 4a and 4b of the molded portion 4. Since the solid electrolytic capacitor is mounted on the printed circuit board A by soldering, the electrodes of both lead terminals 2 and 3 of the solid electrolytic capacitor are mounted on the printed circuit board A. Since it will be soldered as it is when mounted in the opposite direction to, the solid electrolytic capacitor and its electric circuit may fail after being mounted by soldering the solid electrolytic capacitor to the printed circuit board. was there.

Therefore, in the conventional solid electrolytic capacitor,
Either one of the lead terminals 2 and 3 is provided with a slit hole, or a polar mark is provided on a portion of the upper surface of the mold portion 4 near the anode side lead terminal 2 or a portion near the cathode side lead terminal 3. Although it is possible to identify the polarity by providing the solid electrolytic capacitor, since it is a small component originally, it is difficult to visually recognize the slit hole provided in one of the lead terminals like the former. Therefore, the polarity is likely to be mistaken, and the polarity mark on the upper surface of the mold cannot identify the polarity of the solid electrolytic capacitor from the lower surface side of the solid electrolytic capacitor. There is a problem that it is impossible to prevent heat generation and burnout of the solid electrolytic capacitor after mounting by mounting.

An object of the present invention is to provide a mounting device for a solid electrolytic capacitor which solves these problems.

[0007]

In order to achieve this technical object, the present invention provides "claim 1" in which a positive electrode side lead terminal and a negative electrode side lead terminal protruding from both left and right side surfaces of a solid electrolytic capacitor are connected to a printed circuit board. In a mounting structure for soldering to the anode side electrode pad and the cathode side electrode pad on the substrate such as the above, an insulating plate is fixed to the lower surface of the solid electrolytic capacitor, and on both the left and right sides at one end of the lower surface of the insulating plate. Electrically connecting two first electrode films electrically conducting to one of the lead terminals of the solid electrolytic capacitor to a central portion of the other end of the lower surface of the insulating plate and to the other lead terminal of the solid electrolytic capacitor. One second electrode film that conducts to each of the first and second electrode films is provided, and one of the electrode pads on the substrate such as the printed circuit board is connected to the first and second electrode pads. The two first electrode pads, each of the electrode film is Setto, the other electrode pads, the second electrode film is respectively configured to the second electrode pad to Setto, further wherein both the first
The interval in the width direction of the solid electrolytic capacitor between the electrode pads is made larger than the width dimension of the second electrode film,
An interval between the first electrodes in the width direction of the solid electrolytic capacitor is made larger than a width dimension of the second electrode pad. "."

Further, in the "claim 2" of the present invention, "the anode side lead terminal and the cathode side lead terminal projecting from the left and right side surfaces of the solid electrolytic capacitor are provided on the anode side electrode pad and the cathode side of a substrate such as a printed circuit board. In a mounting structure in which each is soldered to an electrode pad, an insulating plate is fixed to the lower surface of the solid electrolytic capacitor, and the lower surface of the insulating plate is electrically connected to one lead terminal of the solid electrolytic capacitor so as to be solid. Two strip-shaped first electrode films extending in the longitudinal direction of the electrolytic capacitor, and one strip-shaped second electrode film electrically connected to the other lead terminal of the solid electrolytic capacitor and extending in the longitudinal direction of the solid electrolytic capacitor. While the second electrode film is provided so as to be located between the both first electrode films, and one of the two electrode pads on the substrate such as the printed circuit board is provided. Electrode pads are formed on two first electrode pads with which each of the first electrode films abuts, and the other electrode pad is formed with a second electrode pad on which the second electrode film abuts, respectively, The widthwise interval of the solid electrolytic capacitor between the first electrode pads is made larger than the width dimension of the second electrode film, while the widthwise interval of the solid electrolytic capacitor between the first electrode films is It is made larger than the width dimension of the second electrode pad. ”

[0009]

[Operation] According to the structure of claim 1, when the solid electrolytic capacitor is mounted on a substrate such as a printed circuit board with the poles of the solid electrolytic capacitor facing in the correct direction, the solid electrolytic capacitor is mounted on the lower surface of the insulating plate. Each of the first electrode films is in contact with both first electrode pads on the substrate side, while the second electrode film on the lower surface of the insulating plate is in contact with the second electrode pad on the substrate side. Therefore, it can be soldered as it is.

However, on the other hand, when the solid electrolytic capacitor is mounted on a substrate such as a printed circuit board with its poles reversed, both the first and second electrodes on the lower surface of the insulating plate are mounted.
The electrode film does not contact the second electrode pad on the substrate side and straddles the second electrode pad, while the second electrode film piece on the lower surface of the insulating plate contacts both the first electrode pads on the substrate side. Without hitting, it is in a state of being located between the both first electrode pads, so that soldering cannot be performed.

That is, according to the structure described in "Claim 1," the solid electrolytic capacitor can be soldered to the substrate only when the pole of the solid electrolytic capacitor is mounted in the correct direction. It is possible to prevent the solid electrolytic capacitor from being mounted with the poles reversed with respect to the electric circuit on the substrate.

Further, when it is configured as in "Claim 2",
When mounting the solid electrolytic capacitor on the substrate, make sure that the poles of the solid electrolytic capacitor are oriented in the correct direction or in the opposite direction, and Each of the first electrode films contacts both the first electrode pads on the substrate side, and at the same time, the second electrode film on the lower surface of the insulating plate contacts the second electrode pads on the substrate side. Since the solid electrolytic capacitor can be soldered in this state, it is possible to prevent the solid electrolytic capacitor from being mounted with the poles reversed with respect to the electric circuit on the substrate.

[0013]

Therefore, according to the present invention, when a solid electrolytic capacitor is mounted on a substrate, it is possible to ensure that the solid electrolytic capacitor and its electric circuit will not fail due to reverse mounting. It has a preventable effect.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. First, FIGS. 1 to 6 show a first embodiment. In the figure, reference numeral 10 indicates a solid electrolytic capacitor, and the solid electrolytic capacitor 10 is configured as follows.

That is, the anode rod 11b projecting from the chip piece 11a in the capacitor element 11 is fixed to one of the left and right pair of metal plate lead terminals 12, 13 on the anode side lead terminal 12, while the chip piece is formed. 11a
Is directly connected to the other cathode-side lead terminal 13 or is connected via a safety fuse wire (not shown) against temperature or overcurrent. At 14, both lead terminals 12, 1
3 so as to project from the left and right side surfaces 14a and 14b of the mold part.
2 and 13 are bent toward the bottom surface 14c of the mold portion 14.

Then, an insulating plate 15 is fixed to the lower surface of the solid electrolytic capacitor 10 (this fixing is performed with respect to the pair of electrode films 16 and 17 formed on the upper surface of the insulating plate 15 with respect to the solid electrolytic capacitor). 10 is carried out by soldering both lead terminals 12 and 13), and the lower surface of the insulating plate 15 is through to the electrode film 16 to which the anode side lead terminals 12 are soldered on both left and right sides of one end thereof. An electrode film 17 in which two first electrode films 19a and 19b which are electrically connected through the hole 18 are formed, and the cathode side lead terminal 13 is soldered to the central portion of the other end portion.
On the other hand, one second electrode film 21 which is electrically connected through the through hole 20 is formed.

On the other hand, on the printed circuit board 22, both first electrode films 19a electrically connected to the anode side lead terminal 12 are provided.
Two first electrode pads 23a, 19b each of which abuts
23b and one second electrode pad 24 with which the second electrode film 21 electrically connected to the cathode side lead terminal 13 abuts.
And the first electrode pads 23a, 2
The width L1 of the solid electrolytic capacitor 10 between 3b is made larger than the width W1 of the second electrode film 21, while the width L1 of the solid electrolytic capacitor 10 between the first electrodes 19a and 19b. L2 is the second
The width W2 of the electrode pad 24 is larger than the width W2.

With this structure, when the solid electrolytic capacitor 10 is mounted on the printed circuit board 22 with the poles of the solid electrolytic capacitor 10 oriented in the correct direction, the solid electrolytic capacitor 10 is indicated by a chain double-dashed line in FIG. To
Both the first electrode films 19a and 19b on the lower surface of the insulating plate 15
Respectively contact the first electrode pads 23a and 23b on the printed circuit board 22 side, and at the same time, the insulating plate 1
The second electrode film 21 on the lower surface of
Since it comes into contact with the second electrode pad 24 on the side, it can be soldered as it is.

On the other hand, on the other hand, the solid electrolytic capacitor 1
When 0 is mounted on the printed board 22 with its poles reversed, as shown by the chain double-dashed line in FIG.
Both the first electrode films 19a and 19b on the lower surface of the insulating plate 15
Is in a state of straddling the second electrode pad 24 on the printed circuit board 22 side without contacting the second electrode pad 24.
The second electrode film piece 21 on the lower surface of the insulating plate 15 has the first electrode pads 23a and 23b on the printed circuit board 22 side.
Without contacting the first electrode pads 23a, 2
Since it is located between 3b, it cannot be soldered.

That is, since the solid electrolytic capacitor 10 can be soldered to the printed board 22 only when the poles of the solid electrolytic capacitor 10 are mounted in the correct direction, the solid electrolytic capacitor 10 is printed. Therefore, it is possible to prevent the electric circuit on the substrate 22 from being mounted with the poles reversed.

Next, FIG. 7 shows a second embodiment. In this second embodiment, the same method as that of the first embodiment is applied to the lower surface of the solid electrolytic capacitor 10 (a pair of electrode films 16 'and 17' formed on the upper surface of the insulating plate 15 'is compared with the solid The anode side lead terminal 1 of the solid electrolytic capacitor 10 is provided on the lower surface of the insulating plate 15 'fixed by soldering both lead terminals 12 and 13 of the electrolytic capacitor 10.
2, two strip-shaped first electrode films 19a ', 19b' which are electrically connected to each other through a hole or the like and extend in the longitudinal direction of the solid electrolytic capacitor 10, and a cathode side lead terminal in the solid electrolytic capacitor 10. The solid electrolytic capacitor 1 is electrically connected to 13 through a hole or the like.
A strip-shaped second electrode film 21 ′ extending in the longitudinal direction of 0, and the second electrode film 21 ′ is connected to both the first electrode films 19
It is provided so as to be located between a'and 19b '.

On the other hand, on the printed circuit board 22 ', both first electrode films 1 electrically connected to the anode side lead terminals 12 are formed.
Two first electrode pads 23a 'and 23b' to which 9a 'and 19b' respectively abut, and a second electrode film 21 'to which the second electrode film 21' electrically conducting to the cathode side lead terminal 13 abuts. In providing the electrode pad 24 ', the width L1' in the width direction of the solid electrolytic capacitor 10 between the first electrode pads 23a 'and 23b' is set to the second electrode film 2 '.
1'is made larger than the width W1 ', while the two first
The distance L2 ′ in the width direction of the solid electrolytic capacitor 10 between the electrode films 19a ′ and 19b ′ is defined by the second electrode pad 2
It is configured to be larger than the width W2 'of 4'.

With this configuration, when the solid electrolytic capacitor 10 is mounted on the printed circuit board 22 ', even when the poles of the solid electrolytic capacitor 10 are oriented in the correct direction, the solid electrolytic capacitor 10 is moved in the opposite direction. Even when facing, both the first two
Each of the electrode films 19a 'and 19b' is a printed circuit board 2
The second electrode film 21 'on the lower surface of the insulating plate 15' is in contact with the second electrode pad 24 'on the side of the printed circuit board 22', while being in contact with both the first electrode pads 23a 'and 23b' on the side of 2 '. Therefore, the solid electrolytic capacitor 10 can be soldered in that state.
Can be prevented from being mounted with the poles reversed with respect to the electric circuit on the printed circuit board 22 '.

In the above embodiment, the two terminal pieces 12a and 12b are provided on the anode side lead terminal 12 of the two lead terminals 12 and 13 of the solid electrolytic capacitor 10, while the two electrode pads A1 on the printed circuit board A1 are provided. The case where the anode-side electrode pad A1 of A2 is configured to be the first electrode pad A1 ′ and the second electrode pad A1 ″ has been shown, but the present invention is not limited to this, and it is not limited to this. While providing two terminal pieces on the cathode side lead terminal 13,
Of the two electrode pads A1 and A2 on the printed circuit board A, the cathode side electrode pad A2 may be configured as a first electrode pad and a second electrode pad.

Although both of the above-mentioned embodiments show the case where the first electrode film and the first electrode pad for the anode side lead terminal 12 in the solid electrolytic capacitor 10 are two, the present invention is not limited to the solid electrolytic capacitor. It goes without saying that the second electrode film and the second electrode pad for the cathode side lead terminal 13 in 10 may be configured in two. Also,
According to the present invention, the two lead terminals 12 and 13 in the solid electrolytic capacitor 10 are connected to the molded portion 1 as in the above-mentioned respective embodiments.
4 is not limited to the case of bending toward the bottom surface side, but as shown in FIG. 8, both of the lead terminals 12 'and 13' projecting from the mold portion 14 'are bent outwardly to form a solid electrolytic capacitor 10'. It is also applicable in cases.

[Brief description of drawings]

FIG. 1 is a perspective view of a solid electrolytic capacitor and an insulating plate according to a first embodiment of the present invention.

2 is a vertical front view of FIG. 1. FIG.

FIG. 3 is a plan view of an insulating plate.

FIG. 4 is a perspective view showing a first embodiment of the present invention.

FIG. 5 is a plan view of a printed circuit board according to a first exemplary embodiment of the present invention.

FIG. 6 is a plan view of a printed circuit board according to a first exemplary embodiment of the present invention.

FIG. 7 is a perspective view showing a second embodiment of the present invention.

FIG. 8 is a perspective view of another solid electrolytic capacitor used in the present invention.

FIG. 9 is a vertical sectional front view of a conventional solid electrolytic capacitor.

10 is a cross-sectional view taken along line XX of FIG.

FIG. 11 is a perspective view showing a state in which a conventional solid electrolytic capacitor is mounted on a printed board.

[Explanation of symbols]

10 Solid Electrolytic Capacitor 12 Anode-side Lead Terminal 13 Cathode-side Lead Terminal 14 Mold Part 15 Insulating Plate 19a, 19b, 19a'19b 'First Electrode Film 21,21' Second Electrode Film 22,22 'Printed Circuit Board 23a, 23b, 23a '23b' First electrode pad 24, 24 'Second electrode pad

Continuation of front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H05K 1/18 U 7128-4E // H01G 2/06

Claims (2)

[Claims] 1. A mounting structure for soldering an anode side lead terminal and a cathode side lead terminal protruding from both left and right side surfaces of a solid electrolytic capacitor to an anode side electrode pad and a cathode side electrode pad on a substrate such as a printed circuit board. At
An insulating plate is fixed to the lower surface of the solid electrolytic capacitor, and two first electrode films electrically connected to one lead terminal of the solid electrolytic capacitor are provided on both left and right sides at one end of the lower surface of the insulating plate. One second electrode film electrically connected to the other lead terminal of the solid electrolytic capacitor is provided at the center of the other end of the lower surface of the insulating plate, while the two electrode pads on the substrate such as the printed circuit board are provided. One of the electrode pads is formed into two first electrode pads that are in contact with each of the first electrode films, and the other electrode pad is formed into a second electrode pad that is in contact with the second electrode film. Further, the interval in the width direction of the solid electrolytic capacitor between the first electrode pads is made larger than the width dimension of the second electrode film, while the solid electrolytic capacitor between the first electrodes is The interval in the width direction of capacitor, the second
A board mounting structure for a solid electrolytic capacitor, characterized in that the width is larger than the width of the electrode pad. 2. A mounting structure for soldering an anode side lead terminal and a cathode side lead terminal protruding from both left and right side surfaces of a solid electrolytic capacitor to an anode side electrode pad and a cathode side electrode pad on a substrate such as a printed circuit board. At
An insulating plate is fixed to the lower surface of the solid electrolytic capacitor, and two strip-shaped first strips extending in the longitudinal direction of the solid electrolytic capacitor are electrically connected to one lead terminal of the solid electrolytic capacitor on the lower surface of the insulating plate. The electrode film and one strip-shaped second electrode film which is electrically connected to the other lead terminal of the solid electrolytic capacitor and extends in the longitudinal direction of the solid electrolytic capacitor, the second electrode film being both the first electrodes While being provided so as to be located between the films, one of the electrode pads on the substrate such as the printed circuit board,
The two first electrode pads are in contact with the first electrode films, and the second electrode pad is in contact with the second electrode pads that are in contact with the second electrode film, respectively. The widthwise interval of the solid electrolytic capacitor between the electrode pads,
The solid is characterized in that the width dimension of the solid electrolytic capacitor between the first electrode membranes is made larger than the width dimension of the second electrode pad while the width dimension of the solid electrolytic capacitor is made larger than the width dimension of the second electrode pad. Board mounting structure for electrolytic capacitors.