JPH07106173A - Manufacture of ceramic electronic component - Google Patents

Abstract

PURPOSE:To provide a ceramic electronic component which can be miniaturized and whose yield is high in the manufacturing method of the ceramic electronic component which is used in various kinds of electric apparatuses. CONSTITUTION:Many recessed parts 4 are formed in a ceramic sheet 1 by a sandblast from opening parts 13 formed in a mask 10 and fitted with an electrode material 6, and the green sheet is cut to pieces of a prescribed shape, each of which is fired; thereby, and a ceramic electronic component is manufactured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component in which an inductor component, a capacitor component or a composite component of these components is miniaturized and has high performance.

[0002]

2. Description of the Related Art In recent years, it has been desired to increase the thickness of internal electrodes of inductor components made of ceramics such as ferrite in order to reduce their size and improve their performance. As means for increasing the thickness of such a film, JP-A-49-73669 and JP-A-3-
In Japanese Laid-Open Patent Publication No. 219605, it has been proposed that a mold or the like is pressed against a predetermined portion of a green sheet to form a recess, and then an electrode material is embedded in the recess to stack the electrodes while keeping the thickness of the electrodes apparently thin. .

A detailed description will be given with reference to FIG. FIG. 3 illustrates how a recess is formed in a ceramic green sheet when a mold is used. In FIG. 3, reference numeral 1 is a ceramic green sheet. As shown in FIG. 3A, the mold 2 is pressed against the ceramic green sheet 1 in the direction of arrow 3,
As shown in (b), the concave portion 4 is formed on the ceramic green sheet 1. At this time, the ceramic raw sheet 1 in the portion corresponding to the concave portion 4 of the ceramic raw sheet 1 is in the high density state 5. Finally, as shown in FIG. 3C, by embedding the electrode material 6 in the recess 4, the film thickness can be increased.

However, according to these methods, the density of the ceramic green sheet 1 pressed by the mold 2 is locally increased. Therefore, when the ceramic green sheets 1 having such a density difference are pressure-laminated or fired,
Defects such as delamination (delamination) easily occur.

Next, the manner of forming recesses in the ceramic green sheet when a laser is used will be described with reference to FIG. In FIG. 4, 7 is a laser beam, carbon dioxide gas, YA
Lasers such as G and excimer. 8 is a burr, which is easily formed around the recess 4. The burr 8 is formed by blowing away the melted material from the laser-irradiated portion of the ceramic green sheet 1, which easily re-attaches to the surface of the ceramic green sheet 1 and the formed recesses 4, and becomes the redeposited material 9. Thus, in laser processing, it was extremely difficult to control the depth of the recess 4 while preventing reattachment of scattered particles to the surface of the green ceramic sheet 1, even if an excimer laser was used.

[0006]

However, in the above-mentioned conventional ceramic electronic component, it was not possible to form the depressions or recesses 4 in the ceramic green sheet 1 without applying a force to the ceramic green sheet 1.

The present invention solves the above-mentioned problems of the prior art. The surface of a ceramic green sheet is ground into a predetermined pattern by a sandblasting method, so that the density of the ceramic green sheet does not change and a predetermined portion of the ceramic green sheet does not change. An object of the present invention is to provide a ceramic electronic component that can remove a sheet with a predetermined thickness, can easily cope with a thick electrode pattern, and has excellent characteristics at low cost.

[0008]

In order to achieve this object, a method of manufacturing a ceramic electronic component according to the present invention is to form a recess in a ceramic green sheet by sandblasting, apply an electrode material to the recess, and cut into a predetermined shape. Then, it is fired to obtain a ceramic electronic component.

[0009]

In this manufacturing method, the sandblasting is used to finely grind the ceramic green sheet in a predetermined portion with the blast particles, so that the concave portion can be formed without changing the density of the ceramic green sheet.

[0010]

【Example】

(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 illustrates a first embodiment of the present invention, and describes how a recess is formed in a ceramic green sheet by sandblasting. In FIG. 1, 10 is a mask, which is in close contact with the green ceramic sheet 1. 11 is compressed air and 12 is particles. The principle of sandblasting is that the particles 12 blown off by the compressed air 11 polish the workpiece.

FIG. 1 (a) illustrates how the recess 4 is formed in the green ceramic sheet 1. As shown in FIG. Figure 1 (a)
As shown in, the particles 12 hit the surface of the ceramic green sheet 1 exposed in the opening 13 of the mask 10 to polish the ceramic green sheet 1. The polished ceramic green sheet material 14 is applied to the mask 10 as indicated by the arrow 15.
Will be blown outside. Even if the polished ceramic sheet material 14 falls into the opening 13 of the mask 10, it is blown off by the compressed air 11 again as shown by an arrow 15.

In this way, the concave portion 4 as shown in FIG. 1B is formed on the surface of the ceramic green sheet 1. Here, the density of the ceramic green sheet 16 near the recess 4 does not change as compared with that before sandblasting. Finally Figure 1
As shown in (c), the electrode material 6 is applied to the recess 4 to form an electrode. In addition, a multilayer ceramic electronic component can be manufactured by forming vias in the ceramic green sheet 1 and laminating a predetermined number of them.

Next, the sandblasting method will be described in more detail with reference to FIG. In FIG. 2, 17 is a nozzle, which blows the particles 12 at high speed by the compressed air 11. Reference numeral 18 is a pin, and the mask 10 and the base film 19 and the ceramic green sheet 1 fixed thereon.
Is fixed on the table 20 in an aligned state. The opening 13 is formed in the mask 10 in a predetermined pattern. The shape of the opening 13 can be formed in a predetermined electrode pattern. As a method of forming the opening 13 in the mask 10, there are ordinary etching, laser, additivity plating and the like.

Inside the opening 13, particles 12 flow on the compressed air 11. Therefore, even if the opening 1
Even if dust is contained in the inside of the concave portion 3 or the concave portion 4, it is not polished by the particles 12 and disappears. Thus, in the case of the present embodiment, the probability that dust remains inside the concave portion 4 is extremely small as compared with the conventional hole forming method.

(Embodiment 2) As Embodiment 2, the surface protection of a mask used during sandblasting will be described.
At the time of sandblasting, a commercially available dry film for sandblasting can be used as a mask. However, in this case, since the dry film is directly attached to the workpiece (here, the ceramic green sheet 1), it is disposable and costly.

For this reason, it is desirable that the sandblasting mask be capable of withstanding multiple uses. As such a mask, a perforated thin plate or film made of metal, ceramic, resin alone or a composite can be used.
The mask surface may be sandblasted. Therefore, by coating a protective layer such as resin on the surface of the mask, the mask can be protected from sandblasting. In addition, the same mask can be used any number of times without damaging the same mask by making the protective layer removable and replacing the protective layer.

By using a rubber-based resin as the resin used, the durability of the protective layer itself can be lengthened. This protective layer can be peeled off with a solvent or the like, or a dry film can be used for the protective layer, or when the SUS plate is used as a mask by etching, the resist layer used for the etching can be used as it is as the protective layer. .

The life of the mask itself can also be extended by subjecting the mask itself to a treatment such as matrix plating (composite plating or dispersion plating) containing fluororesin or ceramic particles.

(Embodiment 3) As Embodiment 3, an example of a method of fixing the mask and the ceramic green sheet will be described.
During the sandblasting, if the mask 10 and the ceramic green sheet 1 are misaligned, the positions of the recesses 4 are misaligned. For this reason, the yield can be improved by sufficiently adhering the mask 10 and the ceramic green sheet 1 by using adhesive force, magnetic force, vacuum force, electrostatic force or the like. For example, a material having magnet adhesion such as SUS430 can be used as the mask material and a magnet can be used for the table 20. Holding strength can also be adjusted by using an electromagnet as the magnet. In addition, the mask material can be prevented from floating by optimizing the magnetic pole spacing of the magnets.

Fourth Embodiment Next, as a fourth embodiment, description will be given of a case where the mask is made of a metal, a ceramic, or a resin alone or a composite, and is formed on the surface of the ceramic green sheet 1 by printing or transfer. As the mask material, a dry film for sandblast can be transferred, or a resist material can be directly printed. Such a commercially available mask material can be easily peeled off after sandblasting. At the time of this peeling, particles remaining after sandblasting can be removed at the same time as the mask.

(Fifth Embodiment) As a fifth embodiment, an example of a method of filling the recesses with an electrode material by using a mask used for sandblasting will be described. First, after forming the concave portion 4 in the ceramic green sheet 1 using a dry film mask, the electrode material 6 can be filled and printed in the concave portion 4 using the dry film mask as a printing mask. After that, the dry film is peeled off to form a multilayer using a normal ceramic green sheet laminating process.

[0022]

INDUSTRIAL APPLICABILITY As described above, according to the present invention, a concave portion is formed by sandblasting on a ceramic green sheet through a mask,
By filling this recess with an electrode material, cutting it into a predetermined shape, and then firing it, a difference in density is generated in the ceramic green sheet, delamination does not occur, and a recess without burr and residue is formed by batch processing. It is possible to manufacture high precision, high quality, low cost ceramic electronic components.

[Brief description of drawings]

FIG. 1 is a process sectional view showing an embodiment of a method for manufacturing a ceramic electronic component of the present invention.

FIG. 2 is a perspective view for explaining the sandblasting method in detail.

FIG. 3 is a cross-sectional view illustrating a method for manufacturing a ceramic electronic component when a conventional mold is used.

FIG. 4 is a cross-sectional view for explaining how a groove is formed in a ceramic green sheet when a conventional laser is used.

[Explanation of reference numerals] 1 ceramic green sheet 4 concave portion 6 electrode material 10 mask 11 compressed air 12 particles 13 opening 14 polished ceramic green sheet material 15 arrow 16 ceramic green sheet 17 nozzle 18 pin 19 base film 20 units

Claims (8)

[Claims] 1. A method of manufacturing a ceramic electronic component, comprising forming a recess in a ceramic green sheet by sandblasting, applying an electrode material to the recess, cutting the recess into a predetermined shape, and then firing. 2. A method of manufacturing a ceramic electronic component, wherein a recess is formed on a ceramic green sheet by sandblasting through a mask, an electrode material is applied to the recess, the product is cut into a predetermined shape and then fired. 3. The method for producing a ceramic electronic component according to claim 1, wherein the ceramic green sheet is fixed on a base film. 4. The mask is made of a metal, a ceramic, a resin alone or a composite, and is formed by printing or transferring on the surface of a ceramic green sheet.
A method for manufacturing the described ceramic electronic component. 5. The mask is a perforated thin plate or film made of a metal, a ceramic, a resin alone or a composite, and is provided with a peelable protective layer if necessary.
A method for manufacturing the described ceramic electronic component. 6. The adhesive force, magnetic force, vacuum force between the mask and the ceramic green sheet at least during sand blasting,
3. The method for manufacturing a ceramic electronic component according to claim 2, wherein the electrostatic electronic force and the composite force are used to bring into close contact with each other. 7. After sandblasting using a mask,
The method of manufacturing a ceramic electronic component according to claim 2, wherein an electrode material is applied to the recess using the mask. 8. The method of manufacturing a ceramic electronic component according to claim 2, wherein a mask in which a portion of the hole of the mask facing the workpiece is chamfered is used.