JP2004166118A - Manufacturing method of dielectric line - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method by which a dielectric line can be efficiently manufactured with high reliability and accuracy. <P>SOLUTION: A resist material 22 is formed on a green molded body 23, an eroding step is performed by a sandblast method by using the resist material 22 as a mask, and a prescribed portion of the green molded body 23 is removed, whereby an unburned dielectric substrate 2a is obtained. Subsequently, through-holes 8 and 9 for through-conductors are formed on the dielectric substrate 2a, and then marginal sections 12 of the opened ends of the through-holes 8 and 9 and internal peripheral surfaces 13 of the holes 8 and 9 are smoothed, by using the eroding step again. Subsequently, a dielectric substrate 2, having a raised section 3 and wing sections 4 and 5 respectively having the through-holes 8 and 9, is obtained by applying a burning step. Thereafter, conductive films are formed on both surfaces of the substrate 2 and, at the same time, through-conductors are formed in the through holes 8 and 9 so as to electrically connect the conductive films formed on both surfaces of the substrate 2 to each other. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a dielectric line suitable for use in the field of transmission lines and integrated circuits used in a millimeter wave band or a microwave band.
[0002]
[Prior art]
A dielectric line of interest to the present invention is one in which a waveguide type transmission line is formed on a dielectric substrate and integrated with the dielectric substrate. As a dielectric line having such a configuration, there is, for example, one having the configuration shown in FIGS. 2 and 3 (for example, see Patent Document 1).
[0003]
FIG. 2 is a cross-sectional view showing the dielectric line 1, and FIG. 3 is a perspective view showing a dielectric substrate 2 provided in the dielectric line 1 shown in FIG.
[0004]
On the dielectric substrate 2, at least one surface is provided with a continuous raised portion 3 having a convex cross section, and wing portions 4 and 5 are provided on both sides of the raised portion 3. Conductive films 6 and 7 are formed on both surfaces of the dielectric substrate 2 including the outer surface of the above-mentioned raised portion 3.
[0005]
The wing portions 4 and 5 of the dielectric substrate 2 are provided with a plurality of arranged through holes 8 and 9, respectively. The through holes 8 and 9 allow the conductor films 6 and 7 to conduct each other. Are provided with a plurality of through conductors 10 and 11, respectively.
[0006]
In such a dielectric line 1, the distance between the conductor films 6 and 7 in the thickness direction of the dielectric substrate 2 in the raised portion 3 is set to be equal to or more than a half wavelength of the wavelength in the dielectric at the operating frequency. By arranging the through conductors 10 and 11 in the wing portions 4 and 5 as described above, the raised portion 3 can function as a part of the dielectric-filled waveguide transmission line.
[0007]
[Patent Document 1]
JP-A-2002-217613
[0008]
[Problems to be solved by the invention]
In the above-described dielectric line 1, when the opening edge 12 or the inner peripheral surface 13 of the through holes 8 and 9 is not smooth due to, for example, a projection formed thereon, current concentrates on the projection or the like. By doing so, the conductor loss increases, which in turn causes a large transmission loss. Therefore, it is necessary to reduce the concentration of current by making the opening edge 12 and the inner peripheral surface 13 of the through holes 8 and 9 have good smoothness.
[0009]
On the other hand, in manufacturing the dielectric substrate 2, after preparing a sintered body to be the dielectric substrate 2 which has been fired in advance and cutting the sintered body to form the raised portion 3, For example, a method of forming the through holes 8 and 9 by laser processing to obtain the dielectric substrate 2 or a method of preparing a plurality of green sheets to be the dielectric substrate 2 and forming these green sheets by laser processing, for example. After the through holes 8 and 9 are formed, a plurality of green sheets are laminated and then fired to obtain a sintered body. A method for obtaining the body substrate 2 is employed.
[0010]
However, since the sintered body after firing is very hard, it is often used in cutting for obtaining the shape of the dielectric substrate 2 having the raised portions 3 and laser processing for forming the through holes 8 and 9. There is a problem that it takes time and effort. Further, since the thickness of the wing portions 4 and 5 is relatively small, there is also a problem that cracks and chips are easily generated during the cutting process.
[0011]
Further, when the through holes 8 and 9 are to be formed in the sintered body as in the former method described above, a dielectric material such as ceramic is formed on the opening edge 12 and the inner peripheral surface 13 of the through holes 8 and 9. There is also a problem that a melt of the material constituting the body substrate 2 adheres. On the other hand, when a plurality of green sheets on which the through holes 8 and 9 are formed by laser processing are stacked as in the latter method, the inner peripheral surfaces of the through holes 8 and 9 after stacking due to stacking misalignment in the stacking. There is also a problem that a step is formed on the surface 13.
[0012]
When the above-mentioned inconvenience occurs, there is a problem that it is difficult to form the through conductors 10 and 11 in the through holes 8 and 9 and a continuity between the conductor films 6 and 7 and the through conductors 10 and 11. Therefore, the current and the continuity in the through conductors 10 and 11 are impaired, so that the current concentrates on the discontinuous portion, and the concentration of the current causes a problem that the conductor loss increases.
[0013]
Therefore, an object of the present invention is to provide a method of manufacturing a dielectric line that can solve the above-described problems.
[0014]
[Means for Solving the Problems]
In brief, the present invention provides a process for giving the shapes of the protruding portion and the wing portion by erosion to a green molded body before firing for forming a dielectric substrate in a state where a resist material is formed. After forming, a through-hole is formed, and after forming the through-hole, an erosion step is performed again to smooth the opening edge and / or the inner peripheral surface of the through-hole, and thereafter, the resist material is removed. It is characterized by doing.
[0015]
More specifically, the present invention includes a dielectric substrate in which at least one surface is provided with a continuous raised portion having a convex cross-sectional shape and a wing portion is provided on both sides of the raised portion, and also includes an outer surface of the raised portion. A conductive film formed on both surfaces of the dielectric substrate, and a plurality of through conductors respectively arranged on the wing portions so as to conduct the conductive films formed on both surfaces of the dielectric substrate to each other. The present invention is directed to a method for manufacturing a line, and has the following configuration.
[0016]
The method of manufacturing a dielectric line according to the present invention is for forming a dielectric substrate with a part thereof, including at least an inorganic powder and an organic binder, a step of producing a green molded body, and a step of producing a green molded body. A step of forming a resist material so as to cover a portion corresponding to the raised portion on the outer surface, and applying erosion to produce a dielectric substrate before firing having a shape of the raised portion and the wing portion. Then, using the resist material as a mask, a first erosion step of removing a portion of the green molded body that is exposed from the resist material by a desired amount, and after the first erosion step, before the sintering is performed. Forming a through hole for a through conductor in the dielectric substrate; and, after the through hole forming step, applying erosion to open the edge of the through hole and / or A second erosion step for smoothing the inner peripheral surface of the through-hole, removing the resist material after the second erosion step, a resist material removing step, and firing the dielectric substrate before firing, firing And a step of providing a conductive film and a through conductor on the dielectric substrate.
[0017]
In this specification, erosion refers to a phenomenon in which a material surface is mechanically damaged by repeated collision (or impact) of a fluid and a part of the material is detached ("Erosion and Corrosion", incorporated association) (Corrosion and Corrosion Protection Association, 1987, Shokabo Co., Ltd.)
[0018]
In the first and second erosion steps described above, for example, various methods such as sandblasting, slurry erosion, cavitation erosion, sputtering, chemical milling, ion milling, and reactive ion etching (RIE) can be applied. Among these, a method using a vacuum process is relatively unsuitable for fine processing of a green molded body containing moisture and an organic component, and is required for manufacturing a dielectric substrate, for example, 0.2 to 1 From the viewpoint that high dimensional accuracy can be realized even in a relatively deep etching such as 0.0 mm, it is most preferable to use a sandblast method in at least the first erosion step.
[0019]
In the through-hole forming step, for example, laser, drill, or punching can be applied. Of these, a laser is more preferably applied because it can be processed at a high speed and the finishing accuracy of the processed diameter is relatively high.
[0020]
The green compact may be obtained by laminating a plurality of green sheets containing at least an inorganic powder and an organic binder.
[0021]
Further, for simplification of the process, the resist material removing process may be performed simultaneously with the firing process. This is because the resist material can be thermally decomposed and removed by the temperature given in the baking step.
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a cross-sectional view sequentially illustrating several typical steps included in a method of manufacturing a dielectric line according to an embodiment of the present invention. By this manufacturing method, the dielectric substrate 2 shown in FIG. 3 is manufactured, and then the dielectric line 1 shown in FIG. 2 is manufactured.
[0023]
First, as shown in FIG. 1A, a plurality of green sheets 21 including an inorganic powder and an organic binder are prepared.
[0024]
As the above-mentioned inorganic powder, ceramic such as alumina, cordierite, forsterite, and spinel, glass, or the like can be used, and any inorganic powder can be used as long as there is no problem in processing accuracy and propagation characteristics. In view of the advantage that the use of a dielectric ceramic can reduce the size compared with the case of using a synthetic resin such as polytetrafluoroethylene, the relative dielectric constant of the inorganic material constituting the inorganic powder is 4 or more. It is preferable to use one.
[0025]
As the above-mentioned organic binder, a butyral-based resin, an acrylic-based resin, a urethane-based resin, an epoxy-based resin, a vinyl-based resin, or the like can be used. The first erosion step shown in FIG. Any resin can be used as long as it is easier to remove than the resist material 22 used in the above.
[0026]
The green sheet 21 further contains a plasticizer such as dioctyl phthalate, dibutyl phthalate, and α-terpineol in order to improve the adhesion between the plurality of green sheets 21 and the handling workability of the green sheet 21. Is also good.
[0027]
Further, in order to produce the green sheet 21, a method such as a doctor blade method, a comma coating method, a roll coating method, and a casting method can be used.
[0028]
Next, as shown in FIG. 1 (2), a plurality of green sheets 21 are stacked and pressed to form a green molded body 23. The green molded body 23 is for forming the dielectric substrate 2 shown in FIGS. 2 and 3 with a part thereof.
[0029]
It is preferable to adjust the thickness at the stage of the green molded body 23 so that the dielectric substrate 2 obtained through the firing step described below has a thickness that allows electromagnetic waves to propagate. Therefore, for example, it is preferable that the above-mentioned thickness adjustment is performed by setting the thickness of the green sheet 21 to about several μm to several mm and adjusting the number of the laminated sheets. Note that the green molded body 23 may be integrally molded instead of being obtained by laminating a plurality of green sheets 21.
[0030]
Next, as shown in FIG. 1C, a resist material 22 is formed on the outer surface of the green molded body 23. The resist material 22 is patterned so as to cover a portion corresponding to the raised portion 3 shown in FIGS.
[0031]
For patterning of the resist material 22, preferably, a photolithography technique is applied, but in addition, a printing method, a coating method, a sticking method, or the like may be applied.
[0032]
As a material constituting the resist material 22, any material may be used as long as it has a sufficient resistance in the first erosion step shown in FIG. Specifically, polyvinyl alcohol, polymethacrylates, cellulose resin, poly-α-methylstyrene, urethane resin, and the like can be used as the material for the resist material 22.
[0033]
Next, as shown in FIG. 1D, a first erosion step of removing a predetermined amount of a portion of the green molded body 23 exposed from the resist material 22 using the resist material 22 as a mask is performed. You. In the first erosion step, a sand blast method is preferably applied. In the sand blast method, as shown by an arrow 24, abrasive grains are sprayed. In this case, even if a drive blast method in which the abrasive grains are sprayed together with a gas is applied, a wet blast method in which the abrasive grains are sprayed together with a liquid is applied. Is also good.
[0034]
As abrasives used in the sandblasting method, abrasives made of alumina, silicon carbide, carbon, hard plastic, or the like can be used.As the gas, air, nitrogen, argon, or the like can be used, and as the liquid, water can be used. , Ethyl alcohol, isopropyl alcohol, and the like.
[0035]
Various methods such as slurry erosion, cavitation erosion, sputtering, ion milling, and reactive ion etching can be applied to the erosion step in addition to the sand blast method.
[0036]
In this way, the dielectric substrate 2a before firing, having the shapes of the raised portions 3 and the wing portions 4 and 5, is manufactured.
[0037]
Next, as shown in FIG. 1 (5), through holes 8 and 9 are formed in the wing portions 4 and 5 of the dielectric substrate 2a before firing, for example, by applying a laser. For forming the through holes 8 and 9, drilling or punching may be applied instead of laser.
[0038]
As described above, when the through holes 8 and 9 are formed in the dielectric substrate 2a before firing, the through holes 8 and 9 are formed as compared with the case where the through holes 8 and 9 are formed in the sintered body. And the processing speed can be increased, and an appropriate form can be achieved as compared with the case where the through holes 8 and 9 are formed in the green sheet 21 or the green molded body 23. Through holes 8 and 9 can be efficiently formed. Thus, the processing cost for forming the through holes 8 and 9 can be reduced. In the step of forming the through holes 8 and 9, since the resist material 22 is left, it is possible to prevent undesired deformation of the dielectric substrate 2a before sintering, in particular, loss of dimensional accuracy in the raised portion 3. be able to.
[0039]
Next, as shown in FIG. 1 (6), erosion is applied again to smooth the opening edge 12 of the through holes 8 and 9 and the inner peripheral surface 13 of the through holes 8 and 9. Is performed.
[0040]
This second erosion step is preferably carried out using the same method as in the case of the first erosion step described above, from the viewpoint of making the equipment common and reducing the cost. For example, when the sand blast method is used in the first erosion step, the sand blast method is also used in the second erosion step, and abrasive grains are sprayed as indicated by an arrow 25.
[0041]
In the second erosion step, the abrasive grains pass through the through holes 8 and 9 uniformly, so that unnecessary substances in the through holes 8 and 9 are removed and the opening edges of the through holes 8 and 9 are removed. 12 and the inner peripheral surface 13 are smoothed.
[0042]
Next, the resist material 22 is removed from the dielectric substrate 2a before firing. As a method for removing the resist material 22, for example, a method in which the resist material 22 is immersed in a solvent and dissolved and removed can be employed. Further, in the baking process described later, a method of removing the resist material 22 by decomposition and burning may be employed. That is, as the method of removing the resist material 22, any method may be adopted as long as there is no risk of causing undesired deformation in the dielectric substrate 2a before firing.
[0043]
Next, the above-described dielectric substrate 2a before firing is fired, thereby having a raised portion 3 and a wing portion 4 or 5 as shown in FIG. 1 (7) and FIG. The dielectric substrate 2 on which 8 and 9 are formed is obtained. This firing step can be performed in any of a non-oxidizing atmosphere and an oxidizing atmosphere, and a general belt furnace, batch furnace, or the like can be used for performing the firing step.
[0044]
Next, conductor films 6 and 7 and through conductors 10 and 11 are provided on dielectric substrate 2 by, for example, applying a vapor deposition method, whereby dielectric line 1 as shown in FIG. 2 is completed.
[0045]
In forming the conductive film 7 on the lower surface side of the dielectric substrate 2 described above, in addition to the vapor deposition method, for example, the stage of the green sheet 21 before firing, the stage of the green molded body 23, or the formation of the dielectric substrate 2a before firing. After a conductive paste film is formed by a printing method or the like at a stage, the conductive pattern film is baked to form the conductive film 7 at the same time as the firing of the dielectric substrate 2a before firing, or the dielectric film after sintering is formed. For example, a method of forming a conductive film 7 on the substrate 2 by applying a printing method, a sputtering method, a sol-gel method, a plating method, or the like can be adopted. Alternatively, the conductor film 7 may be formed by attaching a separately prepared conductor plate such as a metal plate on the lower surface of the dielectric substrate 2 or 2a after or before firing.
[0046]
In forming the through conductors 10 and 11, after the second erosion step is performed, the inside of the through holes 8 and 9 in the dielectric substrate 2 or 2a after firing or before firing is used in addition to the above-described vapor deposition method. For example, a method of forming the through conductors 10 and 11 by applying a printing method, a sputtering method, a sol-gel method, a plating method, or the like may be adopted. Further, since the through conductors 10 and 11 are provided so as to conduct the conductor films 6 and 7 to each other, as shown in FIG. Or may be formed so as to fill through holes 8 and 9.
[0047]
Hereinafter, a method for manufacturing a dielectric line according to the present invention will be described based on more specific examples.
[0048]
Embodiment 1
The first embodiment will be described with reference to FIG.
[0049]
As shown in FIG. 1A, a spinel powder as an inorganic powder, a butyral-based resin “BM-2” (manufactured by Sekisui Chemical Co., Ltd.) as an organic binder, and a plasticizer for producing a green sheet 21 , And ethyl alcohol and toluene as organic solvents were prepared and weighed in predetermined amounts, and then mixed by a ball mill in a polypot. Thereafter, a green sheet 21 having a thickness of 10 to 100 μm was produced by a doctor blade method.
[0050]
Next, the green sheet 21 is cut out into a 70 mm square to adjust its shape, and as shown in FIG. 1 (2), a plurality of green sheets 21 are stacked and pressed by a hydrostatic isostatic press to obtain a green molded body. 23 was obtained.
[0051]
Next, while heating the green molded body 23 to 80 ° C., a dry film resist “BF-405” (manufactured by Tokyo Ohka Kogyo Co., Ltd.) as a photosensitive resist is laminated on the upper surface thereof, and a predetermined pattern mask is formed. Exposure with ultraviolet light was performed. The exposure condition is 200 mJ / cm at 365 nm. ² And Subsequently, spray development is performed with a 0.3% by weight aqueous solution of sodium carbonate at a liquid temperature of 30 ° C., thereby forming a patterned resist material 22 on a green molded body 23 as shown in FIG. Formed.
[0052]
Next, as shown in FIG. 1 (4), using a sandblasting machine of “Pneumatic Blaster SC-3 type” (manufactured by Fuji Seisakusho), the green molded body 23 was formed while using the resist material 22 as a mask. On the other hand, a first erosion step by a sandblast method was performed. The sand blasting conditions were such that the distance between the nozzle and the green compact 23 was 8 cm, fused alumina "# 1000" was used as abrasive grains, and the ejection pressure was 0.3 MPa.
[0053]
As described above, by removing a predetermined amount of the portion of the green molded body 23 exposed from the resist material 22 by the first erosion step by the sand blast method, the shapes of the raised portion 3 and the wing portions 4 and 5 are changed. A pre-fired dielectric substrate 2a was produced.
[0054]
Next, CO ₂ As shown in FIG. 1 (5), through holes 8 and 9 were formed in the wings 4 and 5 of the dielectric substrate 2a before firing using a laser, respectively. At this stage, when the insides of the through holes 8 and 9 were observed using a metallurgical microscope, it was found that unnecessary substances that appeared to have fused and adhered the ceramic particles remained.
[0055]
Next, using the same sand blasting machine as in the first erosion step, as shown in FIG. 1 (6), the opening edges of the through holes 8 and 9 and the inner peripheral surfaces of the through holes 8 and 9 were smoothed. A second erosion step was carried out. In the second erosion step, the ejection pressure of the abrasive grains was set to 0.1 MPa.
[0056]
Thereafter, the dielectric substrate 2a before firing obtained as described above was immersed in a 10% by weight aqueous solution of monoethanolamine at a liquid temperature of 45 ° C. to remove the resist material 22.
[0057]
Next, using a batch type electric furnace, the dielectric substrate 2a before firing is fired in air at a temperature of 1600 ° C. for 2 hours, and as shown in FIG. A dielectric substrate 2 having 4 and 5 was obtained.
[0058]
In the dielectric substrate 2 thus obtained, neither cracks nor chips were generated in the wing portions 4 and 5, and no melt adhered to the through holes 8 and 9 was observed. The smooth through holes 8 and 9 were formed, and the variation (standard deviation) in the width of the raised portion 3 was as good as 10 μm or less.
[0059]
Embodiment 2
The second embodiment is implemented by changing a part of the first embodiment.
[0060]
In the same manner as in Example 1, a green sheet 21 having a thickness of 10 to 100 μm was produced.
[0061]
Next, similarly to Example 1, the green sheet 21 was cut out into a 70 mm square, the shape was adjusted, a plurality of green sheets 21 were stacked, and pressed by a hydrostatic isostatic press to obtain a green molded body 23. .
[0062]
Next, a resist material 22 made of patterned polyvinyl alcohol was formed on the green molded body 23 by a screen printing method.
[0063]
Next, a first erosion step by a sand blast method was performed on the green molded body 23 under the same conditions as in Example 1 while using the resist material 22 as a mask. Thus, by removing a predetermined amount of the portion of the green molded body 23 exposed from the resist material 22, the dielectric substrate 2a before firing having the shapes of the raised portions 3 and the wing portions 4 and 5 is manufactured. did.
[0064]
Next, through holes 8 and 9 were formed in the wing portions 4 and 5 of the dielectric substrate 2a before firing by punching. At this stage, when the insides of the through holes 8 and 9 were observed using a metallographic microscope, burrs caused by tearing during punching were observed at the opening edge portions 12 of the through holes 8 and 9.
[0065]
Next, a second erosion step for smoothing the opening edges of the through holes 8 and 9 and the inner peripheral surfaces of the through holes 8 and 9 was performed under the same conditions as in Example 1.
[0066]
Then, without removing the resist material 22, the dielectric substrate 2a before firing is fired by the same method as in the first embodiment, and at the same time, the resist material 22 is thermally decomposed and the raised portions 3 and the wing portions 4 and 5 are heated. Was obtained.
[0067]
In the dielectric substrate 2 obtained in this manner, neither the wings 4 nor 5 had any cracks or chips, and the burrs generated in the through holes 8 and 9 were not observed. The through holes 8 and 9 were formed, and the variation (standard deviation) of the width of the raised portion 3 was as good as 10 μm or less.
[0068]
【The invention's effect】
As described above, according to the method for manufacturing a dielectric line according to the present invention, in order to obtain shapes such as ridges and wings in a dielectric substrate, a green body in a raw state is used instead of processing a sintered body. Since a predetermined portion of the molded body is removed by erosion, processing for obtaining a desired shape can be performed in a short time without causing cracks or chipping.
[0069]
In the first erosion step of removing a predetermined portion of the green molded body, a resist material having a desired pattern is used as a mask. The resist material is patterned by photolithography capable of precise patterning. Since the technology can be applied, the dimensions at the raised portion and the wing portion can be accurately defined, and the dimensional accuracy at these portions can be improved.
[0070]
In addition, since the through holes are formed in the dielectric substrate before firing, compared to the case of forming the through holes in the sintered body, the limitation on the method that can be applied to form the through holes is not so large. In addition to this, the processing speed can be increased, and a through hole having an appropriate form can be efficiently formed as compared with a case where a through hole is formed in a green sheet or a green molded body. Thus, the processing cost for forming the through-hole can be reduced. In addition, since the resist material is left in the step of forming the through-holes, it is possible to prevent undesired deformation of the dielectric substrate before firing, in particular, loss of dimensional accuracy in the raised portions.
[0071]
In addition, a through hole for a through conductor is formed at the stage of the dielectric substrate before firing obtained in the first erosion step, and then the second erosion step is performed. In the erosion step, the opening edge of the through hole and / or the inner peripheral surface of the through hole can be smoothed.
[0072]
From the above, according to the method for manufacturing a dielectric line according to the present invention, it is possible to manufacture a dielectric line with high reliability and accuracy at a low cost and efficiently, and at the same time, a conductive film and Discontinuity with the through conductor and discontinuity in the through conductor can be made less likely to occur, and the problem of an increase in conductor loss due to concentration of current in the discontinuous portion can be solved. .
[0073]
In the present invention, in particular, if the sand blast method is applied in the first erosion step, the predetermined portion of the green molded body containing water and the organic component can be removed without any problem, and the relatively deep removal can be performed at a high level. It can be performed with dimensional accuracy. Therefore, it can be said that the sandblast method is particularly suitable for manufacturing a dielectric substrate having a raised portion and a wing portion.
[0074]
In the present invention, when a laser is applied to form a through-hole, the through-hole can be formed at a high speed, and a through-hole having a good finishing accuracy of a processing diameter can be formed.
[0075]
In the present invention, if a plurality of green sheets are laminated to obtain a green molded body, the thickness of the raised portion can be easily controlled according to the number of laminated green sheets.
[0076]
In the present invention, if the resist material is removed by thermal decomposition in the baking step, a special process for removing the resist material is not required, and the process for obtaining the dielectric line can be further simplified. it can.
[Brief description of the drawings]
FIG. 1 is a sectional view schematically showing a plurality of typical steps included in a method for manufacturing a dielectric line according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a dielectric line 1 of interest to the present invention.
FIG. 3 is a perspective view showing a dielectric substrate 2 provided in the dielectric line 1 shown in FIG.
[Explanation of symbols]
1 Dielectric line
2 Dielectric substrate
2a Dielectric substrate before firing
3 ridge
4,5 wing
6,7 conductor film
8, 9 through hole
10, 11 through conductor
12 Opening edge
13 Inner surface
21 Green Sheet
22 Resist material
23 Green molded body
24, 25 Arrow showing sandblast

Claims (5)

A dielectric substrate in which at least one surface is provided with a continuous raised portion having a convex cross section and a wing portion is provided on both sides of the raised portion, including the outer surface of the raised portion, Producing a dielectric line, comprising: a conductor film formed on both surfaces; and a plurality of through conductors respectively arranged in the wing portions so that the conductor films formed on both surfaces of the dielectric substrate are electrically connected to each other. A way to
For forming the dielectric substrate with a part thereof, including at least an inorganic powder and an organic binder, a step of producing a green molded body,
Forming a resist material so as to cover a portion corresponding to the raised portion on the outer surface of the green molded body,
In order to produce a dielectric substrate before firing having the shape of the raised portion and the wing portion, by applying erosion, using the resist material as a mask, the green molded body is exposed from the resist material. A first erosion step of removing a desired portion by a desired amount;
After the first erosion step, a through-hole forming step of forming a through-hole for the through-conductor on the manufactured dielectric substrate before firing,
A second erosion step of applying erosion after the through-hole forming step to smooth an opening edge of the through-hole and / or an inner peripheral surface of the through-hole;
Removing the resist material after the second erosion step; a resist material removing step;
Firing the dielectric substrate before firing, firing process,
Providing the conductor film and the through conductor on the dielectric substrate. 2. The method according to claim 1, wherein at least the first erosion step is performed by a sand blast method. The method according to claim 1, wherein the through hole forming step is performed using a laser. The method for manufacturing a dielectric line according to claim 1, wherein the green molded body is obtained by laminating a plurality of green sheets including at least an inorganic powder and an organic binder. The method according to claim 1, wherein the resist material removing step and the baking step are performed simultaneously.

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