JPH07105838A - Method for detecting uneven application of resist film - Google Patents

Method for detecting uneven application of resist film

Info

Publication number
JPH07105838A
JPH07105838A JP24776493A JP24776493A JPH07105838A JP H07105838 A JPH07105838 A JP H07105838A JP 24776493 A JP24776493 A JP 24776493A JP 24776493 A JP24776493 A JP 24776493A JP H07105838 A JPH07105838 A JP H07105838A
Authority
JP
Japan
Prior art keywords
resist film
metal plate
etching
unevenness
detecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24776493A
Other languages
Japanese (ja)
Inventor
Hiroki Watanabe
渡▲なべ▼弘樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP24776493A priority Critical patent/JPH07105838A/en
Publication of JPH07105838A publication Critical patent/JPH07105838A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To detect the uneven application of a resist film by detecting uneven application (uneven thickness of the film) after a second resist film is formed on a metal plate in the manufacture of a shadow mask. CONSTITUTION:After a second resist film 13 is formed on one surface of a metal plate 10, the uneven application of the resist film is detected by water 14. Further, by utilizing water washing after etching, the uneven application of the second resist film is detected. The detection is enabled without flawing the metal plate by utilizing the water absorptivity of the resist film. The uneven application can be also easily detected by the eye and with a camera (detector) 15 by utilizing the discoloration density difference of the resist film absorbing water.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、テレビジョンのブラウ
ン管、特にカラーテレビジョンのブラウン管内に装填し
て使用される金属板状のシャドウマスク製造におけるレ
ジスト膜の塗布ムラの検出方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting uneven coating of a resist film in the production of a shadow mask in the form of a metal plate, which is used by being loaded in a cathode ray tube of a television, and particularly in a cathode ray tube of a color television.

【0002】[0002]

【従来の技術】カラーテレビジョンのブラウン管に用い
られるシャドウマスクの製造方法について述べると、一
般的にブラウン管は、電子銃、シャドウマスク、及び赤
(Red)、緑(Green)、青(Blue)からな
る三色のドット状パターンの蛍光面から構成されてい
る。
2. Description of the Related Art A method of manufacturing a shadow mask used in a cathode ray tube of a color television will be described. In general, the cathode ray tube is composed of an electron gun, a shadow mask, and red, green, and blue. It is composed of three-color dot-shaped fluorescent screens.

【0003】このシャドウマスクは、蛍光面の手前に或
る距離をもって取付けられた薄い鉄系材料で形成された
金属の薄板であり、電子ビームが通過する細孔が規則的
に多数配列されている。
This shadow mask is a thin metal plate formed of a thin iron material, which is attached in front of the fluorescent screen with a certain distance, and a large number of pores through which electron beams pass are regularly arranged. .

【0004】この一つの細孔が、赤、緑、青の蛍光体ド
ットの1組3個に対応しており、シャドウマスクは、電
子銃から放出された3本の電子ビームを、それぞれの蛍
光体ドットに導く役目を果たしている。
This one pore corresponds to three sets of red, green, and blue phosphor dots, and the shadow mask emits three electron beams emitted from the electron gun into respective fluorescent lights. It plays the role of leading to body dots.

【0005】このシャドウマスクの孔径は、高精細度と
称されるものでは、およそ0.10mm〜0.15mm
(ピッチ0.3mm)であり、さらに超高精細度のもの
では、およそ0.07mm〜0.09mm(ピッチ0.
2mm)となる。また、シャドウマスクの板厚は、マス
ク強度と熱膨張を抑制するため、0.01mm〜0.2
0mm程度のものが使用されている。
The hole diameter of this shadow mask, which is called high definition, is about 0.10 mm to 0.15 mm.
(Pitch 0.3 mm), and in the case of ultra-high definition, approximately 0.07 mm to 0.09 mm (pitch 0.
2 mm). Further, the plate thickness of the shadow mask is 0.01 mm to 0.2 mm in order to suppress mask strength and thermal expansion.
The thing of about 0 mm is used.

【0006】従来のシャドウマスクの製造方法として
は、例えば、図2(a)〜(d)に示すように、エッチ
ング液を用いて金属板10に細孔(小孔)を形成する場
合、先ず、金属板10の両面に位置決めした所望の細孔
パターンのレジスト膜12,12を設け、その両面から
エッチング液E(エッチャント)を用いてエッチングを
行う。
As a conventional method of manufacturing a shadow mask, for example, as shown in FIGS. 2 (a) to 2 (d), when a fine hole (small hole) is formed in a metal plate 10 by using an etching solution, first, The resist films 12 and 12 having desired pore patterns positioned on both surfaces of the metal plate 10 are provided, and etching is performed from both surfaces thereof using an etching solution E (etchant).

【0007】しかし、このようなエッチング液を用いた
ウエットエッチングでは等方向的、すなわち垂直方向と
同程度に横方向にもエッチングが進行して、サイドエッ
チングを生じるため、前述した超高精細度シャドウマス
クのように微細な孔径の細孔を精度よく開けることは非
常に困難であった。
However, in wet etching using such an etching solution, since the etching progresses isotropically, that is, in the lateral direction to the same extent as the vertical direction, side etching occurs, so that the ultra-high-definition shadow described above is generated. It was very difficult to accurately open a fine hole having a fine hole diameter like a mask.

【0008】このため、通常の場合は、上記のサイドエ
ッチングを防止或いは抑制するために、図3(a)〜
(e)の側断面図に示すように、まず金属板10の表裏
面に第一のレジスト膜12で所望の規則的な細孔パター
ンを形成後、エッチング液Eを吹き付けるか(図3
(a)を参照)、若しくは浸漬方式にてエッチング液を
付着させて、金属板10表裏両面よりエッチングを行い
(図3(b)を参照)、その途中で該金属板10の片面
にレジスト材19を用いてスプレー方式等によりコーテ
ィングし、その後乾燥させて、第二のレジスト膜13を
形成する(図3(c)を参照)。
Therefore, in a normal case, in order to prevent or suppress the above-mentioned side etching, FIG.
As shown in the side sectional view of (e), first, a desired regular pore pattern is formed on the front and back surfaces of the metal plate 10 with the first resist film 12, and then the etching solution E is sprayed (see FIG. 3).
(See (a)), or an etching solution is attached by a dipping method to perform etching from both front and back surfaces of the metal plate 10 (see FIG. 3B), and in the middle of the process, a resist material is applied to one surface of the metal plate 10. 19 is used to coat by a spray method or the like and then dried to form a second resist film 13 (see FIG. 3C).

【0009】次に、図3(c)に示すように、前記金属
板10を第二のレジスト膜13の反対側よりエッチング
液Eにてエッチングを開始して、図3(d)に示すよう
に、金属板10を貫通させて微細な細孔18を形成し
て、その後に、前記第二のレジスト膜13及び表裏面の
第一のレジスト膜12を除去して、図3(e)に示すよ
うに、金属板10に細孔18が規則的に多数孔設された
シャドウマスクを製造することができる。
Next, as shown in FIG. 3 (c), the metal plate 10 is etched from the opposite side of the second resist film 13 with an etching solution E, as shown in FIG. 3 (d). Then, the fine holes 18 are formed by penetrating the metal plate 10, and thereafter, the second resist film 13 and the first resist film 12 on the front and back surfaces are removed, and as shown in FIG. As shown, it is possible to manufacture a shadow mask in which a large number of pores 18 are regularly formed in the metal plate 10.

【0010】[0010]

【発明が解決しようとする課題】しかしながら、従来の
シャドウマスクの製造方法において、図3(b)〜
(c)の側断面図に示すように、金属板10の片面にレ
ジスト材19をスプレー方式等にてコーティングして、
第二のレジスト膜13を形成するが、そのスプレーの際
に塗布ムラが発生して、エッチングの際の、孔径に影響
したり(膜が薄いと孔径が大きくなり、厚いと孔径が小
さくなる)、また、このムラの部分からエッチング液が
滲み込み金属板表面にエッチングムラ(スジムラ等)を
しばしば発生させていた。
However, in the conventional shadow mask manufacturing method, as shown in FIG.
As shown in the side sectional view of (c), one surface of the metal plate 10 is coated with a resist material 19 by a spray method or the like,
Although the second resist film 13 is formed, coating unevenness occurs during spraying, which affects the pore size during etching (thin film increases pore size, thick film decreases pore size). In addition, the etching liquid permeates from the uneven portion, often causing uneven etching (streak and the like) on the surface of the metal plate.

【0011】更に、第二のレジスト膜に塗布ムラがある
場合には、第一のレジスト膜、第二のレジスト膜を剥膜
する時にレジスト膜残渣が生じ易くなる。
Further, when the second resist film has coating unevenness, a resist film residue is likely to be formed when the first resist film and the second resist film are stripped.

【0012】更に、第二のレジスト材塗布後の塗布ムラ
の検出方法が無く、エッチング後に金属板を検査する方
法のみであった。
Further, there is no method for detecting coating unevenness after coating the second resist material, and there is only a method for inspecting a metal plate after etching.

【0013】そこで本発明は、シャドウマスクの製造に
おいて、金属板に第二のレジスト膜を形成した後に、塗
布ムラ(膜の厚さムラ)を検出するレジスト膜の塗布ム
ラ検出方法を提供するものである。
Therefore, the present invention provides a method for detecting uneven coating of a resist film, which detects uneven coating (uneven thickness of the film) after forming a second resist film on a metal plate in the production of a shadow mask. Is.

【0014】[0014]

【課題を解決するための手段】本発明は、シャドウマス
クの製造において、金属板の片面に第二のレジスト膜を
形成した後に、水によりレジスト膜の塗布ムラを検出す
る工程と、エッチング後の水洗を利用して第一、第二の
レジスト膜の塗布ムラを検出する工程とからなるレジス
ト膜の塗布ムラ検出方法である。また、レジスト膜の吸
水性を利用することにより、金属板に傷を付ける事なく
検出する事が出来る。更に、吸水したレジスト膜の変色
濃度差を利用して、目視およびカメラ(検出器)により
容易に塗布ムラを検出することが出来る検出方法であ
る。
According to the present invention, in the production of a shadow mask, a step of forming a second resist film on one surface of a metal plate and then detecting coating unevenness of the resist film with water, and a step of It is a method for detecting coating unevenness of a resist film, which comprises a step of detecting coating unevenness of the first and second resist films by utilizing washing with water. Further, by utilizing the water absorption of the resist film, it is possible to detect the metal plate without damaging it. Furthermore, it is a detection method that can easily detect coating unevenness visually and by a camera (detector) by utilizing the discoloration density difference of the resist film that has absorbed water.

【0015】[0015]

【作用】本発明方法によれば、レジスト膜の吸水性を利
用し、水を使用して金属板に傷を付けずに、且つ、レジ
スト膜に悪影響を与えずに繰り返しムラや不均一部分等
の欠陥部分を未然に検出しておくことができる。
According to the method of the present invention, the water absorption of the resist film is utilized, water is not used to scratch the metal plate, and the resist film is not adversely affected. It is possible to detect the defective portion in advance.

【0016】このレジスト材(例:メタクリル酸と(メ
タ)アクリル酸エステルの共重合体とアセチルアルコー
ルの混合液)において、アクリル系樹脂を使用すること
により成膜とした際に吸水性が得られる。これにより、
レジスト膜に水を与えると膜のムラや不均一部分につい
ては、レジスト膜の厚みが厚いほど吸水量が高いために
他の部分より濃色(濃い白色)に変色するので、その変
色濃度差を測定することで膜の塗布(厚さ)ムラを検出
することができる。
In this resist material (eg, a mixed solution of a copolymer of methacrylic acid and a (meth) acrylic acid ester and acetyl alcohol), an acrylic resin is used to obtain water absorption when a film is formed. . This allows
When water is applied to the resist film, unevenness or unevenness of the film changes to a darker color (darker white) than other parts because the water absorption is higher as the thickness of the resist film is thicker. By measuring, unevenness in coating (thickness) of the film can be detected.

【0017】[0017]

【実施例】以上、図面を参照して本発明のレジスト膜の
塗布ムラ検出方法を詳細に説明する。図1(a)〜
(j)は、本発明の実施例におけるレジスト膜の塗布ム
ラ検出方法の工程手順を示す側断面図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The method for detecting uneven coating of resist film according to the present invention will be described in detail with reference to the drawings. 1 (a)-
(J) is a side sectional view showing a step procedure of a method for detecting uneven coating of a resist film in the example of the present invention.

【0018】先ず、金属板10の両面に所望の形状のシ
ャドウマスクパターンを、レジスト膜12,12により
形成し、その両面からエッチング液Eを用いてエッチン
グを行う。その途中において、金属板10の片面にレジ
スト材19{例:アクリル系樹脂(メタクリル酸と(メ
タ)アクリル酸エステルの共重合体とアセチルアルコー
ルの混合液)}をスプレーコーティングし、その後乾燥
させて第二のレジスト膜13を形成する。
First, a shadow mask pattern having a desired shape is formed on both surfaces of the metal plate 10 by the resist films 12 and 12, and etching is performed from both surfaces by using the etching solution E. Along the way, a resist material 19 {example: acrylic resin (mixed solution of copolymer of methacrylic acid and (meth) acrylic acid ester and acetyl alcohol)} is spray-coated on one surface of the metal plate 10 and then dried. The second resist film 13 is formed.

【0019】この第二のレジスト膜13を形成した後
に、スプレー等により水14をレジスト膜上に吹き付け
することで、レジスト膜が水を吸水して、レジスト膜表
面が白色に変色してくる。その際、レジスト膜全体は薄
い白色に変色し、ムラ(膜の厚い部分)の部分は他の部
分より濃い白色に変色してくる。その濃く変色した部分
を、目視およびカメラ15により確認する。
After the second resist film 13 is formed, water 14 is sprayed onto the resist film by spraying or the like, whereby the resist film absorbs water and the surface of the resist film turns white. At that time, the entire resist film turns light white, and the unevenness (thick film portion) turns whiter than other portions. The darkly discolored portion is visually checked and confirmed by the camera 15.

【0020】更に、エッチング終了後に水洗をするが、
この水洗14を利用して、再度第二レジスト膜表面を変
色させる。この場合も前記同様に、再度膜全体が薄い白
色に変色し、ムラの部分、エッチングの不均一部分が濃
く変色する。その濃く変色した部分は、目視およびカメ
ラ5により確認する。
Further, after the etching is finished, the substrate is washed with water,
The surface of the second resist film is again discolored by utilizing this water washing 14. In this case as well, similarly to the above, the entire film again changes to a light white color, and the uneven portion and the non-uniform etching portion are changed to a dark color. The darkly discolored portion is visually checked and confirmed by the camera 5.

【0021】また、これら塗布ムラの検出後の修正塗工
は、連続工程のため不可能であるので、レジスト塗布条
件の再セット等の処置をする。
Further, since correction coating after detection of these coating irregularities is impossible because it is a continuous process, measures such as resetting of resist coating conditions are taken.

【0022】検出後、温風(常温±5℃)を吹き付け乾
燥させることにより、変色部分は消え、検出前のレジス
ト膜状態にもどすことが出来る。
After detection, by blowing warm air (room temperature ± 5 ° C.) and drying, the discolored portion disappears and the resist film state before detection can be restored.

【0023】[0023]

【発明の効果】本発明のレジスト膜の塗布ムラ検出方法
は、水によりレジスト膜の塗布ムラ(膜の厚さムラ)の
欠陥部分を容易に検出することが出来る。更に、レジス
ト膜の吸水性を利用してこの検出方法を行うので、レジ
スト膜の諸成分や耐性等を変えることなく、更に金属板
に傷を付けたり、薬品による影響を与えずに塗布(厚
さ)ムラ、スジムラ(第二レジスト膜に関する欠陥)を
検出する効果がある。
According to the method for detecting uneven coating of a resist film of the present invention, a defective portion of uneven coating of a resist film (uneven thickness of a film) can be easily detected with water. Furthermore, since this detection method is performed by utilizing the water absorption of the resist film, it is applied without changing the components or resistance of the resist film, scratching the metal plate, or affecting chemicals (thickness). It is effective in detecting unevenness and uneven streaks (defects related to the second resist film).

【図面の簡単な説明】[Brief description of drawings]

【図1】(a)〜(j)は本発明の実施例におけるレジ
スト膜の塗布ムラ検出方法の工程手順を示す側断面図で
ある。
1A to 1J are side sectional views showing process steps of a method for detecting unevenness in coating of a resist film according to an embodiment of the present invention.

【図2】(a)〜(d)は従来のシャドウマスクの製造
工程の一例を示す側断面図である。
FIG. 2A to FIG. 2D are side sectional views showing an example of a conventional shadow mask manufacturing process.

【図3】(a)〜(e)は従来のシャドウマスクの製造
工程の一例を示す側断面図である。
3 (a) to 3 (e) are side sectional views showing an example of a conventional shadow mask manufacturing process.

【符号の説明】[Explanation of symbols]

10 …金属板 12 …第一のレジスト膜 13 …第二のレジスト膜 14 …水(水洗) 15 …目視及びカメラ(検出器) E …エッチング液 18 …細孔 19 …第二のレジスト膜用のレジスト材 10 ... Metal plate 12 ... First resist film 13 ... Second resist film 14 ... Water (washing) 15 ... Visual and camera (detector) E ... Etching solution 18 ... Pores 19 ... For second resist film Resist material

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】金属板の両面に第一のレジスト膜を設け、
該レジスト膜に所望の細孔パターンを形成してエッチン
グを進行し、該エッチング進行途中で、前記金属板の片
面に第二のレジスト膜を形成して、再びエッチングを行
って所望の規則的な細孔を形成するシャドウマスクの製
造において、前記金属板の片面に第二のレジスト膜を形
成した後に、水によるレジスト膜の塗布ムラ、スジムラ
を検出する工程と、前記金属板のエッチング後の水洗に
より、第二のレジスト膜の塗布ムラを検出する工程とか
らなることを特徴とするシャドウマスク製造におけるレ
ジスト膜の塗布ムラ検出方法。
1. A first resist film is provided on both surfaces of a metal plate,
A desired fine hole pattern is formed on the resist film to advance etching, and during the progress of the etching, a second resist film is formed on one surface of the metal plate, and etching is performed again to obtain a desired regular pattern. In the production of a shadow mask for forming pores, after forming a second resist film on one surface of the metal plate, a step of detecting uneven coating of the resist film with water, uneven streaks, and washing with water after etching the metal plate And a second step of detecting coating unevenness of the resist film.
【請求項2】前記レジスト膜が、吸水することで変色
し、この変色濃度差でムラを検出することを特徴とする
請求項1記載のシャドウマスク製造におけるレジスト膜
の塗布ムラ検出方法。
2. A method for detecting unevenness in application of a resist film in manufacturing a shadow mask according to claim 1, wherein the resist film is discolored by absorbing water, and unevenness is detected by the difference in discoloration density.
【請求項3】前記レジスト膜の変色濃度差を、目視或い
はカメラ(ムラ検出器)により検出することを特徴とす
る請求項1記載のシャドウマスク製造におけるレジスト
膜の塗布ムラ検出方法。
3. The method for detecting unevenness in coating of a resist film in manufacturing a shadow mask according to claim 1, wherein the difference in discoloration density of the resist film is detected visually or by a camera (unevenness detector).
【請求項4】前記吸水したレジスト膜は、乾燥させるこ
とでレジスト膜に影響を与えずに、繰り返し検出するこ
とができることを特徴とする請求項1から請求項3に記
載のシャドウマスク製造におけるレジスト膜の塗布ムラ
検出方法。
4. The resist in the shadow mask manufacturing according to claim 1, wherein the resist film having absorbed water can be repeatedly detected without affecting the resist film by drying. Method for detecting coating unevenness of film.
JP24776493A 1993-10-04 1993-10-04 Method for detecting uneven application of resist film Pending JPH07105838A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24776493A JPH07105838A (en) 1993-10-04 1993-10-04 Method for detecting uneven application of resist film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24776493A JPH07105838A (en) 1993-10-04 1993-10-04 Method for detecting uneven application of resist film

Publications (1)

Publication Number Publication Date
JPH07105838A true JPH07105838A (en) 1995-04-21

Family

ID=17168313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24776493A Pending JPH07105838A (en) 1993-10-04 1993-10-04 Method for detecting uneven application of resist film

Country Status (1)

Country Link
JP (1) JPH07105838A (en)

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