JPH07100683A - Method for cutting aging facing material and device therefor - Google Patents

Abstract

PURPOSE:To improve cross-sectional cutting precision by standardizing cutting of an aging facing material both in punching and laser beam working without treating a program, etc., in laser beam working. CONSTITUTION:In a punching and laser beam working combining machine 1, a slope 55 on which a laser beam LB is allowed to reflect is formed on the inside surface of a laser nozzle 53 which is provided on a laser beam working head 29. A laser nozzle 53 by which a laser interference beam LKB is generated by refracting the laser beam LB which is allowed to reflect on the slope 55 at a hole part 57 which is formed at the internal tip end part of laser nozzle 53 is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for cutting a curing top-coating material, and more specifically, irradiating a laser interference light from a laser nozzle onto the upper surface of the material while melting the curing member on the upper surface of the material. TECHNICAL FIELD The present invention relates to a method for cutting a protective top-coating material and a device therefor that perform laser cutting.

[0002]

2. Description of the Related Art Conventionally, in the case of a material moving type processing machine such as a turret punch press in order to obtain a scratch-free product, the lower surface of the material is scratched because the material slides on the free bearing. Therefore, for example, vinyl or the like is attached as a curing member on the upper surface side to prevent scratches and processed. In the case of laser processing, the curing member is usually peeled off,
Generally, a curing member is attached to the lower surface of the material for processing.

[0003]

By the way, in the above-mentioned conventional method of cutting a curing top-coating material, the method of peeling and processing the curing member of the curing top-coating material at the time of laser processing requires a lot of manpower and time. There's a problem. For this reason,
In the laser processing, when the vinyl or the like is overlaid, an assist gas used for the processing enters between the material and the vinyl, the vinyl is peeled off, and the cut surface accuracy is deteriorated.

In order to solve the above-mentioned problems, it is necessary to make a working program, first melt the vinyl as the curing member with a minute laser power, and then perform the cutting work.

Even so, in the laser processing, there was a problem that the first piercing hole was drilled, and the vinyl-on-paste material swelled or peeled off the vinyl due to the assist gas, resulting in poor processing stability.

However, in the punch / laser compound machine, the piercing hole can be machined by punching, but when cut, the laser processing is not stable due to swelling or peeling of the vinyl on the vinyl-on-paste material. Further, in the case of vinyl under-sticking, scraps are raised during punching processing, and traces of the stripper plate and the like remain on the material surface, which is not suitable. Further, the above-mentioned problems have been largely supported by mirror-finished products and bending in the next step.

In order to solve the above-mentioned problems, an object of the present invention is to easily cut a curing top-coating material in laser processing without making a program or the like, and for both punching and laser processing, the curing top-coating material. The object of the present invention is to provide a method of cutting a curing top-coating material and an apparatus for the same, which can unify the processing of the above and improve the cutting surface accuracy.

[0008]

In order to achieve the above-mentioned object, the present invention provides a laser after a piercing hole is punched when cutting a curing top-coating material having a curing member attached to the surface thereof. This is a method for cutting a curing-on-adhesive material, characterized by performing laser processing while melting a curing member on the material surface with interference light.

Further, according to the present invention, in a punch / laser combined processing machine, an inclined surface for reflecting a laser beam is formed on the inner surface of a laser nozzle provided in a laser processing head, and the laser reflected by this inclined surface is formed. A cutting device for the curing top-coating material was constructed by providing a laser nozzle that bends the beam at a hole formed at the inner tip of the laser nozzle to generate an interference laser beam.

[0010]

By adopting the cutting method and apparatus of the present invention, a hole is formed in a piercing part by a punching die, and then a laser beam is caused to interfere in a laser nozzle to cause interference laser. The material is processed by melting the curing member on the upper surface of the curing-on-adhesive material with light.

Therefore, the curing member attached to the upper surface of the material does not come off because the assist gas does not enter, and since the inert gas is used as the assist gas, it is possible to cut without attaching an oxide film to the cut surface. .

[0012]

Embodiments of the present invention will be described in detail below with reference to the drawings.

In order to facilitate understanding, the overall structure of the punch / laser combined processing machine will first be outlined.

Referring to FIG. 5, the punch / laser combined processing machine 1 is a combination of a punch press 3 and a laser processing machine 5. The punch press 3 is provided with upper and lower turrets 15 and 17 having rams 9 and rotary shafts 11 and 13 provided on the gate-shaped frame 7, and the upper and lower turrets 1 and 1.
A plurality of punches 19 and dies 21 having different shapes and sizes are provided corresponding to 5 and 17, respectively.

An oscillator 23 for oscillating a laser beam LB is provided on the side of the punch press 3, and the oscillated laser beam LB is reflected above the upper frame 25 of the portal frame 7. The work 27 positioned on the fixed table 31 is irradiated with the laser beam LB which is bent by the plate 27 and passes through the laser processing head 29. In front of the fixed table 31 (right side in FIG. 6),
A work moving / positioning device 33 is provided. The work moving / positioning device 33 is provided with a carriage base 35 extending horizontally across a movable table (not shown) horizontally provided on both left and right sides of the fixed table 31.
Is movable in the front-rear direction, and a nut member 37 provided on the carriage base 35 is screwed onto a lead screw 39 provided on the lower portion of the upper frame 25.

Further, a carriage 41 which is movable in the left and right directions is mounted on the carriage base 35, and a work clamp 43 which holds the work W in the carriage 41 and moves and positions the work in the left and right directions is provided.

With the above structure, one edge of the work W is gripped by the work clamp 43, and the work W is appropriately moved in the front, rear, left, and right directions, so that the work W is moved numerically with respect to the punching position or the laser processing position. Positioning is done.

Reference numeral 45 is a shooter and reference numeral 4
Reference numeral 7 is a belt conveyor that carries out the product.

The upper and lower turrets 15 and 17 constituting the punch press 3 and the mounting position and state of the laser processing head 29, which is one member of the laser processing machine 5, will be described in more detail.

Referring to FIG. 4, the upper and lower turrets 15 and 17 provided in the punch press 3 are provided with a plurality of punches 19 and a die 21 facing each other, and a punch 49 for piercing holes. Is provided on the upper turret 15, and a die 51 for piercing holes is attached to the lower turret 17 facing the punch 49 for piercing holes. On the other hand, a laser nozzle 53 is attached to the tip of the laser processing head 29, which is one member of the laser processing machine 5.

The laser nozzle 53 will be described in more detail. Referring to FIG. 1, the inner surface of the laser nozzle 53 has an inclined surface 55 for reflecting the laser beam LB.
A cylindrical hole 57 is formed at the tip of the laser nozzle 53 following the inclined surface 55.

With the above structure, a part of the laser beam LB is reflected by the inclined surface 55, is bent plurally in the cylindrical hole 57, and is indicated by the dotted line in the drawing of FIG. It becomes LKB and is irradiated onto the outside of the laser beam LB with a small diameter. For this reason, since the laser interference light LKB is irradiated to the surface on which the upper surface of the work W is covered with, for example, vinyl as the curing member 59, the curing member 59 in this portion can be melted.

With reference to FIGS. 2 and 3, the operation of the above-described structure is as follows. First, as a curing member 59, a product W having a desired shape is cut by laser processing on a work W having, for example, vinyl adhered on its upper surface. The piercing hole P is formed by the punch 49 provided on the upper turret 15 of the punch press 1 and the die 51 for piercing hole provided on the lower turret 17 in cooperation with each other. See FIG. 2).

Then, the product W having a desired shape is formed from the piercing hole P.
_In order to cut _s , a curing member 59 is attached to the upper surface of the work W with the laser beam LB and the laser interference light LKB from the laser nozzle 53 provided in the laser processing head 29 at the same time.
While irradiating the laser beam, the laser beam LB is used for cutting. Therefore, the curing member 59 is protected by the laser interference light LKB.
Since the curing gas is melted, the curing member 59 does not peel off because the assist gas does not enter, and it is possible to perform cutting without attaching an oxide film to the cut surface. In addition, although the assist gas is also jetted at the same time as the irradiation of the laser beam LB, air or an inert gas such as nitrogen is used as the assist gas (see FIG. 2).
FIG. 3 shows the product W _s after laser cutting.

As described above, the curing member 59 is used for processing the work W on which the curing member 59 is attached in the laser processing.
Cutting can be performed without peeling off, and even with laser processing of the curing top-coating material, cutting can be performed without peeling or bulging of the curing member 59, which is almost the same as punching or shearing. Therefore, there is no problem in quality even in the mirror-finished product and the bending process in the next process. Also, the machining program is 1
With a book, it is possible to shorten the process and improve the cut surface accuracy.

The present invention is not limited to the above-described embodiments, but can be implemented in other modes by making appropriate changes.

[0027]

As will be understood from the above description of the embodiments, according to the present invention, since the constitution is as described in the scope of claims, the material for curing and overcoating with the laser interference light is used. Since laser processing is performed while melting the curing member, cutting can be performed without peeling or bulging of the curing member.

Thus, the cutting process can be easily performed without modifying the processing program and the like, and there is no quality problem in the mirror surface product and the bending process in the next step, and the cutting surface accuracy can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view of a laser nozzle showing a main part of the present invention.

FIG. 2 is an operation explanatory view.

FIG. 3 is a product plan view of an embodiment of the present invention.

FIG. 4 is a side view showing the mounting positions of the punch for pierce holes, the die and the laser processing head and the state thereof according to the embodiment of the present invention.

FIG. 5 is a side view showing an overall configuration of a punch / laser combined processing machine according to an embodiment of the present invention.

[Explanation of symbols]

 1 Punch / Laser Combined Processing Machine 29 Laser Processing Head 53 Laser Nozzle 55 Inclined Surface 57 Hole 59 Curing Member LB Laser Beam LKB Laser Interference Light

Claims (2)

[Claims] 1. When cutting a curing-on-adhesive material having a curing member attached to its surface, laser cutting is performed while punching a piercing hole and then melting the curing member on the upper surface of the material with laser interference light. A method for cutting a curing top-coating material, characterized by: 2. In a punch / laser combined processing machine, an inclined surface for reflecting a laser beam is formed on the inner surface of a laser nozzle provided in a laser processing head, and the laser beam reflected by this inclined surface is used as the laser beam. A curing top material cutting device, comprising a laser nozzle that bends at a hole formed at the inner tip of the nozzle to generate laser interference light.