WO2018029842A1

WO2018029842A1 - Laser processing machine

Info

Publication number: WO2018029842A1
Application number: PCT/JP2016/073675
Authority: WO
Inventors: 直幸中村; 芳晴黒崎
Original assignee: 三菱電機株式会社
Priority date: 2016-08-10
Filing date: 2016-08-10
Publication date: 2018-02-15
Also published as: JP6381849B2; JPWO2018029842A1

Abstract

A laser processing machine (1) irradiates focused laser light (L) onto a workpiece (W) to cut the workpiece (W). The laser processing machine (1) is provided with: a workpiece supporting unit (10) which supports the workpiece (W); and a processing head (20) which irradiates the focused laser light (L) onto the workpiece (W) and emits an auxiliary gas (AG). The laser processing machine (1) is provided with: a thin wire inserting unit (50) which is attached to the processing head (20) and which is capable of inserting into a pierced hole (PH) or a cut groove formed in the workpiece (W) a thin wire (51) which reflects the laser light (L); and a control device (40). The control device (40) controls the thin wire inserting unit (50) during the cutting process, to insert the thin wire (51) into the pierced hole (PH) and the cut groove to the rear of an irradiation point (SP) with respect to a cutting progress direction (MD) resulting from movement of at least one of the workpiece supporting unit (10) and the processing head (20).

Description

Laser processing machine

The present invention relates to a laser processing machine for cutting a workpiece.

In a laser processing machine that cuts a sheet metal by irradiating a laser beam, many means for speeding up the cutting process and improving the quality of the cutting process have been reported. As means for speeding up the cutting process and improving the quality of the cutting process, means for adjusting the intensity distribution and beam shape of the irradiated laser beam is used. In addition, means for realizing a double focus of the laser beam and adjusting a cuttable plate thickness by adjusting the intensity distribution and beam shape of the irradiated laser beam is also used.

However, in the laser processing machine using the above-described means for adjusting the intensity distribution and beam shape of the irradiated laser beam, the laser beam reflected from the front end of the cutting groove of the workpiece does not contribute to the cutting process. Further, in the laser processing machine described above, the progress of the cutting process occurs mainly in the region where the workpiece and the laser beam interact, so the laser beam on the rear side in the cutting progress direction of the laser beam is cut and processed. Does not contribute. For this reason, in the laser processing machine mentioned above, there exists a subject that a laser beam cannot be fully utilized for a cutting process.

In order to solve the problem that such laser light cannot be used for cutting processing, a sheet-like reflector is inserted in the cutting direction relative to the processing target of the laser light, and cutting processing is performed. A method of reflecting non-contributing laser light toward the front end of the cutting groove has been proposed (see Patent Document 1).

JP 2003-170289 A

The laser processing machine disclosed in Patent Document 1 is not configured to inject auxiliary gas from a processing head in order to cut silicon that is an object to be processed. In the laser processing machine disclosed in Patent Document 1, when the auxiliary gas is ejected from the processing head during the cutting process, the reflector is sheet-like, so that the sheet-like reflector is warped by the pressure of the auxiliary gas. Therefore, there is a problem that the laser beam cannot be efficiently reflected toward the tip of the cutting groove, and it is difficult to speed up the cutting process.

The present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing machine capable of increasing the cutting speed.

In order to solve the above-described problems and achieve the object, the present invention is a laser processing machine that irradiates a laser beam focused on a processing target to cut the processing target. The laser processing machine includes a processing target support unit that supports the processing target, and a processing head that irradiates the processing target with the focused laser beam and injects auxiliary gas. The laser processing machine includes a thin wire insertion portion that is attached to a processing head and can insert a thin wire that reflects laser light into a processing region formed on a processing target. The laser processing machine controls the thin wire insertion part during the cutting process, and irradiates the laser beam on the processing object with respect to the cutting progress direction generated by moving at least one of the processing object support part and the processing head. A control device is provided for inserting the thin line into the machining area from behind the point.

The laser beam machine according to the present invention has an effect that the cutting process can be speeded up.

The figure which shows the structure of the laser beam machine which concerns on Embodiment 1. FIG. The figure which shows the structure of the thin wire | line insertion part of the laser processing machine shown by FIG. Sectional view along line III-III in FIG. The perspective view which shows the state during the cutting process of the laser processing machine shown by FIG. Sectional view along line VV in FIG. Sectional drawing which shows the other state of the laser beam shown by FIG. Sectional drawing which shows the state during the cutting process of the laser processing machine of a comparative example Sectional drawing which shows the other state of the laser beam shown by FIG. The perspective view which shows the state during the cutting process of the laser beam machine which concerns on Embodiment 2. FIG. Plan view of the workpiece shown in FIG. Side view showing a thin wire insertion portion of a laser beam machine according to Embodiment 3 The side view which shows the thin wire | line insertion part and angle adjustment mechanism of the laser beam machine concerning Embodiment 4. The side view explaining the state in which the angle adjustment mechanism shown by FIG. 12 adjusts the angle of a thin wire | line The rear view which shows the thin wire | line insertion part and tracking mechanism of the laser beam machine concerning Embodiment 5 FIG. 14 is a perspective view for explaining a state in which the following mechanism shown in FIG. 14 adjusts the angle of the thin line. The perspective view which shows the thin wire | line insertion part of the laser beam machine concerning Embodiment 6, an angle adjustment mechanism, and a follow-up mechanism The rear view which shows the some thin wire | line insertion part of the laser beam machine concerning Embodiment 7. The rear view which shows the state by which some fine wires of the some thin wire insertion part shown by FIG. 17 were inserted in the pierced hole The rear view which shows the state from which the other fine wire of the some thin wire insertion part shown by FIG. 18 was kept away from the workpiece Plan view of the workpiece shown in FIG. The top view which shows the state by which the cutting groove was formed in the workpiece shown by FIG. The top view which shows the state from which the direction of the cutting groove shown by FIG. 21 was changed Side view of machining head of laser beam machine according to Embodiment 8. Plan view of the workpiece shown in FIG. Plan view of workpiece to be cut by laser beam machine according to Embodiment 9 Sectional drawing of the thin wire concerning Embodiment 10 Sectional drawing of the thin wire concerning Embodiment 11 Sectional drawing of the fine wire concerning Embodiment 12 Sectional drawing of the thin wire concerning Embodiment 13 Sectional drawing of the thin wire concerning Embodiment 14 Sectional drawing of the fine wire concerning Embodiment 15 Side view of fine wire according to embodiment 16 Side view of fine wire according to embodiment 17 The figure which shows an example of the structure of the hardware of the control apparatus of the laser beam machine which concerns on each embodiment

Hereinafter, a laser beam machine according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a diagram illustrating a configuration of a laser beam machine according to the first embodiment. FIG. 2 is a diagram showing a configuration of a thin wire insertion portion of the laser beam machine shown in FIG. FIG. 3 is a sectional view taken along line III-III in FIG.

The laser beam machine 1 shown in FIG. 1 irradiates a laser beam L focused on the workpiece W to cut the workpiece W. In the first embodiment, the laser beam machine 1 is an apparatus for irradiating the workpiece W with the laser light L and cutting the workpiece W into parts and remaining materials. In the first embodiment, the workpiece W to be cut into parts and the remaining material by the laser processing machine 1 is made of metal and is formed in a flat plate shape. That is, the workpiece W is a sheet metal. In Embodiment 1, although the metal which comprises the workpiece W is mild steel or stainless steel, it is not limited to this.

The part is cut from the workpiece W, and is assembled into a product by being subjected to at least one of bending, welding, and painting in a later process than the laser processing machine 1. . The remaining material is discarded without being assembled into a product.

As shown in FIG. 1, the laser processing machine 1 includes a processing target support unit 10 that supports the processing target W, a processing head 20 that irradiates the focused laser light L onto the processing target W, and a processing target. A relative movement unit 30 capable of relatively moving the object support unit 10 and the processing head 20, a thin wire insertion unit 50, and a control device 40 are provided.

The processing object support unit 10 supports the processing object W on which the processing object W is placed.

The processing head 20 irradiates the processing target W with the laser light L while being moved relative to the processing target W by the relative moving unit 30 and injects the auxiliary gas AG. The processing head 20 is supplied with the laser light L oscillated by the laser oscillator 21 via the transmission optical system 22 and supplied with the auxiliary gas AG from the auxiliary gas supply source 60. The auxiliary gas AG is a gas used for removing the melt during the cutting process. The auxiliary gas is composed of air, nitrogen, or argon gas. In the first embodiment, the auxiliary gas AG is injected coaxially with the laser light L from the processing nozzle 23 that irradiates the laser light L. The machining head 20 ejects the auxiliary gas AG to the irradiation point SP of the laser beam L on the workpiece W during the cutting process.

The relative movement unit 30 moves the machining head 20 and the workpiece support unit 10 relative to each other along at least one of the X direction and the Y direction along the surface of the workpiece W supported by the workpiece support unit 10. Move. In addition, the relative movement unit 30 relatively moves the machining head 20 and the workpiece support unit 10 in the direction Mz around the axis P parallel to the Z direction orthogonal to both the X direction and the Y direction. In the first embodiment, the relative movement unit 30 moves the machining head 20 along at least one of the X direction and the Y direction and rotates in the direction Mz around the axis P parallel to the Z direction. The object support unit 10 may be moved along at least one of the X direction and the Y direction and may be rotated in a direction Mz around the axis P parallel to the Z direction. Both of them may be moved along at least one of the X direction and the Y direction and rotated in a direction Mz around the axis P parallel to the Z direction. The relative moving unit 30 includes a motor, a lead screw that moves the machining head 20 by the rotational driving force of the motor, and a linear guide that guides the moving direction of the machining head 20. The structure of the relative movement part 30 is not limited to the structure by a motor, a lead screw, and a linear guide. The relative movement unit 30 is controlled by the control device 40.

As shown in FIG. 2, the thin wire insertion portion 50 is attached to the machining head 20 and is to be machined with respect to the cutting progress direction MD generated by moving at least one of the workpiece support 10 and the machining head 20. The thin wire 51 can be inserted into the piercing hole PH shown in FIG. 1 which is a processing region formed in the processing object W from behind the irradiation point SP of the laser beam L on the object W. As shown in FIG. 3, the thin wire 51 is formed in a columnar shape with a round cross section. The thin line 51 reflects the laser light L. The thin wire 51 is made of a metal having a melting point higher than the boiling point of the workpiece W. In Embodiment 1, although the metal which comprises the thin wire | line 51 is tungsten or molybdenum, it is not limited to these.

As shown in FIG. 2, the thin wire insertion section 50 includes an insertion guide 52 attached to the processing head 20 and a feed / retraction mechanism 53. The insertion guide 52 is formed in a cylindrical shape, and the thin wire 51 is passed through the inside thereof. The insertion guide 52 is made of a material that can reflect the laser light L. Furthermore, the insertion guide 52 is gradually inclined with respect to the Z direction in a direction approaching the irradiation point SP of the laser light L on the processing target W as it approaches the processing target W.

The delivery / retraction mechanism 53 includes a pair of rollers 54 that sandwich the thin wire 51 therebetween, and a motor 55 that rotates one of the rollers 54. The feed / draw-in mechanism 53 moves the fine wire 51 along the longitudinal direction of the fine wire 51 when the motor 55 rotates the one roller 54. The feed-in / out mechanism 53 moves the thin wire 51 closer to the workpiece W or away from the workpiece W.

The fine wire insertion part 50 can fix the insertion direction of the fine wire 51 by passing the fine wire 51 through the insertion guide 52 and holding the fine wire 51. Further, since the insertion guide 52 is cylindrical, the auxiliary gas AG may flow simultaneously with the thin line 51. By flowing the auxiliary gas AG through the insertion guide 52, it is possible to prevent the thin wire 51 from being warped by losing the pressure of the auxiliary gas AG ejected from the processing nozzle 23. Further, when the auxiliary gas AG is caused to flow into the insertion guide 52, the auxiliary gas AG is also supplied from the insertion guide 52 into the cutting groove CD (see FIG. 4), so that the melt discharge capability is further improved. The insertion guide 52 also plays a role of scraping off the melt adhering to the thin wire 51 when the thin wire 51 is pulled out from the cutting groove CD.

The control device 40 is a computer. The control device 40 cuts the workpiece W by controlling the relative movement unit 30 and the machining head 20. The control device 40 controls the thin wire insertion portion 50 during the cutting process of the laser beam machine 1 so that the thin wire 51 is the piercing hole PH or the processing region from the rear of the irradiation point SP with respect to the cutting progress direction MD. It inserts in the cutting groove CD shown in FIG. In the first embodiment, the processing region formed in the processing target W is the piercing hole PH or the cutting groove CD, but the processing region may be outside the outer edge of the processing target W.

The control device 40 is connected to an input device 41 for inputting position information of each part on the workpiece W, a program at the time of cutting, and cutting processing conditions. The cutting process conditions are the output of the laser beam L, the frequency of the laser beam L, the duty of the laser beam L, the pressure of the auxiliary gas AG, and the focal position of the laser beam L. The control device 40 is connected to a display device 42 that displays at least position information of each part on the workpiece W.

Next, the state of the laser beam L during the cutting process of the laser beam machine 1 according to Embodiment 1 will be described with reference to the drawings. FIG. 4 is a perspective view showing a state during cutting of the laser beam machine shown in FIG. FIG. 5 is a cross-sectional view taken along the line VV in FIG. 6 is a cross-sectional view showing another state of the laser beam shown in FIG. FIG. 7 is a cross-sectional view showing a state during cutting of the laser processing machine of the comparative example. FIG. 8 is a sectional view showing another state of the laser beam shown in FIG.

When the control device 40 of the laser beam machine 1 according to Embodiment 1 starts cutting the workpiece W, the piercing hole that penetrates the workpiece W based on the position information of each part in the workpiece W. PH is formed. When forming the pierced hole PH, the control device 40 positions the machining head 20 at a position calculated based on the position information of each part, and keeps the thin wire 51 away from the workpiece W, with the machining head While irradiating the laser beam L from 20, the auxiliary gas AG is injected. When the piercing hole PH is formed, the control device 40 stops the irradiation with the laser light L and the injection of the auxiliary gas AG. The control device 40 controls the fine wire insertion portion 50 based on the position information of each part on the workpiece W, and the fine wire is arranged behind the laser beam irradiation point SP in the cutting progress direction MD in the piercing hole PH. 51 is inserted.

The control device 40 of the laser beam machine 1 irradiates the laser beam L from the machining head 20 while moving the machining head 20 relative to the workpiece W based on the position information of each part on the workpiece W, and assists. Gas AG is injected. Then, the control apparatus 40 of the laser beam machine 1 forms a cutting groove CD for cutting the workpiece W from the piercing hole PH as shown in FIG. In the first embodiment, the thin wire 51 has the lower end 51a positioned below the workpiece W. Further, since the thin wire 51 has a melting point higher than the boiling point of the metal constituting the workpiece W, it is inserted into the cutting groove CD, but does not melt during the cutting process. 4 and 5, the thin wire 51 is directly irradiated with the laser light L from the processing head 20, and the front end of the cutting groove CD with respect to the processing target W of the processing head 20 in the cutting progress direction MD. The laser beam L reflected from the inner surface CDB of the CDA is irradiated. Since the thin wire 51 is made of metal, the laser beam L emitted from the machining head 20 and the laser beam L reflected by the inner surface CDB of the front end CDA of the cutting groove CD are used as the inner surface CDB of the front end CDA of the cutting groove CD. Reflect towards

Moreover, since the laser beam machine 1 has inserted the thin wire 51 into the cutting groove CD, the auxiliary gas AG is attracted to the thin wire 51 by the Coanda effect. The laser processing machine 1 attaches a melt called dross generated by melting the workpiece W to the fine wire 51 by the jet of the auxiliary gas AG and the surface tension of the fine wire 51, and discharges it from the cut groove CD along the fine wire 51. To do. Further, since the laser beam L is always irradiated with the laser beam L, the laser beam machine 1 can heat the thin wire 51, suppress the temperature drop of the melt, improve the discharge power of the melt, and cut Processing speed can be increased.

As shown in FIGS. 5 and 6, the laser beam machine 1 according to Embodiment 1 has a thin line 51 behind the piercing hole PH and the cutting progress direction MD in the cutting groove CD from the irradiation point SP of the laser beam L. Inserting. The laser beam machine 1 according to the first embodiment can reflect the laser beam L reflected by the thin wire 51 toward the inner surface CDB of the front end CDA of the cutting groove CD. For this reason, the laser beam machine 1 according to Embodiment 1 can increase the ratio of the laser beam L that contributes to the cutting process as compared with the comparative example shown in FIGS. Can be speeded up. An important point of the laser processing machine 1 is how to prevent the temperature of the melt below the workpiece W from being lowered, especially for high-speed and high-quality cutting of the thick workpiece W. Since the viscosity of the melt has a negative correlation with the temperature, drastic discharge cannot be discharged as a result of a rapid increase in viscosity due to a decrease in the temperature of the melt, resulting in a defective cutting process. Further, since it takes time for the melt generated at the upper part of the workpiece W to escape from the lower part of the workpiece W, if the moving speed is increased from an appropriate cutting process condition, the inner surface CDB of the front end CDA of the cutting groove CD. The inclination with respect to the Z direction increases. If the moving speed of the laser beam machine 1 is further increased, the laser beam L passes before the melted material passes through the lower end of the workpiece W, so that the laser beam machine 1 cannot be cut. In the laser beam machine 1 according to the first embodiment, the laser beam L reflected from the inner surface CDB of the front end CDA of the cutting groove CD is reflected by the thin line 51 to the lower portion of the workpiece W as shown in FIGS. Therefore, it is possible to prevent the temperature of the melt from being lowered even at a moving speed that is normally impossible to cut, and it is possible to speed up the cutting process.

In the laser beam machine 1 according to the first embodiment, since the melting point of the thin wire 51 is higher than the boiling point of the workpiece W, the thin wire 51 is not melted during the cutting process. In addition, when forming the piercing hole PH, the laser beam machine 1 according to Embodiment 1 keeps the thin wire 51 away from the workpiece W, and inserts the thin wire 51 after the piercing hole PH has penetrated. When forming PH, it can suppress that the thin wire | line 51 prevents a cutting process.

Since the laser beam machine 1 according to Embodiment 1 reflects the laser beam L from the cylindrical thin wire 51, the contact area with the melt is larger than that of the sheet-like reflector. For this reason, the laser processing machine 1 improves the discharge ability of the melt due to the surface tension and the Coanda effect.

Since the sheet-like reflector has no escape space for the auxiliary gas AG, the reflector itself is warped against the pressure of the auxiliary gas AG, and the laser beam L irradiated to the reflector is irradiated with the inner surface CDB of the front end CDA of the cutting groove CD. Can not be reflected. Since the laser beam machine 1 according to the first embodiment uses the cylindrical thin wire 51 to reflect the laser light L, the auxiliary gas AG can escape from the gap between the thin wire 51 and the cutting groove CD. 51 does not warp, and the laser beam L can be reflected to the inner surface CDB of the front end CDA of the cutting groove CD, so that the cutting process can be speeded up.

Further, in the laser processing machine 1, when the thin wire 51 is made of tungsten, the melting point of tungsten is 3000 ° C. or higher, which is higher than the boiling points of mild steel and stainless steel, and the wavelength at which the CO ₂ (carbon dioxide) laser oscillator oscillates. The reflectance of the laser beam L of 10.6 μm is as high as 90% or more, and the cutting speed can be increased. Further, in order to prevent the temperature of the thin wire 51 from being lowered, the laser beam machine 1 may energize the thin wire 51 and maintain the temperature of the thin wire 51 by Joule heat generated in the thin wire 51.

Embodiment 2. FIG.
Next, the laser beam machine 1 according to Embodiment 2 will be described with reference to the drawings. FIG. 9 is a perspective view showing a state in which the laser beam machine according to Embodiment 2 is being cut. FIG. 10 is a plan view of the object to be processed shown in FIG. In FIG. 9 and FIG. 10, the same parts as those of the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

As shown in FIGS. 9 and 10, the thin wire insertion unit 50 of the laser beam machine 1 according to Embodiment 2 can insert a plurality of thin wires 51 into the piercing hole PH and the cutting groove CD, and during the cutting process, A plurality of thin wires 51 are inserted into the piercing hole PH and the cutting groove CD.

Similarly to the first embodiment, the laser beam machine 1 according to the second embodiment inserts the thin wire 51 behind the irradiation point SP of the laser beam L into the piercing hole PH and the cutting groove CD in the cutting progress direction MD. Therefore, the laser beam L reflected by the thin wire 51 can be reflected toward the inner surface CDB of the front end CDA of the cutting groove CD. For this reason, the laser beam machine 1 according to the second embodiment can increase the ratio of the laser light L that contributes to the cutting process as compared with the comparative example in which the thin wire 51 is not provided, and the cutting process can be speeded up. it can.

Further, since the laser beam machine 1 according to the second embodiment inserts the plurality of thin wires 51 into the piercing hole PH and the cutting groove CD, the surface area of the thin wire 51 itself is larger than that of the first embodiment, and The surface tension acting on the melt is increased, and the discharge power of the melt can be improved. Further, since the laser beam machine 1 according to the second embodiment inserts the plurality of thin wires 51 into the piercing holes PH and the cutting grooves CD, the thin wires 51 remain in contact with the inner side surface CDC of the cutting grooves CD during the cutting processing. Move and improve cutting quality.

Embodiment 3 FIG.
Next, the laser beam machine 1 according to Embodiment 3 will be described with reference to the drawings. FIG. 11 is a side view showing a thin wire insertion portion of the laser beam machine according to the third embodiment. In FIG. 11, the same parts as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

The thin wire insertion portion 50-3 of the laser beam machine 1 according to Embodiment 3 includes a pair of guide rollers 56 instead of the insertion guide 52. The guide roller 56 is rotatably provided, and guides the moving direction to the fine line 51 with the fine line 51 interposed therebetween.

As in the first embodiment, the laser beam machine 1 according to the third embodiment inserts the thin wire 51 behind the piercing hole PH and the cutting groove CD from the irradiation point SP of the laser beam L in the cutting progress direction MD. Therefore, the laser beam L reflected by the thin wire 51 can be reflected toward the inner surface CDB of the front end CDA of the cutting groove CD. For this reason, the laser beam machine 1 according to Embodiment 3 can increase the speed of the cutting process.

Embodiment 4 FIG.
Next, the laser beam machine 1 according to Embodiment 4 will be described with reference to the drawings. FIG. 12 is a side view showing the thin wire insertion portion and the angle adjustment mechanism of the laser beam machine according to the fourth embodiment. FIG. 13 is a side view for explaining a state in which the angle adjustment mechanism shown in FIG. 12 adjusts the angle of the thin line. In FIG. 12 and FIG. 13, the same parts as those of the third embodiment are denoted by the same reference numerals, and the description thereof is omitted.

In the laser beam machine 1 according to the fourth embodiment, the lower end 51a of the thin wire 51 inserted into the piercing hole PH and the cutting groove CD by the thin wire insertion portion 50-3 is cut in the cutting progress direction MD with respect to the workpiece W of the processing head 20. Is provided with an angle adjusting mechanism 70 that is movable. In the angle adjustment mechanism 70, the angle of the thin line 51 is set to an angle appropriate for the thickness and material of the workpiece W by the control device 40.

In Embodiment 4, the angle adjustment mechanism 70 includes a linear actuator 71 that moves the guide roller 56 in the Z direction. The angle adjusting mechanism 70 can adjust the angle of the thin line 51 between the angle indicated by the solid line and the angle indicated by the broken line in FIG. 13 by moving the guide roller 56 in the Z direction by the linear actuator 71.

Similarly to the first embodiment, the laser beam machine 1 according to the fourth embodiment inserts the thin wire 51 behind the irradiation point SP of the laser beam L in the piercing hole PH and the cutting groove CD in the cutting progress direction MD. Therefore, the laser beam L reflected by the thin wire 51 can be reflected toward the inner surface CDB of the front end CDA of the cutting groove CD. For this reason, the laser beam machine 1 according to Embodiment 4 can increase the speed of the cutting process.

In the laser beam machine 1 according to the fourth embodiment, the angle adjustment mechanism 70 sets the angle of the thin wire 51 to an appropriate angle according to the thickness and material of the workpiece W, so that cutting suitable for the workpiece W is performed. It becomes possible.

Embodiment 5 FIG.
Next, the laser beam machine 1 according to Embodiment 5 will be described with reference to the drawings. FIG. 14 is a rear view showing the thin wire insertion portion and the follow-up mechanism of the laser beam machine according to the fifth embodiment. FIG. 15 is a perspective view for explaining a state in which the follow-up mechanism shown in FIG. 14 adjusts the angle of the thin line. In FIG. 14 and FIG. 15, the same parts as those of the third embodiment are denoted by the same reference numerals, and description thereof is omitted.

In the laser beam machine 1 according to the fifth embodiment, the lower end 51a of the thin wire 51 inserted into the piercing hole PH and the cutting groove CD by the thin wire insertion portion 50-5 is cut in the cutting progress direction MD with respect to the workpiece W of the processing head 20. Is provided with a follow-up mechanism 80 that is movable in a direction intersecting with respect to. In the follow-up mechanism 80, the angle of the thin line 51 is adjusted by the control device 40 so as to be in contact with one inner side surface CDC of the cutting groove CD constituting the part.

In the fifth embodiment, in the thin wire insertion portion 50-5, the axis of the roller 54-5 is orthogonal to the axis of the roller 54, and the axis of the guide roller 56-5 is aligned with the axis of the guide roller 56. Orthogonal. The follow-up mechanism 80 includes a linear actuator 81 that moves the guide roller 56-5 in a direction parallel to the horizontal direction and perpendicular to the cutting progress direction MD. The follow-up mechanism 80 moves the guide roller 56-5 by the linear actuator 81 in a direction parallel to the horizontal direction and perpendicular to the cutting progress direction MD, thereby changing the angle of the thin line 51 to the angle indicated by the solid line in FIG. It can adjust over the angle shown.

As in the first embodiment, the laser beam machine 1 according to the fifth embodiment inserts the thin wire 51 behind the piercing hole PH and the cutting groove CD from the irradiation point SP of the laser beam L in the cutting progress direction MD. Therefore, the laser beam L reflected by the thin wire 51 can be reflected toward the inner surface CDB of the front end CDA of the cutting groove CD. For this reason, the laser beam machine 1 according to Embodiment 5 can increase the cutting speed.

Since the laser beam machine 1 according to the fifth embodiment can move by moving the thin wire 51 in contact with one inner side surface CDC of the cutting groove CD constituting the part by the follow-up mechanism 80, the quality of the cut surface is improved.

Embodiment 6 FIG.
Next, a laser beam machine 1 according to Embodiment 6 will be described with reference to the drawings. FIG. 16 is a perspective view showing a thin wire insertion portion, an angle adjustment mechanism, and a follow-up mechanism of a laser beam machine according to the sixth embodiment. In FIG. 16, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

The laser beam machine 1 according to the sixth embodiment moves the lower end 51a of the thin wire 51 inserted into the piercing hole PH and the cutting groove CD by the thin wire insertion portion 50 in the cutting progress direction MD with respect to the workpiece W of the processing head 20. A possible angle adjustment mechanism 70-6 is provided. In the angle adjusting mechanism 70-6, the angle of the thin wire 51 is set to an angle appropriate for the thickness and material of the workpiece W by the control device 40.

In the laser beam machine 1 according to the sixth embodiment, the lower end 51a of the thin wire 51 inserted into the piercing hole PH and the cutting groove CD by the thin wire insertion portion 50 is cut with respect to the cutting progress direction MD with respect to the workpiece W of the processing head 20. And a follower mechanism 80-6 movable in the intersecting direction. In the follow-up mechanism 80-6, the angle of the thin line 51 is set to an angle at which the fine line 51 comes into contact with one inner surface CDC of the cutting groove CD constituting the part by the control device 40.

The follow-up mechanism 80-6 includes a rotary actuator 84 attached to the machining head 20 and provided with a slit 83 for inserting the insertion guide 52 of the thin wire insertion portion 50 in the drive shaft 82. The drive shaft 82 is parallel to the cutting progress direction MD on a plane parallel to both the X direction and the Y direction. The follow-up mechanism 80-6 rotates the drive shaft 82 to move the lower end 51a of the thin wire 51 in a direction intersecting the cutting progress direction MD with respect to the workpiece W of the processing head 20, thereby cutting the thin wire 51. One inner surface CDC of the groove CD is brought into contact.

The angle adjustment mechanism 70-6 includes a rotary actuator 73 that is built in the drive shaft 82 and in which the drive shaft 72 attached to the insertion guide 52 is orthogonal to the drive shaft 82. The drive shaft 72 intersects the cutting progress direction MD on a plane parallel to both the X direction and the Y direction. The angle adjusting mechanism 70-6 rotates the drive shaft 72 to move the lower end 51a of the thin wire 51 in the cutting progress direction MD with respect to the workpiece W of the machining head 20, and the angle of the thin wire 51 is changed to the workpiece W. The angle is appropriate for the thickness and material of the material.

As in the first embodiment, the laser beam machine 1 according to the sixth embodiment inserts the thin wire 51 behind the piercing hole PH and the cutting groove CD from the irradiation point SP of the laser beam L in the cutting progress direction MD. Therefore, the laser beam L reflected by the thin wire 51 can be reflected toward the inner surface CDB of the front end CDA of the cutting groove CD. For this reason, the laser beam machine 1 according to Embodiment 6 can increase the cutting speed.

In the laser beam machine 1 according to Embodiment 6, the angle of the fine wire 51 is set to an appropriate angle according to the thickness and material of the workpiece W by the angle adjustment mechanism 70-6, so that the cutting suitable for the workpiece W is performed. Processing becomes possible. Since the laser beam machine 1 according to Embodiment 6 can be moved by bringing the thin wire 51 into contact with one inner side surface CDC of the cutting groove CD constituting the part by the follow-up mechanism 80-6, the quality of the cut surface is improved.

Embodiment 7 FIG.
Next, the laser beam machine 1 according to Embodiment 7 will be described with reference to the drawings. FIG. 17 is a rear view showing a plurality of thin wire insertion portions of the laser beam machine according to the seventh embodiment. FIG. 18 is a rear view showing a state in which some fine wires of the plurality of fine wire insertion portions shown in FIG. 17 are inserted into the pierce holes. FIG. 19 is a rear view showing a state in which other fine lines of the plurality of fine line insertion portions shown in FIG. 18 are kept away from the object to be processed. FIG. 20 is a plan view of the object to be processed shown in FIG. FIG. 21 is a plan view showing a state in which cutting grooves are formed in the object to be processed shown in FIG. FIG. 22 is a plan view showing a state where the orientation of the cutting groove shown in FIG. 21 is changed. 17 to 22, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

In the laser beam machine 1 according to the seventh embodiment, a plurality of thin wire insertion portions 50 are arranged around the laser beam L irradiated to the workpiece W from the machining head 20. In the seventh embodiment, a plurality of thin wire insertion portions 50 are arranged on a semicircle centered on the laser beam L on a plane parallel to both the X direction and the Y direction. Further, the central position in the direction parallel to the horizontal direction of the plurality of thin wire insertion portions 50 and perpendicular to the cutting progress direction MD is arranged behind the irradiation point SP of the laser light L in the cutting progress direction MD.

Further, as shown in FIGS. 17 to 19, the plurality of fine wire insertion portions 50 are inclined with respect to the Z direction in the direction in which the lower ends 51 a of the thin wires 51 approach each other as they approach the workpiece W. In the seventh embodiment, the plurality of thin wire insertion portions 50 are arranged at positions where the lower ends 51a of the thin wires 51 are in contact with each other below the workpiece W, but the lower ends 51a of the thin wires 51 are mutually connected to the workpiece W. Contact may be made inside, contact may be made on the upper surface of the workpiece W, or contact may be made above the upper surface of the workpiece W. In the laser beam machine 1 according to the seventh embodiment, since the mutual positions of the thin wires 51 in the cutting groove CD differ depending on the positions where the lower ends 51a of the thin wires 51 are in contact with each other, the ratio of the reflection of the laser light L by the thin wires 51 The melt discharge force due to the surface tension and the Coanda effect can be changed, and cutting according to the purpose can be performed.

The laser beam machine 1 according to the seventh embodiment includes a guide member 90 that guides the moving direction of all the thin wires 51. As shown in FIGS. 20 to 22, the guide member 90 is formed in a ring shape centered on the laser beam L, and guides the thin line 51 around the irradiation point SP of the laser beam L. 20 to 22 show the portion of the guide member 90 that guides the thin line 51 with parallel oblique lines.

The laser beam machine 1 according to Embodiment 7 keeps the thin wire 51 away from the workpiece W as shown in FIG. 17 during the formation of the piercing hole PH, and after the formation of the piercing hole PH, as shown in FIG. All the thin wires 51 are brought close to the workpiece W by the thin wire insertion portion 50, and a part of the thin wires 51 is inserted into the piercing hole PH. Next, the laser beam machine 1 cuts away the thin wire 51 that has not been inserted into the piercing hole PH away from the workpiece W as shown in FIG. In the laser processing machine 1, as indicated by dense parallel oblique lines in FIGS. 20 to 22, the thin wire 51 inserted into the piercing hole PH and the cutting groove CD has a cutting progress direction MD from the irradiation point SP of the laser light L. Located behind. The laser beam machine 1 can measure whether or not the thin wire 51 has been inserted into the piercing hole PH by using a pressure sensor or a position sensor provided in the guide member 90.

In the seventh embodiment, at least one thin wire 51 may be inserted into the piercing hole PH and the cutting groove CD, and it is not always necessary to insert all the thin wires 51. The thin wire 51 inserted into the piercing hole PH and the cutting groove CD can be adjusted by the thickness, material, and part shape of the workpiece W.

As in the first embodiment, the laser beam machine 1 according to the seventh embodiment inserts the thin wire 51 behind the piercing hole PH and the cutting groove CD from the irradiation point SP of the laser beam L in the cutting progress direction MD. Therefore, the laser beam L reflected by the thin wire 51 can be reflected toward the inner surface CDB of the front end CDA of the cutting groove CD. For this reason, the laser beam machine 1 according to Embodiment 7 can increase the speed of the cutting process.

The laser beam machine 1 according to the seventh embodiment can form the piercing hole PH without hindering the irradiation of the laser beam L by the thin wire 51, and can smoothly shift to the cutting process. The laser beam machine 1 according to the seventh embodiment inserts the thin wire 51 behind the laser beam L in the cutting progress direction MD so that the laser beam L is irradiated onto the workpiece W by the thin wire 51 immediately after the start of the cutting process. Is not hindered.

Embodiment 8 FIG.
Next, the laser beam machine 1 according to Embodiment 8 will be described with reference to the drawings. FIG. 23 is a side view of the machining head of the laser beam machine according to the eighth embodiment. FIG. 24 is a plan view of the object to be processed shown in FIG. 23 and 24, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

The machining head 20 injects a purge gas PG from the periphery of the laser beam L onto the workpiece W as shown in FIG. The injection range PGA of the purge gas PG on the workpiece W has a ring shape. In the eighth embodiment, the machining head 20 is provided with an ejection port 25 that ejects the purge gas PG to the workpiece W around the machining nozzle 23 that irradiates the laser beam L and injects the auxiliary gas AG. In the eighth embodiment, the ejection ports 25 are provided on the entire circumference around the processing nozzle 23. In the eighth embodiment, as shown in FIG. 24, the irradiation point SP of the laser beam L, the injection range AGA of the auxiliary gas AG, and the injection range PGA of the purge gas PG are arranged coaxially.

As in the first embodiment, the laser beam machine 1 according to the eighth embodiment inserts the thin wire 51 behind the piercing hole PH and the cutting groove CD from the irradiation point SP of the laser beam L in the cutting progress direction MD. Therefore, the laser beam L reflected by the thin wire 51 can be reflected toward the inner surface CDB of the front end CDA of the cutting groove CD. For this reason, the laser beam machine 1 according to Embodiment 8 can achieve high speed cutting.

In the laser processing machine 1 according to the eighth embodiment, since the thin wire 51 is inserted into the piercing hole PH and the cutting groove CD, the atmospheric pressure in the piercing hole PH and the cutting groove CD is increased, and the auxiliary gas AG is processed. It becomes easy to escape along the upper surface of the object W. Therefore, as shown in FIGS. 23 and 24, the laser processing machine 1 according to the eighth embodiment maintains a high pressure near the plane of the workpiece W by supplying the purge gas PG from the periphery of the auxiliary gas AG. In addition, the auxiliary gas AG can be easily supplied into the piercing hole PH and the cutting groove CD. Since the quality of the cutting process is greatly influenced by the amount and purity of the auxiliary gas AG supplied into the piercing hole PH and the cutting groove CD, the laser processing machine 1 according to the eighth embodiment has a high quality cutting process. It becomes possible.

Embodiment 9 FIG.
Next, the laser beam machine 1 according to Embodiment 9 will be described with reference to the drawings. FIG. 25 is a plan view of a processing object being cut by the laser beam machine according to the ninth embodiment. In FIG. 25, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

The laser beam machine 1 according to the ninth embodiment arranges the thin wire 51A thicker than the thin wire 51 behind the cutting progress direction MD than the thin wire 51. As in the first embodiment, the laser beam machine 1 according to the ninth embodiment inserts the thin wire 51 behind the irradiation point SP of the laser beam L into the piercing hole PH and the cutting groove CD in the cutting progress direction MD. Therefore, the laser beam L reflected by the thin wire 51 can be reflected toward the inner surface CDB of the front end CDA of the cutting groove CD. For this reason, the laser beam machine 1 according to the ninth embodiment can increase the ratio of the laser beam L that contributes to the cutting process as compared with the comparative example in which the thin wire 51 is not provided, and can increase the cutting process speed. it can.

The laser beam machine 1 according to Embodiment 9 is inserted by the pressure in the cutting groove CD when cutting the workpiece W made of stainless steel that requires an auxiliary gas AG having a pressure higher than that of mild steel. The thin wire 51 may bend backward in the cutting progress direction MD. Therefore, the laser beam machine 1 according to Embodiment 9 disposes the thin wire 51A thicker than the thin wire 51 behind the cutting progress direction MD with respect to the thin wire 51, so that the thin wire 51 is in the cutting progress direction MD by the auxiliary gas AG. Bending backward can be suppressed. In the ninth embodiment, the

thin wires

51 and 51A have the same cross-sectional shape, but may have different shapes.

Embodiment 10 FIG.
Next, Embodiment 10 will be described with reference to the drawings. FIG. 26 is a cross-sectional view of a thin line according to the tenth embodiment. The thin wire 51-10 according to the tenth embodiment has a square cross section.

Embodiment 11 FIG.
Next, an eleventh embodiment will be described with reference to the drawings. FIG. 27 is a cross-sectional view of a thin line according to the eleventh embodiment. The thin wire 51-11 according to the eleventh embodiment is formed in a round shape with a groove having a rectangular cross section.

Embodiment 12 FIG.
Next, Embodiment 12 will be described with reference to the drawings. FIG. 28 is a cross-sectional view of a thin line according to the twelfth embodiment. The thin wire 51-12 according to the twelfth embodiment is formed in a round shape in which a groove having a V-shaped cross section is formed.

Embodiment 13 FIG.
Next, Embodiment 13 will be described with reference to the drawings. FIG. 29 is a cross-sectional view of a thin line according to the thirteenth embodiment. The fine wire 51-13 according to the thirteenth embodiment has a crescent-shaped cross section.

Embodiment 14 FIG.
Next, a fourteenth embodiment will be described with reference to the drawings. FIG. 30 is a cross-sectional view of a thin line according to the fourteenth embodiment. The thin wire 51-14 according to the fourteenth embodiment has a cross-sectional shape of an equilateral triangle.

Embodiment 15 FIG.
Next, a fifteenth embodiment will be described with reference to the drawings. FIG. 31 is a cross-sectional view of a thin line according to the fifteenth embodiment. Thin wire 51-15 according to the fifteenth embodiment has a star-shaped cross section.

In the tenth to fifteenth embodiments, as in the first embodiment, the thin wire 51 is inserted behind the laser beam irradiation point SP in the piercing hole PH and the cutting groove CD in the cutting progress direction MD. Therefore, the laser beam L reflected by the thin wire 51 can be reflected toward the inner surface CDB of the front end CDA of the cutting groove CD. Therefore, in the tenth to fifteenth embodiments, the ratio of the laser beam L contributing to the cutting process can be increased as compared with the comparative example in which the thin wire 51 is not provided, and the cutting process can be speeded up. .

The tenth to fifteenth embodiments vary according to the surface tension of the thin wires 51-10, 51-11, 51-12, 51-13, 51-14, and 51-15 and the purpose of flowing the melt. In order to increase the contact area between the fine wires 51-10, 51-11, 51-12, 51-13, 51-14, 51-15 and the melt, the fine wires 51-10, 51-11, 51-12, 51-15 are increased by sandblasting. Concavities and convexities may be formed on the surfaces of −10, 51-11, 51-12, 51-13, 51-14, and 51-15.

Embodiment 16 FIG.
Next, an embodiment 16 will be described with reference to the drawings. FIG. 32 is a side view of a fine line according to the sixteenth embodiment. Thin wire 51-16 according to the sixteenth embodiment has a plurality of cuts having an arcuate cross section.

Embodiment 17. FIG.
Next, an embodiment 17 will be described with reference to the drawings. FIG. 33 is a side view of a thin line according to the seventeenth embodiment. The fine wire 51-17 according to the seventeenth embodiment has a plurality of cuts with a V-shaped cross section.

In the sixteenth and seventeenth embodiments, as in the first embodiment, the thin wire 51 is inserted behind the irradiation point SP of the laser beam L in the piercing hole PH and the cutting groove CD in the cutting progress direction MD. Therefore, the laser beam L reflected by the thin wire 51 can be reflected toward the inner surface CDB of the front end CDA of the cutting groove CD. For this reason, in the sixteenth and seventeenth embodiments, the ratio of the laser light L contributing to the cutting process can be increased as compared with the comparative example in which the thin line 51 is not provided, and the cutting process can be speeded up. .

In the sixteenth and seventeenth embodiments, the laser light L reflected by the inner surface CDB of the front end CDA of the cutting groove CD is efficiently applied to the inner surface CDB of the front end CDA of the cutting groove CD. The reflection angle of the laser beam L can be adjusted.

Next, the configuration of the control device 40 of the laser beam machine 1 according to each embodiment will be described. FIG. 34 is a diagram illustrating an example of a hardware configuration of a control device for a laser beam machine according to each embodiment. The control device 40 receives position information of each part on the workpiece W and cutting processing conditions from an input device 41 connected to the input / output interface 441 shown in FIG. The input device 41 is configured by a touch panel, a keyboard, a mouse, a trackball, or a combination thereof. The control device 40 displays position information of each part on the workpiece W on the display device 42 connected to the input / output interface 441. In each embodiment, the display device 42 is a liquid crystal display device, but is not limited to a liquid crystal display device.

As shown in FIG. 34, the control device 40 is a computer including a CPU (Central Processing Unit) 443, a memory 444, and an input / output interface 441. The memory 444 stores software, firmware, or a combination of software and firmware as a program. In addition, the memory 444 stores part position information on the workpiece W input from the input device 41 and cutting processing conditions. The memory 444 is configured by a nonvolatile or volatile semiconductor memory, a magnetic disk, an optical disk, or a magneto-optical disk. Non-volatile or volatile semiconductor memory uses RAM (Random Access Memory), ROM (Read Only Memory), flash memory, EPROM (Erasable Programmable Read Only Memory), or EEPROM (Electrically Erasable Programmable） Read-Only Memory) It is done. In the control device 40, the CPU 443 executes the program stored in the memory 444 to realize the function of the control device 40.

The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

1 laser processing machine, 10 processing object support section, 20 processing head, 50, 50-3, 50-5 fine wire insertion section, 70, 70-6 angle adjustment mechanism, 80, 80-6 tracking mechanism, W processing object , L laser light, SP irradiation point, AG auxiliary gas, PG purge gas, PH piercing hole (processing area), CD cutting groove (processing area), MD cutting progress direction.

Claims

A laser processing machine that irradiates a laser beam focused on an object to be processed and cuts the object to be processed,
A workpiece support section for supporting the workpiece,
A processing head for irradiating the object to be processed with the condensed laser light and injecting an auxiliary gas;
A thin wire insertion portion that is attached to the processing head and capable of inserting a thin wire that reflects the laser light into a processing region formed on the processing object;
Irradiation of the laser beam on the workpiece with respect to the cutting progress direction caused by moving the at least one of the workpiece support section and the machining head by controlling the thin wire insertion section during the cutting process. And a control device that inserts the thin wire into the processing region from behind the point.
The laser beam machine according to claim 1, wherein the machining head injects the auxiliary gas to the irradiation point during the cutting process.
The laser beam machine according to claim 1, wherein the thin wire is made of metal.
The laser processing machine according to claim 1, wherein the thin wire insertion unit is capable of inserting a plurality of the thin wires into the processing region.
The laser processing machine according to claim 1, further comprising an angle adjustment mechanism capable of moving a lower end of the thin wire inserted into the processing region by the thin wire insertion portion in the cutting progress direction.
6. The laser according to claim 1, further comprising a follow-up mechanism capable of moving a lower end of the thin wire inserted into the processing region by the thin wire insertion portion in a direction intersecting the cutting progress direction. Processing machine.
The laser beam machine according to claim 1, wherein a plurality of the thin wire insertion portions are arranged around the laser beam emitted from the machining head.
The laser processing machine according to claim 1, wherein the processing head injects a purge gas from the periphery of the laser light onto the processing object.