JPH0699386A - Vacuum sucker device - Google Patents

Vacuum sucker device

Info

Publication number
JPH0699386A
JPH0699386A JP4016596A JP1659692A JPH0699386A JP H0699386 A JPH0699386 A JP H0699386A JP 4016596 A JP4016596 A JP 4016596A JP 1659692 A JP1659692 A JP 1659692A JP H0699386 A JPH0699386 A JP H0699386A
Authority
JP
Japan
Prior art keywords
suction
vacuum
passage
sucking
movable valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4016596A
Other languages
Japanese (ja)
Inventor
Koichi Nakae
浩一 中江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RIIDE ELECTRON KK
Original Assignee
RIIDE ELECTRON KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RIIDE ELECTRON KK filed Critical RIIDE ELECTRON KK
Priority to JP4016596A priority Critical patent/JPH0699386A/en
Publication of JPH0699386A publication Critical patent/JPH0699386A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To surely suck a sucked object with no necessity for accurate control of on-timing of a sucking source by providing a bypass means for connecting a sucking chamber to a sucking passage by a flow sufficiently smaller than the sucking passage in the case of closing the sucking chamber and the sucking passage by a movable valve. CONSTITUTION:When sucker pads P8 of a vacuum sucker device are brought into contact with a hole or the like of a printed board 7, a movable valve 25 is lifted by sucking force to close a sucking passage 20, and the other vacuum sucker device total unit connected by the sucking passage 20 holds a vacuum condition, to suck the printed board 7 conveyed. Here by roughing a work surface of a contact surface part 65 to serve as a bypass means, a fine amount of air is fed to the sucking passage 20. A pressure of air in the sucking passage 20 is thus equalized to that of a sucking chamber 2, and the movable valve 25 is moved by its own weight to suck the printed board 7. In this way, the valve in a spot of imperfect suction is automatically controlled, and suction can be surely performed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は真空吸着装置に関し、特
に被吸着物への吸着が完全でない吸引パッドの弁の自動
開閉を行う構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum suction device, and more particularly to a structure for automatically opening and closing a valve of a suction pad which is not completely sucked by an object to be sucked.

【0002】[0002]

【従来の技術】一般に電子部品等をプリントボードに搭
載する工程(マウント工程)では、各部品又はプリント
基板を必要な工程へ搬送する。この搬送としては、ベル
トコンベアや真空吸着装置が用いられている。
2. Description of the Related Art Generally, in the step of mounting electronic parts and the like on a printed board (mounting step), each part or printed board is transported to a necessary step. A belt conveyor or a vacuum suction device is used for this transportation.

【0003】この真空吸着装置を用いて搬送を行うには
通常一つの吸引源に複数の吸着パッドを設けてプリント
ボードを吸着する。そして、吸着は吸着パッドをプリン
トボードに当て吸着パッドを密閉して行われる。
In order to carry using this vacuum suction device, usually one suction source is provided with a plurality of suction pads to suck the printed board. The suction is performed by applying the suction pad to the printed board and sealing the suction pad.

【0004】ところが、プリントボードに穴やへこみ等
があったりする場合がある。このような箇所に吸着パッ
ドを当てても吸着パッドの開口部は完全にふさがらな
い。したがって、吸引してもその部分は真空にならない
ので他の吸引パッドで吸着したとしても吸引源での吸引
圧が低くなってしまう。つまり、全体としての吸引圧が
低くプリントボードの吸着が行う事が出来ず搬送も出来
ない。その為、生産ラインの自動化に対しての障害にな
っていた。
However, the printed board may have holes or dents. Even if the suction pad is applied to such a place, the opening of the suction pad is not completely closed. Therefore, even if suction is performed, that portion does not become a vacuum, and the suction pressure at the suction source becomes low even if suction is performed by another suction pad. In other words, the suction pressure is low as a whole and the print board cannot be sucked and cannot be conveyed. Therefore, it was an obstacle to automation of the production line.

【0005】そこで従来、吸着パッドの吸着が密閉され
ていない真空吸着装置の吸着動作のみを停止させる構造
が提案されている。この構造を図4に掲げる。
Therefore, conventionally, a structure has been proposed in which only the suction operation of the vacuum suction device in which the suction of the suction pad is not sealed is stopped. This structure is shown in FIG.

【0006】図4に示すように、搬送装置80には真空
吸着装置S1からS7まで7台の真空吸着装置が設けら
れプリントボード7の吸着を行う。真空吸着装置S1か
らS7のそれぞれには吸引パッドP1からP7が設けら
れている。また真空吸着装置S1からS7までのそれぞ
れにエアフィルター26が設けられており可動弁25は
エアフィルター26の上に位置する。プリントボード7
を吸着する場合、搬送装置80は下に降下しプリントボ
ード7に接する。尚、このプリントボード7にはへこみ
D1からD3が存在する。
As shown in FIG. 4, the transfer device 80 is provided with seven vacuum suction devices S1 to S7 for suctioning the printed board 7. Suction pads P1 to P7 are provided on the vacuum suction devices S1 to S7, respectively. An air filter 26 is provided in each of the vacuum suction devices S1 to S7, and the movable valve 25 is located above the air filter 26. Printed board 7
In the case of adsorbing, the transport device 80 descends and contacts the printed board 7. The print board 7 has dents D1 to D3.

【0007】まず、へこみD1からD3に接していない
真空吸着装置、例えばS1の動作を図5Aに示し説明す
る。プリントボード7は吸着パッドP1に接しており、
この時吸着パッドP1は密閉された状態である。吸引パ
ッドP1が密閉されている場合、吸引源からの吸引力は
吸引通路20を通じて吸引室2に達する。そして、吸引
室2内の空気を一瞬、矢印30方向へ押上げるが可動弁
25を矢印30方向へ移動させるには至らない。このよ
うな吸引により、やがて吸引室2内は真空になる。つま
り、吸引パッドP1に達した吸引源の吸引力でプリント
ボード7が吸着される。この吸着の状態は図4に示す真
空吸着装置S3、S5、S7でも同様である。
First, the operation of the vacuum suction device, for example, S1 which is not in contact with the depressions D1 to D3 will be described with reference to FIG. 5A. The printed board 7 is in contact with the suction pad P1,
At this time, the suction pad P1 is in a sealed state. When the suction pad P1 is sealed, the suction force from the suction source reaches the suction chamber 2 through the suction passage 20. Then, the air in the suction chamber 2 is momentarily pushed up in the direction of arrow 30, but the movable valve 25 cannot be moved in the direction of arrow 30. Due to such suction, the inside of the suction chamber 2 becomes a vacuum eventually. That is, the print board 7 is sucked by the suction force of the suction source reaching the suction pad P1. This suction state is the same in the vacuum suction devices S3, S5 and S7 shown in FIG.

【0008】一方、プリントボードに穴やへこみ等があ
る場合、吸着パッドをこの穴等の部分に当てても密閉さ
れない。また、真空吸着装置の吸着パッドがずれてプリ
ントボードに当てられていない場合も同じである。
On the other hand, if the printed board has holes or dents, it will not be sealed even if the suction pad is applied to the holes or the like. The same applies to the case where the suction pad of the vacuum suction device is displaced and is not applied to the printed board.

【0009】このような場合の真空吸着装置、例えばS
2の動作を図5B、5C、5Dに基づき説明する。この
場合、プリントボード7上にはへこみD1があるので吸
着パッドP2は密閉されない。吸着パッドP2が密閉さ
れないと、吸引源の吸引力により吸引パッドP2はへこ
みD1から空気を吸い続ける。すると、吸い続けられた
空気はエアフィルター26を通過し吸引室2、吸引通路
20を通じて矢印30方向に移動する。この時、吸引室
2内の可動弁25も矢印方向30に押上げられ移動する
(図5B、5C)。そして、可動弁25は矢印30方向
に移動し続け、その上面は最高到達位置Paに達し吸引
室2と吸引通路20をふさぐことになる(図5D)。
In such a case, a vacuum suction device, for example, S
The operation No. 2 will be described with reference to FIGS. 5B, 5C and 5D. In this case, since there is a dent D1 on the printed board 7, the suction pad P2 is not sealed. If the suction pad P2 is not hermetically closed, the suction pad P2 continues to suck air from the dent D1 due to the suction force of the suction source. Then, the continuously sucked air passes through the air filter 26 and moves in the direction of arrow 30 through the suction chamber 2 and the suction passage 20. At this time, the movable valve 25 in the suction chamber 2 is also pushed up and moved in the direction of arrow 30 (FIGS. 5B and 5C). Then, the movable valve 25 continues to move in the direction of the arrow 30, and the upper surface thereof reaches the maximum reaching position Pa, blocking the suction chamber 2 and the suction passage 20 (FIG. 5D).

【0010】このため、吸引通路20は可動弁25によ
って閉じられた状態となり吸引通路20内は真空とな
る。そして、これ以後は吸引パッドP2はくぼみD1の
空気を吸込むことがなくなる。以上のような可動弁25
の移動は図4に示す真空吸着装置S4,S6においても
同様に生じている。
Therefore, the suction passage 20 is closed by the movable valve 25, and the suction passage 20 is evacuated. Then, thereafter, the suction pad P2 does not suck in the air in the recess D1. Movable valve 25 as described above
The movement of the same occurs also in the vacuum suction devices S4 and S6 shown in FIG.

【0011】したがって、一つの吸引源で複数の真空吸
着装置を用いて吸着を行う図4の場合、全体としての吸
引源の圧力は低下せず吸着を行うことが可能となる。
Therefore, in the case of FIG. 4 in which one suction source uses a plurality of vacuum suction devices, it is possible to perform suction without lowering the pressure of the suction source as a whole.

【0012】[0012]

【発明が解決しようとする課題】しかし、上記のような
真空吸引装置には以下のような欠点があった。図4、図
5のような可動弁25を自動的に開閉する機構を設た場
合、例えば吸着パッドがプリントボードに当たる以前に
吸引源がONされてしまうと、自動的に全ての可動弁2
5が閉じてしまうことになる。一旦、可動弁25が自動
的に閉じてしまうと可動弁25を再び開く作業、つまり
OFFスイッチ入力をする必要があり手間がかかる。
However, the vacuum suction device as described above has the following drawbacks. When a mechanism for automatically opening and closing the movable valve 25 as shown in FIGS. 4 and 5 is provided, for example, if the suction source is turned on before the suction pad hits the printed board, all the movable valves 2 are automatically turned on.
5 will be closed. Once the movable valve 25 is automatically closed, it is necessary to open the movable valve 25 again, that is, to input the OFF switch, which is troublesome.

【0013】また高速な吸着、搬送動作等を行う場合、
吸着の際に吸着パッドをプリントボードに当てると吸着
パッドがプリントボード上ではねかえることがある。こ
のはねかえった時に吸引源がONされてしまうと全部ま
たは一部の真空吸着装置の弁が閉じられてしまうことが
ある。したがって、弁の閉じられた真空吸着装置は吸着
を行わないので搬送装置全体の吸着が弱く搬送中にプリ
ントボードが落ちてしまうこともあった。
In addition, when performing high-speed suction, conveyance operation, etc.,
If the suction pad is applied to the printed board during suction, the suction pad may be repelled on the printed board. If the suction source is turned on at the time of this rebound, the valves of all or part of the vacuum suction device may be closed. Therefore, since the vacuum suction device with the valve closed does not perform suction, the suction of the entire transport device is weak and the print board may drop during transport.

【0014】したがって、吸引パッドを確実にプリント
ボードに当接したことを確認した後、はじめてONにし
なければならず吸引源をONにするタイミングを制御す
る必要がある。
Therefore, it is necessary to turn on the suction pad for the first time after confirming that the suction pad has surely come into contact with the printed board, and it is necessary to control the timing of turning on the suction source.

【0015】さらに、高さの異なるプリントボードを吸
着する場合は吸着パッドの吸着位置(移動量)をプリン
トボードによってその都度合せる調節をしなければなら
ない。この調整が適切でないと、部品等の吸着が出来な
かったり、破損が生じたりする。
Further, when sucking print boards having different heights, it is necessary to adjust the suction position (movement amount) of the suction pad depending on the print board each time. If this adjustment is not done properly, parts may not be adsorbed or may be damaged.

【0016】仮に図6Aに示すように吸着物7の吸着を
行っているとする。この時、吸着パッドP8はプリント
ボード7を表面位置L4で吸着する。つぎにプリントボ
ードが変わり吸着パッドP8で表面位置がL3であるプ
リントボードを吸着する。この場合に吸着パッドP8の
下降位置の調整を行わずにそのまま吸着を続ける。する
と、表面位置がL3であるプリントボードを吸着する場
合でも、吸着パッドP8は前のプリントボード7の表面
位置L4まで下降しようとする。そして、表面位置がL
3のは吸引パッドP8により表面位置L3、L4の位置
差L5分だけ押圧され無理な力が加えられる。したがっ
て、このプリントボード7は位置差L5分の押圧が原因
で破損する虞がある。このように、吸着の際に吸着パッ
ドP8が下降する高さを調整しないと、プリントボード
の破損が生じ歩留り等の低下が生じる虞もある。
It is assumed that the adsorbate 7 is adsorbed as shown in FIG. 6A. At this time, the suction pad P8 sucks the print board 7 at the surface position L4. Next, the print board is changed and the suction pad P8 sucks the print board whose surface position is L3. In this case, suction is continued without adjusting the lowering position of the suction pad P8. Then, even when the print board whose surface position is L3 is sucked, the suction pad P8 tries to descend to the surface position L4 of the previous print board 7. And the surface position is L
3 is pressed by the suction pad P8 by a position difference L5 between the surface positions L3 and L4 and an unreasonable force is applied. Therefore, the printed board 7 may be damaged due to the pressing by the position difference L5. As described above, if the height at which the suction pad P8 descends during suction is not adjusted, the printed board may be damaged and yield or the like may be reduced.

【0017】そこで、本発明は吸引源のONタイミング
の精密な制御を不要とし、しかも確実に被吸着物、すな
わちプリントボードの吸着を行うことができ、かつ、厚
みの異なるプリントボードに対しても高さ調整を行う必
要のない真空吸着装置の提供を目的とする。
Therefore, the present invention eliminates the need for precise control of the ON timing of the suction source, and can reliably adsorb an object to be adsorbed, that is, a printed board, and even for printed boards having different thicknesses. An object of the present invention is to provide a vacuum suction device that does not require height adjustment.

【0018】[0018]

【課題を解決するための手段】請求項1に係る真空吸着
装置は、吸引源の吸引力を伝達する吸引通路、吸引通路
と連通するとともに被吸引物と当接する開口部を持つ吸
引室、吸引室に設けられた可動弁であって、重力もしく
は付勢手段によって通常は吸引通路を閉塞しない位置に
保持され、被吸着物が開口部に当接しない時に吸引通路
を介して吸引を行う場合には吸引通路を閉塞する可動
弁、を有する真空吸着装置において、可動弁によって吸
引室と吸引通路が閉塞された際に、吸引通路よりも十分
に小さい流量で吸引室と吸引通路間を連通するバイパス
手段、を備えた事を特徴としている。
According to a first aspect of the present invention, there is provided a vacuum suction device, which has a suction passage for transmitting a suction force of a suction source, a suction chamber having an opening communicating with the suction passage and in contact with an object to be suctioned, and a suction chamber. A movable valve provided in the chamber, which is normally held at a position where the suction passage is not blocked by gravity or a biasing means, and when suction is performed through the suction passage when the object to be attracted does not contact the opening. In a vacuum adsorption device having a movable valve that closes the suction passage, a bypass that communicates between the suction chamber and the suction passage at a flow rate sufficiently smaller than the suction passage when the suction chamber and the suction passage are closed by the movable valve. It is characterized by having means.

【0019】請求項2に係る真空吸着装置は、請求項1
の真空吸着装置において、真空吸着装置を保持し、被吸
着物に近付く方向に移動する保持板、保持板と真空吸着
装置の間に設けられた弾性手段、を備えたことを特徴と
している。
A vacuum suction device according to a second aspect is the first aspect.
The vacuum suction device is characterized by including a holding plate that holds the vacuum suction device and moves in a direction of approaching the object to be adsorbed, and elastic means provided between the holding plate and the vacuum suction device.

【0020】[0020]

【作用】請求項1に係る真空吸着装置においては、可動
弁によって吸引室と吸引通路が閉塞された際に吸引通路
よりも十分に小さい流量で吸引室と吸引通路間を連通す
るバイパス手段が設けられている。
In the vacuum suction device according to the first aspect, when the movable valve closes the suction chamber and the suction passage, the bypass means for communicating the suction chamber and the suction passage with a flow rate sufficiently smaller than the suction passage is provided. Has been.

【0021】したがって、被吸着物が開口部に当接しな
い場合でも吸引室と吸引通路間には小さい流量の空気が
流れており、被吸着物を当接するだけで吸着を行うこと
が可能となる。
Therefore, even when the object to be adsorbed does not come into contact with the opening, a small flow rate of air is flowing between the suction chamber and the suction passage, and it is possible to carry out adsorption only by abutting the object to be adsorbed. .

【0022】請求項2に係る真空吸着装置においては、
真空吸着装置を保持し、被吸着物に近付く方向に移動す
る保持板と真空吸着装置の間に弾性手段が設けられてい
る。したがって、保持板の移動距離が開口部から被吸着
物までの距離よりも大きい場合は弾性手段が収縮する。
すなわち、弾性手段の収縮により開口部の移動距離は自
動的に調節され、開口部は被吸着物に適切に当接する。
In the vacuum suction device according to claim 2,
An elastic means is provided between the vacuum suction device and a holding plate that holds the vacuum suction device and moves in a direction toward the object to be attracted. Therefore, when the moving distance of the holding plate is larger than the distance from the opening to the object to be attracted, the elastic means contracts.
That is, the contraction of the elastic means automatically adjusts the moving distance of the opening, and the opening appropriately contacts the object to be attracted.

【0023】[0023]

【実施例】真空吸着装置は電子部品等のマウント工程へ
の搬送等、精密部品を搬送する搬送装置に多く用いられ
ている。これは、吸引源である真空発生器を一つ設け、
複数の真空吸着装置を用いてプリントボードを吸着する
ものである。しかし、プリントボードによってはその表
面上で穴やへこみ等が存在する場合がある。このような
穴やへこみ等に吸着パッドが当れば開口部が密閉されな
い。したがって、この穴やへこみ等から吸引パッド内に
空気が流入し他の真空吸着装置の吸引力が低下する。こ
の為、搬送装置全体としての吸引力が低下してしまうの
で吸引が出来なくなる。
EXAMPLE A vacuum suction device is often used as a transfer device for transferring precision parts, such as transferring electronic parts to a mounting process. This is provided with one vacuum generator that is a suction source,
The printed board is sucked by using a plurality of vacuum suction devices. However, depending on the printed board, there may be holes or dents on the surface. If the suction pad hits such a hole or dent, the opening is not sealed. Therefore, air flows into the suction pad through the holes or dents, and the suction force of other vacuum suction devices is reduced. For this reason, the suction force of the entire transport device is reduced, and suction cannot be performed.

【0024】そこで、吸着パッドが密閉していない箇所
の真空吸着装置の弁を自動的に閉じる搬送装置がある
(図4参照)。つまり、吸着パッドが密閉されていない
真空吸着装置の弁を閉じることによって搬送装置全体と
しての真空状態を維持し吸着を行うものである。このよ
うな真空吸着装置の動作制御は真空吸着装置内の吸引室
に設けられている可動弁によって行われる。
Therefore, there is a transfer device that automatically closes the valve of the vacuum suction device at a location where the suction pad is not sealed (see FIG. 4). That is, by closing the valve of the vacuum suction device in which the suction pad is not sealed, the vacuum state of the entire transport device is maintained and suction is performed. Operation control of such a vacuum suction device is performed by a movable valve provided in a suction chamber in the vacuum suction device.

【0025】このような可動弁が設けられている真空吸
着装置であって、本発明に係る真空吸着装置の一実施例
を図に基づいて説明する。図1に本発明の一実施例の断
面図を掲げる。真空吸着装置には吸引通路20、吸引室
2及び吸着パッドP8が設けられている。また吸引室2
内には可動弁25とエアーフィルタ17が設けられてい
る。
An embodiment of the vacuum suction device according to the present invention, which is a vacuum suction device provided with such a movable valve, will be described with reference to the drawings. FIG. 1 shows a sectional view of an embodiment of the present invention. The vacuum suction device is provided with a suction passage 20, a suction chamber 2, and a suction pad P8. Also suction chamber 2
A movable valve 25 and an air filter 17 are provided inside.

【0026】図1Aは吸着パッドがプリントボードに当
る前に真空発生器が事故等の原因でONになってしまっ
た時の本実施例の真空吸着装置の断面図である。可動弁
25は吸引室2と吸引通路20を閉じる最高到達位置P
aに位置している。したがって、真空状態は可動弁25
で遮られて吸引通路20で止ってしまう。
FIG. 1A is a sectional view of the vacuum suction device of this embodiment when the vacuum generator is turned on before the suction pad hits the printed board due to an accident or the like. The movable valve 25 is a maximum reaching position P that closes the suction chamber 2 and the suction passage 20.
It is located at a. Therefore, the vacuum condition is such that the movable valve 25
It is blocked by and stops at the suction passage 20.

【0027】図1で示す本実施例における可動弁25の
上面が吸引室2の上壁に当接している可動弁到達部分6
5の拡大図を図2に掲げる。ここで可動弁25の表面に
は加工精度を落として微細な凹凸28が付けられてい
る。したがって、可動弁25の上面が吸引室2の上壁に
当っている時でも吸引室2内の空気のうち微量が常に矢
印90のように吸引通路20に流れ込んでいる。
The movable valve reaching portion 6 in which the upper surface of the movable valve 25 in this embodiment shown in FIG. 1 is in contact with the upper wall of the suction chamber 2
An enlarged view of No. 5 is shown in Fig. 2. Here, the surface of the movable valve 25 is provided with fine irregularities 28 with reduced processing accuracy. Therefore, even when the upper surface of the movable valve 25 is in contact with the upper wall of the suction chamber 2, a small amount of air in the suction chamber 2 always flows into the suction passage 20 as indicated by an arrow 90.

【0028】次に、可動弁25によって吸引室2が閉じ
た状態でプリントボードを吸着する真空吸着装置の動作
を図1B、1Cに基づいて説明する。プリントボード7
に吸着パッドP8が当接されると、プリントボード7に
よって吸着パッドP8は密閉状態になる(図1B)。す
ると、吸着パッドP8には外部の空気が流入しなくな
る。この時でも吸引室2内のうち微量の空気は図2で示
したように常に可動弁25上の凹凸28を通じて吸引通
路20に流入する。したがって、真空状態の吸引通路2
0と吸引室2内の真空圧の差は徐々に小さくなる。
Next, the operation of the vacuum suction device that suctions the printed board with the movable valve 25 closing the suction chamber 2 will be described with reference to FIGS. 1B and 1C. Printed board 7
When the suction pad P8 is brought into contact with the suction pad P8, the suction pad P8 is sealed by the printed board 7 (FIG. 1B). Then, external air does not flow into the suction pad P8. Even at this time, a small amount of air in the suction chamber 2 always flows into the suction passage 20 through the unevenness 28 on the movable valve 25 as shown in FIG. Therefore, the suction passage 2 in the vacuum state
The difference between 0 and the vacuum pressure in the suction chamber 2 gradually decreases.

【0029】しかし、可動弁25は真空発生器の真空圧
による吸引力でしばらくは図1に示す状態、すなわち最
高到達位置Paに位置している(図1B)。やがて、真
空圧の差が小さくなり真空圧による吸着力が可動弁25
の重さを支えられなくなると、可動弁25は自重によっ
て最高到達位置Paから次第に通常位置Pbに下降して
ゆく(図1C)。すると、吸引室2と吸引通路20とは
連通した状態になる。そして、吸引室2内の空気は吸引
通路20に流入し両者の真空圧は等しくなる。したがっ
て、吸着パッドP8に当っているプリントボード7は真
空発生器の吸引力で確実に吸着が行われる。
However, the movable valve 25 is in the state shown in FIG. 1 for a while due to the suction force of the vacuum pressure of the vacuum generator, that is, at the maximum reaching position Pa (FIG. 1B). Eventually, the difference in vacuum pressure becomes small, and the suction force due to the vacuum pressure becomes
When the movable valve 25 cannot support the weight of the movable valve 25, the movable valve 25 gradually descends from the highest position Pa to the normal position Pb by its own weight (FIG. 1C). Then, the suction chamber 2 and the suction passage 20 are in communication with each other. Then, the air in the suction chamber 2 flows into the suction passage 20 and the vacuum pressures of the both become equal. Therefore, the printed board 7 contacting the suction pad P8 is surely sucked by the suction force of the vacuum generator.

【0030】尚、本実施例においてはバイパス手段とし
て可動弁25上面に凹凸28を付けたが、、同じ効果を
生じさせるものであれば他のバイパス手段、例えば図2
に示すバイパス管29を設けても良い(図2参照)。
Although the unevenness 28 is provided on the upper surface of the movable valve 25 as the bypass means in this embodiment, other bypass means, for example, FIG.
The bypass pipe 29 shown in FIG. 2 may be provided (see FIG. 2).

【0031】次に高さ調整調整機能が設けられた搬送装
置を図3に掲げる。この搬送装置には本体部40内に複
数の真空吸着装置が設けられ、本体部40から吸着パッ
ドP8、P9が突出している。また、本体部40は保持
板50に支柱36を介して連接されている。更に支柱3
6にはコイルばね35が設けられている搬送を行う際は
保持板50の移動に伴って本体部40も移動する。そし
て、本体部40は保持板50に対して上下移動をする。
上下移動をする本体部40に設けられた吸着パッドP
8、P9がプリントボード7に接して吸着が行われる。
Next, FIG. 3 shows a carrying device provided with a height adjusting and adjusting function. A plurality of vacuum suction devices are provided in the main body 40 of the carrying device, and suction pads P8 and P9 project from the main body 40. Further, the main body portion 40 is connected to the holding plate 50 via the columns 36. Further support 3
The coil spring 35 is provided on the body 6, and the main body portion 40 also moves as the holding plate 50 moves when carrying. Then, the main body 40 moves up and down with respect to the holding plate 50.
The suction pad P provided on the main body 40 that moves up and down
8 and P9 come into contact with the printed board 7 to be adsorbed.

【0032】このような高さ調整機構の動作を以下に説
明する。かりに、最初に表面位置L1のプリントボード
7を吸着し、次に表面位置L2のプリントボードを吸着
したとする。すると、吸着パッドP8、P9がプリント
ボード9と接する位置は表面位置L2と表面位置L1と
の表面位置差LD分だけ異なる。しかし、本実施例では
搬送装置の保持板50と移動板40の間にコイルばね3
5が設けられて上下移動が可能である。したがって、コ
イルばね35が矢印100方向に縮むことで表面位置差
LD分の移動を吸収する。
The operation of such a height adjusting mechanism will be described below. At the same time, it is assumed that the print board 7 at the surface position L1 is first sucked and then the print board at the surface position L2 is sucked. Then, the positions where the suction pads P8 and P9 contact the printed board 9 differ by the surface position difference LD between the surface position L2 and the surface position L1. However, in the present embodiment, the coil spring 3 is provided between the holding plate 50 and the moving plate 40 of the transfer device.
5 is provided and can be moved up and down. Therefore, the coil spring 35 contracts in the direction of arrow 100 to absorb the movement of the surface position difference LD.

【0033】つまり、コイルばね35を保持板50と移
動板40の間に設けることにより厚みの違うプリントボ
ードを吸引パッドの位置調整をせずに連続して吸着する
ことが可能となる。
That is, by providing the coil spring 35 between the holding plate 50 and the moving plate 40, it is possible to continuously attract print boards having different thicknesses without adjusting the position of the suction pad.

【0034】尚、本実施例においては弾性手段としてコ
イルばねを用いたが、他の弾性部材等を用いてもよい。
Although the coil spring is used as the elastic means in this embodiment, other elastic members may be used.

【0035】[0035]

【発明の効果】請求項1に係る真空吸着装置において
は、被吸着物が開口部に当接しない場合でも吸引室と吸
引通路間には常に小さい流量の空気が流れており、被吸
着物を当接するだけで吸着を行うことが可能となる。
In the vacuum suction device according to the first aspect of the present invention, even when the object to be adsorbed does not come into contact with the opening, a small flow rate of air is always flowing between the suction chamber and the suction passage, and Adsorption can be performed only by abutting.

【0036】したがって、吸着が完全でない箇所の弁を
自動的に制御し確実な吸着を行う事が可能となる。又、
一旦吸着後になんらかの原因で開口部と被吸着物が当接
しなくなっても、開口部に被吸着物を当接すれば再び吸
着を行うことが可能となるので吸引源の操作の時期を制
御する必要がない。
Therefore, it is possible to automatically control the valve at the portion where the suction is not perfect and to perform the reliable suction. or,
Even if the opening does not come into contact with the object to be adsorbed for some reason after adsorption, it is possible to perform adsorption again if the object comes into contact with the opening, so it is necessary to control the operation timing of the suction source. Absent.

【0037】請求項2に係る真空吸着装置においては、
保持板の移動距離が開口部から被吸着物までの距離より
も大きい場合は弾性手段が収縮する。すなわち、弾性手
段の収縮により開口部の移動距離は自動的に調節され、
開口部は被吸着物に適切に当接する。
In the vacuum suction device according to claim 2,
When the moving distance of the holding plate is larger than the distance from the opening to the object to be attracted, the elastic means contracts. That is, the contraction of the elastic means automatically adjusts the moving distance of the opening,
The opening appropriately contacts the object to be attracted.

【0038】したがって、予め保持板の移動距離を調節
することなく被吸着物を確実に吸着することが可能とな
る。
Therefore, it is possible to surely adsorb the object to be adsorbed without adjusting the moving distance of the holding plate in advance.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る真空吸着装置の作動を示す断面図
である。
FIG. 1 is a sectional view showing an operation of a vacuum suction device according to the present invention.

【図2】図1に示す真空吸着装置の部分拡大断面図であ
る。
FIG. 2 is a partially enlarged sectional view of the vacuum suction device shown in FIG.

【図3】搬送装置にばね機構を設けた状態を示す側面図
である。
FIG. 3 is a side view showing a state in which a spring mechanism is provided in the transfer device.

【図4】搬送装置に従来の真空吸着装置を複数設け吸着
を行う時の開閉動作を表わす断面図である。
FIG. 4 is a cross-sectional view showing an opening / closing operation when a plurality of conventional vacuum suction devices are provided in a transfer device to perform suction.

【図5】図4に示す真空吸着装置を表わす断面図であ
る。
5 is a cross-sectional view showing the vacuum suction device shown in FIG.

【図6】被吸着物の厚みの変化に係る表面位置を表わす
側面図である。
FIG. 6 is a side view showing a surface position related to a change in the thickness of an object to be adsorbed.

【符号の説明】[Explanation of symbols]

2・・・・・吸引室 7・・・・・プリントボード P8、P9・・・・・吸着パッド 20・・・・・吸引通路 25・・・・・ 可動弁 2 ... Suction chamber 7 ... Printed board P8, P9 ... Suction pad 20 ... Suction passage 25 ... Movable valve

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】吸引源の吸引力を伝達する吸引通路、吸引
通路と連通するとともに被吸引物と当接する開口部を持
つ吸引室、吸引室に設けられた可動弁であって、重力も
しくは付勢手段によって通常は吸引通路を閉塞しない位
置に保持され、被吸着物が開口部に当接しない時に吸引
通路を介して吸引を行う場合には吸引通路を閉塞する可
動弁、を有する真空吸着装置において、 可動弁によって吸引室と吸引通路が閉塞された際に、吸
引通路よりも十分に小さい流量で吸引室と吸引通路間を
連通するバイパス手段、を備えた事を特徴とする真空吸
着装置 。
1. A suction passage for transmitting a suction force of a suction source, a suction chamber having an opening communicating with the suction passage and in contact with an object to be sucked, and a movable valve provided in the suction chamber, the gravity valve or A vacuum suction device having a movable valve that is normally held at a position that does not close the suction passage by the biasing means and that closes the suction passage when suction is performed through the suction passage when the object to be attracted does not contact the opening. 2. The vacuum suction device according to claim 1, further comprising a bypass means for communicating between the suction chamber and the suction passage at a flow rate sufficiently smaller than the suction passage when the suction valve and the suction passage are closed by the movable valve.
【請求項2】請求項1の真空吸着装置において、真空吸
着装置を保持し、被吸着物に近付く方向に移動する保持
板、保持板と真空吸着装置の間に設けられた弾性手段、
を備えたことを特徴とする真空吸着装置。
2. The vacuum suction device according to claim 1, further comprising: a holding plate that holds the vacuum suction device and moves in a direction of approaching an object to be attracted; an elastic means provided between the holding plate and the vacuum suction device.
A vacuum suction device comprising:
JP4016596A 1992-01-31 1992-01-31 Vacuum sucker device Pending JPH0699386A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4016596A JPH0699386A (en) 1992-01-31 1992-01-31 Vacuum sucker device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4016596A JPH0699386A (en) 1992-01-31 1992-01-31 Vacuum sucker device

Publications (1)

Publication Number Publication Date
JPH0699386A true JPH0699386A (en) 1994-04-12

Family

ID=11920671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4016596A Pending JPH0699386A (en) 1992-01-31 1992-01-31 Vacuum sucker device

Country Status (1)

Country Link
JP (1) JPH0699386A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1918076A1 (en) * 2006-11-02 2008-05-07 Yong-Chan Yang Vacuum suction system
JP2014008564A (en) * 2012-06-28 2014-01-20 Kyocera Crystal Device Corp Suction nozzle, suction device, and apparatus manufacturing method
WO2021262782A1 (en) * 2020-06-26 2021-12-30 Cryovac, Llc Passive valves for vacuum manifolds

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1918076A1 (en) * 2006-11-02 2008-05-07 Yong-Chan Yang Vacuum suction system
JP2014008564A (en) * 2012-06-28 2014-01-20 Kyocera Crystal Device Corp Suction nozzle, suction device, and apparatus manufacturing method
WO2021262782A1 (en) * 2020-06-26 2021-12-30 Cryovac, Llc Passive valves for vacuum manifolds

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