JPH0697642A - Soldering method - Google Patents

Abstract

PURPOSE:To make stable soldering possible to a printed board, and prevent the generation of scattering of solder particles CONSTITUTION:The plane part of a solder chip 6 which is cut by a cutting blade 5 so as to obtain specified capacity and has the plane in at least one direction by press molding is brought into surface contact with a place to be soldered. The solder chip 6 is heated and fused by using a heat source, and soldering to the place to be soldered is completed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for soldering an entire circuit system of electric / electronic equipment.

[0002]

2. Description of the Related Art A circuit system of an electric / electronic device is composed of a printed circuit board and a connection terminal, or terminals similar thereto. As a method for electrically connecting those, a connecting method by contact of a conductive portion such as a connector or a connecting method by soldering each conductive portion is a main method. Further, in a circuit system such as a printed circuit board, the electronic component itself is mainly soldered and mounted on the printed circuit board.

A conventional soldering method will be described. A general soldering method that has been conventionally performed is to supply the soldered portion with thread solder as shown in FIG. 1 and use an electrically heated soldering iron or the like to solder the portion to be soldered or the threaded solder. A common method is to heat the solder to melt the solder and solder the solder. Also, instead of using thread solder, apply finely powdered solder with cream solder kneaded with a binder such as flux to the part to be soldered, and use a soldering iron or a non-contact type light beam, laser, or hot air for heating. There is a method of melting cream solder and soldering.

[0004]

However, in the above-mentioned configuration, the soldering iron and the thread solder have a short life, and the soldering tip usually requires replacement or maintenance in about 100 to 500 hours. In addition, since the solder is taken by the soldering iron, there is a problem that the solder strength is not stable.

Further, in the method of soldering cream solder by using a light beam, a laser and hot air, cracks and the like are easily gasified due to a rapid rise in heat, and many particles such as solder balls are scattered, resulting in quality In addition, it has a big problem.

The present invention is intended to solve the above problems and enables stable soldering to a printed circuit board.
Another object of the present invention is to provide a soldering method capable of improving the reliability of soldering between terminals.

[0007]

In order to solve the above problems, a soldering method of the present invention is a soldering chip which is cut to have a predetermined capacity and has a flat surface in at least one direction by press molding, The flat portion of the solder chip is brought into surface contact with the soldering place, the solder chip is heated and melted by an external heat source, and soldered to the soldering place.

Further, a solder chip having a flat surface in at least one direction is cut in advance in a fixed amount into a rectangular parallelepiped or a rectangular parallelepiped shape, packaged on a taping carrier, and a fixed amount of solder chip is soldered. To supply the department.

[0009]

With the above-described structure, a constant amount of solder can be constantly supplied to the soldered portion, and stable soldering strength can be achieved without causing particle scattering.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the soldering method of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a state in which the thread solder is wound around the solder reel, FIG. 2 is a sectional view showing a state in which the tip of the thread solder is pressed, and FIG. 3 is a sectional view showing the pressed thread solder cut. FIG. 4 is a perspective view in which a cut solder chip is sucked by a suction nozzle, FIG. 5 is a cross-sectional view in which the sucked solder chip is transferred to a soldered portion, and FIG. FIG. 7 is a perspective view of a soldering chip transferred to a soldered portion, which is heated and melted, FIG. 7 is a perspective view of a taping reel, and FIG.
FIG. 3 is a perspective view of a solder chip.

In the drawings, 1 is a flux-free thread solder, 2 is a solder reel around which the thread solder 1 is wound, 3 is a press upper die, 4 is a press lower die, 5 is a cutting blade, and 6 is a cutting blade 5. The cut solder chip, 7 is a pedestal, 8 is a suction nozzle for sucking the solder chip 6, 9 is a flexible substrate, 10 is a terminal such as an electronic component, 11 is a holding pin, 12 is a heat source for blowing hot air, and 14 is Taping reel, 15 is embossed taping carrier, 16 is top tape, 1
Reference numeral 7 is a solder chip, and 18 is a chip housing portion in which the solder chip 17 is housed.

The operation will be described below. As shown in FIG. 2, the tip portion of the thread solder 1 wound on the solder winding reel 2 shown in FIG. 1 is sandwiched between the press upper die 3 and the press lower die 4 so that the thickness becomes the dimension t. , And press-compressing so that at least one surface is formed into a flat surface. Next, as shown in FIG. 3, the pressed portion of the thread solder 1 is placed on the pedestal 7, and the pressed portion of the thread solder 2 is cut off using the cutting blade 5 to form the solder chip 6. . The cradle 7 may be shared with the lower press die 4.

Next, as shown in FIG. 4, the solder chip 6 having a constant size of length l and width w is sucked by a suction nozzle 8, and the flexible substrate 9 which is a portion to be soldered and an electronic component, etc. To the connection portion with the terminal 10. And FIG.
As shown in FIG. 3, the suction nozzle 8 is separated from the solder chip 6 while pressing the solder chip 6 against the connecting portion with the pressing pin 11.
The solder chip 6 is placed on the connection part.

Next, as shown in FIG. 6, the mounted solder chip 6 is heated and melted by the hot air blown from the heat source 12 to electrically connect the flexible substrate 9 and the terminal 10. When the connection is completed, the pressing pin 11 rises together with the suction nozzle 8, and the soldering is completed.

The pressing pin 11 is made of a ceramic material or the like.
It is made of a material such that the melted solder 6 does not adhere to it.

As described above, according to the present embodiment, since soldering is performed by using the solder chips cut into a certain volume, it is possible to always supply a certain amount of solder to the soldered portion,
Further, unlike the conventional case, the solder containing the flux is not used, and the solder containing the flux is not used. Therefore, the solder particles are not scattered due to the gasification of the flux, and the solder strength is stable. It is a thing.

Further, FIG. 7 shows an attempt to supply a solder chip 17 which is made into a chip by using a standard taping reel 14 conforming to the EIAJ standard. Solder chip 1
7 is a chip storage portion 1 of the embossed taping carrier 15.
It is supplied in a state in which it is stored in No. 8 and is prevented from popping out by the top tape 16. This system has a standardized configuration for chip parts such as resistors and capacitors, that is, surface-mounted parts for printed boards, and has many applications.

Further, as shown in FIG. 8, the size of the solder chip 17 is set to w × l × t and regulated to several types, so that soldering to a printed board or the like can be easily performed by standard mounting equipment. You can

[0020]

As described above, according to the present invention, since a solder chip having a constant volume is set on the soldered portion and the solder is soldered without being picked up by another member, the strength of each soldering portion is increased. Can be kept constant.

Further, unlike the conventional case, the solder containing the flux is not used, and the solder containing the flux is not used. Therefore, the solder particles are not scattered due to the gasification of the flux, and the solder is very stable. Can be attached.

Further, the present invention can be applied to printed circuit boards, flexible boards, connectors, etc. where spot soldering is performed or where soldering is collectively performed. It is a simple soldering method.

[Brief description of drawings]

FIG. 1 is a perspective view of a solder reel according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a state where solder is pressed in the example.

FIG. 3 is a sectional view showing a state in which the solder is cut in the embodiment.

FIG. 4 is a perspective view showing a state in which solder is transferred to a soldered portion in the embodiment.

FIG. 5 is a cross-sectional view showing a state in which the solder is transferred to a soldered portion in the embodiment.

FIG. 6 is a perspective view showing a state in which the solder is being heated in the embodiment.

FIG. 7 is a perspective view of the taping reel according to the embodiment.

FIG. 8 is a perspective view of a solder chip of the same embodiment.

[Explanation of symbols]

 1 Thread Solder 2 Solder Reel 3 Press Upper Mold 4 Press Lower Mold 5 Cutting Blade 6 Solder Chip 7 Cradle 8 Adsorption Nozzle 9 Flexible Board 10 Terminal 11 Presser Pin 12 Heat Source

Claims (4)

[Claims] 1. A solder chip having a predetermined capacity and having a flat surface in at least one direction is brought into surface contact with the flat surface of the solder chip with respect to a place to be soldered, and the solder chip is heated by an external heating source. A soldering method, which comprises melting and soldering to the soldering place. 2. A thread-shaped solder wound on a reel is shape-molded so that at least one direction is a flat surface, and is soldered using a solder chip cut to have a predetermined capacity. How to solder. 3. A solder chip having a flat surface in at least one direction is preliminarily cut into a predetermined amount, packaged on a taping carrier, and the predetermined amount of the solder chip is supplied to a soldered portion for soldering. A soldering method characterized by attaching. 4. The soldering method according to claim 3, wherein the chip shape of the solder chip is a rectangular parallelepiped shape or a rectangular parallelepiped shape.