JPH0696826A - Manufacturing of electric circuit parts - Google Patents

Abstract

PURPOSE:To improve reliability of connection between electrode terminals at fine pitch, and to prevent excess application of pressure to a wiring pattern of an electrode terminal, and to stabilize a connection resistance by fixing a conductive particles to the electrode terminal in a single layer. CONSTITUTION:After an ultraviolet hardening type adhesive 12 is sprayed on a glass plate 11 into a thickness of no more than the radius of each of conductive particles 5, the conductive particles 5 are formed and dispersed on the glass plate 11 in no less than a single layer. After the conductive particles 5 other than the lowermost layer are removed by reversing or air-blowing the glass plate 11, the conductive particles 5 are fixed by an electrode terminal 2. The conductive particles 5 are provided in a single layer at a fixed density, on a part corresponding to the electrode terminal 2, and the conductive particles 5 are fixed to the electrode terminal 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electric circuit component, and more particularly, it can be applied to board connection, TAB mounting technology and the like, and in particular, it can be applied to fine pitch and electrode terminals. The present invention relates to a method for manufacturing an electric circuit component capable of improving the connection reliability by making the heights of the electrodes uniform.

[0002]

2. Description of the Related Art As a conventional method for manufacturing an electric circuit component of this type, conductive particles are laminated in a single layer or more on a flat substrate and then sprayed, and then an adhesive is applied only to the electrode terminals in advance. After pressing a certain electric circuit board onto the conductive particles, the insulating adhesive is cured under a predetermined curing condition to fix the conductive particles to the wiring board. As a conventional example of this type, there is JP-A-3-289070.

[0003]

However, in such a conventional method of manufacturing an electric circuit component, an electric circuit board having conductive particles dispersed and laminated on a flat board is coated with an adhesive. Since the adhesive is thick, or when the conductive particles scattered on the flat substrate are stacked in two layers, the conductive particles are fixed in two layers on the electrode terminals. It was Therefore, there are problems in that the number of electrically contact points increases, the fine pitch cannot be supported, and the reliability of the connection decreases.

In addition to this, since the heights of the electrode terminals become non-uniform, the pressure applied to the wiring pattern of the electrode terminals partially changes greatly. Therefore, for example, if the electrode terminals are ITO (Indiu
In the case of (m Tia Oxide), since ITO is weak, applying a heavy load not only causes cracks, but also reduces the number of electrically connected points, so that a stable resistance value can be obtained. There was a problem that I could not do it.

Further, since there is no means for controlling the number of conductive particles on the electrode terminals, there is a problem that the connection resistance value varies and the connection reliability deteriorates. That is, when the number of conductive particles was small, the connection resistance value was high. On the contrary, when the number of conductive particles increases, the adhesive does not exist around the conductive particles, so the conductive particles do not sufficiently deform when connecting the electrical terminals, and electrical connection cannot be made, or the adhesive strength is low. There was a problem of becoming weak.

Therefore, according to the present invention, by fixing the conductive particles on the electrode terminals in a single layer, it is possible to deal with fine-pitch electrode terminals, and it is possible to improve the reliability of connection between these electrode terminals, It is possible to prevent excessive pressure from being applied to the wiring pattern of the terminals.
An object of the present invention is to provide a method for manufacturing an electric circuit component that can stabilize the connection resistance value.

[0007]

The invention according to claim 1 is
In order to solve the above problems, in a method for producing an electric circuit component in which conductive particles are arranged in a single layer on an electrode terminal formed on an electric circuit board, an insulating adhesive is attached to a flat board substrate with a radius of the conductive particles or less. After spraying to a thickness of 1, the conductive particles are laminated on the flat substrate in a single layer or more and then sprayed, and then the flat substrate is inverted or blown to remove conductive particles other than the lowermost layer, and , After the electric circuit board in which only the electrode terminals are coated with the adhesive is pressure-bonded to the conductive particles, the adhesive is cured under predetermined curing conditions to fix the single-layer conductive particles to the electrode terminals. There is.

In order to solve the above-mentioned problems, a second aspect of the present invention is a method for manufacturing an electric circuit component, wherein conductive particles are arranged in a single layer on electrode terminals formed on the electric circuit board. By laminating and spreading the conductive particles in a single layer or more on the top, and then moving the stage along the flat substrate at a position at a height of approximately the diameter of the conductive particles in the lowermost layer,
The conductive particles other than the bottom layer are removed, and then the electric circuit board in which the adhesive is applied only to the electrode terminals in advance is pressure-bonded to the conductive particles, and then the adhesive is cured under predetermined curing conditions to form a single layer. The feature is that the conductive particles are fixed to the electrode terminals.

In order to solve the above-mentioned problems, a third aspect of the present invention is a method for manufacturing an electric circuit component, wherein conductive particles are arranged in a single layer on electrode terminals formed on the electric circuit board. Apply an adhesive with conductive particles dispersed and mixed onto it, and then move the stage along the flat substrate from the flat substrate at a position approximately the diameter of the conductive particles to form a single layer on the flat substrate. The method is characterized in that the conductive particles are formed, and then the electric circuit board is pressure-bonded to the conductive particles, and then the adhesive is cured under predetermined curing conditions to fix the single-layer conductive particles to the electrode terminals.

In order to solve the above-mentioned problems, a fourth aspect of the present invention is directed to a method for manufacturing an electric circuit component, wherein conductive particles are arranged in a single layer on electrode terminals formed on an electric circuit board. Conductive particles are placed in a single layer at a constant density on the parts corresponding to the terminals, and then the electric circuit board with adhesive applied only to the electrode terminals is crimped to the conductive particles and then cured It is characterized in that the adhesive is cured under the conditions to fix the single-layer conductive particles to the electrode terminals.

In order to solve the above-mentioned problems, the present invention has a diameter on one side substantially equal to that of the conductive particles, the other side communicates with the one side, and has a diameter smaller than the diameter of the conductive particles. A flat plate substrate having tapered through holes provided along the electrode terminals is prepared, and conductive particles are laminated in a single layer or more on the flat plate substrate and dispersed, and then the conductive particles are applied from the other side of the flat plate substrate. Is sucked to remove the other conductive particles scattered while leaving the conductive particles in the through hole.

In order to solve the above-mentioned problems, a flat plate substrate having a recess having a depth shorter than the diameter of the conductive particles on one surface side is prepared, and the flat plate substrate is provided with a single layer of conductive particles. After being laminated and sprayed as described above, the other conductive particles that have been sprayed are removed while leaving the conductive particles placed in the recesses. In order to solve the above-mentioned problems, the invention according to claim 7 is characterized in that resin particles are plated with metal as the conductive particles.

In order to solve the above problems, the invention according to claim 8 is characterized in that an ultraviolet curable adhesive is used as the adhesive. The invention according to claim 9 is
In order to solve the above problems, a conductive adhesive is used as the adhesive.

[0014]

According to the first aspect of the present invention, the insulating adhesive is sprayed on the flat substrate to a thickness not larger than the radius of the conductive particles, and then the conductive particles are stacked in a single layer or more on the flat substrate. ,
Then, the flat substrate is inverted or blown with air to remove the conductive particles other than the lowermost layer, and then the conductive particles are fixed to the electrode terminals.

Therefore, the conductive particles are fixed on the electrode terminals in a single layer, and the point where they are electrically contacted is optimized, which corresponds to the fine pitch electrode terminals and the reliability of the connection between the electrode terminals. Is improved. Further, the height of the electrode terminals becomes uniform, and the pressure applied to the wiring pattern of the electrode terminals becomes constant at each electrode terminal. Therefore, the electrode terminals are IT
In the case of O, no crack is generated. Further, since the electrically connected point is optimum, a stable resistance value can be obtained.

According to the second aspect of the present invention, the conductive particles are laminated in a single layer or more on the flat plate substrate and scattered, and then the stage is arranged along the flat plate substrate at a position approximately at the height of the diameter of the conductive particles in the lowermost layer. The conductive particles other than the lowermost layer are removed by being moved by the above, and the conductive particles are fixed to the electrode terminals.
Therefore, the same operation as that of claim 1 is achieved. In the invention according to claim 3, an adhesive agent in which conductive particles are dispersed and mixed is applied on the flat plate substrate, and then the stage is moved from the flat plate substrate along the flat plate substrate at a position having a height substantially equal to the diameter of the conductive particles. As a result, a single layer of conductive particles is formed on the flat substrate, and the conductive particles are fixed to the electrode terminals.

Therefore, in addition to the effects of the first and second aspects of the present invention, since the conductive particles are not dispersed on the flat substrate, the spraying step is eliminated and the electric circuit component is easily manufactured, and the manufacturing cost thereof is reduced. To do. In a fourth aspect of the invention, the conductive particles are arranged in a single layer and at a constant density at a portion corresponding to the electrode terminal, and the conductive particle is fixed to the electrode terminal. Therefore, the number of conductive particles on the electrode terminals is controlled, and the connection resistance value does not vary. As a result, an arbitrary connection resistance value is obtained, the adhesive is surely present around the conductive particles, and the conductive particles are sufficiently deformed at the time of connecting the electric terminals, so that the electric connection is surely performed.

In the invention according to claim 5, one surface side has a diameter substantially equal to that of the conductive particles, and the other surface side communicates with the one surface side.
A flat plate substrate provided with tapered through holes having a diameter smaller than the diameter of the conductive particles along the electrode terminals is prepared, and after the conductive particles are laminated and spread in a single layer or more on the flat plate substrate, By sucking the conductive particles from the other surface side of the flat plate substrate, the other conductive particles scattered with the conductive particles remaining in the through holes are removed.

Therefore, the number of conductive particles fixed to the electrode terminals can be easily controlled, and the conductive particles can be easily arranged in a single layer with a constant density. Therefore, the manufacturing cost of the electrode circuit component is reduced, and in the invention according to claim 6, a flat substrate having a recess having a depth shorter than the diameter of the conductive particles on one surface side is prepared, and the conductive particles are formed on the flat substrate. After being laminated and spread over more than one layer, other conductive particles that have been scattered are removed, leaving the conductive particles placed in the recesses. Therefore,
The same operation as in claim 5 is achieved.

In the invention described in claim 7, as the conductive particles, resin particles plated with metal are used.
Therefore, the electrode terminal is easily deformed, and the contact area with the electrode terminal is increased. Therefore, the electrode terminals are stably connected, and cracks do not occur when the electrode terminals are made of ITO. In the invention described in claim 8, an ultraviolet curable adhesive is used as the adhesive. Therefore, it is not necessary to heat the electric circuit board, and the conductive particles are connected to the electrode terminals in a short time. Further, since there is no heating step, the conductive particles do not move due to the difference in thermal expansion between the electric circuit board, the electrode terminals and the conductive particles, and a fine pitch can be accommodated.

In the ninth aspect of the invention, a conductive adhesive is used as the adhesive. Therefore, variations in the diameter of the conductive particles are easily absorbed, and more stable electrical connection is achieved.

[0022]

EXAMPLES The present invention will be described below based on examples.
1 to 4 show a first method of manufacturing an electric circuit component according to the present invention.
It is a figure which shows an Example, Claims 1, 2, 3, 7, 8, 9
It corresponds to. First, the configuration will be described. In FIGS. 1 and 2, 1 is a TAB constituting an electric circuit board, and 2 is an ITO.
The electrode terminals 3 are composed of an ultraviolet curable adhesive (for example,
3Bond 3034), 4 is a glass plate coated with the adhesive 3, and 5 is conductive particles made of Ni-plated resin balls (for example, Sekisui Fine Chemical Micropearl N).
i, particle size 39 μm, Ni plating thickness 1000Å). Also,
Reference numeral 11 is a glass plate as a flat substrate, and 12 is an insulating adhesive uniformly applied to the glass plate 11 within the radius of the conductive particles 5.

Next, a method of manufacturing the electric circuit component will be described. First, as shown in FIG. 1 (a), the electrode terminal 2 side is positioned downward, and as shown in FIG. 1 (b), the adhesive 3 is attached to a glass plate 4 uniformly applied, As shown in (c), the TAB 1 is separated from the electrode terminal 2. Therefore, the adhesive 3 is applied only to the electrode terminals 2 of the TAB 1.

Next, as shown in FIG. 2 (a), the adhesive 12 is applied onto the glass plate 11 having the radius of the conductive particles 5 or less.
As shown in (b), a plurality of conductive particles 5 are laminated in a single layer or more and dispersed. Then, the glass substrate 12 is turned over or blown with air to remove the conductive particles 5 other than the lowermost layer. As a result, single-layer conductive particles 5 remain on the glass substrate 11 as shown in FIG.

Then, as shown in FIG.
The TAB 1 having the adhesive 3 applied only to the conductive particles 5 on the glass plate 11 shown in FIG. 2 (c) is pressure-bonded to the adhesive, and the adhesive 3 is irradiated with ultraviolet rays to be cured. The TAB 1 is pulled away from the glass plate 11 as shown in e). As a result, the single-layer conductive particles 5 are fixed to the electrode terminals 2. As described above, in this embodiment, after the ultraviolet curable adhesive 12 is sprayed on the glass plate 11 to a thickness not larger than the radius of the conductive particles 5, the conductive particles 5 are laminated on the glass plate 11 in a single layer or more. After the conductive particles 5 other than the lowermost layer are removed by spraying and then inverting the glass plate 11 or blowing the air, the conductive particles 5 are fixed to the electrode terminal 2, so that the conductive particles 5 are electrically conductive on the electrode terminal 2. The particles 5 can be fixed in a single layer to optimize the point of electrical contact, and the electrode terminals 2 with a fine pitch can be dealt with. As a result, the reliability of the connection between the electrode terminals can be improved.

Further, the height of the electrode terminals 2 can be made uniform, and the pressure applied to the wiring pattern of the electrode terminals 2 can be made constant at each electrode terminal 2. Therefore, it is possible to prevent the occurrence of cracks in the electrode terminal 2.
In addition, since the electrically connected points can be optimized, a stable resistance value can be obtained. Further, in the present embodiment, since the conductive particles 5 are resin particles plated with metal, the electrode terminal 2 is used.
Can be easily deformed, and the contact area with the electrode terminal 2 can be increased. Therefore, the electrode terminals 2 can be stably connected, and cracks can be more reliably prevented from occurring.

Further, an ultraviolet curable adhesive 3 is used as an adhesive.
Since it is used, it is not necessary to heat the TAB substrate 1, and the conductive particles 5 can be connected to the electrode terminals 2 in a short time. Further, since the heating process can be eliminated, it is possible to prevent the conductive particles 5 from moving due to the difference in thermal expansion between the TAB 1, the electrode terminal 2 and the conductive particles 5, and it is possible to cope with a fine pitch. .

Although the ultraviolet curable adhesive 3 is used in this embodiment, the invention is not limited to this, and a conductive adhesive may be used. By doing so, the variation in the diameter of the conductive particles 5 can be easily absorbed, and more stable electrical connection can be performed. Further, in the present embodiment, the glass plate 11 is inverted or air blown to form the conductive particles 5 into a single layer, but other than this method, the method shown in FIG. 3 may be used.

That is, as shown in FIG. 3, the glass plate 11
The conductive particles 5 are laminated in a single layer or more on the top and then dispersed,
By moving the stage 21 from one end side to the other end side along the glass plate 11 at the position of the diameter height of the conductive particles 5 in the lowermost layer, the conductive particles 5 other than the lowermost layer are removed. There is. Even in this case, the conductive particles 5 can be formed into a single layer on the glass plate 11.

As another method, as shown in FIG. 4, an adhesive 30 in which conductive particles 5 are dispersed and mixed is applied onto a glass substrate 11, and then the stage 21 is attached to the glass plate 11.
Thus, by moving the conductive particles 5 along the glass plate 11 at a position approximately at the height of the diameter, the single-layer conductive particles 5 can be formed on the glass plate 11. In this way, in addition to the above effects, it is not necessary to spray the conductive particles 5 on the glass plate 11, so that the spraying step can be eliminated and the electric circuit board can be easily manufactured, and the manufacturing cost thereof can be reduced. Can be reduced.

5 to 9 are views showing a second embodiment of the method for manufacturing an electric circuit component according to the present invention.
It corresponds to. In this embodiment, the configuration of the flat substrate is different from that of the first embodiment, and the other points are the same as those of the first embodiment. Therefore, the same components are denoted by the same reference numerals and the description thereof will be omitted. In FIG. 5, reference numeral 31 denotes a plastic plate serving as a flat substrate, and the plastic plate 31 is made of polyimide and has a thickness of 25 μm. One side of the plastic plate 31 has a diameter substantially equal to that of the conductive particles 5,
The other side communicates with the one side, and a plurality of tapered through holes 31 a having a diameter smaller than the diameter of the conductive particles 5 are provided, and the through holes 31 a are provided along the electrode terminal 2.

FIG. 6 is a view showing an apparatus for forming the through hole 31a in the plastic plate 31. In FIG. 6, 41 is KrF
An excimer laser oscillator that oscillates excimer laser light,
42 is a laser beam having an energy density of 200 mJ / cm ² oscillated from the laser oscillator 41, 43 is a mask in which the surface hole diameter of the plastic plate 31 is set to 45 μm, 44 is the laser beam 4
It is a lens for focusing 2. Through this device, the through hole 31a shown in FIG. 5 is formed. According to this device, the hole diameter difference between the one surface side and the other surface side of the plastic plate 31 is 15 to 10 μm.
can be formed into m. As a result, the plastic plate 3
Through holes 31a are formed on 1 with a constant density.

Next, a method of forming an electric circuit component using the plastic plate 31 will be described with reference to FIG. Figure 7
As shown in (a), from the other surface side of the through hole 31a, the suction nozzle 45
Start aspiration by. Then this plastic plate
The conductive particles 5 are sprinkled and laminated on 31. At this time, the conductive particles 5 in the lowermost layer are buried in the through holes 31 by a predetermined amount and sucked by the suction nozzle 45.

Then, as shown in FIG. 7B, the through hole 31
At the height of the upper end of the conductive particles 5 buried in a, the stage 21
The lower end is set, and in this state, the stage 21 is moved from one end to the other end, and the conductive particles 5 other than the conductive particles 5 buried in the through hole 31a are removed from the plastic plate 31. Therefore, the conductive particles 5 are arranged on the plastic plate 31 as a single layer with a constant density. Note that this removal may be performed by reversing the plastic plate 31 or supplying an air blow.

Next, as shown in FIG. 7 (c), after the electrode terminals 2 of TAB1 in which only the electrode terminals 2 are previously coated with the adhesive 3 are pressure-bonded to the conductive particles 5, the adhesive 3 is exposed to ultraviolet rays. After irradiation and curing, as shown in FIG. 7 (d), TAB1
Is peeled off from the plastic plate 31. As a result, the single-layer conductive particles 5 can be fixed to the electrode terminal 2. As described above, in this embodiment, the conductive particles 5 are arranged in a single layer and at a constant density at the portion corresponding to the electrode terminal 2.
Is fixed to the electrode terminal 2, it is possible to control the number of the conductive particles 5 on the electrode terminal 2, and it is possible to prevent variation in the connection resistance value. As a result, an arbitrary connection resistance value can be obtained, and the adhesive 3 can be surely present around the conductive particles 5, so that the conductive particles 5 can be sufficiently deformed when the electric terminals 2 are connected to ensure the reliability. An electrical connection can be made to.

Further, a through hole 31a is provided in the plastic plate 31, one surface side of this through hole 31a is formed to have a diameter substantially equal to that of the conductive particles 5, and the other surface side is made to communicate with the one surface side so that the conductive particles 5 The conductive particles 5 are formed in a tapered shape having a diameter smaller than the diameter, the conductive particles 5 are laminated on the plastic plate 31 in a single layer or more, and then the conductive particles 5 are sucked from the other surface side of the plastic plate 31. Therefore, the number of conductive particles 5 fixed to the electrode terminal 2 can be easily controlled,
The conductive particles 5 can be easily arranged in a single layer with a constant density. Therefore, the manufacturing cost of the electrode circuit component can be significantly reduced.

In this embodiment, the tapered through hole 31
Although the conductive particles 5 are buried in a, the present invention is not limited to this and may be as shown in FIG. That is, FIG.
As shown in FIG. 9, a plastic substrate 51 as a flat substrate having a recess 51a having a depth shorter than the diameter of the conductive particles 5 on one surface side is prepared, and as shown in FIGS. 9 (a) to 9 (d), After the conductive particles 5 are laminated on the plastic substrate 51 in a single layer or more and dispersed, the other conductive particles 5 dispersed in the recess 51a are removed, and the other conductive particles 5 are removed from the recess 51a. The placed conductive particles 5 may be fixed to the electrode substrate 2.

[0038]

According to the first and second aspects of the present invention, the conductive particles can be fixed in a single layer on the electrode terminals so that the point of electrical contact can be optimized, and the fine pitch can be achieved. It is possible to deal with various electrode terminals. As a result, the reliability of the connection between the electrode terminals can be improved. Also,
The height of the electrode terminals can be made uniform, and the pressure applied to the wiring pattern of the electrode terminals can be made constant at each electrode terminal. Therefore, it is possible to prevent the occurrence of cracks in the electrode terminals. In addition, since the electrically connected points can be optimized, a stable resistance value can be obtained.

According to the invention described in claim 3, claim 1,
In addition to the effect of the invention described in 2, it is not necessary to spray the conductive particles on the flat substrate, so that the spraying step can be eliminated to easily manufacture the electric circuit board, and the manufacturing cost can be reduced. it can. According to the invention of claim 4,
It is possible to control the number of conductive particles on the electrode terminals and prevent the occurrence of variations in connection resistance values. As a result, an arbitrary connection resistance value can be obtained, and the adhesive can be surely present around the conductive particles, so that the conductive particles can be sufficiently deformed when the electric terminals are connected, and the electric connection can be surely made. It can be performed.

According to the fifth and sixth aspects of the present invention, the number of conductive particles fixed to the electrode terminals can be easily controlled, and the conductive particles can be easily arranged in a single layer with a constant density. be able to. As a result, the manufacturing cost of the electrode circuit component can be reduced. According to the invention of claim 7, the electrode terminal can be easily deformed, and the contact area with the electrode terminal can be increased. Therefore, it is possible to stably connect the electrode terminals, and it is possible to prevent cracks from occurring when the electrode terminals are made of ITO.

According to the eighth aspect of the present invention, it is not necessary to heat the electric circuit board, and the conductive particles can be connected to the electrode terminals in a short time. Further, since the heating step can be eliminated, it is possible to prevent the conductive particles from moving due to the difference in thermal expansion between the electric circuit board, the electrode terminals and the conductive particles, and it is possible to cope with a fine pitch.

According to the invention described in claim 9, it is possible to easily absorb the variation in the diameter of the conductive particles, and to make more stable electrical connection.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of a method of manufacturing an electric circuit component according to the present invention, and a diagram illustrating the manufacturing process thereof.

FIG. 2 is a diagram showing a step of disposing the conductive particles of the first embodiment in a single layer on a flat substrate.

FIG. 3 is a diagram showing a process of another aspect for disposing the conductive particles of the first embodiment in a single layer on a flat substrate.

FIG. 4 is a diagram showing a process of another embodiment for disposing the conductive particles of the first example in a single layer on a flat substrate.

5A and 5B are views showing a second embodiment of a method for manufacturing an electric circuit component according to the present invention, in which FIG. 5A is a perspective view of a flat substrate for achieving the manufacturing method, and FIG. Is.

FIG. 6 is a schematic view of an apparatus for forming a through hole in a flat board according to a second embodiment.

FIG. 7 is a diagram showing a manufacturing process of the second embodiment.

8A is a perspective view showing another aspect of the flat substrate of the second embodiment, and FIG. 8B is a sectional view thereof.

9 is a diagram showing a manufacturing process of an electric circuit board using the flat board of FIG.

[Explanation of symbols]

 1 TAB (Electrical Circuit Board) 2 Electrode Terminal 3 UV Curing Adhesive (Adhesive) 5 Conductive Particles 11 Glass Plate (Plate Substrate) 12, 30 Adhesive 21 Stage 31, 51 Plastic Plate (Plate Substrate) 31a Through Hole 51a Recess

Claims (9)

[Claims] 1. A method of manufacturing an electric circuit component in which conductive particles are arranged in a single layer on an electrode terminal formed on an electric circuit board, wherein an insulating adhesive is applied to a flat board to a thickness not larger than a radius of the conductive particles. Then, the conductive particles are laminated in a single layer or more on the flat plate substrate and then sprayed, and then the flat plate substrate is inverted or air blown to remove the conductive particles other than the lowermost layer, and then the electrode is prepared in advance. An electrical circuit characterized by fixing an electric circuit board with adhesive applied only to the terminals to the conductive particles and then curing the adhesive under prescribed curing conditions to fix the single-layer conductive particles to the electrode terminals. Method of manufacturing circuit parts. 2. A method of manufacturing an electric circuit component in which conductive particles are arranged in a single layer on electrode terminals formed on an electric circuit board, wherein the conductive particles are laminated in a single layer or more on a flat board and dispersed. Then, the conductive particles other than the lowermost layer are removed by moving the stage along the flat substrate at a position approximately at the height of the diameter of the conductive particles in the lowermost layer, and then only the electrode terminals are previously coated with the adhesive. After crimping the attached electric circuit board to the conductive particles, cure the adhesive under predetermined curing conditions,
A method of manufacturing an electric circuit component, comprising fixing a single layer of conductive particles to an electrode terminal. 3. A method of manufacturing an electric circuit component in which conductive particles are arranged in a single layer on an electrode terminal formed on an electric circuit board, wherein an adhesive containing conductive particles dispersed and mixed is applied onto a flat board. Then, the stage is moved along the flat substrate from the flat substrate at a position approximately equal to the diameter of the conductive particles to form single-layer conductive particles on the flat substrate. A method for manufacturing an electric circuit component, which comprises press-bonding the particles and then curing the adhesive under predetermined curing conditions to fix the single-layer conductive particles to the electrode terminals. 4. A method of manufacturing an electric circuit component in which conductive particles are arranged in a single layer on an electrode terminal formed on an electric circuit board, wherein the conductive particle is a single layer and is uniform in a portion corresponding to the electrode terminal. After that, the electric circuit board in which the adhesive is applied only to the electrode terminals in advance is pressure-bonded to the conductive particles, and then the adhesive is cured under predetermined curing conditions to form a single-layer conductive particle. A method for manufacturing an electric circuit component, which comprises fixing to an electrode terminal. 5. One surface has a diameter substantially equal to that of the conductive particles,
Prepare a flat plate substrate in which the other side communicates with the one face side, and a tapered through hole having a diameter smaller than the diameter of the conductive particles is provided along the electrode terminal, and the flat plate substrate has a single layer or more of conductive particles. After being laminated and sprayed on, the conductive particles are sucked from the other surface side of the flat plate substrate to remove the other conductive particles scattered while leaving the conductive particles in the through holes. The method for manufacturing an electric circuit component according to claim 4. 6. A flat plate substrate having a recess having a depth shorter than the diameter of the conductive particles on one surface side is prepared, and the conductive particles are laminated in a single layer or more on the flat plate substrate and dispersed, and then placed in the recess. 5. The method for manufacturing an electric circuit component according to claim 4, wherein the other conductive particles that have been dispersed are removed while leaving the other conductive particles. 7. The conductive particles are resin particles plated with a metal, and are used as the conductive particles.
To 6, a method for manufacturing an electric circuit component. 8. The method for manufacturing an electric circuit component according to claim 1, wherein an ultraviolet curable adhesive is used as the adhesive. 9. The method for manufacturing an electric circuit component according to claim 1, wherein a conductive adhesive is used as the adhesive.