JPH069476Y2 - Chip-shaped electronic component - Google Patents

Description

[Detailed description of the device] [Industrial applications]

The present invention relates to a chip-shaped electronic component in which cap terminals are fitted to both ends of a ceramic body.

[Prior art]

Conventional electronic components of this type are shown in FIGS. 5 and 6. That is, the cylindrical or rod-shaped ceramic body 1
A metal film 11 is formed on a part of a predetermined surface of the metal element, and metal cap-shaped terminals 2, 2 are formed on both end sides of the ceramic body 1.
Are fitted and external electrodes for connecting the substrate are formed.
Further, the surface of the ceramic body 1 exposed between the cap-shaped terminals 2 and 2 is covered with a resin having an insulating property and a moisture-proof property, so that a resin sheath 3 is formed. This will be described more specifically. In FIG. 6, metal films 11, 11 serving as counter electrodes for capacitors are formed on the inner and outer peripheral surfaces of the ceramic body 1 made of a cylindrical dielectric, and A part of the conductor film 11 is led out to one end of the outer periphery of the ceramic body 1. Then, the cap-shaped terminals 2 are fitted to both ends of the ceramic element body 1, and the ceramic element body 1 exposed from between the cap-shaped terminals 2 is further exposed.
A resin such as an epoxy resin is applied and solidified so as to cover the outer peripheral side of the resin outer casing 3 to form the resin sheath 3. As a result, the ceramic capacitor as shown in FIG. 6 is formed. Here, as shown in FIG. 7, the cap-shaped terminal is
It has a cylindrical cap shape in which one end face is open and the other end face is closed.

[Problems that the device is trying to solve]

However, when the resin 3 is applied to the outer peripheral side of the ceramic body 1 exposed from between the cap-shaped terminals 2 in the above-described manufacturing process of the chip-shaped electronic component, as shown in FIG. It may flow toward the cap-shaped terminal 2 and adhere to the outer peripheral surface 21 and the end surface 22 of the cap-shaped terminal 2. As a result, when soldering to the electrode lands on the substrate, there is a problem in that the adhesion of the solder to the cap-shaped terminals 2 and 2 becomes uncertain and causes a connection failure. SUMMARY OF THE INVENTION It is an object of the present invention to provide a chip-shaped electronic component which can surely be soldered to an electrode land on a substrate in order to solve the above conventional problems.

[Technical means for solving the problem]

The present invention provides the following means for solving the above problems. That is, the ceramic film 1 having either the metal film 11 or the metal oxide film 12 formed on a part of the surface thereof, and the ceramic film 1 fitted on both end faces thereof,
Alternatively, a pair of cap-shaped terminals 2 and 2 connected to the metal oxide film 12, and a resin exterior 3 coated so as to cover the peripheral surface of the ceramic body 1 exposed between the cap-shaped terminals 2 and 2. A chip-shaped electronic component consisting of
The cap-shaped terminals 2 and 2 are chip-shaped electronic components characterized in that they are integrally molded products in which the outer diameter of the end face side portion 23 is stepwise thicker than the other side portion 22.

[Action]

In the chip-shaped electronic component according to the present invention, even if the resin applied between the cap-shaped terminals 2 and 2 at both ends flows toward the cap-shaped terminals 2 and 2, the stepped portion 21 on the outer peripheral surface thereof causes It is prevented from flowing first. As a result, it becomes difficult for the resin to adhere to the portion 23 having a large diameter of the cap-shaped terminals 2 and 2, so that a part of the cap-shaped terminals 2 and 2 can be reliably exposed.

【Example】

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment in which the present invention is applied to a cylindrical ceramic capacitor. In FIG. 1, reference numeral 1 denotes a cylindrical dielectric ceramic element body, and one metal film 11 forming a counter electrode of a capacitor is formed on the inner and outer peripheral surfaces of the ceramic element body 1. . Further, the other metal film 11 is formed on the inner peripheral surface of the ceramic body 1, and a part thereof is led out to one edge of the outer peripheral surface of the ceramic body 1. Of course, the metal films 11 and 11 are separated from each other and are formed so as not to cause a short circuit. Cap-shaped terminals 2 are respectively fitted on both ends of the ceramic body 1 as electrodes for connecting to the substrate.
Furthermore, a resin having an insulating property and a moisture proof property is coated so as to cover the peripheral surface of the ceramic body 1 exposed between the cap-shaped terminals 2 and 2, and a resin exterior 3 is formed. Here, as is apparent from FIG. 2, the cap-shaped terminal 2 is formed of a cylindrical body with one end face closed, and the open end face portion 22 and the closed end face portion 23 have different outer diameters. And has a step portion 21 between them. It goes without saying that the inner diameter, outer diameter, length, etc. of the cap-shaped terminal 2 are appropriately determined according to the dimensions of the ceramic body 1. Further, as shown in FIG. 3, the projection 24 may be formed in a hoop shape so as to be convex toward the inner peripheral surface side of the cap-shaped terminal 2. As a result, the elastic force of the cap-shaped terminals 2, 2 can be effectively utilized, and the cap-shaped terminals 2, 2 can be reliably fitted to the end portion of the ceramic body 1. In the above-described manufacturing process of the ceramic capacitor, after the cap terminals 2 are fitted on both end sides of the ceramic body 1, a resin is applied to the ceramic body 1 between the cap terminals 2 to form a resin exterior 3. In the process, the resin in a molten state is prevented from passing over the stepped portions 21 of the cap terminals 2 and 2 and adhering to the thick portion 23 side. Therefore, make sure that the cap-shaped terminals 2 and 2 are partly exposed,
When mounting the chip-shaped electronic component on the circuit board, reliable soldering can be performed. FIG. 4 shows an embodiment in which the present invention is applied to a chip resistor. That is, a rod-shaped insulating ceramic body is used as the ceramic body 1 in this case, and a resistance film made of the metal oxide film 12 is formed on the surface thereof. Then, the cap terminals 2 are fitted to both ends of the ceramic body 1 to form a chip-shaped resistor. Also in this case, the diameters of both ends of the cap-shaped terminals 2, 2 are stepwise, and the outer diameter of the portion 23 close to the closed end face is larger than the outer diameter of the other portion 22, and in between It is a step portion 21.

[Effect of device]

As described above, according to the present invention, since the cap-shaped terminals 2 and 2 at both ends can be surely exposed, it is possible to prevent solder failure when the chip-shaped electronic component is mounted on the circuit board. It is possible to obtain a chip-shaped electronic component that is reliably soldered.

[Brief description of drawings]

FIG. 1 is a vertical sectional side view of a chip-shaped electronic component showing an embodiment of the present invention, FIG. 2 is a perspective view showing a cap-shaped terminal used in the same embodiment, and FIG. 3 is another embodiment. FIG. 4 is a vertical sectional side view of the chip-shaped electronic component shown in FIG. 4, FIG. 4 is a vertical sectional side view of the chip-shaped electronic component showing another embodiment, and FIG. Is a vertical sectional side view of the chip-shaped electronic component, FIG. 7 is a perspective view showing a cap-shaped terminal used in the conventional example, and FIG.
It is a principal part side view which shows the edge part of the conventional chip-shaped electronic component. 1 ... Ceramic body, 2 ... Cap terminal, 21 ...
... stepped portion of cap-shaped terminal, 22 ... thin portion of cap-shaped terminal, 23 ... thick portion of cap-shaped terminal,
3 ... Resin, 11 ... Metal film, 12 ... Metal oxide film

Claims (1)

[Scope of utility model registration request] 1. A ceramic body 1 having a metal film 11 or a metal oxide film 12 formed on a part of the surface thereof, and the metal film 11 fitted on both end faces of the ceramic body 1. Alternatively, a pair of cap-shaped terminals 2 and 2 connected to the metal oxide film 12 and a resin sheath 3 coated to cover the peripheral surface of the ceramic body 1 exposed between the cap-shaped terminals 2 and 2.
In the chip-shaped electronic component, the cap-shaped terminals 2 and 2 are integrally molded products in which the outer diameter of the end face side portion 23 is stepwise thicker than the other side portion 22. Chip-shaped electronic parts to be.