JPH069098U - Charging electrostatic discharge device for carrier - Google Patents

Abstract

(57) [Abstract] [Purpose] Providing a safe and highly reliable electrostatic charging / discharging device for a transfer device that reliably and safely discharges static electricity charged during operation of the transfer device to the equipment to be transferred before transfer work. To do. [Constitution] In a transfer system for transferring parts by a transfer device 1 which is supported and travels from the ground in a non-conductive state
Before the transfer operation is performed after the transfer device 1 has stopped at a predetermined station, the transfer device 1 has a predetermined resistance value for equalizing the electric potential of the static electricity charged on the transfer device 1 and the transfer target equipment, for example. Contact plate 7, contactor 8 and conductors 7a, 8
The conductive contact mechanism consisting of a is installed in the carrier device 1 and / or the equipment 2 to be transferred.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an auxiliary mechanism provided in a transport system for transporting articles by a magnetic levitation transport vehicle, an unmanned transport vehicle, a mobile robot, a linear transport device, etc., and particularly, between the transport system of this transport system and ground equipment. When transferring goods, the static electricity charged while the carrier is running is discharged safely and securely, and the influence of the charged static electricity such as the electrical damage to semiconductor parts to be transferred is prevented. And highly reliable carrier electrostatic charging and discharging device.

[0002]

[Prior art]

 In a magnetically levitated vehicle, a vehicle that carries articles traveling along a predetermined traveling path levitates from the ground via air, which is an insulator, and travels, such as an unmanned vehicle, a mobile robot, or a linear vehicle. In order to absorb the vibration generated between the road surface and the ground surface, tires with elasticity are often used. Such tires are generally made of an electrically insulating material such as rubber or resin. A carrier device using a tire as described above may be charged with static electricity while traveling. In addition, even in a transfer device such as a magnetically levitated vehicle that is supported in a state in which it is not in contact with the ground, static electricity is generated due to friction between the transfer object or the transfer device and the air, and it is charged. When transferring a transferred product from a transfer device to another device, or from a device installed on the ground to a transfer device, the device to be charged and transferred as described above and the device to be transferred If the electric potential between the transferred object and the transferred object is different, the transferred object is discharged at the moment of contact with the device to be transferred, and the instantaneously generated discharge current or potential change destroys or controls the transferred object such as semiconductor parts. The device sometimes malfunctioned. For this reason, measures have been taken to prevent electrification by hanging a conductive belt or the like from the carrier device to the floor, or by mounting a discharge antenna on the carrier device. Devices for preventing such electrification include those disclosed in JP-A-62-125903, JP-A-1-88499, and JP-A-1-174281. Japanese Unexamined Patent Publication No. 62-125903 discloses a vehicle in which a vehicle having wheels made of an insulating material travels along a traveling path in which a conductive member is exposed at a part of a non-conductive traveling path. It is characterized by a metal chain hanging from the carrier and a contact piece made of a conductive elastic body that comes into contact with the running surface attached to the tip of this chain. Further, the one described in Japanese Utility Model Laid-Open No. 1-88499 has one end electrically connected to the bottom of a mobile electronic equipment box in which a caster for movement is attached to the bottom of the electronic equipment box, and the other end. Is equipped with a string-shaped conductor that is always in contact with the floor. Further, the one described in Japanese Utility Model Laid-Open No. 1-174281 is characterized in that a discharge antenna is provided in a vehicle body on which a battery is mounted.

[0003]

[Problems to be solved by the device]

 By the way, in the transfer device provided with the means for preventing electrification as described above, for example, according to the method of hanging the conductive belt or the string, the state of the floor, that is, whether the material of the floor is metal or the non-conductive state is used. The effect varies depending on whether the body is coated with a metal, a conductive resin, or whether such a metal or conductor is grounded. In addition, the effect varies depending on the contact state with the conductive belt connected to the conveyor and the floor to be brought into contact with the cord, that is, the degree of dirt on the floor and the manner of contact. Also, if a discharge antenna is provided, it is not possible to completely discharge, so a constant potential will remain in the carrier. On the other hand, in recent semiconductor manufacturing equipment, semiconductors with low withstand voltage have been manufactured, and with regard to the transfer of semiconductor wafers, the potential difference between the transfer equipment and the equipment to be transferred such as ground equipment is reduced as much as possible. Is required. In addition, since the control device that drives and controls the carrier device is becoming more and more composed of semiconductors that are operated by signals at minute levels, noise sources such as discharge pulse current, which causes malfunctions, are reduced as much as possible. Required to do so. In order to meet such demands, the conventional antistatic means described above are incomplete, and an effective and complete discharge means is desired. The present invention solves the above-mentioned conventional problems, and discharges static electricity charged during the operation of the transfer device to the equipment to be transferred reliably and safely before the transfer work. It is a safe and reliable electrostatic charge of the transfer device. The purpose (problem) is to provide a discharge device.

[0004]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, in the electrostatic charging / discharging device of the transfer device according to the present invention, in the transfer system in which parts are transferred by the transfer device which is supported and travels from the ground in a non-conductive state, the transfer device is a predetermined one. After stopping at the station and before carrying out the transfer operation, a conductive contact mechanism having a predetermined resistance value for making the electric potential of the static electricity charged in the transfer device and the potential of the transfer target equipment equipotential is used. / And equipped to the transfer target equipment. The conductive contact mechanism described above may be configured by equipping the transfer device or the transfer target equipment with a contact plate, and equipping the transfer target equipment or the transfer device with an antistatic brush. The conductive contact mechanism described above may be configured by equipping the transfer device or the transfer target equipment with a contact plate, and by mounting the transfer target equipment or the transfer device with a conductive drive mechanism. The conductive contact mechanism described above may be configured by connecting the equipment to be transferred to the relay conductor attached to the floor surface and equipping the relay conductor with the conductive drive mechanism at the position above the relay conductor when the transport device is stopped. good. Further, the conductive contact mechanism described above may be configured by equipping the transfer mechanism of the transfer target equipment with a contact rod at a contactable position.

[0005]

[Action]

 As described above, the present invention is equipped with the conductive contact mechanism having a predetermined resistance value. Therefore, before the transfer work, the conductive contact between the predetermined transfer device and the transfer target device is performed. By contacting the mechanism, the static electricity charged by the transfer device can be discharged to the transfer target device in a stable and reliable manner, so that the transfer device and the transfer target device become equipotential, and the transfer work is performed between the equipotential devices. To be done. Therefore, the transferred semiconductor components are not electrically damaged, and the control device does not malfunction.

[0006]

【Example】

 The details of the charging electrostatic discharge device of the carrier device according to the present invention in the carrier system will be described in detail with reference to the drawings. Embodiment 1 FIG. 1 shows an example in which a semiconductor wafer-cassette 3 is transferred between a mobile robot 1 which is an example of a transfer device and a semiconductor manufacturing apparatus 2 which is a transfer target device. The mobile robot 1 is a transfer mechanism that travels along a predetermined path on the floor surface 5 by the drive wheels 4 according to a command from a control device (not shown), stops at a predetermined station, for example, beside the semiconductor manufacturing device 2. The semiconductor wafer cassette 3 is transferred by a robot arm 6 having a predetermined number of arms 6a, a joint 6b for rotatably connecting the two arms 6a, a grip 6c and the like. . A conductive contact plate 7 is connected to the robot arm 6 at a lower side surface of the mobile robot 1 by an electric wire 7a having a predetermined resistance value, and the tip grip 6c of the robot arm 6 and the contact plate 7 are electrically connected. Are electrically connected. In the semiconductor manufacturing apparatus 2, a contactor 8 such as a destaticizing brush, which will be described in detail later, is mounted at a position facing the contact plate 7 located when the mobile robot 1 is stopped. The contactor 8 is a semiconductor wafer cassette 3. It is connected by a conductive wire 8 a having a predetermined resistance value so as to be electrically connected to. An example of the static elimination brush 8 will be described with reference to FIG. FIG. 2 shows an outline of the static elimination brush 8. The static elimination brush 8 is provided with a conductive brush 8c having a large number of conductive needles provided with elasticity on the side surface of the flat portion 8b. From the other surface, an electric conductor 8a having a predetermined resistance value electrically connected to the conductive brush 8c is led out, and the conductor 8a is electrically connected to the semiconductor wafer cassette 3 as described above. It is formed to be done. That is, in this embodiment, the conductive contact mechanism is composed of the contact plate 7, the contactor 8 and the conductive wires 7a, 8a. In the above-mentioned configuration, when the mobile robot 1 charged with electric charges moves to a station provided on the side surface of the predetermined semiconductor manufacturing apparatus 2 and stops there, the conductive brush 8c of the static elimination brush 8 comes into contact with the contact plate 7. . Therefore, the above-described structure functions as a conductive contact mechanism, and the grip 6c of the mobile robot 1 and the semiconductor wafer cassette 3 have the same potential without electric shock. Therefore, even if the grip 6c of the mobile robot 1 comes into contact with the semiconductor wafer cassette 3 for transferring it, no electrical shock occurs. Therefore, the semiconductor components (not shown) in the semiconductor wafer / cassette 3 are not destroyed and no noise is generated. Contrary to the above-described configuration, it is natural that the mobile robot 1 may be provided with a contact such as a static eliminating brush, and the semiconductor manufacturing apparatus 2 may be provided with a contact plate.

Embodiment 2 FIG. 3 shows Embodiment 2 using another conductive contact mechanism for transferring the semiconductor wafer-cassette 3 between the mobile robot 1 and the semiconductor manufacturing apparatus 2. The same element devices as those of the embodiment described with reference to FIG. 1 are designated by the same reference numerals. In FIG. 3, a conductive contact plate 17 is attached to the lower side surface of the semiconductor manufacturing apparatus 2, and the contact plate 17 is a conductive wire 17a having a predetermined resistance value so as to be electrically connected to the semiconductor wafer cassette 3. It is connected. The mobile robot 1 is equipped with a piston 18 which is a conductive drive mechanism at a position facing a contact plate 17 located when the mobile robot 1 stops at a station beside the semiconductor manufacturing apparatus 2. The piston 18 is supported by a piston cylinder 18b and is provided with a conductive piston rod 18c which is movable back and forth by a pneumatic force or a driving force of a linear motor or the like. The piston rod 18c is electrically connected to a grip 6c of the robot arm 6. As described above, they are connected by the conductive wire 18a having a predetermined resistance value. In the above-mentioned configuration, when the mobile robot 1 charged with electric charges moves to a predetermined station on the side of the semiconductor manufacturing apparatus 2 and stops while traveling, the piston rod 18c projects and the tip thereof due to the operating condition preset in the controller (not shown). Contacts the contact plate 17. Therefore, in the second embodiment, the contact plate 17, the piston 18, and the conductive wires 17a, 18a described above function as a conductive contact mechanism, and the grip 6c of the mobile robot 1 and the semiconductor wafer cassette 3 are the same without any electrical shock. It becomes a potential. Therefore, even if the grip 6c of the mobile robot 1 comes into contact with the semiconductor wafer cassette 3 for transferring it, no electrical shock occurs. Therefore, the semiconductor components (not shown) in the semiconductor wafer / cassette 3 are not destroyed and no noise is generated. The above-mentioned piston rod 18c itself is composed of a non-conductive object, the tip end portion of the piston rod 18c is composed of a conductive object, and this tip portion is electrically connected to the grip 6c of the robot arm 6 by a conductive wire 18a. You may do it. Contrary to the above configuration, the contact plate electrically connected to the grip 6c of the robot arm 6 of the mobile robot 1 and at least the tip of the semiconductor wafer / cassette 3 mounted on the semiconductor manufacturing apparatus 2 are provided. It goes without saying that a piston whose parts are electrically connected may be mounted.

Embodiment 3 A mobile robot using a similar conductive contact mechanism to the example of transferring the semiconductor wafer / cassette 3 between the mobile robot 1 and the semiconductor manufacturing apparatus 2 shown in FIG. Example 3 in which a semiconductor wafer / cassette 3 is transferred between a mobile station 1 (hereinafter referred to as a first mobile robot) and another mobile robot or a carrier (hereinafter referred to as a second mobile robot) 10 4 will be described. The same element devices as those of the embodiment described with reference to FIG. 3 are designated by the same reference numerals. In FIG. 4, the second mobile robot 10 is driven by a drive wheel 11 according to a command from a controller (not shown) to move along a predetermined path on the floor surface 5, for example, by carrying a semiconductor wafer / cassette 3 and running. Stop at the station. A conductive contact plate 17 is mounted on the lower side surface of the second mobile robot 10, and the contact plate 17 is connected by a conductive wire 17a having a predetermined resistance value so as to be electrically connected to the semiconductor wafer cassette 3. Has been done. That is, in the third embodiment, the conductive contact mechanism is composed of the contact plate 17, the piston 18, and the conductive wires 17a, 18a. A piston 18 is attached to the first mobile robot 1 at a position facing the contact plate 17 when the first mobile robot 1 stops at a station beside the second mobile robot 2. The first mobile robot 1 is similar to the second embodiment shown in FIG. However, the length and the like of the piston rod 18c are not necessarily the same, and are appropriately set according to the mutual relation position when the first mobile robot 1 and the second mobile robot 10 stop. In the above-mentioned configuration, when the first mobile robot 1 and the second mobile robot 10 charged with electric charges during traveling move to the predetermined opposite position stations and stop, the operating conditions set in advance in the control device (not shown) The piston rod 18c projects and the tip thereof contacts the contact plate 17. Therefore, the grip 6c of the first mobile robot 1 and the semiconductor wafer cassette 3 have the same potential without electrical shock. Therefore, even if the grip 6c of the first mobile robot 1 comes into contact with the semiconductor wafer cassette 3 to transfer it, no electric shock is generated. Therefore, the semiconductor parts in the semiconductor wafer-cassette 3 (not shown) are not destroyed and no noise is generated. The above-mentioned piston rod 18c itself is composed of a non-conductive object, the tip end portion of the piston rod 18c is composed of a conductive object, and this tip portion is electrically connected to the grip 6c of the robot arm 6 by a conductive wire 18a. You may do it. Contrary to the above configuration, a contact plate electrically connected to the grip 6c of the robot arm 6 of the first mobile robot 1 and a semiconductor wafer cassette to be loaded on the second mobile robot 10. It goes without saying that a piston having at least its tip end electrically connected to 3 may be mounted.

Example 4 Example 4 using another conductive contact mechanism for transferring the semiconductor wafer cassette 3 between the mobile robot 1 and the semiconductor manufacturing apparatus 2 described with reference to FIGS. Will be described with reference to FIG. The same element devices as those of the embodiment described with reference to FIGS. 1 and 3 are designated by the same reference numerals. In FIG. 5, a conductive connecting wire 9 is attached to the lower surface of the semiconductor manufacturing apparatus 2, and the tip of the connecting wire 9 is connected to a relay conductor 5a formed of a metal plate having a predetermined shape and affixed to the floor surface. There is. The connecting wire 9 is connected to the semiconductor wafer cassette 3 by a conductive wire 9a having a predetermined resistance value so as to be electrically connected. A piston 18, which is a conductive drive mechanism, is mounted downward on the mobile robot 1 so as to be located above the relay conductor 5a when the mobile robot 1 stops at a station beside the semiconductor manufacturing apparatus 2. The piston 18 is provided with a conductive piston rod 18c which is supported by a piston cylinder 18b and is movable up and down by a driving force such as atmospheric pressure or by a combination with a spring as in the second embodiment. 18c is connected to the grip 6c of the robot arm 6 by a conductive wire 18a having a predetermined resistance value so as to be electrically connected. That is, in the fourth embodiment, the conductive contact mechanism is composed of the relay conductor 5a, the piston 18, the connecting wire 9, and the conductive wires 9a, 18a. In the above-mentioned configuration, when the mobile robot 1 charged with electric charges moves to a predetermined station on the side of the semiconductor manufacturing apparatus 2 and stops while traveling, the piston rod 18c projects and the tip thereof due to the operating condition preset in the controller (not shown). Contacts the relay conductor 5a. Therefore, the above-described structure functions as a conductive contact mechanism, and the grip 6c of the moving robot 1 and the semiconductor wafer cassette 3 have the same potential without electrical shock. Therefore, even if the grip 6c of the mobile robot 1 comes into contact with the semiconductor wafer cassette 3 for transferring it, no electrical shock occurs. Therefore, the semiconductor components (not shown) in the semiconductor wafer / cassette 3 are not destroyed and no noise is generated. In the piston 18 described above, the piston rod 18c itself is made of a non-conductive material, and the tip end portion of the piston rod 18c is made of a conductive material, and the tip end portion is made into a conductive wire, as in the second and third embodiments described above. 18a may be electrically connected to the grip 6c of the robot arm 6.

Embodiment 5 An embodiment using another conductive contact mechanism for transferring the semiconductor wafer / cassette 3 between the mobile robot 1 and the semiconductor manufacturing apparatus 2 described with reference to FIGS. 1, 3 and 5. 5 will be described with reference to FIG. The same element devices as those of the embodiment described with reference to FIGS. 1, 3 and 5 are designated by the same reference numerals. In FIG. 6, a contact rod 12 whose details will be described later is provided at a predetermined position above the semiconductor manufacturing apparatus 2, and the contact rod 12 is connected to the semiconductor wafer cassette 3 by a conductive wire 12a so as to be electrically connected. The mobile robot 1 is standard equipment, and is not equipped with special element parts for discharge. FIG. 7 shows an example of the structure of the contact rod 12. In FIG. 7, the contact rod 12 is provided with a spherical high resistance body 12c having a predetermined resistance coefficient at the tip of a conductor rod 12b having a predetermined elastic modulus. The conductor rod 12b is electrically connected to the semiconductor wafer cassette 3 by the conductor wire 12a as described above. That is, the fifth embodiment is an example in which the conductive contact mechanism is composed of the contact rod 12 and the conductive wire 12a. In the above-mentioned configuration, when the mobile robot 1 charged with electric charges moves to a predetermined station on the side of the semiconductor manufacturing apparatus 2 and stops during traveling, the robot arm 6 of the mobile robot 1 moves according to preset operating conditions of a controller (not shown). The grip 6c attached to the tip is brought into contact with the tip high resistance body 12c of the contact rod 12 provided in the semiconductor manufacturing apparatus 2 for a predetermined time. Therefore, the above-described structure functions as a conductive contact mechanism, and the grip 6c of the mobile robot 1 and the semiconductor wafer cassette 3 have the same potential without electric shock. Therefore, even if the grip 6c of the mobile robot 1 comes into contact with the semiconductor wafer cassette 3 for transferring it, no electrical shock occurs. Therefore, the semiconductor components (not shown) in the semiconductor wafer / cassette 3 are not destroyed and no noise is generated.

Embodiment 6 Using the same conductive contact mechanism as the example of transferring the semiconductor wafer cassette 3 between the mobile robot 1 and the semiconductor manufacturing apparatus 2 shown in FIG. 6 and FIG. Similar to the third embodiment described above, another embodiment 6 in which the semiconductor wafer cassette 3 is transferred between the first mobile robot 1 and the second mobile robot 10 will be described with reference to FIG. . That is, in the sixth embodiment, the conductive contact mechanism is composed of the contact rod 12 provided on the second robot 10 and the conductive wire 12a for connecting the cassette 3. The same element devices as those of the embodiment described with reference to FIGS. 4, 6 and 7 are designated by the same reference numerals. In the configuration shown in FIG. 8, when the first mobile robot 1 and the second mobile robot 10, which have been charged with electric charges during traveling, respectively move to a predetermined opposite position station and stop, a controller (not shown) is preset. The grip 6c attached to the tip of the robot arm 6 of the first mobile robot 1 is brought into contact with the high resistance body 12c of the tip of the contact rod 12 provided on the second mobile robot 10 for a predetermined time according to the operating conditions described above. Therefore, the grip 6c of the first mobile robot 1 and the semiconductor wafer cassette 3 have the same electric potential without electric shock. Therefore, even if the grip 6c of the first mobile robot 1 comes into contact with the semiconductor wafer cassette 3 to transfer it, no electric shock is generated. Therefore, the semiconductor parts in the semiconductor wafer-cassette 3 (not shown) are not destroyed and no noise is generated.

The above description shows the embodiments of the present invention, and the technical concept of the present invention can be utilized to apply and modify various transport systems. That is, the equipment to be transferred may be a semiconductor manufacturing equipment that is fixed to the ground as described above, or a movable equipment that moves like a mobile robot like a transfer equipment. ， Also, it may be just a shelf. Also, for example, an example in which an articulated robot arm is used as a work machine of a mobile robot as the transfer mechanism has been described, but it can be applied to any other transfer work machine or moving mechanism. Is natural. In addition, although the conductors 7a, 8a, 9a, 17a, and 18a shown in each of the embodiments are described as having a predetermined resistance value, the conductor wires 7a, 8a, 9a, 17a, and 18a have a certain resistance value. A conductive wire having an appropriate resistance value may be used so as not to cause a current change, and a normal conductive wire having a small resistance value may be used such as the conductive wire 12a corresponding to other constitutional conditions. However, a resistor having a predetermined value may be connected to the ordinary conductor. If it is not necessary, it is of course possible to use copper wire with a small resistance value. In addition, depending on the moving mechanism such as a mobile robot or the structure and electrical characteristics of the ground equipment such as semiconductor manufacturing equipment, the contact plates 7 and 17, the static elimination brush 8, the connecting wire 9, the piston 18, the contact rod. 12 may exclude the lead wire connected respectively. Although the piston 18 is illustrated as the conductive drive mechanism, the conductive drive mechanism may be replaced with a movable mechanism of an arbitrary structure driven by a motor or the like as long as the structure can contact the contact plates facing each other by a predetermined signal. Of course it is also good. In this case as well, as with the piston, the tip that contacts the contact plate should be conductive and connected to a predetermined location to be discharged. In addition, it is natural that a conductive contact mechanism having an appropriate structure may be properly mounted according to the structure of the transfer device or the structure of the transfer target device. In addition, in each of the above explanations, the case where the transfer device is mounted on the transfer device has been described. However, when the transfer device is installed in each station, the configuration of each device is in accordance with the technical concept of the present invention. Of course, it is only necessary to provide a discharge device having an appropriate structure corresponding to the above.

[0013]

[Effect of device]

 Since the present invention is configured as described above, it is possible to eliminate the potential difference between the equipments to be transferred before the transfer operation. Therefore, the excellent effects as described below were obtained. There is no risk of electrical damage to semiconductor components that should be transferred or malfunction of the control device due to noise. If the transfer device or transfer target equipment is equipped with a contact plate and the transfer target equipment or transfer device is equipped with a static elimination brush, the contact plate and the static elimination brush come into contact before the transfer operation and the electrostatic charge of the transfer device The transferred semiconductor parts will not be electrically damaged, and the control device will not malfunction. If the transfer device or the transfer target equipment is equipped with a contact plate and the transfer target equipment or transfer device is equipped with a conductive drive mechanism, the contact plate and the conductive drive mechanism are brought into contact before the transfer operation. Since the electrostatic charge of the transfer device is discharged, the transferred semiconductor parts are not electrically damaged, and the control device does not malfunction. If the equipment to be transferred is connected to the relay conductor attached to the floor surface and a conductive drive mechanism is installed at the upper position of the relay conductor when the transfer device is stopped, the relay conductor and the conductive material must be connected before the transfer operation. Since the static electricity of the transfer device is discharged by contacting the sexual drive mechanism, the transferred semiconductor parts are not electrically damaged and the control device does not malfunction. If a contact rod is installed at a position where the transfer mechanism of the transfer target equipment can contact the transfer mechanism, the electrostatic charge of the transfer device is discharged by bringing the transfer mechanism into contact with the contact rod before the transfer operation. Therefore, the transferred semiconductor components are not electrically damaged and the control device does not malfunction.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram illustrating a first embodiment in which the present invention is applied to a transport system.

FIG. 2 is a schematic three-dimensional structural diagram showing a structural example of the static elimination brush shown in FIG.

FIG. 3 is a schematic configuration diagram illustrating a second embodiment in which the present invention is applied to a transport system.

FIG. 4 is a schematic configuration diagram illustrating a third embodiment in which the present invention is applied to a transfer system.

FIG. 5 is a schematic configuration diagram illustrating a fourth embodiment in which the present invention is applied to a transport system.

FIG. 6 is a schematic configuration diagram illustrating a fifth embodiment in which the present invention is applied to a transfer system.

7 is a schematic side view showing a structural example of the contact rod shown in FIG.

FIG. 8 is a schematic configuration diagram illustrating a sixth embodiment in which the present invention is applied to a transfer system.

[Explanation of symbols]

 1, 10: Transfer device (mobile robot) 2: Transfer target device (semiconductor manufacturing device) (station) 3: Semiconductor wafer / cassette 4: Drive wheel 5: Floor surface 6: Transfer mechanism (robot arm) 7, 17: Contact plate 8: Contact element (static elimination brush) 9: Connection wire 12: Contact rod 18: Conductive drive mechanism (piston) 12a, 17a, 18a: Conductor wire

Claims (5)

[Scope of utility model registration request] 1. A transfer system in which parts are transferred from a ground by a transfer device which is supported and runs in a non-conductive state, and static electricity charged on the transfer device after the transfer device stops at a predetermined station and before a transfer operation is performed. Electrostatic discharge of the carrier device, characterized in that the carrier device and / or the facility to be transferred is equipped with a conductive contact mechanism having a predetermined resistance value for making the potential of the transfer target equipment and the potential of the transfer target equipment equal. apparatus. 2. The conductive contact mechanism according to claim 1, wherein the transfer device or the transfer target equipment is equipped with a contact plate, and the transfer target equipment or the transfer device is equipped with an antistatic brush. Charging device electrostatic discharge device. 3. The conductive contact mechanism according to claim 1, wherein the transfer device or the transfer target equipment is equipped with a contact plate, and the transfer target equipment or the transfer device is equipped with a conductive drive mechanism. Charging electrostatic discharge device for transport equipment. 4. The conductive contact mechanism according to claim 1, wherein the equipment to be transferred is connected to the relay conductor attached to the floor surface, and the conductive drive mechanism is provided at the upper position of the relay conductor when the transfer device is stopped. The electrostatic charging and discharging device of the transport device configured as described above. 5. The electrostatic charging / discharging device of a transfer device, wherein the conductive contact mechanism according to claim 1 is equipped with a contact rod at a transfer mechanism contactable position provided in the transfer device of the transfer target facility.