JP2583253Y2 - Charged electrostatic discharge device for transport equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an auxiliary mechanism provided in a transport system for transporting articles by a magnetic levitation transport vehicle, an unmanned transport vehicle, a mobile robot, a linear transport device, and the like. When transferring goods to and from the ground equipment, the transfer device reliably discharges the static electricity charged while traveling, and the charged static electricity causes the semiconductor components to be transferred to be electrically destroyed. The present invention relates to a safe and reliable charged electrostatic discharge device for a transport device that prevents an influence.

[0002]

2. Description of the Related Art In a magnetic levitation carrier, a carrier device that travels while loading articles on a predetermined traveling path floats from the ground via air, which is an insulating material, and travels unmanned carriers, mobile robots, In a linear transfer device and the like, elastic tires are often used to absorb vibration generated between the linear transfer device and the ground surface. Such tires generally use an electrical insulator such as rubber or resin. A transport device using the above-described tires may be charged with static electricity during traveling. Further, even in a transfer device that travels in a non-contact support state with the ground, such as a magnetic levitation transfer vehicle, static electricity is generated due to friction between a transfer object or the transfer device and air, and the device is charged. The above-mentioned charged and transferred device and the device to be transferred when transferring the transferred material from the transfer device to another device or from the device installed on the ground to the transfer device. If the potential between
Discharge occurs at the moment when the conveyed object comes into contact with the transfer target device, and the conveyed object such as a semiconductor component may be destroyed or the control device may malfunction due to an instantaneously generated discharge current or potential change. For this purpose, a means for hanging a conductive belt or the like on the floor from the transfer device or mounting a discharge antenna on the transfer device to prevent charging is used. Apparatuses for preventing such charging include JP-A-62-125903, JP-A-1-88499 and JP-A-1-174281.
Is disclosed in Japanese Unexamined Patent Application Publication No. 2000-205,878. JP-A-62-12
Japanese Patent No. 5903 discloses a method in which a carrier having wheels formed of an insulator is caused to travel on a traveling path where a conductive member is exposed to a part of a non-conductive traveling path. It is characterized by comprising a metal chain and a contact piece made of a conductive elastic body that comes into contact with the running surface mounted on the tip of the chain. Japanese Patent Application Laid-Open No. 1-88499 discloses an electronic device box in which one end is mounted in an electrically conductive state on the bottom surface of a movable electronic device box in which a transfer caster is mounted on the bottom surface. Is characterized by having a string-shaped conductor that is always in contact with the floor surface. Furthermore, the one disclosed in Japanese Utility Model Laid-Open No. 1-174281 is characterized in that a discharge antenna is provided on a vehicle body on which a battery is mounted.

[0003]

However, in a transfer device provided with a means for preventing charging as described above,
For example, according to the means of hanging a conductive belt or string, the condition of the floor, that is, whether the floor material is metal, whether a non-conductive material is coated with metal, whether it is a conductive resin, or not. The effect varies depending on whether such a metal or a conductor is grounded. The effect also varies depending on the state of contact with the conductive belt or the floor surface to be brought into contact with the string, that is, the degree of soiling of the floor surface and the manner of contact. Further, when the discharge antenna is provided, the discharge cannot be completely performed, so that a constant potential remains in the transfer device. On the other hand, in recent semiconductor manufacturing facilities, semiconductors having a low withstand voltage have been manufactured, and for the transfer of semiconductor wafers and the like, it is necessary to minimize the potential difference between the transfer device and the equipment to be transferred such as ground equipment as much as possible. Is required. In addition, since the control device for controlling the drive of the transfer device is configured by a semiconductor that is operated by a minute level signal, it is possible to minimize a noise source such as a discharge pulse current that causes a malfunction. Has been requested. For such a demand, the conventional antistatic means as described above is incomplete,
Effective and complete discharge means are desired. The present invention solves the above-mentioned conventional problems by reliably and safely discharging static electricity charged during the operation of the transfer device to the equipment to be transferred before the transfer operation.
It is an object (problem) to provide a charged electrostatic discharge device for a transport device that is safe and highly reliable.

[0004]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, in a charged electrostatic discharge device of a transport device according to the present invention, a transfer device supported in a non-conductive state from the ground and running is mounted on a transfer target facility. In the transfer system for transferring the transfer target object to be transferred, after the transfer device stops at a predetermined station provided in the transfer target facility, before the transfer operation is performed, the potential of the static electricity charged to the transfer device and the transfer potential are changed. A conductive contact mechanism having a predetermined resistance value for making the electric potential of the equipment to be mounted equal to the electric potential of the equipment to be mounted is provided on the transfer device and / or the equipment to be transferred. The above-described conductive contact mechanism may be configured by equipping a transfer device or a transfer target facility with a contact plate, and equipping the transfer target facility or the transfer device with a neutralization brush. Further, the above-mentioned conductive contact mechanism may be configured such that the transfer device or the transfer target equipment is provided with a contact plate, and the transfer target equipment or the transfer device is provided with a conductive drive mechanism. The above-mentioned conductive contact mechanism is equipped with a relay conductor attached to the floor surface, and the transport device is equipped with a conductive drive mechanism that is electrically connected to the relay conductor when stopped at the station. You may. Further, the above-mentioned conductive contact mechanism may be configured by equipping a transfer device of a transfer target facility with a contact rod at a position where the transfer mechanism can be contacted.

[0005]

According to the present invention, as described above, the conductive contact mechanism having a predetermined resistance value is provided, so that the transfer between the predetermined transfer device and the device to be transferred is performed before the transfer operation. By bringing the conductive contact mechanism into contact, the static electricity charged by the transfer device can be stably and reliably discharged to the transfer target device.
The transfer device and the transfer target device have the same potential, and the transfer operation is performed between the devices having the same potential. Therefore, the semiconductor component to be transferred is not electrically destroyed, and the control device does not malfunction.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of a charged electrostatic discharge device of a transfer device according to the present invention in a transfer system will be described in detail with reference to the drawings. First Embodiment FIG. 1 shows an example in which a mobile robot 1 which is an example of a transfer device and a semiconductor wafer cassette 3 which is a transfer target mounted on a semiconductor manufacturing apparatus 2 which is a transfer target facility are transferred. I have. The mobile robot 1 travels on the floor 5 along a predetermined route by driving wheels 4 according to a command from a control device (not shown), stops at a predetermined station, for example, beside the semiconductor manufacturing apparatus 2, and is a transfer mechanism. The semiconductor wafer cassette 3 is transferred by a robot arm 6 having an arm 6a having a predetermined shape and size, a joint 6b for rotatably connecting the two arms 6a to each other, a grip 6c, and the like. A conductive contact plate 7 is provided on the lower part of the side surface of the mobile robot 1 by an electric lead 7a having a predetermined resistance value.
, And the distal end grip 6c of the robot arm 6 and the contact plate 7 are electrically connected. Semiconductor manufacturing equipment 2
A contact 8 such as a static elimination brush, which will be described in detail later, is mounted at a position facing the contact plate 7 which is located when the mobile robot 1 stops, and the contact 8 is electrically connected to the semiconductor wafer cassette 3. 8a having a predetermined resistance value
Connected by One example of the charge removing brush 8 will be described with reference to FIG. FIG. 2 shows a schematic appearance of the static elimination brush 8, and a conductive brush 8c in which a large number of conductive needles having elasticity are arranged on a side surface of a plate-like portion 8b of the static elimination brush 8,
From the other surface of the plate portion 8b, an electrical lead 8a having a predetermined resistance electrically connected to the conductive brush 8c is led out, and the lead 8a is electrically connected to the semiconductor wafer cassette 3 as described above. It is formed so that it may be connected to. That is, in this embodiment, the conductive contact mechanism is constituted by the contact plate 7, the contact 8
And the conductors 7a and 8a. In the above-described configuration, when the mobile robot 1 charged with electric charge while traveling moves to a station provided on a side surface of the predetermined semiconductor manufacturing apparatus 2 and stops, the conductive brush 8c of the neutralization brush 8 comes into contact with the contact plate 7. Accordingly, the above-described configuration functions as a conductive contact mechanism, and the grip 6c of the mobile robot 1 and the semiconductor wafer cassette 3 have the same potential without an electric shock. Therefore, even if the grip 6c of the mobile robot 1 comes into contact with the semiconductor wafer cassette 3 to transfer it, no electric shock is generated. Therefore, semiconductor components (not shown) in the semiconductor wafer cassette 3 are not destroyed, and no noise is generated. Contrary to the above-described configuration, it is natural that the mobile robot 1 may be provided with a contact such as a neutralization brush and the semiconductor manufacturing apparatus 2 may be provided with a contact plate.

Embodiment 2 Referring to FIG. 3, another conductive contact mechanism for transferring a semiconductor wafer cassette 3 to be transferred between a mobile robot 1 and a semiconductor manufacturing apparatus 2 to be transferred is used. Example 2 is shown. The same elements as those in the embodiment described with reference to FIG. 1 are denoted by the same reference numerals. In FIG. 3, a conductive contact plate 17 is mounted on the lower side surface of the semiconductor manufacturing apparatus 2, and the contact plate 17 is connected by a conductive wire 17a having a predetermined resistance value so as to be electrically connected to the semiconductor wafer cassette 3. Have been. The mobile robot 1 is provided with a piston 18 as a conductive drive mechanism at a position facing the contact plate 17 located when the mobile robot 1 stops at a station beside the semiconductor manufacturing apparatus 2. The piston 18 is provided with a conductive piston rod 18c which is supported by a piston cylinder 18b and which can be moved back and forth by air pressure or driving force of a linear motor or the like.
c is connected to a grip 6c of the robot arm 6 by a conductive wire 18a having a predetermined resistance so as to be electrically connected. In the above-described configuration, when the mobile robot 1 charged with electric charge during traveling moves to a predetermined station on the side of the semiconductor manufacturing apparatus 2 and stops, the piston rod 18c protrudes under the operating conditions set in advance by a control device (not shown) and its tip Contacts the contact plate 17. Therefore, Embodiment 2
Now, the contact plate 17, the piston 18, and the conductor 17 described above are used.
a, 18a function as a conductive contact mechanism, and the grip 6c of the mobile robot 1 and the semiconductor wafer cassette 3 have the same potential without an electric shock. Therefore, mobile robot 1
No electrical shock is generated even if the grip 6c contacts the semiconductor wafer cassette 3 for transfer. Therefore,
The semiconductor components (not shown) in the semiconductor wafer cassette 3 are not destroyed, and no noise is generated. The above-described piston rod 18c itself is made of a non-conductive object, and the tip of the piston rod 18c is made of a conductive object, and this tip is electrically connected to the grip 6c of the robot arm 6 by a conducting wire 18a. May be. In addition, contrary to the above configuration, the mobile robot 1 is provided with the robot arm 6.
It is a matter of course that a contact plate electrically connected to the grip 6c and a piston electrically connected at least at the tip thereof may be mounted on the semiconductor wafer cassette 3 mounted on the semiconductor manufacturing apparatus 2.

Embodiment 3 The same applies to an example in which a semiconductor wafer cassette 3 as a transfer target is transferred between a mobile robot 1 and a semiconductor manufacturing apparatus 2 as a transfer target facility shown in FIG. The semiconductor wafer cassette 3 is transferred between the mobile robot 1 (hereinafter, referred to as a first mobile robot) and another mobile robot or a carrier (hereinafter, referred to as a second mobile robot) 10 using a conductive contact mechanism. A third embodiment to be transferred will be described with reference to FIG. The same elements as those in the embodiment described with reference to FIG. 3 are denoted by the same reference numerals. In FIG. 4, a second mobile robot 10 travels along a floor 5 by a drive wheel 11 according to a command from a control device (not shown), for example, by transporting a semiconductor wafer cassette 3 to a predetermined station. To stop. A conductive contact plate 17 is mounted on the lower side surface of the second mobile robot 10, and the contact plate 17 is connected to the semiconductor wafer cassette 3 by a conductive wire 17 a having a predetermined resistance so as to be electrically connected to the semiconductor wafer cassette 3. ing. That is,
In the third embodiment, the conductive contact mechanism includes the contact plate 17 and the piston 1
8 and conductors 17a and 18a. A piston 18 is mounted on the first mobile robot 1 at a position facing the contact plate 17 when the first mobile robot 1 stops at a station beside the second mobile robot 2.
The first mobile robot 1 is the same as the second embodiment shown in FIG. However, the length and the like of the piston rod 18c are not necessarily the same, and are appropriately set in accordance with the mutual relationship position when the first mobile robot 1 and the second mobile robot 10 stop. In the above-described configuration, when the first mobile robot 1 and the second mobile robot 10 charged with electric charges while traveling move to predetermined opposing position stations and stop, respectively, according to operating conditions preset in a control device (not shown). The piston rod 18c projects and its tip comes into contact with the contact plate 17. Therefore, the first
The grip 6c of the mobile robot 1 and the semiconductor wafer cassette 3 have the same potential without an electric shock. Therefore,
Even if the grip 6c of the first mobile robot 1 comes into contact for transferring the semiconductor wafer cassette 3, no electric shock is generated. Therefore, semiconductor components (not shown) in the semiconductor wafer cassette 3 are not destroyed, and no noise is generated. The above-described piston rod 18c itself is formed of a non-conductive object, and the tip of the piston rod 18c is formed of a conductive object, and this tip is electrically connected to the grip 6c of the robot arm 6 by a conducting wire 18a. May be. Contrary to the above configuration, the first mobile robot 1 has a contact plate electrically connected to the grip 6c of the robot arm 6, and the semiconductor wafer cassette 3 mounted on the second mobile robot 10 has at least the tip thereof. It goes without saying that a piston whose parts are electrically connected may be mounted.

Embodiment 4 Another conductive member for transferring a semiconductor wafer cassette 3 to be transferred between the mobile robot 1 described with reference to FIGS. 1 and 3 and a semiconductor manufacturing apparatus 2 to be transferred. Embodiment 4 using the sexual contact mechanism will be described with reference to FIG. The same elements as those in the embodiment described with reference to FIGS. 1 and 3 are denoted by the same reference numerals. In FIG. 5, a conductive connection line 9 is mounted on the lower surface of the semiconductor manufacturing apparatus 2, and the end of the connection line 9 is connected to a relay conductor 5a formed of a metal plate having a predetermined shape and size attached to a floor surface. I have. The connection line 9 is connected to the semiconductor wafer cassette 3 by a conductor 9a having a predetermined resistance so as to be electrically connected. The mobile robot 1 has a piston 18 which is a conductive drive mechanism such that the mobile robot 1 is positioned above the relay conductor 5a when the mobile robot 1 stops at a station beside the semiconductor manufacturing apparatus 2.
Is mounted downward. The piston 18 is provided with a conductive piston rod 18c which is supported by a piston cylinder 18b and can be moved up and down by pneumatic pressure or other driving force or by means such as combination with a spring. Is connected by a conducting wire 18a having a predetermined resistance so as to be electrically connected to the grip 6c of the robot arm 6. That is, in the fourth embodiment, the conductive contact mechanism includes the relay conductor 5a, the piston 18, the connection wire 9, and the conductive wires 9a and 18a. In the above-described configuration, when the mobile robot 1 charged with electric charge during traveling moves to a predetermined station on the side of the semiconductor manufacturing apparatus 2 and stops, the piston rod 18c is operated according to operating conditions set in advance by a control device (not shown).
Protrudes and its tip comes into contact with the relay conductor 5a. Accordingly, the above-described configuration functions as a conductive contact mechanism, and the grip 6c of the mobile robot 1 and the semiconductor wafer cassette 3
Is the same potential without electrical shock. Therefore, even if the grip 6c of the mobile robot 1 comes into contact with the semiconductor wafer cassette 3 to transfer it, no electric shock is generated. Therefore, semiconductor components (not shown) in the semiconductor wafer cassette 3 are not destroyed, and no noise is generated. In the piston 18 described above, similarly to the second and third embodiments, the piston rod 18c itself is made of a non-conductive object, the tip of the piston rod 18c is made of a conductive object, and this tip is connected to the conducting wire 18a. May be electrically connected to the grip 6c of the robot arm 6.

Embodiment 5 A semiconductor wafer cassette 3 to be transferred is transferred between the mobile robot 1 described with reference to FIGS. 1, 3 and 5 and a semiconductor manufacturing apparatus 2 to be transferred. A fifth embodiment using another conductive contact mechanism will be described with reference to FIG. The same elements as those of the embodiment described with reference to FIGS. 1, 3 and 5 are denoted by the same reference numerals. In FIG. 6, a contact rod 12, which will be described in detail later, is provided at a predetermined position above the semiconductor manufacturing apparatus 2. The contact rod 12 is connected to the semiconductor wafer cassette 3 by a conducting wire 12a so as to be electrically connected thereto. The mobile robot 1 is a standard equipment and does not have any special component parts for electric discharge. FIG.
2 shows an example of the structure. In FIG. 7, a contact rod 12 is provided with a spherical high resistance body 12c having a predetermined resistance coefficient at the tip of a conductive rod 12b having a predetermined elastic modulus. The conductor bar 12b is electrically connected to the semiconductor wafer cassette 3 by the conducting wire 12a as described above. That is, in the fifth embodiment, the conductive contact mechanism includes the contact rod 12 and the conductive wire 1.
2a. In the above-described configuration, when the mobile robot 1 charged with electric charge while traveling moves to a predetermined station on the side of the semiconductor manufacturing apparatus 2 and stops, the robot arm 6 of the mobile robot 1 is operated according to preset operating conditions of a control device (not shown). Grip 6 attached to the tip
The contact c is brought into contact with the tip high-resistance body 12c of the contact rod 12 provided in the semiconductor manufacturing apparatus 2 for a predetermined time. Accordingly, the above-described configuration functions as a conductive contact mechanism, and the grip 6c of the mobile robot 1 and the semiconductor wafer cassette 3 have the same potential without an electric shock. Therefore, even if the grip 6c of the mobile robot 1 comes into contact with the semiconductor wafer cassette 3 to transfer it, no electric shock is generated. Therefore, semiconductor components (not shown) in the semiconductor wafer cassette 3 are not destroyed, and no noise is generated.

Embodiment 6 The same as the example of transferring the semiconductor wafer cassette 3 as the transfer target between the mobile robot 1 and the semiconductor manufacturing apparatus 2 as the transfer target equipment shown in FIGS. Another embodiment in which the semiconductor wafer cassette 3 is transferred between the first mobile robot 1 and the second mobile robot 10 in the same manner as the third embodiment shown in FIG. 6 will be described with reference to FIG. That is, in the sixth embodiment, the conductive contact mechanism is configured by the contact rod 12 provided on the second robot 10 and the conducting wire 12 a connecting the cassette 3. The same components as those of the embodiment described with reference to FIGS. 4, 6 and 7 are denoted by the same reference numerals. In the configuration shown in FIG. 8, when the first mobile robot 1 and the second mobile robot 10 charged with electric charges during traveling move to predetermined opposing position stations and stop, respectively, a preset operation of a control device (not shown) is performed. Depending on conditions, the grip 6c attached to the tip of the robot arm 6 of the first mobile robot 1
Of the contact rod 12 provided in the mobile robot 10 of FIG. Therefore, the grip 6c of the first mobile robot 1 and the semiconductor wafer cassette 3 have the same potential without an electric shock. Therefore, even if the grip 6c of the first mobile robot 1 comes in contact with the semiconductor wafer cassette 3 to transfer it, no electric shock is generated. Therefore, semiconductor components (not shown) in the semiconductor wafer cassette 3 are not destroyed, and no noise is generated.

The above description shows an embodiment relating to the present invention, and can be applied to various transport systems utilizing the technical idea of the present invention. That is, the equipment to be transferred may be a semiconductor manufacturing apparatus that is fixed on the ground as described above, or may be a movable equipment that moves like a mobile robot like a transfer apparatus. , It may be a simple shelf. Also, for example, an example is described in which an articulated robot arm is used as a work machine of a mobile robot as a transfer mechanism.
Naturally, the present invention can be applied to any other transfer working machine or moving mechanism. Although the conductors 7a, 8a, 9a, 17a, and 18a shown in the respective embodiments are described to have a predetermined resistance value, a sudden current change that affects a semiconductor component or the like during a discharging operation is performed. Wire with an appropriate resistance value may be used to prevent
An ordinary conductor having a small resistance value, such as the conductor 12a, may be used according to other configuration conditions, or a resistor having a predetermined value may be connected to the ordinary conductor.
Also, if necessary, a copper wire or the like having a small resistance may be used. Also, according to the structure and electrical characteristics of a moving mechanism such as a mobile robot, or ground equipment such as a semiconductor manufacturing apparatus, the contact plates 7, 17, the static elimination brush 8, the connecting wire 9, the piston 18, and the contact rod 12 are provided. The conductors connected to each other may be omitted. Although the piston 18 has been illustrated as an example of the conductive drive mechanism, the conductive drive mechanism may be replaced with a movable mechanism having an arbitrary structure driven by a motor or the like as long as the conductive drive mechanism can be brought into contact with the opposing contact plate by a predetermined signal. The good is natural. In this case as well, it is only necessary that the tip portion that comes into contact with the contact plate, like the piston, is conductive and is connected to a predetermined place to be discharged.
In addition, it is natural that the conductive contact mechanism having an appropriate structure should be appropriately mounted according to the structure of the transfer device and the structure of the transfer target device. Also, in the above description, the case where the transfer device is mounted on the transfer device has been described. However, the case where the transfer device is installed at each station also corresponds to the configuration of each device according to the technical idea of the present invention. Needless to say, a discharge device having an appropriate structure may be provided.

[0013]

Advantages of the Invention Since the present invention is configured as described above, it is possible to eliminate the potential difference between the equipments to be transferred before the transfer operation. Therefore, the following excellent effects were obtained. There is no danger that the semiconductor components or the like to be transferred are electrically damaged or the control device malfunctions due to noise. If the transfer device or the equipment to be transferred is equipped with a contact plate and the equipment to be transferred or the transfer device is equipped with a neutralization brush, the contact plate and the neutralization brush come into contact before the transfer operation, and the charged static electricity of the transfer device will be reduced. Since the discharge occurs, the transferred semiconductor components are not electrically damaged, and the control device does not malfunction. If the transfer equipment or the equipment to be transferred is equipped with a contact plate and the equipment or transfer equipment is equipped with a conductive drive mechanism, the contact plate and the conductive drive mechanism must be brought into contact before the transfer operation. Since the charged static electricity of the transfer device is discharged, the transferred semiconductor component is not electrically destroyed, and the control device does not malfunction. Connect the equipment to be transferred to the relay conductor affixed to the floor,
If a conductive drive mechanism is installed at the upper position of the relay conductor when the transport device stops, the charged static electricity of the transport device is discharged by bringing the relay conductor into contact with the conductive drive mechanism before the transfer operation. The transferred semiconductor component is not electrically destroyed, and the control device does not malfunction. If a contact rod is installed at a position where the transfer mechanism of the equipment to be transferred can contact the transfer mechanism, the charged static electricity of the transfer device is discharged by bringing the transfer mechanism into contact with the contact rod before the transfer operation. Therefore, the transferred semiconductor components are not electrically destroyed, and the control device does not malfunction.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating a first embodiment in which the present invention is applied to a transport system.

FIG. 2 is a schematic three-dimensional structure diagram showing a structural example of a static elimination brush shown in FIG. 1;

FIG. 3 is a schematic configuration diagram illustrating a second embodiment in which the present invention is applied to a transport system.

FIG. 4 is a schematic configuration diagram illustrating a third embodiment in which the present invention is applied to a transport system.

FIG. 5 is a schematic configuration diagram illustrating a fourth embodiment in which the present invention is applied to a transport system.

FIG. 6 is a schematic configuration diagram illustrating a fifth embodiment in which the present invention is applied to a transport system.

FIG. 7 is a schematic side view showing a structural example of a contact rod shown in FIG. 6;

FIG. 8 is a schematic configuration diagram illustrating a sixth embodiment in which the present invention is applied to a transport system.

[Explanation of symbols]

 1, 10: transfer device (mobile robot) 2: transfer target device (semiconductor manufacturing device) (station) 3: semiconductor wafer cassette 4: drive wheel 5: floor surface 6: transfer mechanism (robot arm) 7, 17: Contact plate 8: Contact (static elimination brush) 9: Connection wire 12: Contact rod 18: Conductive drive mechanism (piston) 12a, 17a, 18a: Conductive wire

Claims (5)

(57) [Scope of request for utility model registration] 1. A transfer system for transferring an object to be transferred, which is mounted on a transfer target equipment by a transfer device that is supported and travels in a non-conductive state from the ground, wherein the transfer device includes the transfer target equipment. after stopping the predetermined station provided in, the conveying device charged conductive contact having a predetermined resistance value for the equipotential electrostatic the potential of potential and the transfer target equipment before performing the transfer operation A charging / discharging device for a transfer device, wherein the mechanism is provided in the transfer device or / and the equipment to be transferred. 2. The transfer device according to claim 1, wherein the transfer device or the transfer target equipment is provided with a contact plate, and the transfer target equipment or the transfer device is provided with a neutralization brush. Device electrostatic discharge device. 3. A conductive contact mechanism according to claim 1, wherein is the conveying device or transfer target facility equipped with a contact plate, also the transfer target facilities or transport device is constructed equipped with conductive drive mechanism Electrostatic discharge device for transfer equipment. 4. The conductive contact mechanism according to claim 1, wherein the conductive contact mechanism is attached to a floor surface.
Equipped with a relay conductor attached to the transfer station to the station
A charging / discharging device for a transporting device configured to be equipped with a conductive drive mechanism electrically connected to the relay conductor when stopped . 5. A charged electrostatic discharge device of a transfer device, wherein the conductive contact mechanism according to claim 1 is provided with a contact rod at a position where the transfer mechanism can be brought into contact with the transfer device of the equipment to be transferred.