JPH0689676A - Driving semiconductor element-incorporated fluorescent character display panel - Google Patents

Driving semiconductor element-incorporated fluorescent character display panel

Info

Publication number
JPH0689676A
JPH0689676A JP4358737A JP35873792A JPH0689676A JP H0689676 A JPH0689676 A JP H0689676A JP 4358737 A JP4358737 A JP 4358737A JP 35873792 A JP35873792 A JP 35873792A JP H0689676 A JPH0689676 A JP H0689676A
Authority
JP
Japan
Prior art keywords
marker
semiconductor element
bonding
bonding pad
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4358737A
Other languages
Japanese (ja)
Other versions
JP2901446B2 (en
Inventor
Masamichi Yokono
真路 横野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
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Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP4358737A priority Critical patent/JP2901446B2/en
Publication of JPH0689676A publication Critical patent/JPH0689676A/en
Application granted granted Critical
Publication of JP2901446B2 publication Critical patent/JP2901446B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To attain high-reliability automatic wire bonding by providing markers indicating the region for stable bonding on a conductor bonding pad at one end of a wiring conductor formed on an anode substrate. CONSTITUTION:A wiring conductor is formed on the glass anode substrate 1 of a driving semiconductor element-incorporated fluorescent character display panel, and a conductor bonding pad 2 is provided at its one end. The wiring conductor is covered with an insulating layer 3 having an opening section 4 at the position corresponding to the conductor bonding pad 2, and a driving semiconductor element 5 is mounted on the insulating layer 3. The IC bonding pad 7 on the semiconductor element 5 and the conductor bonding pad 2 are connected with a bonding Al wire 6. A center marker 8 and a drift detecting marker 9 are provided on the conductor bonding pad 2, and they are read and fed to the program of an automatic bonding machine. Sufficient junction is easily obtained, and the reliability of bonding is improved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は駆動用半導体素子内蔵型
蛍光表示パネルに関し、特に駆動用半導体素子のボンデ
ィングパッドから配線用導体のボンディングパッドへワ
イヤボンディングをする自動ワイヤボンディングに関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a driving semiconductor element-embedded fluorescent display panel, and more particularly to automatic wire bonding for wire bonding from a bonding pad of a driving semiconductor element to a bonding pad of a wiring conductor.

【０００２】[0002]

【従来の技術】図５は従来の駆動用半導体素子内蔵型蛍
光表示パネルの駆動用半導体素子固定部の断面図及びそ
の側面図であって、図において、陽極基板１と称せられ
るガラス基板の上には配線用導体が形成され、この配線
用導体を被覆して絶縁層３が形成されるが、配線用導体
の導体用ボンディングパッド２の部分を露出するように
絶縁層３内に絶縁層開口部４が形成されている。駆動用
半導体素子５は絶縁層３上に搭載され、駆動用半導体素
子５上のＩＣボンディングパッド７から対応する配線用
導体のボンディングパッド２まではアルミニウムワイヤ
６を用いたボンディングワイヤによりワイヤボンディン
グされる。2. Description of the Related Art FIG. 5 is a cross-sectional view and a side view of a driving semiconductor element fixing portion of a conventional driving semiconductor element-embedded fluorescent display panel, showing a glass substrate called an anode substrate 1 in the drawing. A wiring conductor is formed on the wiring conductor, and the insulating layer 3 is formed by covering the wiring conductor. An insulating layer opening is formed in the insulating layer 3 so as to expose the conductor bonding pad 2 portion of the wiring conductor. The part 4 is formed. The driving semiconductor element 5 is mounted on the insulating layer 3, and the IC bonding pad 7 on the driving semiconductor element 5 to the bonding pad 2 of the corresponding wiring conductor is wire-bonded with a bonding wire using an aluminum wire 6. .

【０００３】陽極基板１上には陽極セグメントが配列さ
れ、各陽極セグメントには配線用導体の一端が接続さ
れ、その配線用導体の他端はボンディングパッド２を形
成している。陽極セグメント上には蛍光膜が形成され、
すべての陽極セグメントに対向して共通の陰極がフィラ
メン状に設けられ、フィラメントと陽極セグメントの間
には電子加速用の共通のグリッド電極が設けられる。以
上述べた部分が陽極基板１を構成するガラス基板とフロ
ントガラスとの間に真空封止された蛍光表示パネルを構
成する。これらの部分は本発明には直接関係はないの
で、図面では省略している。選択された陽極セグメント
には、駆動用半導体素子５、ＩＣボンディンパッド７、
アルミニウムワイヤ６、導体用ボンディングワイヤ２、
配線用導体を経て駆動電圧が供給され、電子がその陽極
セグメントに衝突してその陽極セグメント上の蛍光膜を
発光させる。Anode segments are arranged on an anode substrate 1, one end of a wiring conductor is connected to each anode segment, and a bonding pad 2 is formed at the other end of the wiring conductor. A fluorescent film is formed on the anode segment,
A common cathode is provided in a filament shape facing all the anode segments, and a common grid electrode for electron acceleration is provided between the filament and the anode segment. The above-described portion constitutes a fluorescent display panel which is vacuum-sealed between the glass substrate forming the anode substrate 1 and the windshield. These parts are not directly related to the present invention and are omitted in the drawings. The selected semiconductor segment includes a driving semiconductor element 5, an IC bond pad 7,
Aluminum wire 6, conductor bonding wire 2,
A driving voltage is supplied through the wiring conductor, and electrons collide with the anode segment to cause the fluorescent film on the anode segment to emit light.

【０００４】[0004]

【発明が解決しようとする課題】アルミニウムワイヤ６
でＩＣボンディングパッド７と導体用ボンディングパッ
ド２の間を接続するワイヤボンディングは、ホスト計算
機によりプログラム制御される自動ボンディングマシー
ンによって実行される。この場合プログラムには、ＩＣ
ボンディングパッド７の中心位置と、これに対応するボ
ンディングパッド２の中心位置が入力され、この中心位
置へボンディングツールの先端部が位置制御される。従
って、ボンディングパッド２と７の実際の位置と、その
設計上の位置との間には、問題となるような位置誤差は
生じない。然しながら、絶縁層３は厚膜印刷技術を用い
てスクリーン印刷により形成されるため、印刷回数を重
ねるにしたがいスクリーンに伸びが生じ、印刷方向の手
前側と奥側とでは印刷位置、ひいては絶縁層開口部４の
位置や大きさが異なるという問題点がある。Aluminum wire 6
Wire bonding for connecting the IC bonding pad 7 and the conductor bonding pad 2 is executed by an automatic bonding machine which is program-controlled by the host computer. In this case, the program is IC
The center position of the bonding pad 7 and the center position of the bonding pad 2 corresponding thereto are input, and the position of the tip of the bonding tool is controlled to this center position. Therefore, no problematic position error occurs between the actual positions of the bonding pads 2 and 7 and their designed positions. However, since the insulating layer 3 is formed by screen printing using the thick film printing technique, the screen stretches as the number of times of printing increases, and the printing position on the front side and the back side in the printing direction, and thus the insulating layer opening. There is a problem that the position and size of the portion 4 are different.

【０００５】最近は、大型ガラス基板に多数の陽極基板
を同時に形成する傾向にあり、同一の大型ガラス基板上
でも陽極基板の形成場所が異なると絶縁層開口部４の印
刷、形成位置や大きさも異なることになる。このため、
自動機のボンディングプログラム作成に用いた陽極基板
と比較して、印刷位置ずれの大きい絶縁層開口部４内の
ボンディングパッド２では、ワイヤボンディングの際に
ボンディングツールの先端部が絶縁層３に接触して、ボ
ンディングパッド２とアルミニウムワイヤ６との間の十
分な接合が得られず、ワイヤボンディング工程及びその
後工程で不良を生み出す原因となるという問題点があっ
た。ワイヤボンディングの作業員は、作業にあたり顕微
鏡で絶縁層開口部４を観察する（普通は顕微鏡の視野を
工業テレビの受像機に表示する）のであるが、図５
（ｂ）に示すような表示になるため、ボンディングパッ
ド２の中心位置に対する絶縁層開口部４のずれを判定す
ることはできない。Recently, there is a tendency to form a large number of anode substrates on a large glass substrate at the same time. Even if the same large glass substrate is formed at different places, the insulating layer opening 4 is printed, and the formation position and size are also different. It will be different. For this reason,
In the bonding pad 2 in the insulating layer opening 4 where the printing position shift is larger than that of the anode substrate used for creating the bonding program of the automatic machine, the tip of the bonding tool comes into contact with the insulating layer 3 during wire bonding. As a result, sufficient bonding cannot be obtained between the bonding pad 2 and the aluminum wire 6, which causes a defect in the wire bonding process and the subsequent process. The wire-bonding worker observes the insulating layer opening 4 with a microscope (usually, the field of view of the microscope is displayed on the receiver of the industrial television) during the work.
Since the display is as shown in (b), the displacement of the insulating layer opening 4 with respect to the center position of the bonding pad 2 cannot be determined.

【０００６】なお、当然のことながら、大型ガラス基板
上での陽極基板の形成位置に応じて複数のプログラムを
用意すればワイヤボンディングは可能であるが、この方
法では，管理や運用面で繁雑になるという問題が生じ
る。Needless to say, wire bonding is possible by preparing a plurality of programs according to the formation position of the anode substrate on the large glass substrate, but this method is complicated in terms of management and operation. The problem arises.

【０００７】本発明の目的は、自動ボンディングマシー
ンで導体用ボンディングパッド２とアルミニウムワイヤ
６との間で容易で充分な接合が得られる駆動用半導体素
子内蔵型蛍光表示パネルを提供することにある。An object of the present invention is to provide a driving semiconductor element-embedded fluorescent display panel which can easily and sufficiently bond the conductor bonding pad 2 and the aluminum wire 6 in an automatic bonding machine.

【０００８】[0008]

【課題を解決するための手段】本発明では、導体用ボン
ディングパッドに当該ボンディングパッドの中心位置を
直接又は間接に表示するマーカを設けることとした。ま
た一つの実施例では、このマーカは当該ボンディングパ
ッドの中心位置を示すセンタマーカと、該センタマーカ
と一定間隔をおいて前記ボンディングパッド周辺に形成
される、ずれ検出マーカである。さらに他の実施例で
は、このマーカは配線用導体のボンディングパッドの中
心位置からの許容ずれ領域を示す、領域始点マーカと領
域終点マーカである。According to the present invention, the conductor bonding pad is provided with a marker that directly or indirectly indicates the central position of the bonding pad. Further, in one embodiment, the marker is a center marker indicating the center position of the bonding pad and a displacement detection marker formed around the bonding pad at a constant interval from the center marker. In still another embodiment, the markers are a region start point marker and a region end point marker that indicate a permissible deviation region from the center position of the bonding pad of the wiring conductor.

【０００９】[0009]

【実施例】次に、本発明の実施例について図面を参照し
て説明する。図１（ａ），（ｂ）は、本発明の第１の実
施例の駆動用半導体素子固定部の断面図及びその平面図
であり、図５と同一符号は同一または相当部分を示す。Embodiments of the present invention will now be described with reference to the drawings. 1A and 1B are a sectional view and a plan view of a driving semiconductor element fixing portion according to a first embodiment of the present invention, and the same reference numerals as those in FIG. 5 denote the same or corresponding portions.

【００１０】第１の実施例は、図１（ａ），（ｂ）に示
すように、まず、ガラスからなる陽極基板１の表面上に
アルミニウムの導体薄膜を形成し、エッチング等の手段
によりボンディングパッド２を含む配線用導体を形成す
る。この際、配列された両端部のボンディングパッド２
にボンディングパッド２の中心位置を示すセンタマーカ
８、及びセンタマーカ８に対し所定の間隔を取り配置さ
れたずれ検出マーカ９を同時に形成する。In the first embodiment, as shown in FIGS. 1 (a) and 1 (b), first, a conductive thin film of aluminum is formed on the surface of an anode substrate 1 made of glass and is bonded by means of etching or the like. A wiring conductor including the pad 2 is formed. At this time, the bonding pads 2 on both ends of the array are arranged.
At the same time, a center marker 8 indicating the center position of the bonding pad 2 and a displacement detection marker 9 arranged at a predetermined distance from the center marker 8 are formed at the same time.

【００１１】次に、絶縁物からなる絶縁層３を厚膜印刷
技術を用いて形成するが、絶縁層３内にはボンディング
パッド２に対応する位置に所定の形状の絶縁層開口部４
を形成しておく。なお、陽極セグメント、蛍光膜、フィ
ラメント、グリッド電極等の形成については説明を省略
するが、陽極セグメントは配線用導体と同時にエッチン
グ等で形成される。駆動用半導体素子５は絶縁層３上の
所定の位置に固定される。Next, an insulating layer 3 made of an insulating material is formed by using a thick film printing technique. In the insulating layer 3, an insulating layer opening 4 having a predetermined shape is formed at a position corresponding to the bonding pad 2.
Is formed. Although description of the formation of the anode segment, the fluorescent film, the filament, the grid electrode, etc. is omitted, the anode segment is formed by etching or the like at the same time as the wiring conductor. The driving semiconductor element 5 is fixed at a predetermined position on the insulating layer 3.

【００１２】次に、ボンディングパッド２とＩＣボンデ
ィングパッド７間にアルミニウムワイヤ６でワイヤボン
ディングするためのボンディングプログラムを新規作成
ないし補正するが、その前に顕微鏡で絶縁層開口部４内
のボンディングパッド２に設けられたセンタマーカ８及
びずれ検出マーカ９を観察する。この際、大型ガラス基
板上での絶縁層３の印刷方向の手前側及び奥側に設けら
れた陽極基板１上の絶縁層開口部４内のボンディングパ
ッド２を観察し、ずれ検出マーカ９が絶縁層３で覆い隠
されることなく存在している場合、ボンディングプログ
ラム作成ないし補正時にセンタマーカ８の位置をプログ
ラムに入力すれば、大型ガラス基板上に形成された全て
の陽極基板１で安定したワイヤボンディングが可能であ
る。Next, a bonding program for wire bonding with the aluminum wire 6 is newly created or corrected between the bonding pad 2 and the IC bonding pad 7. Before that, the bonding pad 2 in the insulating layer opening 4 is microscopically examined. The center marker 8 and the deviation detection marker 9 provided on the above are observed. At this time, the displacement detection marker 9 is insulated by observing the bonding pad 2 in the insulating layer opening 4 on the anode substrate 1 provided on the front side and the back side of the insulating layer 3 on the large glass substrate in the printing direction. When existing without being covered by the layer 3, if the position of the center marker 8 is input to the program when the bonding program is created or corrected, stable wire bonding can be performed on all the anode substrates 1 formed on the large glass substrate. Is possible.

【００１３】また、いずれかのボンディングパッド２で
ずれ検出マーカ９の一部ないし全体が絶縁層３で覆い隠
されている場合は、ボンディングプログラム作成ないし
補正時に、センタマーカ８の位置を入力すると、ボンデ
ィングツールの先端部（図示せず）が絶縁層３と接触す
ることになるので、センタマーカ８の位置をボンディン
グプログラムに入力するのではなく、印刷ずれの方向、
即ち、印刷方向に補正を施した位置をプログラムに入力
すれば、大型ガラス基板上に形成された全ての陽極基板
１で安定したワイヤボンディングが可能となる。When a part or the whole of the displacement detection marker 9 is covered with the insulating layer 3 by any one of the bonding pads 2, if the position of the center marker 8 is input when the bonding program is created or corrected, Since the tip portion (not shown) of the bonding tool comes into contact with the insulating layer 3, the position of the center marker 8 is not input to the bonding program, but the direction of misalignment of printing,
That is, if the position corrected in the printing direction is input to the program, stable wire bonding can be performed on all the anode substrates 1 formed on the large glass substrate.

【００１４】図２（ａ），（ｂ）は本発明の第２の実施
例の駆動用半導体素子固定部の断面図及びその平面図で
あり、図１と同一符号は同一または相当部分を示し、セ
ンタマーカ１８と、ずれ検出マーカ１９とが、同一のマ
ーカ図形の２部分で表示される例を示す。図２のセンタ
マーカ１８、ずれ検出マーカ１９が、図１のセンタマー
カ８、ずれ検出マーカ９と類似の方法で形成され、ボン
ディングプログラムに入力する位置を決定するのに同様
に使用できることは明らかである。FIGS. 2A and 2B are a sectional view and a plan view of a driving semiconductor element fixing portion of a second embodiment of the present invention, and the same reference numerals as those in FIG. 1 denote the same or corresponding portions. The center marker 18 and the shift detection marker 19 are displayed in two parts of the same marker figure. Obviously, the center marker 18 and the displacement detection marker 19 of FIG. 2 are formed in a similar manner to the center marker 8 and the displacement detection marker 9 of FIG. 1, and can be similarly used for determining the position to be input to the bonding program. is there.

【００１５】図３（ａ），（ｂ）は、本発明の第３の実
施例の駆動用半導体素子固定部の断面図及びその平面図
であり、図１と同一符号は同一または相当部分を示し、
マーカとしてはボンディングパッド上で信頼度の高いボ
ンディングを行うことができる領域の始点を示す領域始
点マーカ２８と、当該領域の終点を示す領域終点マーカ
２９を形成する。領域始点マーカ２８と領域終点マーカ
２９の形成方法は、図１に関して説明したセンタマーカ
８と、ずれ検出マーカ９の形成方法に類似しているので
その説明は省略する。3 (a) and 3 (b) are a sectional view and a plan view of a driving semiconductor element fixing portion of a third embodiment of the present invention, and the same reference numerals as those in FIG. 1 denote the same or corresponding portions. Shows,
As the markers, an area start point marker 28 indicating the start point of the area where highly reliable bonding can be performed on the bonding pad and an area end point marker 29 indicating the end point of the area are formed. The method of forming the area start point marker 28 and the area end point marker 29 is similar to the method of forming the center marker 8 and the displacement detection marker 9 described with reference to FIG.

【００１６】ボンディングプログラムを新規作成ないし
補正する場合、大型ガラス基板において、絶縁層３形成
時の印刷方向の手前側及び奥側に位置する、複数の陽極
基板１上の絶縁層開口部４内のボンディングパッド２を
観察し、領域始点マーカ２８と領域終点マーカ２９とが
両方とも存在する場合には、ボンディングプログラムの
データとしてボンディングパッド２の中心位置を入れれ
ば、大型ガラス基板上に形成された全ての陽極基板で信
頼性の高いワイヤボンディングが可能となる。When a new bonding program is created or corrected, in a large glass substrate, inside the insulating layer openings 4 on the plurality of anode substrates 1 located on the front side and the back side in the printing direction when the insulating layer 3 is formed. When the bonding pad 2 is observed and both the area start point marker 28 and the area end point marker 29 are present, if the center position of the bonding pad 2 is entered as the data of the bonding program, all of the areas formed on the large glass substrate will be displayed. With this anode substrate, highly reliable wire bonding becomes possible.

【００１７】また、もし領域始点マーカ２８と領域終点
マーカのうちの、いずれかが絶縁層３で被覆されて観察
できないときは、どちらのマーカが観察できないかに従
って、ボンディングプログラムに入れる位置データを正
または負の方向に補正する。If one of the area start point marker 28 and the area end point marker is covered with the insulating layer 3 and cannot be observed, the position data to be included in the bonding program is corrected according to which marker cannot be observed. Or correct in the negative direction.

【００１８】図４（ａ），（ｂ）は、本発明の第２の実
施例の駆動用半導体素子固定部の断面図及びその平面図
であり、図３と同一符号は同一または相当部分を示し、
領域始点マーカ３８と領域終点マーカ３９とが、同一の
マーカ図形の２部分で表示される例を示す。図４の領域
始点マーカ３８、領域終点マーカ３９が、図３の領域始
点マーカ２８、領域終点マーカ２９と類似の方法で形成
され、ボンディングプログラムに入力する位置を決定す
るのに同様に使用できることは明らかである。4 (a) and 4 (b) are a sectional view and a plan view of the driving semiconductor element fixing portion of the second embodiment of the present invention, and the same reference numerals as those in FIG. 3 denote the same or corresponding portions. Shows,
An example is shown in which the area start point marker 38 and the area end point marker 39 are displayed in two parts of the same marker figure. The area start point marker 38 and the area end point marker 39 of FIG. 4 are formed in a similar manner to the area start point marker 28 and the area end point marker 29 of FIG. 3, and can be similarly used to determine the position to be input to the bonding program. it is obvious.

【００１９】以上に説明した実施例では、マーカとして
は１対のマーカを形成したが、センタマーカ８だけを形
成し、このセンタマーカ８が絶縁層開口部４内で観察で
きるか、また観察できる場合絶縁層開口部４の長手方向
の中心線からのずれが、どの方向でどの程度かを決定す
ることによって、ボンディングプログラムに入力する位
置を決定することができる。In the embodiment described above, a pair of markers is formed as the markers, but only the center marker 8 is formed and whether or not the center marker 8 can be observed in the insulating layer opening 4 or can be observed. In this case, the position to be input to the bonding program can be determined by determining in what direction and how much the insulating layer opening 4 deviates from the longitudinal centerline.

【００２０】[0020]

【発明の効果】以上説明したように本発明によれば、駆
動用半導体素子内蔵型蛍光表示パネルにおいて、厚膜印
刷技術で形成する絶縁層の位置が薄膜のエッチング等に
より形成する導体のボンディングパッドの位置に対して
誤差を生じた場合でも、そのボンディングパッドに対し
信頼度の高いボンディングを自動ボンディングマシーン
で実行することが容易になる。As described above, according to the present invention, in a fluorescent display panel with a built-in driving semiconductor element, a bonding pad of a conductor is formed in which the position of an insulating layer formed by a thick film printing technique is formed by etching a thin film or the like. Even if an error occurs with respect to the position, it becomes easy to perform highly reliable bonding on the bonding pad by the automatic bonding machine.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の第１の実施例の駆動用半導体素子固定
部の断面図及びその平面図である。FIG. 1 is a sectional view and a plan view of a driving semiconductor element fixing portion according to a first embodiment of the present invention.

【図２】本発明の第２の実施例の駆動用半導体素子固定
部の断面図及びその平面図である。FIG. 2 is a cross-sectional view and a plan view of a driving semiconductor element fixing portion according to a second embodiment of the present invention.

【図３】本発明の第３の実施例の駆動用半導体素子固定
部の断面図及びその平面図である。FIG. 3 is a sectional view and a plan view of a driving semiconductor element fixing portion according to a third embodiment of the present invention.

【図４】本発明の第４の実施例の駆動用半導体素子固定
部の断面図及びその平面図である。FIG. 4 is a sectional view and a plan view of a driving semiconductor element fixing portion according to a fourth embodiment of the present invention.

【図５】従来の駆動用半導体素子内蔵型蛍光表示パネル
の駆動用半導体素子固定部の断面図及びその平面図であ
る。5A and 5B are a cross-sectional view and a plan view of a driving semiconductor element fixing portion of a conventional driving semiconductor element-embedded fluorescent display panel.

【符号の説明】[Explanation of symbols]

１ 陽極基板 ２ ボンディングパッド ３ 絶縁層 ４ 絶縁層開口部 ５ 半導体素子 ６ アルミニウムワイヤ ７ ＩＣボンディングパッド ８，１８ センタマーカ ９，１９ ずれ検出マーカ ２８，３８ 領域始点マーカ ２９，３９ 領域終点マーカ 1 Anode Substrate 2 Bonding Pad 3 Insulating Layer 4 Insulating Layer Opening 5 Semiconductor Element 6 Aluminum Wire 7 IC Bonding Pad 8,18 Center Marker 9,19 Displacement Detection Marker 28,38 Area Start Point Marker 29,39 Area End Point Marker

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 陽極基板と、該陽極基板上に形成された
配線用導体と、この配線用導体の一端として形成される
導体用ボンディングパッドと、該導体用ボンディングパ
ッドと対応する位置に開口部を有し前記配線用導体を被
覆する絶縁層と、該絶縁層上に搭載された駆動用半導体
素子と、該駆動用半導体素子の表面に形成されたＩＣ用
ボンディングパッドと、該ＩＣ用ボンディングパッドと
前記導体用ボンディングパッドを接続するボンディング
ワイヤと、前記陽極基板を構成するガラス基板に封着さ
れ真空容器を形成するカバーガラスとを有する駆動用半
導体素子内蔵型蛍光表示パネルにおいて、 前記開口部に露出する配列された前記導体用ボンディン
グパッドのうち少なくとも一端の導体用ボンディングパ
ッドにワイヤボンディングマシンで安定したボンディン
グが可能な領域を示すマーカを設けたことを特徴とする
駆動用半導体素子内蔵型蛍光表示パネル。1. An anode substrate, a wiring conductor formed on the anode substrate, a conductor bonding pad formed as one end of the wiring conductor, and an opening at a position corresponding to the conductor bonding pad. An insulating layer for covering the wiring conductor, a driving semiconductor element mounted on the insulating layer, an IC bonding pad formed on the surface of the driving semiconductor element, and the IC bonding pad And a bonding wire for connecting the conductor bonding pad, and a driving semiconductor element-embedded fluorescent display panel having a cover glass sealed to a glass substrate forming the anode substrate to form a vacuum container, in the opening. A wire bonding machine is attached to at least one conductor bonding pad among the exposed conductor bonding pads. In stable semiconductor device embedded fluorescent display panel driving, characterized in that bonding is provided with a marker indicating the available space. 【請求項２】 マーカは前記導体用ボンディングパッド
の中心位置を示すセンタマーカであることを特徴とする
請求項第１項記載の駆動用半導体素子内蔵型蛍光表示パ
ネル。2. The driving semiconductor element built-in type fluorescent display panel according to claim 1, wherein the marker is a center marker indicating a center position of the conductor bonding pad. 【請求項３】 マーカは前記導体用ボンディングパッド
の中心位置を示すセンタマーカと前記駆動用半導体素子
側から見て該センタマーカの外側に位置するずれ検出マ
ーカとで構成されることを特徴とする請求項第項１記載
の駆動用半導体素子内蔵型蛍光表示パネル。3. The marker comprises a center marker indicating the center position of the conductor bonding pad and a shift detection marker located outside the center marker when viewed from the driving semiconductor element side. A fluorescent display panel with a built-in driving semiconductor element according to claim 1. 【請求項４】 請求項第３項記載のセンタマーカとずれ
検出マーカとが１つのマーカ図形の互いに異なる２部分
により構成されることを特徴とする請求項第３項記載の
駆動用半導体素子内蔵型蛍光表示パネル。4. The built-in driving semiconductor element according to claim 3, wherein the center marker and the shift detection marker according to claim 3 are composed of two different portions of one marker figure. Type fluorescent display panel. 【請求項５】 マーカは安定したボンディングが可能な
領域の始点を示す領域始点マーカと該領域の終点を示す
領域終点マーカとで構成されることを特徴とする請求項
第１項記載の駆動用半導体素子内蔵型蛍光表示パネル。5. The driving device according to claim 1, wherein the marker is composed of a region start point marker indicating a start point of a region where stable bonding is possible and a region end point marker indicating an end point of the region. Fluorescent display panel with a built-in semiconductor element. 【請求項６】 領域始点マーカと領域終点マーカとが１
つのマーカ図形の互いに異なる２部分により構成される
ことを特徴とする請求項第５項記載の駆動用半導体素子
内蔵型蛍光表示パネル。6. The area start point marker and the area end point marker are 1
7. The fluorescent display panel with a built-in driving semiconductor element according to claim 5, wherein the marker display is composed of two different portions of one marker figure.
JP4358737A 1992-01-08 1992-12-28 Fluorescent display panel with built-in driving semiconductor element Expired - Fee Related JP2901446B2 (en)

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JP4358737A JP2901446B2 (en) 1992-01-08 1992-12-28 Fluorescent display panel with built-in driving semiconductor element

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013070260A (en) * 2011-09-22 2013-04-18 Nippon Dempa Kogyo Co Ltd Elastic surface wave element and manufacturing method therefor
JP2014056966A (en) * 2012-09-13 2014-03-27 Renesas Electronics Corp Semiconductor device manufacturing method
JP2016189499A (en) * 2016-08-12 2016-11-04 ルネサスエレクトロニクス株式会社 Semiconductor device

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JPS61234555A (en) * 1985-04-11 1986-10-18 Oki Electric Ind Co Ltd Semiconductor device
JPS6413126U (en) * 1987-07-14 1989-01-24

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234555A (en) * 1985-04-11 1986-10-18 Oki Electric Ind Co Ltd Semiconductor device
JPS6413126U (en) * 1987-07-14 1989-01-24

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013070260A (en) * 2011-09-22 2013-04-18 Nippon Dempa Kogyo Co Ltd Elastic surface wave element and manufacturing method therefor
JP2014056966A (en) * 2012-09-13 2014-03-27 Renesas Electronics Corp Semiconductor device manufacturing method
US9589923B2 (en) 2012-09-13 2017-03-07 Renesas Electronics Corporation Method of manufacturing semiconductor device
US10050011B2 (en) 2012-09-13 2018-08-14 Renesas Electronics Corporation Method of manufacturing semiconductor device
JP2016189499A (en) * 2016-08-12 2016-11-04 ルネサスエレクトロニクス株式会社 Semiconductor device

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