JP2004153008A - Light-emitting element array - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting element array having an accurate positioning function and an optical guide function through the use of a plurality of light-emitting windows. <P>SOLUTION: A plurality of conical light-emitting windows are regularly arranged on a substrate 51, and one or more connecting circuits are provided on the substrate 51 corresponding to light-emitting window positions. Light-emitting element array devices mounted with a plurality of light-emitting elements are bonded to the substrate 51, with each light-emitting element positioned in a corresponding light-emitting window and with the electrode of each of the light-emitting elements connected to a corresponding connecting circuit. Electric connection is established with control ICs (Integrated Circuits) 55 in this way for a remarkable reduction in the number of wire bondings in the product, and light-emitting windows are assured of accurate positioning. These simplify the accurate positioning of light-emitting array devices relative to each other and make able to decrease the mutual interference between radiated beams. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a kind of light emitting element array, and more particularly, to a light emitting element array having accurate positioning and light guiding functions by a plurality of light exit windows.
[0002]
[Prior art]
2. Description of the Related Art A light emitting element array (LED Array) in which a plurality of independent light emitting element units are arranged in an orderly manner is widely used in facsimile machines, scanners, printers, large screens or display panels, and whether or not each light emitting element is arranged in an orderly manner. Or whether the emitted rays interfere with each other has a significant effect on the emission quality, document printing or image representation.
[0003]
For this reason, the industry has invested a large amount of resources to develop a light emitting element array having good light emission quality (for example, see Patent Documents 1 and 2).
[0004]
1 and 2 are a structural plan view and a three-dimensional display diagram of a known light emitting element array, respectively. An active layer 14 (active) capable of emitting a light beam is provided on the surface of the LED substrate 11.
A first electrode 19 is provided, and an insulating layer 17 or a current diffusion layer 16 (current diffusion layer) arranged in a lateral direction is provided at an appropriate position on the active layer 14 by a technique such as etching. ), The location of the current spreading layer 16 is set as a predetermined light emitting area, the projection light emitted from the current spreading layer 16 (light emitting area) is not blocked by the bonding pad, and a subsequent wire bonding step is performed. In consideration of the convenience of the above, the second electrode 18 formed of a light-transmitting oxidizing substance leads the connection circuit of the current diffusion layer 16 (light emitting region) to the predetermined wire bonding region 12 on the side, and here the wire bonding is performed. After the process is completed, the control circuit further uses a corresponding control IC (illustrated Not) to be electrically connected. In addition, according to the actual use and size requirements of the product, two light emitting element arrays 101 and 102 are arranged in an orderly manner, the current spreading layers 16 and 162 (light emitting areas) are linearly arranged in a horizontal direction, and linear light rays are formed. Project and use the product.
[0005]
The above-mentioned well-known light-emitting element array basically has a connecting circuit of the same number as the number of light-emitting elements derived from the light-emitting element, and a wire bonding method is generally adopted for a connecting process of the connecting circuit. However, such a conventional wire bonding method has the following problems.
1. The increase in the number of bonding wires and the reduction in the bonding wire array pitch 112 greatly increase manufacturing difficulties and manufacturing cost expenditures.
2. The wire bonding of the connecting circuit tends to cause the dropout of other electric circuits, and the production yield, light emission quality or service life of the product is reduced.
3. The light beam to be projected in the light emitting region has a vertical surface emission type B light beam, a lateral surface emission type T light beam, and both of these two types of light beams are projected toward the adjacent LED surface, Crosstalk between two adjacent light emitting elements was caused, increasing the difficulty in reliably identifying the position of light emission, thereby affecting the quality of image resolution.
4. There is an array gap 112 between the two light emitting element array devices 101 and 102, which causes certain technical difficulties in accurate positioning, which severely affects light emission quality.
5. If one of the light emitting devices is damaged, the entire light emitting device array device must be abandoned, which not only wastes resources but also increases cost expenditure.
[0006]
For this reason, the industry has provided a second type of light emitting element array (for example, see Patent Document 3). It embeds a first connection circuit 32, a second connection circuit 34, and a third connection circuit 36 on a substrate 31, as shown in FIGS. 3 and 4, and includes at least one light emitting element array device 331 to 333 and At least one control IC 35 is prepared, a plurality of light emitting elements 41 are provided on the light emitting element array 331, and a first electrode 49 and a second electrode 48 corresponding to each light emitting element 41 are provided. Subsequently, the direct light emitting element array device 331 is disposed on the surface of the substrate 31 and is interposed between the first connection circuit 32 and the second connection circuit 34, using the first bonding layer 42 and the second bonding layer 44, The first electrode 49 of each light emitting element 41 is electrically connected to the first connection circuit 32, and the second electrode 48 is electrically connected to the second connection circuit 34. The control IC 35 is also disposed on the other side of the surface of the substrate 31 and is interposed between the second connection circuit 34 and the third connection circuit 36, and uses the fourth bonding layer 45 and the third bonding layer 46. The control IC 35 is electrically connected to the second connecting circuit 34 and the third connecting circuit 36, thereby completing the manufacture of the light emitting element array, and the light emitting element 41 is transmitted through the light transmitting substrate 31 when the bias voltage is applied. The projection light is emitted to form the light emitting region 38.
[0007]
The above-mentioned light emitting element array can effectively increase the product yield by reducing the number of wire bonding. However, the structure has the following problems.
1. The T-class rays emitted from the side surface of each light emitting element are projected on the adjacent LED surface, causing crosstalk between two adjacent light emitting elements, and increasing difficulty in reliable position identification of light emission. However, this may affect the quality of image analysis.
2. The light emitting element array devices (331 to 333) are directly joined on the first connecting circuit and the second connecting circuit, and it is not possible to observe or secure whether two adjacent light emitting element array devices are on an ideal predetermined circuit, and to match them. There are difficulties in positioning techniques.
3. There is an array gap 339 between each two light emitting element array devices 331, 332, which poses certain technical difficulties in accurate positioning, which severely affects light emission quality.
4. If one light emitting device is damaged due to the difficulty in alignment during product processing, the entire light emitting device array device must be discarded, which not only wastes resources but also increases cost expenditure.
[0008]
[Patent Document 1]
US Patent No. 6,236,065 [Patent Document 2]
US Patent No. 6,191,438 [Patent Document 3]
US Patent No. 4,916,464
[Problems to be solved by the invention]
Accordingly, it is an important point of the present invention how to provide a novel light-emitting element array for the above-mentioned problem and apply it to a high-density or high-resolution product.
[0010]
A main object of the present invention is to provide a kind of light emitting element array that can solve the above-mentioned problems of the known light emitting element array.
[0011]
A further object of the present invention is to provide a kind of light emitting element array, which is provided with light emitting windows arranged in order on a substrate, that is, to enable each light emitting element to be positioned naturally and accurately, and to be easily manufactured. The light emitting element array is intended to be able to achieve the high quality requirement of the above and to reduce the technical difficulty of the alignment positioning between the adjacent light emitting element array devices effectively.
[0012]
It is another object of the present invention to provide a kind of light emitting device array, in which each light emitting device array device and a control IC are arranged directly on a substrate to complete an electrical connection, and more times. The light emitting element array eliminates the need to perform a wire bonding process, thereby effectively extending the product yield and the service life of the product.
[0013]
It is yet another object of the present invention to provide a kind of light emitting element array, wherein the substrate itself effectively isolates the projection light sources of the light emitting elements in two adjacent light emitting windows, thereby. It is assumed that the light emitting element array can effectively solve the crosstalk between the light emitting elements, increase the degree of discrimination of the light emitting position, and effectively increase the light emitting luminance.
[0014]
It is another object of the present invention to provide a kind of light emitting device array, which allows a substrate to be formed of a light-transmitting or non-light-transmitting material, widens the choice of materials, and limits manufacturing. Is assumed to be a light emitting element array capable of reducing the number of light emitting elements.
[0015]
[Means for Solving the Problems]
The invention according to claim 1 is a light emitting element array,
A substrate, on which at least a plurality of second connection circuits, and a plurality of light exit windows penetrating the substrate are provided, each light exit window corresponding to one of the second connection circuits,
At least one light-emitting element array device, a plurality of light-emitting elements are provided thereon, each light-emitting element has a first electrode and a second electrode, and the light-emitting element array device is continuously provided on the substrate surface; The at least one light-emitting element array device, wherein each light-emitting element is located in a vertically extending position of a corresponding light-emitting window, and the second electrode is electrically connected to a second connection circuit;
Said at least one control IC being at least one control IC, being connected to said substrate surface, and being electrically connected to a corresponding second connection circuit;
The light emitting element array is characterized by comprising:
According to a second aspect of the present invention, in the light emitting element array according to the first aspect, at least one first connection circuit is provided on the substrate, and the first electrode of each light emitting element is electrically connected to the corresponding first connection circuit. The light emitting element array is characterized in that:
According to a third aspect of the present invention, in the light emitting element array according to the first aspect, at least one third connection circuit is provided on the substrate, and the third connection circuit of each light emitting element is electrically connected to the control IC. And a light-emitting element array.
According to a fourth aspect of the present invention, there is provided the light emitting element array according to the first aspect, wherein a reflection layer is provided in the light exit window.
According to a fifth aspect of the present invention, there is provided the light emitting element array according to the first aspect, wherein a package layer is provided in the light exit window.
According to a sixth aspect of the present invention, in the light emitting element array according to the fifth aspect, the package layer is formed of any one of a light-transmitting resin layer, a light-transmitting layer, a phosphor, an oxygen-containing resin, and a combination thereof. Light emitting element array.
According to a seventh aspect of the present invention, in the light emitting element array according to the first aspect, an outer surface of the light exit window is covered with a light transmitting layer.
According to an eighth aspect of the present invention, in the light emitting element array according to the seventh aspect, the light transmitting layer is formed of any one of a color filter, a color conversion layer, glass, an oxygen-containing resin, and a combination thereof. It is a light emitting element array.
According to a ninth aspect of the present invention, there is provided the light emitting element array according to the first aspect, wherein the light emitting window has a cone shape.
According to a tenth aspect of the present invention, in the light emitting element array according to the first aspect, the substrate is any one of a printed substrate, a silicon substrate, a semiconductor material substrate, a light-transmitting or light-transmitting substrate, and a combination thereof. Light emitting element array.
The invention according to claim 11 is a light emitting element array,
A substrate, on which at least a plurality of second connecting circuits, at least one third connecting circuit, and a plurality of cone-shaped light emitting windows each having a cone shape penetrating the substrate are provided; Said board corresponding to one of the connecting circuits;
At least one light-emitting element array device, a plurality of light-emitting elements are provided thereon, each light-emitting element has a first electrode and a second electrode, and the light-emitting element array device is continuously provided on the substrate surface; The at least one light-emitting element array device, wherein each light-emitting element is located in a vertically extending position of a corresponding conical light-emitting window, and the second electrode is electrically connected to a second connection circuit;
At least one control IC which is at least one control IC, is connected to the substrate surface, and is electrically connected to the corresponding second connection circuit and third connection circuit;
The light emitting element array is characterized by comprising:
According to a twelfth aspect of the present invention, in the light emitting element array according to the eleventh aspect, at least one first connecting circuit is provided on the substrate, and the first electrode of each light emitting element is electrically connected to the corresponding first connecting circuit. The light emitting element array is characterized in that:
According to a thirteenth aspect of the present invention, there is provided the light emitting element array according to the eleventh aspect, wherein a reflection layer is provided in the conical light exit window.
According to a fourteenth aspect of the present invention, in the light emitting element array according to the eleventh aspect, a package layer is provided in the conical light exit window, and the package layer includes a light transmitting resin layer, a light transmitting layer, a phosphor, an oxygen-containing resin, The light-emitting element array is characterized by being formed by any one of the combinations.
According to a fifteenth aspect of the present invention, in the light emitting element array according to the eleventh aspect, the outer surface of the conical light exit window is covered with a light transmitting layer, and the light transmitting layer is a color filter, a color conversion layer, glass, and an oxygen-containing resin. And a combination thereof.
According to a sixteenth aspect of the present invention, in the light emitting element array according to the first aspect, the substrate is any one of a printed substrate, a silicon substrate, a semiconductor material substrate, a light-transmitting or non-light-transmitting substrate, and a combination thereof. Light emitting element array.
The invention according to claim 17 is a light emitting element array,
A substrate, on which at least one of a first connecting circuit, a second connecting circuit, a third connecting circuit and a plurality of light exit windows penetrating the substrate are provided, each light emitting window being connected to the first connecting circuit and the second connecting circuit; Said substrate, located between the circuits,
At least one light-emitting element array device, a plurality of light-emitting elements are provided thereon, each light-emitting element has a first electrode and a second electrode, and the light-emitting element array device is continuously provided on the substrate surface; Each light emitting element is located in the vertical extension position of the corresponding light exit window, and the first electrode is electrically connected to the corresponding first connection circuit, and the second electrode is electrically connected to the corresponding second connection circuit. Connected to the at least one light emitting element array device,
The at least one control IC, which is provided between the second connection circuit and the third connection circuit on the substrate surface, and is electrically connected to the corresponding second connection circuit and the third connection circuit, respectively. At least one control IC;
The light emitting element array is characterized by comprising:
According to an eighteenth aspect of the present invention, in the light emitting element array according to the seventeenth aspect, the light emitting window is formed in a conical shape.
A nineteenth aspect of the present invention is the light emitting element array according to the seventeenth aspect, wherein a reflection layer is provided in the light exit window.
A twentieth aspect of the present invention is the light emitting element array according to the seventeenth aspect, wherein a package layer is provided in the light exit window.
According to a twenty-first aspect of the present invention, in the light emitting element array,
A substrate provided with at least one hole, a plurality of extension circuit first contact regions are embedded in the substrate, and the extension circuit first contact region corresponds to a control circuit first contact region corresponding to one control circuit. The substrate, wherein the substrate is electrically connected, and the control circuit first contact area is located within a control IC predetermined arrangement area of the substrate;
At least one light emitting element array device provided with a plurality of light emitting elements, each one light emitting element is electrically connected to a corresponding extension circuit second contact region by an extension circuit, and the light emitting element array device is provided on the substrate. The at least one extending circuit second contact area is electrically connected to the extending circuit first contact area of the substrate when being connected to the surface, and the plurality of light emitting elements are aligned and arranged in the hole. One light emitting element array device;
At least one control IC having a plurality of control circuit second contact areas provided therein, which is provided continuously in a predetermined arrangement area of the control IC on the board, and the control circuit second contact area is provided on the control circuit first contact area of the board. Said at least one control IC electrically connected to a contact area;
The light emitting element array is characterized by comprising:
According to a twenty-second aspect of the present invention, there is provided the light emitting element array according to the twenty first aspect, wherein the holes are formed in a V shape.
According to a twenty-third aspect of the present invention, there is provided the light-emitting element array according to the twenty-first aspect, wherein the holes are formed in an elongated shape.
According to a twenty-fourth aspect of the present invention, in the light emitting element array according to the twenty first aspect, at least one reflection layer is provided on a side of the hole.
A twenty-fifth aspect of the present invention is the light-emitting element array according to the twenty-first aspect, wherein the substrate is any one of a printed board, a silicon substrate, a semiconductor material substrate, and a combination thereof.
According to a twenty-sixth aspect of the present invention, in the light-emitting element array according to the twenty-first aspect, a package layer is provided in the hole, and the package layer includes a light-transmitting resin layer, a light-transmitting layer, a phosphor, an oxygen-containing resin, and a combination thereof. Wherein the light-emitting element array is formed of any one of the above.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Please refer to FIG. 5 to FIG. These figures are a structural exploded view, a combination display diagram, and a II-II sectional view of an embodiment of the light emitting element array of the present invention, respectively. As shown in the drawing, the present invention first applies a plurality of circuit boards or substrates 51 (printed substrates or semiconductor material substrates) to a plurality of substrates by using micromachine electrotechnology such as laser etching, chemical etching, a semiconductor process or a printed circuit board process. The light exit window 57 is formed. A reflection layer 59 having a light reflection function is formed on the inner wall of the light exit window by oblique sputtering or vapor deposition. A first connection circuit 52, a second connection circuit 54, and a third connection circuit 56 are embedded at appropriate positions on the substrate 51. In addition, a plurality of light emitting element array devices 531 to 533 and at least one control IC 55 are prepared. A plurality of light emitting elements 61 are provided in the light emitting element array device 531, and each light emitting element 61 has a corresponding first electrode 69 and a second electrode 68. Subsequently, the direct light emitting element array devices 531 to 533 are arranged on the surface of the substrate 51, which is located between the first connecting circuit 52 and the second connecting circuit 54, and is indicated by a dotted line in FIG. Is displayed. Furthermore, the first electrode 69 of each light emitting element 61 is connected to the first connection circuit 52 by bonding or hot melt bonding technology using the first bonding layer 62 and the second bonding layer 64 (solder paste, adhesive substance or metal material). It is electrically connected, and the second electrode 68 is electrically connected to the second connection circuit 54. Further, the control IC 55 is located on the other side of the surface of the substrate 51 and is disposed between the second connection circuit 54 and the third connection circuit 56, and a predetermined arrangement area 555 is indicated by a dotted line in FIG. . In addition, the control IC 55 is electrically connected to the second connection circuit 54 and the third connection circuit 56 using the fourth connection layer 65 and the third connection layer 66, thereby completing the manufacture of the light emitting element array. The light-emitting element 61 emits a projected light beam through the light-emitting window 57 in the substrate 51 when a bias is applied, thereby forming a light-emitting region 58.
[0017]
The substrate 51 of the present invention is first provided with a plurality of light exit windows 57 which are arranged in a laterally orderly linear manner and allow light rays to pass through, so that the substrate 51 needs to be formed of a translucent material as in a well-known structure. Instead, both translucent and opaque materials are applied in the structure of the present invention. In addition, the bonding layer achieves the purpose of electrical connection between the electrode and the corresponding connection circuit, whereby the structure of the present invention can greatly reduce the number of wire bonding, and the product yield in which the wire bonding step is effectively formed. The disadvantage of reduction can be prevented.
[0018]
In addition, a reflection layer 59 is provided on the inner wall of the light exit window 57, so that the projection light guides any of the vertical type emission B type light or the lateral type emission T type light source into the working range of the light emission window 57. This limits the crosstalk interference problem between two adjacent light emitting elements, thereby effectively improving the quality of the degree of discrimination of the position where light emission is reliable and the quality of image analysis.
[0019]
FIG. 8 is a sectional view taken along the line III-III of the embodiment of FIG. 6 of the present invention. As shown, the light exit window 57 of the present invention is accurately formed on the substrate 51 by a technique such as laser etching, and the accuracy of the horizontal linear arrangement is good. When each of the light emitting elements 61 is joined, the light emitting elements 61 can emit the projection light source through the corresponding light exit window 57. In other words, although there is an array gap 539 between the two light emitting element array devices 531 and 532, the matching technology between the light emitting element array devices 531 and 533 has a traditional structure in which the light emitting element array devices 531 and 533 are used. Unlike the unit, the light exit window 57 is set as a matching unit, so that it is possible to inspect or secure that two adjacent light emitting element array devices 531 to 533 are at an ideal predetermined installation position, which is effective. The light emission quality can be improved.
[0020]
In addition, according to the present invention, the light-emitting window 57 is a matching unit, so that even if one light-emitting element 61 is damaged during the process, the light-emitting element array device 531 needs to be discarded as in the known structure. Instead, the lightly damaged light emitting element portion may be cut off, and good light emitting elements may be continuously arranged by the corresponding light emitting window 57, so that resources can be effectively used and the manufacturing cost can be reduced.
[0021]
A light-transmitting layer (not shown) can be provided on the outer surface of the light exit window 57 of the present invention, and the light-transmitting layer is made of a color filter, a color conversion thin film, glass or an oxygen-containing resin. 61 can be protected, and the purpose of changing the wavelength and color of the projection light source can be achieved.
[0022]
FIG. 9 is a structural sectional view of another embodiment of the present invention. As shown in FIG. 9, the light emitting element array device 531 is provided with a plurality of light emitting elements 61, and each light emitting element 61 A first electrode 69 and a second electrode 68 are provided. A plurality of light exit windows 77 are formed in the substrate 71 so as to correspond to each light emitting element 61. In this embodiment, the light exit window 77 has a cone shape, a reflection layer 79 having a light reflection effect is provided on the oblique side 777, and a package layer 75 is provided in the light exit window 77. Is a light-transmitting resin, a light-transmitting layer, an oxygen-containing resin, or a phosphor, and has a function of protecting the light-emitting element 61 and a function of changing the wavelength and color of light collected, guided, or projected.
[0023]
Finally, FIG. 10 and FIG. 11 are an exploded structure diagram and a combination display diagram of still another embodiment of the present invention, respectively. As shown in this figure, in this embodiment, a light emitting window 91 which is formed as a V-shaped hole in this embodiment is formed in a substrate 90 which is a silicon substrate or another semiconductor substrate. A reflection layer 93 having a light ray reflecting or light collecting effect is provided on the side wall or the inclined side wall of the semiconductor substrate 90, and a plurality of contact points which are electrically connected to a plurality of high-density elements are first formed in the silicon substrate 90 by micromachine electrotechnology such as a semiconductor. A first extending circuit contact area 95 is provided, and each one extending circuit first contact area 95 is electrically connected by a control circuit 97 to a control circuit first contact area 99 fixed in a control IC predetermined arrangement area 92. Connected.
[0024]
The plurality of light emitting elements 101 are arranged side by side on an LED substrate (or a light emitting element array device) 100, and each LED light emitting element 101 is electrically connected to the extending circuit second contact area 103 by the extending circuit 105. Is done. When the LED substrate 100 and the silicon substrate 90 are combined, the LED light emitting device 101 is aligned and disposed in the light exit window 91, and the extended circuit second contact region 103 naturally aligns with the extended circuit first contact region 95 to join. Is done. The control IC 120 is also connected to the control IC predetermined arrangement area 92, and a plurality of control circuit second contact areas 129 provided on the surface of the control IC 120 are also provided on the corresponding control circuit first arrangement area on the silicon substrate control IC predetermined arrangement area 92. The LED light emitting element 101 is aligned and joined to the contact area 99, and thus the LED light emitting element 101 is connected to the extension circuit second contact area 103, the extension circuit first contact area 95, the control circuit 97, the control circuit first contact area 99, and the control circuit second contact. The region 129 completes the electrical connection with the control IC 120, as shown in FIG.
[0025]
Of course, in each of the above-described embodiments, the control IC 120 is displayed on one side of the substrate 90. However, the control IC can be installed on both sides of the light exit window 91 in order to correspond to a high-density light emitting element array. The extension circuits 105 of the two light emitting elements 101 are electrically connected to corresponding control ICs located on different sides in a crossing manner.
[0026]
【The invention's effect】
Taken together, the present invention provides a kind of light-emitting element array, which is a light-emitting element array having accurate positioning and light-guiding function, particularly by a plurality of light exit windows. Therefore, the present invention is an invention having novelty, inventive step and industrial value, and conforms to the requirements of patent. It should be noted that any modification or alteration of details that can be made based on the present invention belongs to the scope of the present invention.
[Brief description of the drawings]
FIG. 1 is a plan view of a known light emitting element array.
FIG. 2 is a three-dimensional display diagram of the known structure of FIG.
FIG. 3 is a three-dimensional display diagram of another known light-emitting element array.
FIG. 4 is a cross-sectional view of the known structure of FIG.
FIG. 5 is an exploded structural view of a preferred embodiment of the present invention.
FIG. 6 is a view showing a combination of light emitting element arrays according to the present invention.
FIG. 7 is a sectional view taken along the line II-II of the light emitting element array of the present invention.
FIG. 8 is a sectional view taken along the line III-III of the light emitting element array of the present invention.
FIG. 9 is a structural sectional view of another embodiment of the present invention.
FIG. 10 is an exploded structural view of still another embodiment of the present invention.
FIG. 11 is a combination display diagram of the embodiment of FIG. 10 of the present invention.
[Explanation of symbols]
REFERENCE SIGNS LIST 100 light emitting device array device 102 light emitting device array device 11 substrate 112 array gap 12 wire bonding region 14 active layer 16 current spreading layer 162 current spreading layer 17 insulating layer 18 second electrode 19 first electrode 31 substrate 32 first connection circuit 331 Element array device 332 Light emitting device array device 333 Light emitting device array device 339 Array gap 34 Second connecting circuit 35 Control IC 36 Third connecting circuit 38 Light emitting area 41 Light emitting element 42 First bonding layer 44 Second bonding layer 45 Fourth bonding layer 46 Third bonding layer 48 Second electrode 49 First electrode 51 Substrate 52 First connecting circuit 531 Light emitting device array device 532 Light emitting device array device 533 Light emitting device array device 539 Array gap 54 Second connecting circuit 55 Control IC
551 predetermined arrangement area 555 predetermined arrangement area 56 third connection circuit 57 light emitting window 58 light emitting area 59 reflective layer 61 light emitting element 62 first bonding layer 64 second bonding layer 65 fourth bonding layer 66 third bonding layer 67 package layer 68 2 electrode 69 first electrode 71 substrate 75 package layer 77 light emission window 777 slanted side wall 79 reflection layer 90 silicon substrate 91 light emission window 92 control IC predetermined arrangement area 95 extension circuit first contact area 93 reflection layer 99 control circuit first contact area 97 Control circuit 103 Extension circuit second contact area 100 LED substrate 101 LED light emitting element 105 Extension circuit 129 Control circuit second contact area 120 Control IC

Claims (26)

In the light emitting element array,
A substrate, on which at least a plurality of second connection circuits, and a plurality of light exit windows penetrating the substrate are provided, each light exit window corresponding to one of the second connection circuits,
At least one light-emitting element array device, a plurality of light-emitting elements are provided thereon, each light-emitting element has a first electrode and a second electrode, and the light-emitting element array device is continuously provided on the substrate surface; The at least one light-emitting element array device, wherein each light-emitting element is located in a vertically extending position of a corresponding light-emitting window, and the second electrode is electrically connected to a second connection circuit;
Said at least one control IC being at least one control IC, being connected to said substrate surface, and being electrically connected to a corresponding second connection circuit;
A light-emitting element array, comprising: 2. The light emitting element array according to claim 1, wherein at least one first connection circuit is provided on the substrate, and a first electrode of each light emitting element is electrically connected to the corresponding first connection circuit. , Light emitting element array. The light-emitting device according to claim 1, wherein at least one third connection circuit is provided on the substrate, and the third connection circuit of each light-emitting device is electrically connected to the control IC. array. The light emitting element array according to claim 1, wherein a reflection layer is provided in the light exit window. The light emitting element array according to claim 1, wherein a package layer is provided in the light exit window. The light emitting element array according to claim 5, wherein the package layer is formed of any one of a light transmitting resin layer, a light transmitting layer, a phosphor, an oxygen-containing resin, and a combination thereof. The light emitting element array according to claim 1, wherein an outer surface of the light exit window is covered with a light transmitting layer. The light-emitting element array according to claim 7, wherein the light-transmitting layer is formed of one of a color filter, a color conversion layer, glass, an oxygen-containing resin, and a combination thereof. The light emitting element array according to claim 1, wherein the light exit window has a conical shape. 2. The light emitting device array according to claim 1, wherein the substrate is any one of a printed substrate, a silicon substrate, a semiconductor material substrate, a light transmitting or light transmitting substrate, and a combination thereof. In the light emitting element array,
A substrate, on which at least a plurality of second connecting circuits, at least one third connecting circuit, and a plurality of cone-shaped light emitting windows each having a cone shape penetrating the substrate are provided; Said board corresponding to one of the connecting circuits;
At least one light-emitting element array device, a plurality of light-emitting elements are provided thereon, each light-emitting element has a first electrode and a second electrode, and the light-emitting element array device is continuously provided on the substrate surface; The at least one light-emitting element array device, wherein each light-emitting element is located in a vertically extending position of a corresponding conical light-emitting window, and the second electrode is electrically connected to a second connection circuit;
At least one control IC which is at least one control IC, is connected to the substrate surface, and is electrically connected to the corresponding second connection circuit and third connection circuit;
A light-emitting element array, comprising: 12. The light emitting element array according to claim 11, wherein at least one first connection circuit is provided on the substrate, and a first electrode of each light emitting element is electrically connected to the corresponding first connection circuit. , Light emitting element array. The light emitting element array according to claim 11, wherein a reflection layer is provided in the conical light exit window. The light emitting device array according to claim 11, wherein a package layer is provided in the conical light exit window, and the package layer is formed of any one of a light-transmitting resin layer, a light-transmitting layer, a phosphor, an oxygen-containing resin, and a combination thereof. A light-emitting element array, comprising: The light-emitting element array according to claim 11, wherein the outer surface of the conical light-emitting window is covered with a light-transmitting layer, and the light-transmitting layer is a color filter, a color conversion layer, glass, an oxygen-containing resin, or a combination thereof. A light-emitting element array, which is formed. 2. The light emitting device array according to claim 1, wherein the substrate is any one of a printed substrate, a silicon substrate, a semiconductor material substrate, a light transmitting or light transmitting substrate, and a combination thereof. In the light emitting element array,
A substrate, on which at least one of a first connecting circuit, a second connecting circuit, a third connecting circuit and a plurality of light exit windows penetrating the substrate are provided, each light emitting window being connected to the first connecting circuit and the second connecting circuit; Said substrate, located between the circuits,
At least one light-emitting element array device, a plurality of light-emitting elements are provided thereon, each light-emitting element has a first electrode and a second electrode, and the light-emitting element array device is continuously provided on the substrate surface; Each light emitting element is located in the vertical extension position of the corresponding light exit window, and the first electrode is electrically connected to the corresponding first connection circuit, and the second electrode is electrically connected to the corresponding second connection circuit. Connected to the at least one light emitting element array device,
The at least one control IC, which is provided between the second connection circuit and the third connection circuit on the substrate surface, and is electrically connected to the corresponding second connection circuit and the third connection circuit, respectively. At least one control IC;
A light-emitting element array, comprising: The light emitting element array according to claim 17, wherein the light exit window is formed in a conical shape. 18. The light emitting element array according to claim 17, wherein a reflection layer is provided in the light exit window. The light emitting element array according to claim 17, wherein a package layer is provided in the light exit window. In the light emitting element array,
A substrate provided with at least one hole, a plurality of extension circuit first contact regions are embedded in the substrate, and the extension circuit first contact region corresponds to a control circuit first contact region corresponding to one control circuit. The substrate, wherein the substrate is electrically connected, and the control circuit first contact area is located within a control IC predetermined arrangement area of the substrate;
At least one light emitting element array device provided with a plurality of light emitting elements, each one light emitting element is electrically connected to a corresponding extension circuit second contact region by an extension circuit, and the light emitting element array device is provided on the substrate. The at least one extending circuit second contact area is electrically connected to the extending circuit first contact area of the substrate when being connected to the surface, and the plurality of light emitting elements are aligned and arranged in the hole. One light emitting element array device;
At least one control IC having a plurality of control circuit second contact areas provided therein, which is provided continuously in a predetermined arrangement area of the control IC on the board, and the control circuit second contact area is provided on the control circuit first contact area of the board. Said at least one control IC electrically connected to a contact area;
A light-emitting element array, comprising: 22. The light emitting element array according to claim 21, wherein the holes have a V shape. 22. The light emitting element array according to claim 21, wherein the holes are formed in an elongated shape. 22. The light emitting element array according to claim 21, wherein at least one reflective layer is provided on a side of the hole. 22. The light emitting device array according to claim 21, wherein the substrate is any one of a printed substrate, a silicon substrate, a semiconductor material substrate, and a combination thereof. 22. The light emitting device array according to claim 21, wherein a package layer is provided in the hole, and the package layer is formed of any of a light-transmitting resin layer, a light-transmitting layer, a phosphor, an oxygen-containing resin, and a combination thereof. A light-emitting element array, characterized in that:

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