JPH0688658B2 - Substrate separation and transport device from carrier - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate separating / conveying device from a carrier in an automatic soldering device, and more particularly to separating a substrate from a carrier after dip-type soldering is completed and lead wires are cut. The present invention relates to a substrate separating / conveying device which can be conveyed to the outside of a return mechanism of a carrier with good timing and can be sent out as a single substrate to a subsequent process such as a subsequent jet soldering device.

2. Description of the Related Art Conventionally, a dip-type soldering device suitable for soldering electronic components with long lead wires has a lead wire cutter device integratedly arranged in the subsequent step, and in addition to this, a substrate is attached to a carrier. A so-called round type automatic soldering device in which a jet soldering device is integrally arranged in a U-turned transport path is put to practical use.

However, in this round type automatic soldering device, the substrate is conveyed while being attached to the carrier in all the steps, and therefore, in the jet soldering device, the substrate may be conveyed in a close contact state, but the extra carrier As a result of the useless spacing between the substrates by such a length, the number of passing substrates per unit time is reduced. That is, since the transfer speed of the substrate in the jet solder bath is determined to be 1200 mm / min, for example, the speed of the conveyor in the jet soldering device should be kept constant regardless of the existence of the carrier. There must be. Therefore, for example, for a substrate with a length of 400 mm, if there is a carrier, the length including the edge of the carrier is 50
0mm, and if the distance between carriers is 200mm, 2
A single board occupies a length of 1200 mm, and a jet solder bath with a speed of 1200 mm per minute can process only two boards per minute. Therefore, even if the dip type soldering device
Even if it is a 20-second tact device and has a processing capacity of 3 sheets per minute, it must be reduced to a processing speed of 2 sheets per minute according to the capacity of the jet soldering device. The efficiency will be reduced to 2/3.

Therefore, when the round type automatic soldering device is not used, the 20-second tact substrate after the cutting of the lead wire is manually removed from the carrier, and the substrate is mounted on the conveyor of the jet soldering device as a single unit in close contact. Let's continue, also 20
I was able to process in seconds tact.

However, according to this method, one worker is required for the dip-type soldering device and the cutter device, one for separating and transferring the board, and one for the jet-type soldering device. Although the production efficiency is higher than that of the automatic die soldering device, there is a drawback that the number of workers required is three times.

Further, in the prior art, at present, there is no device capable of automatically separating the substrate from the carrier and transporting it to the outside of the carrier return mechanism in a timely manner.

Also, Japanese Utility Model Publication No. 53-33984 discloses an automatic transfer device in which a mechanism for holding and transferring a plate-like body is detected and controlled by a positioning switch. In the conventional example, a passage is provided. An automatic transfer device capable of performing a consistent assembling work by connecting the conveyor mechanism separated by the above without closing the passage and the like, which is unrelated to the automatic soldering device, and is simply a pair of The present invention is merely an invention that is different from the present invention in that it has a conveyor mechanism, detects a transported object, and controls its movement, and that its purpose, configuration, and operational effect are completely different.

In addition, Japanese Utility Model Publication No. 57-32988 discloses an automatic soldering device for gripping and conveying a substrate. The conventional example is a so-called round type automatic soldering device similar to that described above, However, the purpose of the present invention is completely different from that of the present invention, and there is no need for a substrate separating device for separating the substrate from the carrier, and there is no need for a carrier return mechanism. However, it is irrelevant to the present invention in which these are indispensable constituent elements.

Further, Japanese Patent Publication No. 55-39491 discloses an electrode plate aligning machine which includes a timer for controlling the sandwiching type transfer device. In this conventional example, the distance between the electrode plates in the electrolytic cell is constant. In this way, the electrode plates can be arranged in advance in such a state on the conveyors facing each other in the electrolytic cell so that the timer can be used to control the transfer of the transported object. However, the present invention is a different invention having completely different purposes, configurations, and operational effects,
In particular, the invention is unrelated to the automatic soldering device.

Aim The present invention has been made to eliminate the above-mentioned drawbacks of the prior art, and an object of the present invention is to allow at least a part of a gripping tool for gripping a substrate to be retracted to a release position of the substrate. A carrier, a carrier position sensor,
A timer for timing the return mechanism of the carrier, an operating device for opening the holding tool of the carrier to separate the substrate from the carrier, and a transfer device for mounting the substrate dropped from the carrier and transferring it to the outside of the carrier return mechanism. A device for receiving a substrate sent from the transfer device and delivering it to the next process, which is configured to be vertically swingable around a horizontal rotation axis and sends the substrate further upward or downward. And a carrier device configured as described above, so that the substrate whose lead wires have been cut can be automatically separated from the carrier so that the next process having different heights can be carried. It is to achieve labor saving of one worker. Still another object is to realize the board separating and conveying device from the carrier as described above, thereby making it possible to connect the dip type soldering device and the jet type soldering device as an automated line without using the round type. In the jet soldering apparatus, the substrates are individually brought into intimate contact with each other so that, for example, three substrates can be processed per minute with a takt time of 20 seconds to improve the production efficiency.

In summary, the present invention relates to a carrier configured such that at least a part of a gripping tool that grips a side surface of a substrate can be retracted to a release position of the substrate, a carrier position sensor that detects arrival of the end point of the carrier, and the carrier. A timer that starts a timing operation by a signal from a position sensor and operates a return mechanism of the carrier after a predetermined time, and a timer that operates by a signal from the carrier position sensor to retract a gripping tool of the carrier to move the substrate An actuation device for separating from the carrier,
A carrier device for mounting the substrate which has been separated from the carrier and dropped, and carrying the substrate to the outside of the carrier return mechanism;
A device for receiving the substrate sent from the transfer device and delivering it to the next step, which is configured to be swingable in the vertical direction about a horizontal rotation axis so that the substrate is directed further upward or downward. And a transfer device configured to send out.

The present invention will be described below based on the embodiments shown in the drawings. First
1 to 6, a carrier-separating / conveying device 1 from a carrier according to the present invention includes a carrier 2, a carrier position sensor 3, a timer (not shown), an operating device 4, and a carrier device 5. There is.

As shown in FIGS. 3 and 4, the carrier 2 has an aluminum edge member 2a formed in a square shape and four elongated holes 2b formed in the edge member. Nut 6
Thus, the pair of grippers 8 and 9 are movably attached to the left and right sides in the traveling direction of the substrate 10. The gripper 8 is a side surface of the substrate 10.
10a is gripped and the other side surface 10b is gripped by the gripper 9, and a plurality of claw members 11 are attached to the lower ends of the grippers 8 and 9, respectively, and are formed at the lower ends of the claw members. Groove 11
The substrate 10 is configured to be engaged with and held by a.

The gripping tool 8 has a movable member 14 rotatably attached via a hinge 8a, the claw member 11 is attached to the movable member 14, and the movable member is provided with a torsion spring 15 as shown in FIGS. In the figure, the claw member 11 is pressed to the right, and the substrate 10 is pressed against the claw member 11 on the gripping tool 9 side. A rod member 16 is implanted in the movable member 14, and the rod member is the carrier 2
The head 16a formed on the uppermost portion of the claw 11a is pressed by the actuating device 4 in the direction of arrow A so that the claw member 11 can be retracted to the release position of the substrate 10 as indicated by arrow H.

In the illustrated embodiment, the claw member 11 of the gripping tool 8 is movable, and the claw member 11 of the gripping tool 9 is fixed.
It is obvious that the claw member 11 of the gripper 9 may also be movable.

Further, the carrier 2 is carried on a guide rail (not shown) in the dip type soldering device 18, and is carried by a plurality of carrying conveyors 20, 21, 22 in the lead wire cutter device 19, and a longer lead is provided by the cutter 23. Lines (not shown) are cut, and in the substrate separating / conveying device 1 from the carrier according to the present invention, a pair of chains 25 driven by a plurality of sprockets 24 intermittently conveys to the end position. Is configured. The chain 25 is synchronously driven by a motor 28 via a gear 29, and is intermittently driven according to the takt time of the dip type soldering device 18, so that the carrier 2 and the carrier position sensor 3 are arranged. It is designed to be transported to the end point position.

The carrier position sensor 3 detects the arrival of the end point of the carrier 2 and is composed of, for example, a limit switch. The front end 2c of the carrier 2 presses the actuator 3a of the carrier position sensor 3 as indicated by the arrow G, so that a signal indicating that the carrier 2 has reached the end point is sent to the timer.

The timer starts a timing operation by a signal from the carrier position sensor 3 and after a predetermined time, returns mechanism of the carrier 2.
It is designed to activate 28. This is because it is necessary to stop the carrier return mechanism 28 until the substrate 10 released from the carrier 2 and dropped downward is completely carried outside the carrier return mechanism 28. For example, about 5 seconds is sufficient.

The operating device 4 is operated by a signal from the carrier position sensor 3 to retract the claw member 11 of the holding tool 8 of the carrier 2 to the release position of the substrate 10 and separate the substrate 10 from the carrier 2. For example, the head portion of the rod member 16 is formed by the pressing member 34 attached to the tip of the piston rod 33 of the air cylinder 32 fixed to the bracket 31 fixed to the base 29 with the bolt 30 protruding as shown by arrow A. A guide bar 35 configured to press 16a and for preventing the pressing member 34 from falling is fixed to the pressing member 34, and the guide bar is guided by a groove 31a formed in the bracket 31. The air cylinder 32 is configured to operate at the same time when the timer starts counting time.

The carrier device 5 separates the substrate 10 from the carrier 2 and drops it.
Is mounted and conveyed to the outside of the carrier return mechanism 28.In the illustrated embodiment, a wide and soft belt 38 is wound around a pair of pulleys 39, 40 and is constantly driven by a motor (not shown). Alternatively, it is adapted to be rotationally driven intermittently, and when the substrate 10 falls onto the soft belt 38, the soft belt 38 is moving in the direction of arrow C and the substrate 10 is provided outside the carrier return mechanism 28. The transfer device 41 can be transferred onto the soft belt 42 of the other transfer device 41. The carrier device 5 has a carrier return mechanism 28.
And is configured to be able to descend together with the vertically movable member 44 slidably supported by the guide rod 43 as indicated by arrow B.

Further, the sprocket 24 and the chain 25 are also mounted on the vertically movable member 44 in the same manner as the transport device 5, and are configured to move vertically with the vertically movable member.

The transfer device 41 receives the substrate 10 from the transfer device 5, and transfers the substrate 10 to a transfer mechanism 48 to the jet type soldering device 46 as shown in FIG.
6 is swingable from the state shown by the solid line in FIG. 6 to the positions shown by the phantom lines in the vertical direction, so that the substrate 10 can be sent further upward or downward.

Next, the carrier return mechanism 28 will be described. As shown in FIG. 6, the carrier return mechanism 28 is conveyed in the dip-type soldering device 18 in the direction of the arrow D, and the carrier return mechanism 28 is moved in the cutter device 19 of the lead wire. After the substrate 10 that has passed in the direction is separated and conveyed from the carrier 2, it is operated to lower the carrier 2 as indicated by an arrow B and pass the lower portion of the dip type soldering device 18 as indicated by an arrow E to remove the emptied carrier 2. For returning to the inlet 18a of the dip type soldering device 18, a pair of transfer devices 50 is provided at the bottom of the base 29, and the transfer devices are wound around a pair of pulleys 51. The belt 52 is configured to intermittently rotate in the direction of arrow E to return the carrier 2 in the same direction, and the leg 2d of the empty carrier 2 is mounted on the belt 52. It ’s put on, and the chain 25 Released from carrier 2
Is placed on the belt 52 and conveyed in the direction of arrow E.

One end of a rope 53 is fixed to the vertically movable member 44 by a bolt 54, and the rope 53 is rotatably attached to the vertically movable member 44 and a guide pulley 55 is rotatably attached to a base 29. It is wound around a guide pulley 60 rotatably attached to the piston rod 59 of the air cylinder 58 and the air cylinder 58, and the other end is locked to the base 29 by a locking member 61. The piston rod 59 of the air cylinder 58 is configured to move up and down to the position shown by the solid line and the imaginary line in FIG. 6 to move the vertically movable member 44 up and down via the rope 53.

Operation The present invention is configured as described above, and its operation will be described below. The board 10 on which electronic components (not shown) are mounted is gripped by the claw members 11 of the grippers 8 and 9 of the carrier 2 on the left and right side surfaces 10a and 10b, respectively. In the state where the long lead wire is still attached, the electronic component is soldered, then sent to the lead wire cutter device 19 and the lead wire is cut short by the pair of rotary cutters 23, and then the present invention is concerned. When it is sent from the carrier to the substrate separating / transporting apparatus 1, the gear 28 is rotated by the motor 28, whereby the chain 25 is rotated in the traveling direction via the pair of sprockets 24, and the carrier 2 has its front end 2c at the carrier position. It advances until it abuts on the actuator 3a of the sensor 3, and the actuator 3a is pressed by the front end 2c as shown by an arrow G to stop the motor 28, and at the same time, the carrier position sensor is pressed. Connected timer 3 starts time counting operation, which as to the air cylinder 32 of the actuating device 4 is activated at the same time, projecting the piston rod 33 in the direction of arrow A, the rod head member 16 16
A is pressed to a position indicated by an imaginary line in FIG. 5 via the pressing member 34 as indicated by an arrow A, and as a result, the rod member 16 rotates and the movable member 14 of the gripping tool 8 resists the torsion spring 15. It rotates as indicated by an arrow H, and as a result, the claw member 11 retracts to a position where the substrate 10 is released as shown by an imaginary line. As a result, the side surface 10a of the substrate 10
Is released, it begins to descend as indicated by arrow F. As a result, the side surface 10b on the right side in the traveling direction is also disengaged from the claw member 11, and the substrate 10 is on its lower side.
Falls on 38. Then, the substrate 10 is received by the soft belt 38 without any impact, and because the soft belt 38 is rotating in the direction of the arrow C, the substrate 10 is sent in the same direction and is delivered onto the soft belt 42 of another carrying device 41. . In this way, it takes about 5 seconds for the substrate 10 to be transferred from the carrier return mechanism 28 to the transfer device 41 and to the outside.
The timer stops the carrier return mechanism 28 for this 5 seconds.

After 5 seconds, the air cylinder 32 of the actuator 4
Since the supply of air to the is stopped, the pressing member 34 returns to the original position, the claw member 11 is returned to the position where the next substrate 10 can be gripped, and along with this, the air cylinder 58 operates and its piston rod. 59 projects upward and rises to the position shown by the phantom line in FIG. As a result, the vertically movable member 44 is guided by the guide rod 43 and descends to the lowermost position of the base 29 together with the chain 25, the carrier 5 and the carrier 2 as shown by the arrow B. As a result, the lower end of the leg portion 2d of the carrier 2 is located at the carrier device.
The carrier 2 is placed on the upper surface of the belt 52 of 50, the carrier 2 is released from the chain 25, and the belt 52 is rotating in the direction of the arrow E. Therefore, the carrier 2 is again dip type soldering device.
It is returned to the inside of 18 and conveyed toward its entrance 18a.

It should be noted that in the above-described embodiment, the conveying device 5 is described as a wide flexible belt, but this is not limited to the belt having such a structure, and the substrate of the carrier 2 is temporarily used.
In FIG. 6, a transfer device (not shown) may be used, which projects from the left side in FIG. 6 to a position where 10 is dropped, and then advances to the left side in the drawing, and any other structure. It may be one. Further, it is obvious that the gripping tool 9 of the carrier 2 may be configured so that the claw member 11 can be retracted to the release position of the substrate 10, like the gripping tool 8.

Advantageous Effects of Invention The present invention provides a carrier configured such that at least a part of the gripping tool for gripping a substrate as described above can be retracted to the release position of the substrate, a carrier position sensor, and a timer for timing the carrier return mechanism. An operating device that opens the holding tool of the carrier to separate the substrate from the carrier, a transport device that mounts the substrate dropped from the carrier and transports it to the outside of the carrier return mechanism, and a substrate that is delivered from the transport device and then receives the substrate. Since it is a device for transferring to a process, it is provided with a transfer device configured to be capable of swinging in the vertical direction around a horizontal rotation axis and configured to send the substrate further upward or downward. , The substrate whose lead wire has been cut can be automatically separated from the carrier, and can be carried to the next process with different heights.
As a result, there is an effect that labor saving of one worker can be achieved. In addition, the realization of the substrate separating and transporting device from the carrier as described above allows the use of the round type,
It is possible to connect the dip-type soldering device and the jet-type soldering device as an automated line, and in the jet-type soldering device, the board can be brought into close contact with itself and transported, for example, with a takt time of 20 seconds every time. The effect is that three substrates can be processed, and the production efficiency can be improved.

[Brief description of drawings]

The drawings relate to the embodiment of the present invention. FIG. 1 is a perspective view of a substrate separating / transporting device from a carrier in a state where the carrier is removed, FIG. 2 is a perspective view showing a lower portion of a carrier return mechanism, and FIG. 3 is a carrier. FIG. 4 is a plan view of the substrate separating and transferring apparatus from FIG. 4, FIG. 4 is a vertical sectional view taken along the line IV-IV of FIG. 3, FIG. 5 is an enlarged front view of a portion taken along the line V of FIG. 4, and FIG. FIG. 7 is a side view showing a substrate separating and conveying device, a carrier returning mechanism and other conveying devices, and FIG. 7 is a diagram showing a substrate from a carrier according to the present invention with a dip soldering device, a lead wire cutter device and a jet soldering device. It is a side view which shows the Example linearly connected by the separation conveyance apparatus. 1 is a device for separating and transferring a substrate from a carrier, 2 is a carrier,
3 is a carrier position sensor, 4 is an actuator, 5 and 41 are conveying devices, 8 and 9 are grippers, 10 is a substrate, 10a and 10b are side surfaces, and 28 is a carrier return mechanism.

Claims (1)

[Claims] 1. A carrier configured such that at least a part of a gripping tool for gripping a side surface of a substrate is retractable to a release position of the substrate, a carrier position sensor for detecting arrival of the end point of the carrier, and the carrier position sensor. From the carrier to start the timing operation by a signal from the carrier and to operate the return mechanism of the carrier after a predetermined time, and to operate the signal from the carrier position sensor to retract the grasping tool of the carrier to move the substrate from the carrier. An operating device for separating, a carrier device for mounting the substrate separated and dropped from the carrier and carrying it to the outside of the carrier return mechanism, and a substrate sent from the carrier device for receiving and delivering to the next step. And a device for moving the substrate further upward or downward and configured to be swingable in the vertical direction about a horizontal rotation axis. Substrate separation conveying device from the carrier, characterized in that a configured transport device to issue.