JPH0686038U - Thermal anomaly detector - Google Patents

Abstract

(57) [Summary] [Object] To provide a thermal anomaly detection device with an image processing mechanism that exhibits an excellent superimposed display function without requiring a complicated optical system or an expensive infrared imaging device. An image pickup unit 1 having a built-in infrared image pickup device and a visible light image pickup device, an image processing device 2 for superposing a thermal image picked up by the infrared image pickup device on a visible image picked up by the visible light image pickup device, and a superimposed image. In a device configuration including a monitor 3 for displaying, a spectroscopic means (half mirror 5, total reflection mirror 7) for splitting incident light from a monitored object into a visible region and an infrared region, and a range from a visible region to a near infrared region A structure having the CCD camera 8 for imaging visible light and the CCD camera 6 for imaging infrared light, which have high sensitivity and have the same performance, as the imaging unit 1.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a thermal anomaly detection device having a mechanism for performing image processing of incident light from an object to be monitored and highlighting a thermal anomaly location.

[0002]

[Prior art]

 As a means of detecting thermal anomalies by monitoring the image of incident light, the visible light camera and an infrared camera set separately from this are used to image the brightness of the monitored object, and the temperature is displayed on the resulting visible image by image processing. A method has been developed in which the status and temperature distribution of the monitored object are simultaneously grasped by superimposing and displaying the thermal images (Japanese Patent Laid-Open No. 61-207936).

[0003]

[Problems to be solved by the device]

 However, in the device used for the thermal abnormality detection means, the visible light camera and the infrared camera often use completely different image pickup elements, and therefore the visible light camera and the infrared camera must be equipped with separate lens systems. There are structural difficulties. Especially when a zoom lens is used, the design of the optical system becomes more complicated. Moreover, since infrared imaging devices with high resolution are extremely expensive, infrared cameras are often used with lower resolutions than visible light cameras. Is difficult to distinguish, and the superimposition display effect cannot be fully exerted.

The present invention was developed to solve the above-mentioned problems, and an object thereof is to perform image processing that exhibits an excellent superimposed display effect without requiring a complicated optical system or an expensive infrared imaging device. It is to provide a thermal abnormality detection device using a mechanism.

[0005]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, a thermal anomaly detection device according to the present invention includes an infrared imaging device for capturing a thermal image of an object to be monitored and a visible light imaging device for capturing a visible image. And an image processing device for superimposing a thermal image captured by the infrared imaging device on a visible image captured by the visible light imaging device, and a monitor for displaying the superimposed image. A spectroscopic means for splitting the incident light from the object into visible and infrared regions, and a CCD camera for visible light imaging and infrared light imaging, which have sensitivity in the visible to near-infrared range and have the same performance The structural feature is that the image pickup unit is equipped with a CCD camera.

In the device configuration of the present invention, the spectroscopic means for separating the incident light from the monitored object into the visible region and the infrared region is visible on the optical axis incident on the CCD camera for infrared light imaging. A structure in which a half mirror that reflects light rays and transmits infrared rays is installed, and a total reflection mirror that focuses an image on a CCD camera for infrared light imaging is placed on the optical axis of the reflected visible light rays is preferably used. It

In addition, a visible light imaging CCD camera and an infrared light imaging CCD camera having the same performance mean that these two series of CCD cameras have the same size, resolution, and photometric sensitivity characteristics of the image pickup device. This means that it is not necessary to use a high-resolution image sensor for a CCD camera for infrared light imaging.

[0008]

[Action]

 In the thermal anomaly detection device of the present invention, incident light is split into a visible region and an infrared region through a spectroscopic unit equipped in the image pickup unit, visible light is reflected by a CCD camera for visible light imaging, and infrared light is detected by infrared light. An image is formed by being divided on each of the image pickup CCD cameras. Both the CCD camera for visible light imaging and the CCD camera for infrared light imaging have the same performance as the sensitivity from the visible range to the near-infrared range. It provides a display effect that is easy to distinguish when a thermal image is superimposed on a visible image captured by a visible light imaging CCD camera. Therefore, it becomes possible to accurately detect the thermal abnormality location of the monitored object by the monitor display.

[0009]

【Example】

 Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments. FIG. 1 is an explanatory view of a mechanism showing a thermal anomaly detection device (detection temperature range: 500 ° C. or higher) according to the present invention. Reference numeral 1 is an image pickup unit, 2 is an image processing device, and 3 is a monitor. A zoom lens optical system 4 is provided on the front surface of the image pickup unit 1 for collecting incident light from the monitored object and entering the light into the image pickup unit.

Inside the image pickup unit 1, a half mirror 5 and an infrared light image pickup CCD camera 6 are arranged on the optical axis of the incident light, a total reflection mirror 7 for receiving the reflected light of the half mirror 5 and the light thereof. A visible light imaging CCD camera 8 is set on the axis. The half mirror 5 splits light at a wavelength of 800 nm as a boundary, transmits infrared light having a wavelength of 800 nm or more, forms an image on the CCD camera 6 for infrared light imaging, and reflects visible light shorter than 800 nm in wavelength. It has a function. Therefore, the reflected visible light is imaged on the visible light imaging CCD camera 8 via the total reflection mirror 7. At this time, since there is a certain correlation between the brightness of the near-infrared light imaged on the CCD camera 6 for infrared light imaging and the temperature of the object to be monitored, the infrared light imaging is performed. The CCD camera for use 6 can capture a thermal image.

FIG. 2 schematically shows the spectral sensitivity characteristics of the image pickup device equipped in the CCD camera used. The spectral sensitivity characteristic as a whole exhibits a sensitivity curve as shown in (a), but the spectral sensitivity characteristic of the infrared camera CCD camera 6 apparently has sensitivity only in the near infrared region as shown in (b). Further, the spectral sensitivity characteristic of the CCD camera 8 for imaging visible light is apparently sensitive only to visible light as shown in (c).

The thermal image captured by the infrared light imaging CCD camera 6 and the visible image captured by the visible light imaging CCD camera 8 are each converted into image signals and input to the image processing device 2. In the image processing apparatus 2, preferably, in order to facilitate discrimination of the thermal image, color coding or luminance enhancement is performed according to the temperature of the monitored object, and then the thermal image is displayed on the monitor 3 by being superimposed on the visible image. To do. As a result, it is possible to easily detect the abnormal heat spot of the monitored object by monitoring the fluctuation of the overlapping image displayed on the monitor 3.

[0013]

[Effect of device]

 As described above, according to the thermal anomaly detection device of the present invention, by combining the spectroscopic means of the simple mechanism, the infrared light image pickup CCD camera and the visible light image pickup CCD camera to form the image pickup section, a complicated optical It is possible to accurately detect thermal anomalies in the monitored object based on the image superimposing mechanism without the need to equip a system or expensive infrared imaging device. Therefore, for example, it is extremely useful as a device for heat management in a heating step of exceeding 500 ° C.

[Brief description of drawings]

FIG. 1 is a mechanism explanatory view showing a thermal abnormality detection device according to an embodiment of the present invention.

2A and 2B schematically show the spectral sensitivity characteristics of the CCD camera for imaging used in the embodiment, where FIG. 2A is the overall spectral sensitivity characteristics, and FIG. 2B is the spectral sensitivity of the CCD camera for infrared light imaging. The characteristic, (c) is the spectral sensitivity characteristic of the CCD camera for visible light imaging.

[Explanation of symbols]

 1 Imaging Unit 2 Image Processing Device 3 Monitor 4 Zoom Lens Optical System 5 Half Mirror 6 Infrared Light Imaging CCD Camera 7 Total Reflection Mirror 8 Visible Light Imaging CCD Camera

Claims (1)

[Scope of utility model registration request] 1. An infrared imaging device for capturing a thermal image of an object to be monitored, and an imaging unit including a visible light imaging device for capturing a visible image; and a thermal image captured by the infrared imaging device. In a device configuration including an image processing device for superimposing on a visible image captured by a visible light image capturing device and a monitor for displaying the superimposed image, the incident light from the monitored object is split into a visible region and an infrared region. And an infrared light imaging CCD camera that has sensitivity in the visible to near-infrared range and has the same performance as the visible light imaging CCD camera and the infrared light imaging CCD camera. Thermal abnormality detection device.