JPH0683910A - Wiring area determining device - Google Patents

Abstract

PURPOSE:To improve the efficiency of manufacture by relaxing the manufacture conditions of wiring on a printed circuit board. CONSTITUTION:This wiring area determining device is provided with X- directional and Y-directional high-density wiring area calculating means 10A and 10B which divide the printed board based upon wiring design data obtained previously in a preprocessing stage in an X and a Y direction and calculate X-directional and Y-directional high-density wiring areas from rat nest density values of the respective divided areas, a high-density wiring area determining means 10C which determines a rectangular high-density wiring area from the high density wiring areas calculated by those area calculating means 10A and 10B, and a low-density wiring area determining means 10D which determines areas other than the high-density wiring area as low-density wiring areas.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring area determining device used when automatic wiring is performed using a printed circuit board design support system or the like. The present invention relates to a determined wiring area determining device.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 8, an automatic wiring processing technique for a printed circuit board is capable of automatically wiring three or more conductor patterns 3 between two pins P, P on the entire surface of the printed circuit board 1. It is being appreciated. Therefore, this automatic wiring process is an automatic wiring system under the so-called same wiring condition in which a high-density pattern of three or more pins is wired over the entire printed circuit board 1.

[0003]

However, in such an automatic wiring of a high-density pattern having three or more pins P and P, a high-level manufacturing technique for manufacturing the printed circuit board 1,
That is, an advanced plating manufacturing technique or the like for forming three or more conductor patterns 3, ... Between the very narrow pins P-P without short-circuiting is required, and as described above, the pins P, Since the wiring is performed under the same wiring condition of three or more between Ps, there is a problem that the wiring manufacturing conditions of the printed circuit board 1 become very strict and the manufacturing efficiency significantly decreases.

The present invention has been made in view of the above-mentioned circumstances, and the entire area of the printed circuit board is divided into a high density area and a low density area from the rat nest density of the wiring design data, thereby improving the manufacturing efficiency. An object is to provide a determining device.

[0005]

In order to solve the above-mentioned problems, the invention corresponding to claim 1 divides the printed circuit board in the X direction sequentially based on a predetermined first division width data, and each of these is divided. X-direction high-density area calculating means for calculating the X-direction high-density wiring area from the rat nest density of the wiring design data of the printed-circuit board in the divided area, and Y of the printed board based on the predetermined second division width data. Y-direction high-density area calculating means for sequentially dividing the area in each direction and calculating a Y-direction high-density wiring area from the rat nest density of the wiring design data of the printed circuit board in each of the divided areas, and the X-direction and Y-direction high density. High-density wiring area determining means for determining the high-density wiring area of the printed circuit board from the coordinate data of the high-density wiring area calculated by the area calculating means; A wiring area determination device provided with a region other than the degree wiring region and a low-density wiring region determining means for determining a low-density wiring area of the printed circuit board.

[0006]

Therefore, in the invention corresponding to claim 1, since the means as described above are provided, the X-direction and Y-direction high-density area calculating means respectively calculates the X-direction and Y-direction of the printed circuit board based on the division width data. Direction, and the rat nest density of each of these divided areas is used to determine the X direction and the Y direction.
The coordinate value of the high-density wiring area in the direction is calculated and stored. After that, a rectangular high-density wiring area is determined from the coordinate values of the high-density areas in the X direction and the Y direction, and an area other than the high-density wiring area is determined as a low-density wiring area, and the high-density area of the printed circuit board is high. The area is set to a limited area to improve the manufacturing efficiency of wiring work.

[0007]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a hardware block diagram showing an embodiment of a wiring area determining apparatus according to the present invention, and FIG. 2 is a functional block diagram for explaining a main part of the apparatus of the present invention. In these figures, 10 is a data processing means using a computer for executing a predetermined process based on program data, and bus lines 11 such as addresses, data and control lines are derived from this data processing means 10. . A magnetic disk device 13 is connected to the bus line 11 via a disk control circuit 12. The magnetic disk device 13 stores various data regarding wiring conditions and other wiring, and further stores program data and the like as required.

Reference numeral 14 is a design data memory for storing design data at a preprocessing stage to be wired in advance, and the rat nest density is calculated based on the design data of the memory 14 as described later. The design data at the preprocessing stage may be stored in the magnetic disk device 13 or the like without using the dedicated memory 14. Reference numeral 15 is a buffer memory for temporarily storing the arithmetic processing data of the data processing means 10.

Further, on the bus line 11, an input device 17 such as a keyboard and a mouse is connected via an input port 16 and a CRT display device 19 is connected via a display control circuit 18.

Reference numeral 20 denotes an automatic wiring processor for executing wiring of the printed circuit board based on the automatic wiring processing data determined by the device of the present invention, which is connected to the bus line 11 via the drive control circuit 21. There is.

Next, the data processing means 10 realizes the function as shown in FIG. 2 based on the program data. That is, the data processing means 10 is the magnetic disk device 1
The division width data is read out from the data regarding the wiring of No. 3, and the memory 1 is read based on the division width data.
X-direction high-density area calculation for calculating the high-density wiring area in the X-direction of the printed board from the rat nest density of each divided area, which is the design data data stored in FIG. Similarly to the X direction of the printed circuit board, the means 10A is sequentially divided in the Y direction of the printed circuit board based on the division width data, and the high density wiring area in the Y direction of the printed circuit board is obtained from the rat nest density of each divided area. Y-direction high-density region calculation means 10B for calculation
And are provided. The high-density region referred to here is a wiring region that is assumed to pass between the pins, for example, three or more conductor patterns from the rat nest density.

Further, the data processing means 10 determines a rectangular high-density (for example, three or more pins) wiring area from the two high-density wiring areas calculated by the two area calculating means 10A and 10B. Density wiring area determining means 10
C, and a low-density wiring area determination that determines a low density (for example, two pins or less between pins) in an area other than the high-density wiring area of the rectangular shape determined by the high-density wiring area determination means 10C. Means 10D are provided.

Next, the operation of the wiring area determining device configured as described above will be described with reference to FIGS. 3 and 4 are flowcharts for explaining the operation of the device of the present invention, FIG. 5 is a diagram conceptually showing design data at a pretreatment stage including a printed circuit board stored in the wiring design data memory 14, and FIG. 6 is a diagram. 5 is an explanatory diagram for dividing the printed circuit board shown in FIG. 5 to determine a high-density wiring region, and FIG. 7 is a diagram divided into a high-density wiring region and a low-density wiring region by the device of the present invention.

That is, in the data processing means 10, the wiring design data including the printed circuit board in the pre-processing stage stored in the wiring design data memory 14 is read and transferred to, for example, the buffer memory 15. FIG. 5 shows wiring design data including the printed circuit board 25. However, in the wiring design data, although the positions of the pins 26, ... During wiring are fixed, the connection conductor paths 3, 3 between the pins 26, 26 are fixed.
4, etc. are to examine the rat nest density under certain conditions by virtually connecting the crossover wiring. Therefore, the data processing means 10 thereafter calculates the rat nest density while virtually connecting the pins 26 and 26 shown in FIG. 5 while sequentially dividing the printed circuit board 25.

That is, the data processing means 10 has a fixed parameter, for example, "2.54 mm width", which determines a division width for dividing the printed circuit board 25 in the X direction from various data regarding the wiring stored in the magnetic disk device 13. After reading the data, the printed board 25, which is the wiring design data stored in the buffer memory 15, is sequentially divided in the X direction using the read 2.54 mm width data (ST1). Then, the total number of divisions of the printed circuit board is set in the memory 15 and other counters, and the process proceeds to the next step ST2 to decrement the set value of the counter by "1".

Thereafter, as shown in FIG. 5, the rat nest density is calculated for a certain divided area of the printed circuit board in the X direction (ST3). The calculation of this rat nest density is
When both ends and one side of the rat nest are present in the divided area, they are counted as the number of rat nests, and when both ends of the rat nest are outside the divided area, they are not counted as the number of rat nests. Incidentally, four conductor paths "4", "5", "5", "7" are included in a certain divided area shown in FIG. Therefore, if the rat nest density (number) of the divided regions is calculated, this rat nest density is compared with a predetermined threshold value (ST4). This threshold value is for looking at the high density area. For example, when the number of pins is three, “3” is preset from the input device 17. Here, for example, the coordinates of the design origin are set to (0, 0), and when the rat nest density exceeds the threshold value, the minimum and maximum coordinate values of the divided area are stored (ST5).

Thereafter, it is judged from the contents of the counter whether or not there is a next divided area (ST6). When it is judged that there is a divided region, the process proceeds to step ST2, and "1" is subtracted from the contents of the counter. The rat nest density is calculated for the divided area. This series of processing is sequentially repeated for the total number of divisions.

As a result, it can be seen that the shaded area in FIG. 6A in the X direction of the printed circuit board 25 is a high density area. Then, after checking the rat nest density for all the divided areas, the minimum coordinate value is set to Xmin based on the coordinate values already stored in the memory 15 and
The maximum coordinate value is set to Xmax, the high-density wiring area in the X direction is determined, and the coordinate value data is stored in the memory 15 (ST7).

Also in the Y direction of the printed circuit board 25, a fixed parameter, for example, "2.54 mm width", which determines the division width for dividing the printed circuit board 25 in the Y direction from various data regarding the wiring from the magnetic disk device 13. While reading out the data, the wiring design data stored in the buffer memory 15 is 2.5 in the Y direction for the printed circuit board.
Steps ST8-ST shown in FIG.
The process of 14 is repeatedly executed to determine the high-density wiring region in the Y direction. FIG. 6B shows the determined state of the wiring area.

Subsequently, in the data processing means 10, the minimum coordinate value X in the X direction stored in the memory 15 is set.
min, the maximum coordinate value Xmax and the minimum coordinate value Ymin in the Y direction,
A rectangular high-density wiring area 27 as shown in FIG. 6C is determined using the maximum coordinate value Ymax (ST15), and the coordinate value data of the high-density wiring area 27 is used by the automatic wiring processor 20. It is enabled and stored in an appropriate memory.

Further, once the high-density wiring area 27 is determined, the area other than this high-density wiring area is determined as the low-density wiring area 28, and the coordinate values of this low-density wiring area 28 are similarly set in the automatic wiring processor. The data usable in 20 is converted and stored in the memory (ST16).

Therefore, according to the configuration of the above embodiment, the printed circuit board is sequentially virtually divided using the predetermined division width data in the X direction and the Y direction of the printed circuit board 25, and the rat of each divided area is divided. Since the high density area of the printed circuit board is determined while checking the nest density, it is not necessary to perform automatic wiring under the same wiring condition, that is, high density state over the entire board as in the past, and it is limited by the rat nest density. It is only necessary to implement high-density automatic wiring based on a high-density wiring area, and if other areas are defined as low-density wiring areas and automatic wiring is executed, all wiring on the printed circuit board will be ensured. It can be carried out.

Therefore, the high-density wiring area can be set in a limited manner as compared with the conventional specification of the high-density wiring area on the entire surface of the printed circuit board as in the automatic wiring, so that the area to which the high precision technique is applied is narrowed accordingly. It is possible to improve the manufacturing efficiency of the printed circuit board.

In the above embodiment, one rectangular high-density wiring region is determined as shown in FIG. 6C, but it is not always one rectangular shape. Of course, a plurality of rectangular high-density wiring regions are also possible. In addition, the present invention can be modified in various ways without departing from the scope of the invention.

[0026]

As described above, according to the present invention, the wiring area of the printed board can be appropriately divided into the high-density wiring area and the low-density wiring area based on the rat nest density of the printed board. It is possible to relax the manufacturing conditions in the low-density wiring region other than the high-density wiring region specified in 1., thus contributing to the improvement of the manufacturing efficiency and the yield.

[Brief description of drawings]

FIG. 1 is a hardware configuration diagram showing an embodiment of a wiring area determining device according to the present invention.

FIG. 2 is a functional block diagram illustrating a main part of a wiring area determining device according to the present invention.

FIG. 3 is a flowchart illustrating the operation of the device of the present invention.

FIG. 4 is a flowchart explaining the operation of the device of the present invention.

FIG. 5 is a conceptual diagram of design data in a pretreatment stage including a printed circuit board.

FIG. 6 is an explanatory diagram for dividing the printed circuit board shown in FIG. 5 to determine a high-density wiring region.

FIG. 7 is a diagram in which a high-density wiring region is specified as a narrow region in the wiring region of the printed circuit board by the device of the present invention.

FIG. 8 is an explanatory view of a conventional wiring process in which the entire surface of the printed board is a high-density wiring region.

[Explanation of symbols]

10 ... Data processing means, 10A ... X direction high density area calculating means, 10B ... Y direction high density area calculating means, 10C ... High density wiring area determining means, 10D ... Low density wiring area determining means, 13 ... Magnetic disk device, 14 ... Wiring design data memory, 15 ... Buffer memory, 25 ... Printed circuit board, 2
7 ... High-density wiring area, 28 ... Low-density wiring area.

Claims (1)

[Claims] 1. A wiring area determining device for determining a wiring area of a printed circuit board, wherein the printed circuit board is sequentially divided in the X direction of the printed circuit board based on predetermined first division width data, and the printed circuit board in each of these divided areas. X-direction high-density wiring area calculating means for calculating the X-direction high-density wiring area from the rat nest density of the wiring design data, and the printed board is sequentially divided in the Y-direction based on the predetermined second division width data. Calculated by a Y-direction high-density region calculating unit that calculates a Y-direction high-density wiring region from the rat nest density of the wiring design data of the printed circuit board in each of these divided regions, and the X-direction and Y-direction high-density region calculating unit. And a high-density wiring area determining means for determining the high-density wiring area of the printed circuit board from the coordinate data of the high-density wiring area. Wiring area determination apparatus characterized by a region other than the linear region and a low-density wiring region determining means for determining a low-density wiring area of the printed circuit board.