JPH0683041A - Method and device for inspecting adhesion state of pellicle - Google Patents

Abstract

PURPOSE:To efficiently and surely inspect the adhesion state of a pellicle at the time of inspecting the airtightness of the adhered part between a mask and the pellicle. CONSTITUTION:A pellicle 12 is adhered to a mask 11 through an adhesive 12d to form a mask provided with the pellicle. In this case, a gap 14 at the interface 13 between the mask 11 and adhesive 12d is inspected. Namely, a high-pressure gas 10 is ejected on the interface 13, a gap 14 is judged to be present when the pellicle film 12b of the pellicle 12 is expanded 15, and the gap 14 is judged to be absent at the interface 13 when the pellicle film 12b is not expanded.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of inspecting the adhered state of a pellicle for inspecting the airtight state of an adhesive portion between a mask and a pellicle, and more particularly to an inspection method capable of efficiently and surely inspecting the adhered state of a pellicle. Regarding

As shown in FIG. 3 (a), when the pellicle 12 is attached to both sides of the mask 11 with the adhesive 12d interposed therebetween to form a pellicle-equipped mask 11 ', an adhesive portion between the mask 11 and the pellicle 12 is formed. For details, see FIG. 3 at the interface 13 between the mask 11 and the adhesive 12.
A minute gap 14 as shown in (b) may occur.

When such a gap 14 exists at the interface 13 between the mask 11 and the adhesive 12, a minute foreign substance enters the inside of the pellicle-equipped mask 11 ′ through the gap 14 and adheres to the pattern area of the mask 11. It will be.

When a resist (not shown) deposited on a semiconductor wafer or the like is exposed by using the mask 11 in which such foreign matter adheres to the pattern area, the foreign matter is transferred to the resist and the yield of semiconductor chips is reduced. It also causes

Therefore, the adhesive 12d is applied to both sides of the mask 11.
Mask with pellicle by attaching pellicle 12 with intervening
It is indispensable to inspect the state of the interface 13 between the mask 11 and the adhesive 12d, that is, the attachment state of the pellicle, and exclude the pellicle-equipped mask 11 ′ having the gap 14 when 11 ′ is selected.

3A and 3B are explanatory views of a conventional method for inspecting the attachment state of a pellicle. FIG. 3A is a side sectional view of a main part of a mask 11 'with a pellicle, and FIG. 3B is a pellicle. FIG. 3 is an enlarged side sectional view of a main part of a mask 11 with a mask.

In FIG. 3, 12a is a pellicle frame,
Reference numeral 12c is an adhesive that adheres the pellicle film 12b to the pellicle frame 12a.

[0008]

2. Description of the Related Art By the way, a conventional inspection method for detecting whether or not a gap 14 has occurred in an interface 13 between a mask 11 of a pellicle-equipped mask 11 'and an adhesive 12d is a method in which an operator checks the interface 13 The presence or absence of the gap 14 was visually determined.

[0009]

However, the conventional inspection method described above not only requires a lot of man-hours for inspection,
It is less likely to overlook the gap 14.

The present invention has been made to solve such a problem, and an object thereof is to provide an inspection method capable of inspecting the attachment state of a pellicle efficiently and surely.

[0011]

As shown in the principle explanatory view of FIG. 1, the above-mentioned object is to use the adhesive 12d of the pellicle 12 on the mask 11 as shown in FIG.
In the method of inspecting the attachment state of the pellicle to detect the gap 14 generated in the interface 13 between the mask 11 and the adhesive 12d when the mask is adhered to form a mask with a pellicle, a high-pressure gas 10 is jetted to the interface 13, Bulge 15 on pellicle membrane 12b of pellicle 12
When it occurs, it is determined that the gap 14 is present in the interface 13,
When the bulge 15 does not occur in the pellicle film 12b, a gap is formed.
This is achieved by a method for inspecting the attachment state of a pellicle, which is characterized by determining that 14 does not exist at the interface 13.

[0012]

According to the method of inspecting the adhered state of the pellicle of the present invention, the high pressure gas 10 is jetted to the interface 13 between the mask 11 and the adhesive 12d, and whether or not the swelling 15 is generated in the pellicle film 12b of the pellicle 12 is determined. It is configured to inspect the attachment state of the pellicle.

In the inspection method of the attachment state of the pellicle of the present invention thus constructed, the swelling of the pellicle film 12b
By observing only 15, it is possible to determine whether or not the gap 14 exists, and it is possible to efficiently inspect the attachment state of the pellicle, and the inspection result is also reliable.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A pellicle pasting state inspection apparatus according to one embodiment of the present invention will be described below with reference to FIG. FIG. 2 is a schematic diagram showing the configuration of the inspection device for the attachment state of the pellicle according to the embodiment of the present invention.

In the present specification, the same parts, the same materials and the like are given the same reference numerals throughout the drawings. In FIG. 2, reference numeral 21 denotes a mask 11 ′ with a pellicle, which is obtained by adhering the adhesive 12d of the pellicle 12 to the mask 11.
An injection nozzle for injecting a high-pressure gas, for example, a clean nitrogen gas 10, from four directions onto the interface 13 (and the vicinity thereof) between the mask 11 and the adhesive 12d, and 22 is a beam-like light beam 22a parallel to the pellicle film 12b of the pellicle 12. A semiconductor laser which generates a (laser beam) and passes the beam 22a at a minute distance from the surface of the pellicle film 12b, for example, about 100 μm.
23 is a photomultiplier tube (hereinafter referred to as a photomultiplier) that receives the light ray 22a and converts the light ray 22a into an electric signal corresponding to its intensity, 24 is an electric signal input from the Photomar 23, and this Photomar 23 receives the light It is an oscilloscope that displays the output value corresponding to the intensity of the light beam 22a on the display screen.

In the inspection apparatus for the attachment state of the pellicle according to the embodiment of the present invention thus configured, high-pressure nitrogen gas is injected from the injection nozzle 21 to the interface 13 (and the vicinity thereof) between the mask 11 and the adhesive 12d. At this time, if there is no gap 14 at the interface 13, the pellicle film 12b of the pellicle 12 expands.
15 never occurs.

Therefore, the beam-like light beam 22a generated from the semiconductor laser 22 is directly incident on the photo-maru 23, and the electric signal output from the photo-maru 23 becomes large. Therefore, the oscilloscope 24 connected to this Photomaru 23
The waveform 24b of the electric signal displayed on the display screen 24a becomes large.

However, when a gap 14 is present at the interface 13, a high pressure nitrogen gas is put inside the mask 11 'with a pellicle.
10 penetrates to generate a bulge 15 in the pellicle film 12b.
When the bulge 15 is generated in the pellicle film 12b, the beam-shaped light beam 22a is diffusely reflected by the pellicle film 12b and is incident on the photomal 23 as it is, and the incident amount on the photomar 23 is decreased as compared with the case described above. Become.

As a result, the electric signal output from the photomaru 23 becomes small, and the display screen 24a of the oscilloscope 24 is displayed.
The waveform 24b of the electric signal displayed at is also smaller than that in the above case.

Thus, the display screen 24 of the oscilloscope 24
By observing the waveform 24b of the electric signal displayed on a, whether or not there is a gap 14 at the interface 13 between the mask 11 and the adhesive 12d can be efficiently and surely determined.

In addition, in the method and apparatus for inspecting the adhered state of the pellicle of the present invention (the inspection apparatus for the adhered state of the pellicle in one embodiment), the aforementioned gap 14 is formed at the interface between the pellicle film 12b and the adhesive 12d. Of course, the presence or absence of a similar gap (not shown) can also be detected together.

[0022]

As described above, according to the present invention, a pellicle that can efficiently and surely detect a gap generated at an interface between a mask and an adhesive when the adhesive is adhered to the mask by interposing the adhesive of the pellicle. It is possible to provide a method for inspecting the adhered state of and a device therefor.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the present invention.

FIG. 2 is a schematic diagram showing a configuration of a pellicle pasting state inspection device according to an embodiment of the present invention.

FIG. 3 is an explanatory diagram of a conventional pellicle attachment state inspection method.

[Explanation of symbols]

 10, nitrogen gas (high pressure gas) 11, mask 12, pellicle 12a, pellicle frame 12b, pellicle film 12c, adhesive 12d, adhesive 13, interface 14, gap 15 Reference numeral 21 indicates an injection nozzle (injection means) 22, semiconductor laser (light source) 22a, light beam 23, photomal (photoelectric conversion means) 24, oscilloscope (electrical signal detection means) 24a, display screen 24b, Waveform

Claims (2)

[Claims] 1. An adhesive (12) for a pellicle (12) is attached to a mask (11).
When d) is adhered to form a mask with a pellicle, a gap (1) generated at the interface (13) between the mask (11) and the adhesive (12d)
In the method for inspecting the attachment state of the pellicle for detecting 4), a high-pressure gas (10) is jetted to the interface (13),
When the expansion (15) occurs in the pellicle film (12b) of (12), it is determined that the gap (14) exists at the interface (13), and the expansion is observed in the pellicle film (12b). A method for inspecting a stuck state of a pellicle, characterized in that when the (15) does not occur, it is determined that the gap (14) does not exist at the interface (13). 2. The high-pressure gas (1) at the interface (13) according to claim 1.
(22) is generated in parallel to the pellicle film (12b) of the pellicle (12) and the injection means (21) for injecting the light beam (22a).
Light source that passes a small distance from the surface of 2b)
(22), and the photoelectric conversion means (23) for receiving the light beam (22a) and converting the light beam (22a) into an electric signal corresponding to its intensity, and the electric signal from the photoelectric conversion means (23). The electric signal detecting means (24) for inputting and outputting an output value corresponding to the intensity of the light beam (22a) received by the photoelectric conversion means (23) is included in the pellicle attachment state. Inspection device.