JPH0680780B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a resin-sealed non-volatile memory on an integrated circuit substrate,
For example EPROM (UV erasable programmable lead
EPROM built-in type hybrid integrated circuit device in which only memory is mounted.

(B) Conventional technology EPRO with a UV irradiation window that can erase and rewrite memory information that has already been written by UV irradiation.
The M element is preferably used in various electronic devices. This E
Most of PROM elements are currently mounted on a printed wiring board together with an integrated circuit for control or driving. In order to rewrite information once written, it is usually mounted on a printed wiring board that is easily removable. ing. For various electronic devices that are required to be smaller and lighter, after a semiconductor integrated circuit (IC) chip is directly mounted on a printed wiring board by a technique called chip-on-board and the required wiring is performed. The IC chip including the wiring portion is covered with a synthetic resin, and the size and weight are extremely reduced.

On the other hand, EPROM chips that require an ultraviolet irradiation window cannot be reduced in size and weight because the irradiation window becomes a neck and is still manufactured by being assembled in a sardip type package and mounted on a printed wiring board.

A mounting structure of such a conventional EPROM element will be described with reference to FIG. 14. FIG. 14 is a perspective view having a partial cross section of the conventional EPROM element, in which a conductive wiring pattern (41) is formed on the main surface.
An EPROM device (44) is mounted in a sardive type package in a through hole (43) of an insulating substrate (42) made of glass epoxy resin or the like on which the EPROM device (44) is mounted. This EPROM element (44) has a header (45) and a cap (46), and the header (45) is bonded to a ceramic base material (47) from an external lead (48) with a low melting point glass material. Further, in this header (45), an element mounting portion (50) obtained by sintering a so-called gold paste in which a large amount of gold powder is mixed with glass is adhered onto the low melting point glass material or the ceramic base material (47), In this element mounting part (50)
The EPROM chip (51) is mounted with the UV irradiation surface facing up, and the electrodes of the chip (51) and the external lead (4) are attached.
8) and are connected by a thin metal wire (52). The cap (46) is a storage member, and the EPROM chip (5
An EPROM that includes a ceramic substrate (54) having a window (53) in a portion facing the ultraviolet irradiation surface of 1), and this cap (46) is placed on a header (45) by a low melting point glass.
The tip (51) is sealed. In this way EPROM chip (5
The EPROM device (44) with the sealed 1) is the insulating substrate (4).
An external lead (48) is inserted through the through hole (43) of 2) and fixed by soldering. This through hole (4
3) has a required wiring arrangement by the conductive wiring pattern (41) and is connected from the male connector terminal portion (55) provided at the end of the insulating substrate to a female connector (not shown). .

Now, the packaging structure of such a conventional EPROM element has an extremely large package outer shape as compared with the EPROM chip (51), and is three-dimensional, that is, the height is several times as high as the height of the chip as well as the plane occupancy rate. It is extremely disadvantageous. Furthermore, it is necessary to fix the lead-out lead through the through-hole (43) with solder or the like. A further major drawback to be noted is that the EPROM device is once assembled into a package prior to mounting on an insulating substrate. Since the EPROM element has a window for UV irradiation, the package is assembled into a cerdip type package that uses ceramics as a base material. However, this package is sealed with a low melting point glass, so it can be used at high temperatures (400 to 500). If the metal thin wires connecting the EPROM chip electrodes (aluminum) and the external leads are not made of the same material, alloying will occur, increasing wiring resistance and causing wire breakage. In order to avoid such a situation, aluminum thin wires are usually used, but this EPROM chip requires a substrate to be at ground potential, so the ground electrode of the EPROM chip is wire-connected to the chip mounting part made of gold paste. . Even in this case, since the secondary or multi-component alloy reaction proceeds between the metal such as gold or foil in the gold paste and the aluminum, a silicon piece having aluminum coated on the head called a ground die is used. Separately from the EPROM chip, fix it to the chip mounting part made of the gold paste, and
The conventional mounting structure is unsatisfactory in terms of small size, light weight, and low price, such as the extremely complicated work of connecting to the ground electrode of the EPROM chip.

There is an EPROM mounting structure shown in FIG. 15 to solve such a problem.

The EPROM mounting structure shown in FIG. 15 will be described below.

An insulating substrate (60) such as a glass / epoxy resin plate with a conductive wiring pattern (60b) formed on the main surface (60a)
Area with chip (60c) to mount EPROM chip (61)
The wiring pattern (60b) is routed from near the area on the main surface (60a) and is connected to a male connector terminal portion (not shown). An EPROM chip (61) is mounted on the area (60c), and this chip (61)
The surface electrode and the wiring pattern (60b) of the metal thin wire (6
Connected by 2). Of course, one of the thin metal wires (62) is connected to the substrate of the chip (61),
The chip (61) is wired with the wiring pattern (60b) mounted thereon. On the ultraviolet irradiation surface (61a) of the EPROM chip (61), an ultraviolet transparent window material (64) is fixed via an ultraviolet transparent resin (63) (for example, Toray Co., model name TX-978). ing. The window material (64) is a known ultraviolet ray transmissive material such as quartz or transparent alumina.
Since the top surface (64a) of the window material (64) is a surface for introducing light to the ultraviolet irradiation surface of the EPROM chip (61),
The remaining window material (64) excluding this top surface (64a),
The thin metal wire (62) and the connecting portion between the thin metal wire (62) and the wiring pattern (60b) are covered with a synthetic resin (65) (for example, model name MP-10 manufactured by Nitto Denko Corporation). if,
Insulating substrate (60), EPROM chip (61) and window material (64)
If it is necessary to further reduce the total thickness dimension including
The chip mounting area (60c) of the substrate (60) may be used as a countersunk hole to grip about half the thickness of the substrate (60). Further, if such counterbore holes are formed, a flow stop dam of the synthetic resin (65) is formed, which effectively acts on ingress of moisture and the like.

The EPROM mounting structure shown in FIG. 14 and FIG.
-83393 (H05K 1/18).

(C) Problems to be Solved by the Invention It goes without saying that the EPROM mounting structure shown in FIG. 15 is miniaturized because the EPROM chip is die-bonded onto the printed circuit board. However, the miniaturization referred to here is only miniaturization of the EPROM itself. That is, the fifteenth
Although it is not clear from the figure, since the microcomputer and its peripheral circuit elements that are erected around the EPROM are composed of electronic components such as discretes, they are used as an integrated circuit for a printed circuit board equipped with the EPROM. When the entire system is viewed, there is a problem that the size of the printed circuit board does not become small at all, that is, the size of the entire system becomes large as usual. Furthermore, in the EPROM structure shown in FIG.
When erasing the program data of the PROM, after erasing by irradiating the printed circuit board with ultraviolet rays, write terminals such as a probe are contacted with the conductive pattern of the routing wire extended from the EPROM and rewriting is performed. However, the conventional general ROM writer cannot be used, and there is a problem in that EPROM rewriting is complicated.

In addition, in the EPROM mounting structure shown in FIG. 14, since the EPROM can be attached to and detached from the printed circuit board in terms of rewriting after erasing, comparison can be made because writing can be performed using a general ROM writer. It can be done easily. However, in the mounting structure shown in FIG. 12 as well, as in FIG. 14, the circuits around the EPROM, that is, the circuit elements such as the microcomputer and its peripheral LSI, IC are composed of discrete electronic components. However, there is a big problem that the printed circuit board becomes large in size, that is, the entire system becomes large in size, and it is impossible to provide a light, thin, short and small EPROM mounted integrated circuit which is required by the user.

Furthermore, in the EPROM mounting structure shown in FIGS. 14 and 15,
As mentioned above, the whole system becomes larger and EPROM
Also, since the conductive patterns that connect the circuit elements in the surroundings to each other are exposed, there is a problem that reliability is reduced.

Furthermore, in the EPROM mounting structure shown in FIG. 14 and FIG.
Since the OM and the circuit elements such as the microcomputer and ICs, LSIs and the like around the OM are exposed, there is a problem that unevenness is generated on the upper surface of the substrate, which makes it difficult to handle and reduces workability.

(D) Means for Solving the Problems The present invention has been made in view of the above problems, and a hole is provided at a predetermined position of a substrate, and the hole is connected to a conductive path formed on the substrate. To secure the socket and insert a single in-line type non-volatile memory into the socket to expose only the non-volatile memory, the microcomputer and all other circuit elements are sealed with a board and a case material. It is characterized by a structure that seals in a closed space.

Therefore, it is possible to provide a hybrid integrated circuit device in which the EPROM is miniaturized and the EPROM has a high-density packaging. Further, since the non-volatile memory is mounted by being inserted and mounted in the socket fixed in the hole on the exposed surface of the substrate having the hole, the non-volatile memory can be freely inserted and removed.

(E) Operation As described above, according to the present invention, holes are provided at predetermined positions of the substrate,
Since the single in-line type non-volatile memory is inserted into the socket that is fixed to the hole and connected to the conductive path formed on the substrate to connect to the conductive path, mounting of the single in-line type non-volatile memory is performed. The placement position can be set arbitrarily, the EPROM and the microcomputer can be efficiently connected in consideration of the electrical connection with the built-in microcomputer, and the signal line, that is, the lead line of the conductive path is unnecessary. You can

Furthermore, the most closely related microcomputer can be placed in the adjacent position of the EPROM, the data line for exchanging data between the EPROM and the microcomputer can be realized with the shortest distance or the minimum distance, and the loss of packaging density due to the routing of the data line. Will be suppressed to the minimum, and high-density mounting can be performed.

Further, in the present invention, only the non-volatile memory is exposed to the outside by being inserted into the socket fixed to the hole provided at the predetermined position of the substrate, and all other circuit elements are sealed by the substrate and the case material. Since it is housed in the space, it is possible to provide a hybrid integrated circuit device that is compact and has a high density packaging.

(F) Embodiment A hybrid integrated circuit device according to the present invention will be described in detail below with reference to an embodiment shown in FIGS.

1 to 3 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having a function independently in a wide range of fields such as computers.

As shown in FIGS. 1 to 3, the hybrid integrated circuit device (1) includes an integrated circuit board (2), a hole (4) provided at a predetermined position of the integrated circuit board (2), and an integrated circuit board. (2) A conductive path (5) having a desired shape formed on the socket, a socket (16) fixed to the hole (4) and connected to the conductive path (5), and a conductive path (5) inserted into the socket (16). 5) a single in-line type resin-molded non-volatile memory (6), a microcomputer (7) supplied with data from the memory (6) and peripheral circuit elements (8), a substrate ( It is composed of a case material (9) integrated with 2).

A hard substrate made of ceramics, glass epoxy, metal, or the like is used as the integrated circuit substrate (2), and in this embodiment, a metal substrate excellent in heat dissipation and mechanical strength is used.

As the metal substrate, for example, an aluminum substrate having a thickness of 0.5 to 1.0 mm is used. As shown in FIG. 4, an aluminum oxide film (9) is formed on the surface of the substrate (2) by known anodic oxidation.
(Alumite layer) is formed, 10-70μ on one main surface side
An insulating resin layer (10) such as thick epoxy and polyimide is attached. Furthermore, a copper foil (11) having a thickness of 10 to 70 μm is adhered to the insulating resin layer (10) at the same time as the insulating resin layer (10) by means such as a roller or a hot press.

On the surface of the copper foil (11) provided on one main surface of the substrate (2), a conductive path of a desired shape is exposed by screen printing and masked with a resist, and a noble metal (gold, silver, platinum) plating layer is formed. The surface of the copper foil (11) is plated. After that, the resist is removed and the copper foil (11) is etched using the noble metal plating layer as a mask to form a desired conductive path (5). Here, the fineness of the conductive path (5) by screen printing is 0.5 mm.
Therefore, when a very fine wiring pattern is required, it is possible to form a very fine conductive path (5) of up to about 2 μ by the well-known photo-etching technique.

A single in-line type non-volatile memory (6), a microcomputer (7) to which data is supplied from the memory (6) and a circuit element (8) around it are provided in the conductive path (5) on the substrate (2). It is installed. Further, a conductive path (5) is extended to one side edge of the substrate (2) or a peripheral edge portion of the opposite side edge to form a plurality of pads for fixing the external lead terminals (12). An external lead terminal (12) is fixed to the pad by solder, is led out horizontally, and is bent at a substantially right angle at its central portion.

EPROM (Erasable Program) as a non-volatile memory (6)
mable read only memory) is used (hereinafter, nonvolatile memory (6) is referred to as EPROM). As is well known, this EPROM (6) emits electrons (program data) accumulated in the floating gate formed in the pellet of the EPROM (6) by irradiating light to excite it to restore it to the unstored state. It is an element that can be rewritten and used.

The structure of a general EPROM (6) is a SIP (single in line) type as shown in FIGS. 5 and 6, and is roughly classified into a resin mold type package type and a ceramics type package type. In both the resin mold type and the ceramic type, it is necessary to irradiate light in order to erase the memory of the pellet (14), so the side surface of the resin mold at the upper surface of the pellet (14) has high energy. A transmission member (15) that transmits light (ultraviolet light) is arranged. In this example, SI
As long as it is a P type EPROM (6), either a resin mold type or a ceramic type package may be used. Such an EPROM device is disclosed in JP-A-53-74358 and JP-A-62-290160.

On the other hand, in the present invention, the hole (4) is provided at a predetermined position of the substrate (2). As apparent from FIGS. 1 and 2, the holes (4) are provided with the same number of holes (4) as the lead-out direction of the SIP type EPROM (6). That is, since the EPROM (6) used in this embodiment is of the SIP type, one elongated hole (4) is formed in the substrate (2). It is assumed that the hole (4) is formed by the press punching process before the formation of the conductive path (5) described above.

A part of a socket (16) described later is fitted into the hole (4) and integrated with the substrate (2). A part of the conductive path (5) formed on the substrate (2) is formed so as to extend at the peripheral end of the hole (4), and the distal end of the conductive path (5) is formed. The electrodes of the socket and the socket (16) are fixedly connected by the solder (17) by a predetermined solder reflow process.

As shown in FIG. 2, the socket (16) has a single protruding portion (18) fitted into the hole (4) and completely sealed without a gap. The connection electrode of the socket (16) is connected to the conductive path (5) extending at the peripheral end of the hole (4) by solder (17). When the socket (16) is fitted in the hole (4), the upper surface of the protruding portion (18) of the socket (16) is flush with the upper surface of the substrate (2) or slightly protruding. SIP type EPROM (6)
Will be inserted into the protrusion (18) of the socket (16) and connected to the conductive path (5). Further SIP type EPROM
For (6), bend the leadon pin 90 ° and socket it (16).
Is arranged in parallel with and in contact with the substrate (2) with the transparent member (15) as the lower surface.

On the other hand, the IC, transistor, chip resistor, chip capacitor, etc. of the microcomputer (7) and its peripheral circuit elements (8) supplied by selecting the program data of the SIP type EPROM (6) are desired as chip parts. The conductive path (5) is attached by soldering or a brazing material such as Ag paste, and the microcomputer (7) and the circuit element (8) are bonded and connected to the nearby conductive path (5). Further, a carbon resistor by screen printing or a nickel-plated resistor by nickel plating is formed as a resistance element between the conductive paths (5).

The substrate (2) is fixedly integrated with the case material (9).

The case member (9) is formed of a thermoplastic resin as an insulating member, and is formed in a box shape so that a space is formed when it is fixed to the substrate (2) as shown in FIGS. 2 and 3. There is. The peripheral end of the box-shaped case material (9) is arranged substantially at the peripheral end of the substrate (2) and firmly fixed to the substrate (2) by an adhesive sealant (J sheet: product name). Be integrated. As a result, a predetermined sealed space (21) is formed between the substrate (2) and the case material (9).

By the way, as described above, one end of the plurality of conductive paths (5) is extended to the peripheral end portion of the hole (4), and the SIP type EPROM fitted in the conductive path (5) and the hole (4). The socket (16) into which (6) is inserted is fixed. The other end of the conductive path (5), to which the socket (16) is fixed, extends near the microcomputer (7) and has a chip-shaped microcomputer (7).
Is electrically connected with a bonding wire.

Here, the positional relationship between the EPROM (6) and the microcomputer (7) will be described. FIG. 7 shows a socket (16) for inserting a SIP type EPROM (6) and a microcomputer (7).
FIG. 3 is an enlarged view of an essential part when and are arranged on a substrate (2),
As shown in FIG. 7, the socket (16) into which the SIP type EPROM (6) is inserted and the chip-shaped microcomputer (7) are connected via a large number of conductive paths (5). SIP type EPROM to shorten the routing of the road (5)
The socket (16) into which (6) is inserted and the microcomputer (7) are arranged so as to be adjacent to each other or as close to each other as possible. Therefore SIP type EPROM (6)
The conductive path (5) between the socket (16) for inserting the connector and the microcomputer (7) can be formed in the shortest distance, and the mounting area on the substrate can be effectively used. SIP
The EPROM (6) and a chip-shaped microcomputer (7) arranged in the vicinity of or adjacent to the EPROM (6) are, as shown in FIG. 7, a leading end portion of a conductive path (5) extending in the vicinity of the microcomputer (7). Is bonded to the socket (16) through a wire and electrically connected to the socket (16) into which the EPROM (6) is inserted.

By the way, the SIP type EPROM (6) will be inserted into the socket (16) and mounted on the exposed surface of the substrate (2).
The entire P-type EPROM (6) is exposed to the outside. That is, only the SIP type EPROM (6) is mounted outside the board, and the microcomputer (7) and its peripheral circuit elements (8) other than the SIP type EPROM (6) are mounted on the board (2) and the case material ( 9) will be arranged in the sealed space (21) formed by.

As described above, the microcomputer (7) connected to the SIP type EPROM (6) and the circuit elements (8) around it are the sealed space (2) formed by the substrate (2) and the case material (9).
It is set to be placed in 1). Furthermore, all the chip-shaped electronic components and resistive elements such as printing resistors and plating resistors are provided in the sealing space (21).

On the other hand, although the whole EPROM (6) is exposed, the light can be completely blocked by making the transparent member (15) face the substrate (2).

When erasing the data of the EPROM (6) in this embodiment, there is a case where the EPROM (6) is removed from the socket (16) and ultraviolet rays are irradiated. In case of rewriting, EPROM (6)
Is removed from the socket, electrically written using a general ROM writer, and after writing, inserted into the socket (16).

A specific example of a hybrid integrated circuit device for a modem using the present invention will be shown below.

First, with a modem (MODEM), there exists a modem for data communication in which data digitized by a data terminal such as a personal computer is transmitted and received at a distance from each other using a telephone line. The function of the modem is to modulate the digitized data by using the frequency that can be used in the telephone line, convert it into an analog signal and put it on the telephone line, and the analog signal modulated with the data sent from the other party. It has the function of demodulating and returning to digitized data.

The modem will be briefly described based on the block diagram shown in FIG.

FIG. 9 is a block diagram when a modem is mounted on the integrated circuit board (2).

The modem stores a data transmitted from a personal computer in a built-in memory and outputs the data, and a micro that outputs a predetermined output signal based on the data output from the DTE interface (31). EPROM containing data addressed by the computer (7) and the microcomputer (7)
(6), the first and second modulation / demodulation circuits (32) (33) that modulate and demodulate the output signal from the microcomputer (7) and output to the NCU (NETWORK CNTROL UNIT), and the output from the microcomputer (7) And a DTMF generator (34) for generating a desired DTMF signal (tone signal) according to the signal.

The DTE interface (31) is composed of an IC such as STC9610 (Seiko Epson), supplies the output signal of the personal computer, stores the output signal in the built-in memory and outputs it to the microcomputer (7) as shown in FIG. A transmission memory section (35), a reception memory section (36) for accumulating a signal supplied with an output signal from the microcomputer (7) in the internal memory and outputting the signal to the personal computer (38), and a transmission memory section ( 35) and a control section (37) for switching respective signals input and output through the reception memory section (36), and has a predetermined function for connecting the personal computer (38) and the microcomputer (7). I have.

The microcomputer (7) is composed of, for example, an IC such as STC9620 (Seiko Epson), and as shown in FIG. 11, it is recognized by the command recognition unit that recognizes the output signal output from the DTE interface (31) and the command recognition unit. The command decoding unit that decodes the output signal, the command execution unit that compares the data in the memory unit based on the signal decoded by the command decoding unit and supplies the data to the modem circuit, the data in the command decoding unit and the data in the memory unit When incorrect data is supplied to the command execution unit as a result of comparison with
The DTE interface (31) includes a response code generation unit that outputs an output signal.

The modulation / demodulation circuit (38) converts the digital signal transmitted from the microcomputer (7) into an analog signal and transmits it to the NCU unit. On the other hand, the analog signal transmitted from the NCU unit is converted into a digital signal and transmitted to the microcomputer (7), which includes low-speed and medium-speed circuits. The first modulation / demodulation circuit (32) is 30
This is a low-speed modulation / demodulation circuit of 0 bps, and the second modulation / demodulation circuit (33)
Is a 1200bp medium speed modulation / demodulation circuit. One of the first and second modulation / demodulation circuits (32, 33) is selected by the microcomputer (7).

The DTMF generator (34) generates a predetermined DTMF signal by inputting the data output from the command execution unit of the microcomputer (7) to the input terminals of each of COL and ROW, and transmits AMP.
Output to (39) and supply signal to telephone line.

Program data for setting various modes of the modem is stored in the EPROM (6) and is supplied to the microcomputer (7) based on the address of the microcomputer (7).

Next, the operation of the modem will be briefly described.

First, when the personal computer communication is started, the control switch (40) operates based on the read signal from the microcomputer (38), and the predetermined address data is transferred to the EPROM (7).
Is supplied to the microcomputer (7), and the program data of the EPROM (6) based on the address is supplied to the microcomputer (7), and the communication standard (BELL / CCITT) of each modem is used for communication.
Standard), communication speed (300 / 1200bps), matching of data format, switching of DIP switch mode, etc. are checked to see if they match.

Assuming that the various modes are the same, enter the telephone number of the answering modem into the personal computer. The telephone number is input to the DTE interface (31) for interfacing with the personal computer and transferred to the microcomputer (7) for decoding the telephone number. The decrypted result is DT
The signal is transmitted to the MF generator (34), the DTMF signal is generated from the DTMF generator (34), and the signal is transferred to the general telephone line via the transmission AMP (39) and the line transformer (41).

The transferred DTMF signal sends a calling signal to the answering modem, and the answering modem receives the calling signal and automatically receives the incoming call. Then, the answering modem sends an answer tone for the connection procedure to the calling modem.

The modem on the calling side passes through the line transformer (41) and the receiving amplifier (42), and the low speed modulation / demodulation circuit (32) detects whether or not the answer tone is a predetermined answer tone for the modem on the calling side. . If it is a predetermined answer tone, the communication state is entered.

In the communication state, parallel data from the personal computer is input to the DTE interface (31) based on a predetermined key input signal from the keyboard of the calling personal computer, and the data is transferred to the microcomputer (7). Here, the parallel data is converted into serial data. The digital signal converted into serial data is transmitted to the low speed modulation / demodulation circuit (32). Here, the digital signal is converted into an analog signal, frequency modulation FSK is performed based on the communication standard corresponding to it, transmission AMP (39), line transformer (41)
To the modem on the answering side.

On the other hand, the frequency-modulated analog signal sent by the key input signal of the responding personal computer is sent to the calling modem and input to the low speed modulation / demodulation circuit (32) via the line transformer (41) and receiving AMP (42). To be done. Here analog signals are converted to digital signals and DTE interface (31)
The serial digital signal is converted to a parallel digital signal and input to the calling personal computer. As a result, the personal computer for the calling side and the personal computer for the answering side can perform full-duplex communication, thus realizing personal computer communication.

FIG. 12 is a plan view of the modem circuit shown in FIG. 9 mounted on the substrate (2) used in this embodiment, and the circuit elements mounted have the same reference numerals. The connection between the EPROM (6) and the microcomputer (7) is shown by a bus line. The conductive paths connecting the plurality of circuit elements are omitted because they are complicated.

As shown in FIG. 12, a plurality of fixing pads (5a) to which the external lead terminals (12) are fixed are provided on the opposing peripheral ends of the substrate (2). A plurality of circuit elements (8) are provided at predetermined positions on the conductive path (5) extending from the fixing pad (5a).
And the socket (16) carrying the EPROM (6) is fixed. A plurality of circuit elements (8) including a microcomputer (7) other than the EPROM (6) are fixed on the substrate (2), (31) is a DTE interface, and (32)
(33) is the first and second modulation / demodulation circuits, (34) is a DTMF generation circuit, (40) is a control switch for controlling the EPROM (6), (7) is a microcomputer, (8) is a chip such as a capacitor. It is a part.

As shown in FIG. 12, the socket (16) on which the SIP type EPROM (6) is mounted is fixed near or adjacent to the microcomputer (7). By fixing the socket (16) near or adjacent to the microcomputer (7), the microcomputer (7) and EPROM
The distance between the bus line and (6), that is, the routing line of the conductive path (6) can be laid out in the shortest and smallest distance, and other mounting patterns can be effectively used and high-density mounting can be performed. The area surrounded by the alternate long and short dash line shows the area where the case material (9) is fixed with an adhesive sheet.

FIG. 13 shows a case material (9) on the substrate (2) shown in FIG.
FIG. 3 is a plan view of a finished product of the hybrid integrated circuit device for a modem when the board is fixed, and the SIP type EPROM is seen from the upper surface of the substrate (2).
Only (6) is exposed. That is, EPROM
All the elements other than (6) are sealed in the sealed space (21) formed by the case material (9) and the substrate (2), and the EPRO
SIP type EPROM because only M (6) is mounted outside the board
The insertion / removal of (6) can be freely performed as necessary.

EPROM for hybrid integrated circuit device for modems detailed above
In (6), in order to prepare for diversification of product specifications, it is possible to easily deal with specification changes required by the set maker (user) such as destination, OEM, and in-house sales. That is, EPROM
Circuit configurations other than (6) were designed in advance to accommodate various specification changes, but when a hybrid integrated circuit was designed based on the specifications of a specific user, it may not match the specifications of other users. In that case, conventionally, it was necessary to review the design of the hybrid integrated circuit itself.

However, in the hybrid integrated circuit device of the present invention, SIP type EPROM (6)
Is mounted on the exposed surface of the board (2) via the socket (16), the SIP type EPROM (6) can be removed, so that the user can select and mount the EPROM to mount a single hybrid integration. Circuit devices can realize multi-model hybrid integrated circuit devices.

According to the present invention, holes (4) are formed at desired positions on the substrate (2).
Is provided, and the socket (16) is fitted into the hole (4) so that the lead pin insertion part faces outward in the hole (4), and the SIP type EPROM (6) is inserted into the socket (16). By inserting and arranging the microcomputer (7) and other circuit elements (8) in the sealed space (21) formed by the substrate (2) and the case material (9),
It is possible to provide a system that is integrated with the EPROM and is compact, and the EPROM (6) can be freely inserted and removed.

(G) Effect of the Invention As described in detail above, according to the present invention, firstly, the hole (4) is provided at a desired position of the substrate (2), and the hole (4) is fixed to the substrate (2). Since the SIP type EPROM (6) is inserted and connected to the socket (16) connected to the desired conductive path (5), it has an advantage that the mounting position of the SIP type EPROM (6) can be arbitrarily selected. . Therefore, considering the electrical connection with the built-in microcomputer (7), the EPROM can be used efficiently.
Since (6) and the microcomputer (7) can be connected, it is possible to eliminate the need for routing the signal line. More specifically, EPROM
The most closely related microcomputer (7) can be arranged in the adjacent position of (6), and as a result, the data line for exchanging data between the EPROM (6) and the microcomputer (7) can be designed with the shortest distance or the easiest design. This can be realized by a layout, and the mounting density due to routing of data lines can be suppressed to a minimum.

Second, since the SIP type EPROM (6) is inserted and arranged in the socket (16) fitted into the hole (4) at the desired position of the substrate (2), it can be handled as an integrated small hybrid integrated circuit device. Have advantages. Further, by improving the mounting density of the microcomputer and its peripheral circuit elements to be incorporated on the integrated circuit board (2), the conventionally required printed circuit board can be eliminated and one miniaturized SIP type EPROM (6) can be provided. A hybrid integrated circuit device that is detachably incorporated can be realized. Furthermore, since the SIP type EPROM (6) is arranged on the exposed surface of the substrate, the EPROM can be easily attached and detached.

Thirdly, by using a metal substrate as the integrated circuit board (2), the heat radiation effect thereof can be greatly improved compared with the printed circuit board, which can contribute to further improvement of the mounting density. Further, by using the copper foil (11) as the conductive path (5), the resistance value of the conductive path (5) can be significantly reduced as compared with the conductive paste, and the mounted circuit can be expanded to a level equal to or larger than that of the printed circuit board.

Fourthly, since the EPROM (6) can be a single in-line type, it can be used as an EPROM for a hybrid integrated circuit device.
Implementation of (6) is extremely easy and EPROM (6)
The transparent member (15) is brought into contact with the substrate (2) to shield light.

Fifth, the microcomputer (7) connected to the EPROM (6) and its peripheral circuit elements (8) are case materials (9).
Since it is incorporated in the sealed space (21) formed by the integrated circuit board (2) and the integrated circuit board (2) in a die shape or a chip shape, the area occupied is much smaller than that of a conventional printed circuit board that is resin-molded. , Has the advantage that the packaging density can be greatly improved.

Sixth, by making the peripheral edges of the case material (9) and the integrated circuit board (2) substantially coincide with each other, almost the entire surface of the integrated circuit board (2) can be used as the sealing space (21), and the mounting density Combined with the improvement, an extremely compact hybrid integrated circuit device can be realized.

Seventh, the external lead terminals (12) can be led out from one side of the integrated circuit board (2) or the opposite sides, which has an advantage that an extremely multi-pin hybrid integrated circuit device can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view showing this embodiment, and FIG. 2 is I- in FIG.
I sectional view, FIG. 3 is a II-II sectional view of FIG. 1, FIG. 4 is a substrate sectional view used in this embodiment, and FIG. 5 is used in this embodiment.
FIG. 6 is a perspective view showing the EPROM, FIG. 6 is a cross-sectional view of FIG. 5, FIG. 7 is a perspective view showing the positional relationship between the socket into which the EPROM is inserted and the microcomputer, and FIG. 8 is other than that shown in FIG. FIG. 9 is a block diagram showing a modem circuit used in this embodiment, FIG. 10 is a block diagram showing a DTE interface of the modem shown in FIG. 9, and FIG. 11 is FIG. Fig. 12 is a block diagram showing the microcomputer of the modem shown in Fig. 12, Fig. 12 is a plan view when the block diagram shown in Fig. 9 is mounted on a substrate, and Fig. 13 is a case material on the substrate shown in Fig. 12. FIGS. 14 and 15 are perspective views showing a conventional EPROM mounting structure when the other substrate is fixed via the. (1) ... hybrid integrated circuit device, (2) ... integrated circuit board, (5) ... conductive path, (6) ... SIP pattern EPROM, (7)
...... Microcomputer, (8) …… Circuit element,
(4) …… Hole, (9) …… Case material, (16) …… Socket.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Osamu Nakamoto 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Katsumi Okawa 2-18 Keiyo Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuhiro Koike, 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Masao Kaneko 2-18, Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Seiwa Ueno 2-18, Keihanhondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuo Saito 41-1, Omama-cho, Yamama-gun, Gunma Prefecture Tokyo IC

Claims (8)

[Claims] 1. An integrated circuit substrate, a conductive path having a desired pattern formed on one main surface of the substrate, a single in-line type resin-molded non-volatile memory connected to the conductive path, and from the memory. A microcomputer to which data is supplied and which is connected to the board-shaped conductive path and its peripheral circuit element; and a case member integrated with the board, wherein a hole is provided at a desired position of the board, and the hole is formed. The non-volatile memory was inserted into a socket fixed to the substrate and connected to a desired conductive path on the substrate, and the microcomputer and its peripheral circuit elements were placed in a sealed space formed by the substrate and the case material. A hybrid integrated circuit device characterized by the above. 2. The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit substrate. 3. The hybrid integrated circuit device according to claim 1, wherein a copper foil is used as the conductive path. 4. The hybrid integrated circuit device according to claim 1, wherein the hole and the socket are hermetically sealed. 5. The hybrid integrated circuit device according to claim 1, wherein the microcomputer is mounted on the conductive path in a die shape. 6. The hybrid integrated circuit device according to claim 1, wherein a chip resistor and a chip capacitor are used as the peripheral circuit element. 7. The hybrid integrated circuit device according to claim 1, wherein a peripheral end portion of the case member is substantially aligned with a peripheral end portion of the substrate. 8. The hybrid integrated circuit device according to claim 1, wherein the socket is connected to the conductive path.