JPH0680773B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a resin-sealed non-volatile memory on an integrated circuit substrate,
For example EPROM (UV erasable programmable lead
EPROM built-in type hybrid integrated circuit device in which only memory is mounted.

(B) Conventional technology EPRO with a UV irradiation window that can erase and rewrite memory information that has already been written by UV irradiation.
The M element is preferably used in various electronic devices. This E
Most of PROM elements are currently mounted on a printed wiring board together with an integrated circuit for control or driving. In order to rewrite information once written, it is usually mounted on a printed wiring board that is easily removable. ing. For various electronic devices that are required to be smaller and lighter, a semiconductor integrated circuit (IC) is mounted on the printed wiring board by a technique called chip-on-board.
The chip is directly mounted, and after the required wiring is provided, the IC chip including this wiring portion is covered with a synthetic resin, and the size and weight are extremely reduced.

On the other hand, EPROM chips that require an ultraviolet irradiation window cannot be reduced in size and weight because the irradiation window becomes a neck and is still manufactured by being assembled in a sardip type package and mounted on a printed wiring board.

A mounting structure of such a conventional EPROM element will be described with reference to FIG. 14. FIG. 14 is a perspective view having a partial cross section of the conventional EPROM element, in which a conductive wiring pattern (4
An EPROM element (44) is mounted in a sardip type package in a through hole (43) of an insulating substrate (42) made of glass epoxy resin or the like on which 1) is formed. The EPROM element (44) has a header (45) and a cap (46), and the header (45) is bonded to a ceramic base material (47) with an external lead (48) or a low melting point glass material. Further, in this header (45), an element mounting portion (50) obtained by sintering a so-called gold paste in which a large amount of gold powder is mixed with glass is adhered onto the low melting point glass material or the ceramic base material (47), This element mounting part (50)
An EPROM chip (51) is mounted on the surface of the chip (51) with the UV irradiation surface facing upward, and the electrodes of the chip (51) and the external leads (4) are attached.
8) and are connected by a thin metal wire (52). The cap (46) is a storage member, and the EPROM chip (5
An EPROM that includes a ceramic substrate (54) having a window (53) in a portion facing the ultraviolet irradiation surface of 1), and this cap (46) is placed on a header (45) by a low melting point glass.
The tip (51) is sealed. In this way EPROM chip (5
The EPROM device (44) with the sealed 1) is the insulating substrate (4).
An external lead (48) is inserted through the through hole (43) of 2) and fixed by soldering. This through hole (4
3) has a required wiring arrangement by the conductive wiring pattern (41) and is connected from the male connector terminal portion (55) provided at the end of the insulating substrate to a female connector (not shown). .

Now, the packaging structure of such a conventional EPROM element has an extremely large package outer shape as compared with the EPROM chip (51), and is three-dimensional, that is, the height is several times as high as the height of the chip as well as the plane occupancy rate. It is extremely disadvantageous. Furthermore, it is necessary to fix the lead-out lead through the through-hole (43) with solder or the like. A further major drawback to be noted is that the EPROM device is once assembled into a package prior to mounting on an insulating substrate. Since the EPROM element has a window for UV irradiation, the package is assembled into a cerdip type package that uses ceramics as a base material. However, this package is sealed with a low melting point glass, so it can be used at high temperatures (400 to 500). If the metal thin wire that connects the electrode (aluminum) of the EPROM chip and the external lead is not made of the same kind of material, alloying occurs and wiring resistance increases or disconnection occurs. In order to avoid such a situation, an aluminum thin wire is usually used, but in this EPROM chip, the ground electrode of the EPROM chip is wire-connected to a chip mounting portion formed of gold paste because the substrate is grounded. Even in this case, since the secondary or multi-component alloy reaction proceeds between the metal such as gold or foil in the gold paste and the aluminum, a silicon piece having aluminum coated on the head called a ground die is used. Separately from the EPROM chip, it is fixed to the chip mounting part made of the gold paste, and the ground die head and EP
When the complicated work of connecting to the ground electrode of the ROM chip is involved, the conventional mounting structure is unsatisfactory in its small size, light weight and low cost.

There is an EPROM mounting structure shown in FIG. 15 to solve such a problem.

The EPROM mounting structure shown in FIG. 15 will be described below.

An insulating substrate (60) such as a glass / epoxy resin plate with a conductive wiring pattern (60b) formed on the main surface (60a)
Area with chip (60c) to mount EPROM chip (61)
The wiring pattern (60b) is routed from near the area on the main surface (60a) and is connected to a male connector terminal portion (not shown). An EPROM chip (61) is mounted on the area (60c), and this chip (61)
The surface electrode and the wiring pattern (60b) of the metal thin wire (6
Connected by 2). Of course, one of the thin metal wires (62) is connected to the substrate of the chip (61),
The chip (61) is wired with the wiring pattern (60b) mounted thereon. On the ultraviolet irradiation surface (61a) of the EPROM chip (61), an ultraviolet transparent window material (64) is fixed via an ultraviolet transparent resin (63) (for example, Toray Co., model name TX-978). ing. The window material (64) is a known ultraviolet ray transmissive material such as quartz or transparent alumina.
Since the top surface (64a) of the window material (64) is a surface for introducing light to the ultraviolet irradiation surface of the EPROM chip (61),
The remaining window material (64) excluding this top surface (64a),
The thin metal wire (62) and the connecting portion between the thin metal wire (62) and the wiring pattern (60b) are covered with a synthetic resin (65) (for example, model name MP-10 manufactured by Nitto Denko Corporation). if,
Insulating substrate (60), EPROM chip (61) and window material (64)
If it is necessary to further reduce the total thickness dimension including
The chip mounting area (60c) of the substrate (60) may be used as a countersunk hole to grip about half the thickness of the substrate (60). Further, if such counterbore holes are formed, a flow stop dam of the synthetic resin (65) is formed, which effectively acts on ingress of moisture and the like.

The EPROM mounting structure shown in FIG. 14 and FIG.
-83393 (H05K 1/18).

(C) Problems to be Solved by the Invention Needless to say, the EPROM mounting structure shown in FIG. 15 is miniaturized because the EPROM chip is die-bonded onto the printed circuit board. However, the miniaturization referred to here is only miniaturization of the EPROM itself. That is, the first
Although it is not clear from Fig. 5, the microcomputer and its peripheral circuit elements fixed around the EPROM are composed of electronic components such as discretes. When the entire system is viewed, there is a problem that the size of the printed circuit board does not become small at all, that is, the size of the entire system becomes large as usual. Furthermore, in the EPROM structure shown in FIG. 13, E
When erasing the program data of the PROM, after erasing by irradiating the printed circuit board with ultraviolet rays, write terminals such as a probe are contacted with the conductive pattern of the routing wire extended from the EPROM and rewriting is performed. However, the conventional general ROM writer cannot be used, and there is a problem in that EPROM rewriting is complicated.

In addition, in the EPROM mounting structure shown in FIG. 14, since the EPROM can be attached to and detached from the printed circuit board in terms of rewriting after erasing, comparison can be made because writing can be performed using a general ROM writer. It can be done easily. However, in the mounting structure shown in FIG. 12 as well, as in FIG. 14, the circuits around the EPROM, that is, the circuit elements such as the microcomputer and its peripheral LSI, IC are composed of discrete electronic components. However, there is a big problem that the printed circuit board becomes large in size, that is, the entire system becomes large in size, and it is impossible to provide a light, thin, short and small EPROM mounted integrated circuit which is required by the user.

Furthermore, in the EPROM mounting structure shown in FIGS. 14 and 15,
As mentioned above, the whole system becomes larger and EPROM
Also, since the conductive patterns that connect the circuit elements in the surroundings to each other are exposed, there is a problem that reliability is reduced.

Furthermore, in the EPROM mounting structure shown in FIG. 14 and FIG.
Since the OM and the circuit elements such as the microcomputer and ICs, LSIs and the like around the OM are exposed, there is a problem that unevenness is generated on the upper surface of the substrate, which makes it difficult to handle and reduces workability.

(D) Means for Solving the Problems The present invention has been made in view of the above problems, and a hole is provided at a predetermined position of a substrate, and the hole is connected to a conductive path formed on the substrate. The microcomputer and all other circuit elements are sealed in a sealed space formed by the substrate and case material so that the socket is fixed and the nonvolatile memory is inserted into the socket to expose only the nonvolatile memory. Characterized by a structure that stops.

Therefore, it is possible to provide a hybrid integrated circuit device in which the EPROM is miniaturized and the EPROM has a high-density packaging. Further, since the non-volatile memory is mounted by being inserted and mounted in the socket fixed in the hole on the exposed surface of the substrate having the hole, the non-volatile memory can be freely inserted and removed.

(E) Operation As described above, according to the present invention, holes are provided at predetermined positions of the substrate,
Since the non-volatile memory is inserted into the socket that is fixed to the hole and connected to the conductive path formed on the substrate to connect with the conductive path, the mounting position of the non-volatile memory can be set arbitrarily. In consideration of electrical connection with the built-in microcomputer, the EPROM and the microcomputer can be efficiently connected, and the signal line, that is, the lead line of the conductive path can be eliminated.

Furthermore, the most closely related microcomputer can be placed in the adjacent position of the EPROM, the data line for exchanging data between the EPROM and the microcomputer can be realized with the shortest distance or the minimum distance, and the loss of packaging density due to the routing of the data line. Will be suppressed to the minimum, and high-density mounting can be performed.

Further, in the present invention, only the non-volatile memory is exposed to the outside by being inserted into the socket fixed to the hole provided at the predetermined position of the substrate, and all other circuit elements are sealed by the substrate and the case material. Since it is housed in the space, it is possible to provide a hybrid integrated circuit device that is compact and has a high density packaging.

(F) Embodiment A hybrid integrated circuit device according to the present invention will be described in detail below with reference to an embodiment shown in FIGS.

1 to 3 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having a function independently in a wide range of fields such as computers.

As shown in FIGS. 1 to 3, the hybrid integrated circuit device (1) includes an integrated circuit board (2), a hole (4) provided at a predetermined position of the integrated circuit board (2), and an integrated circuit. A conductive path (5) having a desired shape formed on the substrate (2), a socket (16) fixed to the hole (4) and connected to the conductive path (5), and a conductive path inserted in the socket (16). A nonvolatile memory (6) connected to (5), a microcomputer (7) supplied with data from the memory (6) and circuit elements (8) around it, and a substrate (2) are integrated. And a case material (9).

A hard substrate made of ceramics, glass epoxy, metal, or the like is used as the integrated circuit substrate (2), and in this embodiment, a metal substrate excellent in heat dissipation and mechanical strength is used.

As the metal substrate, for example, an aluminum substrate with a thickness of 0.5 to 1.0 mm is used. As shown in FIG. 4, an aluminum oxide film (9 ') (alumite layer) is formed on the surface of the substrate (2) by well-known anodic oxidation, and one main surface side thereof is formed.
An insulating resin layer (10) such as epoxy and polyimide having a thickness of 10 to 70 μm is attached. 10 to 10 on the insulating resin layer (10)
A 70μ thick copper foil (11) is attached at the same time as the insulating resin layer (10) by means such as a roller or a hot press.

On the surface of the copper foil (11) provided on one main surface of the substrate (2), a conductive path of a desired shape is exposed by screen printing and masked with a resist, and a noble metal (gold, silver, platinum) plating layer is formed. The surface of the copper foil (11) is plated. After that, the resist is removed and the copper foil (11) is etched using the noble metal plating layer as a mask to form a desired conductive path (5). Here, the fineness of the conductive path (5) by screen printing is 0.5 mm.
Therefore, when a very fine wiring pattern is required, it is possible to form a very fine conductive path (5) of up to about 2 μ by the well-known photo-etching technique.

A non-volatile memory (6), a microcomputer (7) to which data is supplied from the memory (6), and a circuit element (8) around it are mounted on the conductive path (5) on the substrate (2). . Further, a conductive path (5) is extended to one side edge of the substrate (2) or a peripheral edge portion of the opposite side edge to form a plurality of pads for fixing the external lead terminals (12). An external lead terminal (12) is fixed to the pad by solder, is led out horizontally, and is bent at a substantially right angle at its central portion.

EPROM (Erasable Program) as a non-volatile memory (6)
mable read only memory) is used (hereinafter, nonvolatile memory (6) is referred to as EPROM). As is well known, this EPROM (6) emits electrons (program data) accumulated in the floating gate formed in the pellet of the EPROM (6) by irradiating light to excite it to restore it to the unstored state. It is an element that can be rewritten and used.

The structure of a general EPROM (6) is a DIP (dual in line) type as shown in FIG. 5 and FIG. 6, and is roughly classified into a resin mold type package type and a ceramics type package type. With either resin mold type or ceramic type, it is necessary to irradiate light to erase the memory of the pellet (14), so the part above the pellet (14) transmits high energy light (ultraviolet rays). A transparent member (15) is arranged. In this embodiment, either a resin mold type or a ceramic type package may be used as long as it is a DIP type EPROM (6). Such an EPROM device is disclosed in JP-A-53-74358 and JP-A-62-290160.

In this embodiment, a DIP type EPROM device is used for the EPROM (6), but the type of the EPROM (6) is basically arbitrary, and for example, it is also used for a ceramic type or resin mold type LCC, PLCC, or other package. It is possible. LCC and PLCC
Each type of EPROM device has a structure in which electrodes for connection are provided on four sides of the bottom surface. LCC and PLCC type EPR
Although the OM is smaller than the DIP type EPROM, this embodiment will be described using the DIP type EPROM device, which has the highest diffusion rate.However, in the case of requiring a more compact system, the LCC, PL
The effect is great if a CC type EPROM device is used. Further, the LCC and PLCC type EPROMs are mounted on the substrate via the sockets similarly to the DIP type.

On the other hand, in the present invention, the hole (4) is provided at a predetermined position of the substrate (2). As is apparent from FIGS. 1 and 2, the holes (4) are provided with the same number of holes (4) as the lead pins of the EPROM (6) are led out. That is, since the EPROM (6) used in this embodiment is a DIP type, two elongated holes (4) are formed in the substrate (2).
It is assumed that the hole (4) is formed by the press punching process before the formation of the conductive path (5) described above. The EPROM (6) used in this embodiment is of the DIP type as described above. However, when using the LCC type or PLCC type EPROM, the holes formed in the substrate are not shown, but they have the same shape as the EPROM.
One hole should be formed.

A part of a socket (16) described later is fitted into the hole (4) and integrated with the substrate (2). A part of the conductive path (5) formed on the substrate (2) is formed so as to extend at the peripheral end of the hole (4), and the distal end of the conductive path (5) is formed. The electrodes of the socket and the socket (16) are fixedly connected by the solder (17) by a predetermined solder reflow process.

As shown in FIG. 2, the socket (16) is formed so that its cross section is in the shape of a geta, and the two protruding parts (18) of the geta are fitted into the holes (4) to form a gap. It is completely sealed without any damage. The connection electrode of the socket (16) is connected to the conductive path (5) extending at the peripheral end of the hole (4) by solder (17). When the socket (16) is fitted in the hole (4), the upper surfaces of the two geta-shaped protrusions (18) of the socket (16) are arranged so as to be flush with the upper surface of the substrate (2) or slightly protrude. Has been done. EPROM
(6) will be inserted into the two protrusions (18) of the socket (16) and connected to the conductive path (5).

On the other hand, the ICs, transistors, chip resistors, chip capacitors, etc. of the microcomputer (7) and its peripheral circuit elements (8), which are supplied by selecting the program data of the EPROM (6), are desired conductive paths in chip parts. It is attached to (5) by soldering or a brazing material such as Ag paste, and the microcomputer (7) and the circuit element (8) are connected by bonding to a conductive path (5) in the vicinity. Further, a carbon resistor by screen printing or a nickel-plated resistor by nickel plating is formed as a resistance element between the conductive paths (5).

The substrate (2) is fixedly integrated with the case material (9).

The case member (9) is formed of a thermoplastic resin as an insulating member, and is formed in a box shape so that a space is formed when it is fixed to the substrate (2) as shown in FIGS. 2 and 3. There is. The peripheral end of the box-shaped case material (9) is arranged substantially at the peripheral end of the substrate (2) and firmly fixed to the substrate (2) by an adhesive sealant (J sheet: product name). Be integrated. As a result, a predetermined sealed space (21) is formed between the substrate (2) and the case material (9).

By the way, as described above, one end of the plurality of conductive paths (5) is extended to the peripheral end portion of the hole (4), and the EPROM (6) fitted in the conductive path (5) and the hole (4). ) Is inserted into the socket (16). The other end of the conductive path (5) to which the socket (16) is fixed extends near the microcomputer (7) and is electrically connected to the chip-shaped microcomputer (7) by a bonding wire.

Here, the positional relationship between the EPROM (6) and the microcomputer (7) will be described. FIG. 7 is an enlarged view of an essential part when the socket (16) for inserting the EPROM (6) and the microcomputer (7) are arranged on the substrate (2).
As shown in FIG. 7, the socket (16) into which the M (6) is inserted and the chip-shaped microcomputer (7) are connected through a large number of conductive paths (5). The socket (16) into which the EPROM (6) is inserted to shorten the routing of 5) and the microcomputer (7) are arranged so as to be adjacent to each other or as close to each other as possible. Therefore, the routing of the conductive path (5) between the socket (16) for inserting the EPROM (6) and the microcomputer (7) can be formed in the shortest distance, and the mounting area on the substrate can be effectively used. As shown in FIG. 7, the EPROM (6) and the chip-shaped microcomputer (7) arranged in the vicinity of or adjacent to the EPROM (6) are connected to the tip of the conductive path (5) extending in the vicinity of the microcomputer (7). It is bonded and connected by a wire wire and electrically connected to a socket (16) into which the EPROM (6) is inserted.

By the way, the EPROM (6) is inserted into the socket (16) and mounted on the exposed surface of the substrate (2).
The whole of (6) will be exposed to the outside. That is, EPRO
Only M (6) will be mounted outside the board, and EPROM
The microcomputer (7) and its peripheral circuit element (8) other than (6) are arranged in the sealed space (21) formed by the substrate (2) and the case material (9).

As described above, the microcomputer (7) connected to the EPROM (6) and the circuit elements (8) around it are the sealed space (21) formed by the substrate (2) and the case material (9).
It is set to be placed in. Furthermore, all the chip-shaped electronic components and resistive elements such as printing resistors and plating resistors are provided in the sealing space (21).

On the other hand, since the entire EPROM (6) is exposed, its EPR
A light blocking sealing material (22) is adhered to the upper surface of the OM (6) to completely block light.

By the way, in FIG. 8, the socket (16) into which the EPROM (6) is inserted has a shape in which two protrusions are integrated. In this case, the area of the socket (16) itself may reduce the mounting density. Therefore, in order to further improve the packaging density, the socket (16) can be divided into two and used as shown in FIG. In this case, the conductive path (5) can be formed between the two sockets (16), and the area can be effectively used.

When erasing the data of the EPROM (6) in this embodiment, the sealing material (22) is peeled off and ultraviolet rays are irradiated, or the EPROM (6) is removed from the socket (16) and ultraviolet rays are irradiated. For rewriting, the EPROM (6) may be removed from the socket, electrically written using a general ROM writer, and then inserted into the socket (16) after writing.

A specific example of a hybrid integrated circuit device for a modem using the present invention will be shown below.

First, a modem (MODEM) exists for data communication in which digitized data handled by a data terminal such as a personal computer is transmitted and received at a distance from each other using a telephone line. The function of the modem is to modulate the digitized data by using the frequency that can be used in the telephone line, convert it into an analog signal and put it on the telephone line, and the analog signal modulated with the data sent from the other party. It has the function of demodulating and returning to digitized data.

The modem will be briefly described based on the block diagram shown in FIG.

FIG. 9 is a block diagram when a modem is mounted on the integrated circuit board (2).

The modem stores a data transmitted from a personal computer in a built-in memory and outputs the data, and a micro that outputs a predetermined output signal based on the data output from the DTE interface (31). EPROM containing data addressed by the computer (7) and the microcomputer (7)
(6), first and second modulation / demodulation circuits (32) (33) that modulate and demodulate the output signal from the microcomputer (7) and output to the NCU (NETWORK CONTROL UNIT), and output from the microcomputer (7) Desired DTMF depending on the signal
And a DTMF generator (34) for generating a signal (tone signal).

The DTE interface (31) is composed of an IC such as STC9610 (Seiko Epson), supplies the output signal of the personal computer, stores the output signal in the built-in memory and outputs it to the microcomputer (7) as shown in FIG. A transmission memory section (35), a reception memory section (36) for accumulating a signal supplied with an output signal from the microcomputer (7) in the internal memory and outputting the signal to the personal computer (38), and a transmission memory section ( 35) and a control section (37) for switching respective signals input and output through the reception memory section (36), and has a predetermined function for connecting the personal computer (38) and the microcomputer (7). I have.

The microcomputer (7) is composed of, for example, an IC such as STC9620 (Seiko Epson), and as shown in FIG. 11, it is recognized by the command recognition unit that recognizes the output signal output from the DTE interface (31) and the command recognition unit. The command decoding unit that decodes the output signal, the command execution unit that compares the data in the memory unit based on the signal decoded by the command decoding unit and supplies the data to the modem circuit, the data in the command decoding unit and the data in the memory unit When incorrect data is supplied to the command execution unit as a result of comparison with
The DTE interface (31) includes a response code generation unit that outputs an output signal.

The modulation / demodulation circuit (38) converts the digital signal transmitted from the microcomputer (7) into an analog signal and transmits it to the NCU unit. On the contrary, it converts an analog signal transmitted from the NCU unit into a digital signal and transmits it to the microcomputer (7), and includes low-speed and medium-speed circuits. The first modulation / demodulation circuit (32) is 30
This is a low-speed modulation / demodulation circuit of 0 bps, and the second modulation / demodulation circuit (33)
Is a 1200bps medium speed modulation / demodulation circuit. One of the first and second modulation / demodulation circuits (32, 33) is selected by the microcomputer (7).

The DTMF generator (34) generates a predetermined DTMF signal by inputting the data output from the command execution unit of the microcomputer (7) to the input terminals of each of COL and ROW, and transmits AMP.
Output to (39) and supply signal to telephone line.

Program data for setting various modes of the modem is stored in the EPROM (6) and is supplied to the microcomputer (7) based on the address of the microcomputer (7).

Next, the operation of the modem will be briefly described.

First, when the personal computer communication is started, the control switch (40) operates based on the read signal from the microcomputer (38), and the predetermined address data is transferred to the EPROM (7).
Is supplied to the microcomputer (7), and the program data of the EPROM (6) based on the address is supplied to the microcomputer (7), and the communication standard (BELL / CCITT) of each modem is used for communication.
Standard), communication speed (300 / 1200bps), matching of data format, switching of DIP switch mode, etc. are checked to see if they match.

Assuming that the various modes are the same, enter the telephone number of the answering modem into the personal computer. The telephone number is input to the DTE interface (31) for interfacing with a personal computer and transferred to the microcomputer (7) for decoding the telephone number. The decrypted result
Send to DTMF generator (34) and DTMF from DTMF generator (34)
A signal is transmitted and the signal is transferred to a general telephone line via a transmission AMP (39) and a line transformer (41).

The transferred DTMF signal is transmitted to the modem on the answer side to issue a call signal, and the modem on the answer side receives the call signal and automatically receives the call. Then, the answering modem sends an answer tone for the connection procedure to the calling modem.

The modem on the calling side passes through the line transformer (41) and the receiving amplifier (42), and the low speed modulation / demodulation circuit (32) detects whether or not the answer tone is a predetermined answer tone for the modem on the calling side. . If it is a predetermined answer tone, the communication state is entered.

In the communication state, parallel data from the personal computer is input to the DTE interface (31) based on a predetermined key input signal from the keyboard of the calling personal computer, and the data is transferred to the microcomputer (7). Here, the parallel data is converted into serial data. The digital signal converted into serial data is transmitted to the low speed modulation / demodulation circuit (32). Here, the digital signal is converted into an analog signal, frequency modulation FSK is performed based on the communication standard corresponding to it, transmission AMP (39), line transformer (41)
To the modem on the answering side.

On the other hand, the frequency-modulated analog signal sent by the key input signal of the responding personal computer is sent to the calling modem and input to the low speed modulation / demodulation circuit (32) via the line transformer (41) and receiving AMP (42). To be done. Here analog signals are converted to digital signals and DTE interface (31)
The serial digital signal is converted to a parallel digital signal and input to the calling personal computer. As a result, the personal computer for the calling side and the personal computer for the answering side can perform full-duplex communication, thus realizing personal computer communication.

FIG. 12 is a plan view of the modem circuit shown in FIG. 9 mounted on the substrate (2) used in this embodiment, and the circuit elements mounted have the same reference numerals. The connection between the EPROM (6) and the microcomputer (7) is shown by a bus line. The conductive paths connecting the plurality of circuit elements are omitted because they are complicated.

As shown in FIG. 12, a plurality of fixing pads (5a) to which the external lead terminals (12) are fixed are provided on the opposing peripheral ends of the substrate (2). A plurality of circuit elements (8) are provided at predetermined positions on the conductive path (5) extending from the fixing pad (5a).
And the socket (16) carrying the EPROM (6) is fixed. A plurality of circuit elements (8) including a microcomputer (7) other than the EPROM (6) are fixed on the substrate (2), (31) is a DTE interface, and (32)
(33) is the first and second modulation / demodulation circuits, (34) is a DTMF generation circuit, (40) is a control switch for controlling the EPROM (6), (7) is a microcomputer, (8) is a chip such as a capacitor. It is a part.

As shown in FIG. 12, the socket (16) on which the EPROM (6) is mounted is fixed near or adjacent to the microcomputer (7). Microcomputer (7)
By fixing the socket (16) near or adjacent to the microcomputer (7) and EPROM (6)
The distance between the bus line and the wiring line of the conductive path (6) can be set to the shortest distance and the shortest distance, and other mounting patterns can be effectively used and high-density mounting can be performed. The area surrounded by the alternate long and short dash line shows the area where the case material (9) is fixed with an adhesive sheet.

FIG. 13 shows a case material (9) on the substrate (2) shown in FIG.
FIG. 3 is a plan view of a finished product of the hybrid integrated circuit device for a modem when the other substrate (2) is fixed via the substrate (2).
Only the EPROM (6) is exposed from the upper surface of the. That is, all the elements other than the EPROM (6) are sealed in the sealing space (21) formed by the case material (9) and the substrate (2), and only the EPROM (6) is mounted outside the substrate. So EPR
The OM (6) can be freely inserted and removed as needed.

EPROM for hybrid integrated circuit device for modems detailed above
In (6), in order to prepare for diversification of product specifications, it is possible to easily deal with specification changes required by the set maker (user) such as destination, OEM, and in-house sales. That is, EPROM
Circuit configurations other than (6) were designed in advance to accommodate various specification changes, but when a hybrid integrated circuit was designed based on the specifications of a specific user, it may not match the specifications of other users. In that case, conventionally, it was necessary to review the design of the hybrid integrated circuit itself.

However, in the hybrid integrated circuit device of the present invention, since the EPROM (6) is placed on the exposed surface of the substrate (2) through the socket (16), the EPROM (6) can be detached, so that the EPROM (6) can be removed by the user. It is possible to realize multiple types of hybrid integrated circuit devices with one hybrid integrated circuit device only by selecting and mounting.

According to the present invention, holes (4) are formed at desired positions on the substrate (2).
Is provided, and the socket (16) is fitted into the hole (4) so that the lead pin insertion part faces outward in the hole (4), and the EPROM (6) is inserted into the socket (16). By arranging a microcomputer (7) and other circuit elements (8) in a sealed space (21) formed by two substrates (2) and (3) and a case material (9), A system in which the circuit and the EPROM are integrated and miniaturized can be provided, and the EPROM (6) can be freely inserted and removed.

(G) Effect of the Invention As described in detail above, according to the present invention, firstly, a hole (4) is provided at a desired position of the substrate (2) and the substrate (2) is fixed to the hole (4). Since the EPROM (6) is inserted and connected to the socket (16) connected to the desired conductive path (5) above, E
This has the advantage that the placement position of the PROM (6) can be arbitrarily selected. Therefore, considering the electrical connection with the built-in microcomputer (7), the EPROM (6) and the microcomputer (7) can be efficiently connected, and the wiring of the signal line can be eliminated. More specifically, the most closely related microcomputer (7) can be arranged at a position adjacent to the EPROM (6), and as a result, the data line for exchanging data between the EPROM (6) and the microcomputer (7) can be minimized. It can be realized with the distance or the layout that is most easily designed, and the loss of the mounting density due to the routing of the data lines can be suppressed to the minimum.

Since the EPROM (6) is inserted and arranged in the socket (16) fitted in the hole (4) at the desired position of the second substrate (2),
Despite the use of a commercially available mold type EPROM (6), it has an advantage that it can be handled as an integrated small hybrid integrated circuit device. Furthermore, by improving the packaging density of the microcomputer and its peripheral circuit elements to be incorporated on the integrated circuit board (2), the conventionally required printed circuit board can be eliminated and one miniaturized EPROM (6) can be detachably attached. It is possible to realize a hybrid integrated circuit device that is built into the. Furthermore EPRO
M (6) will be placed on the exposed surface of the substrate, and EPROM
Easy to put on and take off.

Thirdly, by using a metal substrate as the integrated circuit board (2), the heat radiation effect thereof can be greatly improved compared with the printed circuit board, which can contribute to further improvement of the mounting density. Further, by using the copper foil (11) as the conductive path (5), the resistance value of the conductive path (5) can be significantly reduced as compared with the conductive paste, and the mounted circuit can be expanded to a level equal to or larger than that of the printed circuit board.

Fourthly, since a commercially available dual in-line type or LCC type can be used as the EPROM (6), there is an advantage that the EPROM (6) can be very easily mounted on the hybrid integrated circuit device.

Fifth, the microcomputer (7) connected to the EPROM (6) and its peripheral circuit elements (8) are case materials (9).
Since it is incorporated in the sealing space (21) formed by the integrated circuit board (2) and the integrated circuit board (2) in a die shape or a chip shape, the occupied area is much smaller than that of a conventional printed circuit board molded with resin. , Has the advantage that the packaging density can be greatly improved.

Sixth, by making the peripheral edges of the case material (9) and the integrated circuit board (2) substantially coincide with each other, almost the entire surface of the integrated circuit board (2) can be used as the sealing space (21), and the mounting density Combined with the improvement, an extremely compact hybrid integrated circuit device can be realized.

Seventh, the external lead terminals (12) can be led out from one side of the integrated circuit board (2) or the opposite sides, which has an advantage that an extremely multi-pin hybrid integrated circuit device can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view showing this embodiment, and FIG. 2 is I- in FIG.
I sectional view, FIG. 3 is a II-II sectional view of FIG. 1, FIG. 4 is a substrate sectional view used in this embodiment, and FIG. 5 is used in this embodiment.
FIG. 6 is a perspective view showing the EPROM, FIG. 6 is a cross-sectional view of FIG. 5, FIG. 7 is a perspective view showing the positional relationship between the socket into which the EPROM is inserted and the microcomputer, and FIG. 8 is other than that shown in FIG. FIG. 9 is a block diagram showing a modem circuit used in this embodiment, FIG. 10 is a block diagram showing a DTE interface of the modem shown in FIG. 9, and FIG. 11 is FIG. Fig. 12 is a block diagram showing the microcomputer of the modem shown in Fig. 12, Fig. 12 is a plan view when the block diagram shown in Fig. 9 is mounted on a substrate, and Fig. 13 is a case material on the substrate shown in Fig. 12. FIGS. 14 and 15 are perspective views showing a conventional EPROM mounting structure when the other substrate is fixed via the. (1) ... hybrid integrated circuit device, (2) ... integrated circuit board, (5) ... conductive path, (6) ... EPROM, (7) ...
Microcomputer, (8) ... Circuit element, (4) ...
… Hole, (9) …… Case material, (16) …… Socket.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Osamu Nakamoto 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Katsumi Okawa 2-18 Keiyo Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuhiro Koike, 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Masao Kaneko 2-18, Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Seiwa Ueno 2-18, Keihanhondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuo Saito 41-1, Omama-cho, Yamama-gun, Gunma Prefecture Tokyo IC

Claims (10)

[Claims] 1. An integrated circuit substrate, a conductive path having a desired pattern formed on the substrate, a resin-molded nonvolatile memory connected to the conductive path, and data supplied from the memory, A microcomputer connected to a conductive path on the substrate and its peripheral circuit element; and a case member integrated with the substrate, a hole is provided at a desired position of the substrate, and the hole is fixed to the hole and fixed on the substrate. The non-volatile memory is inserted into a socket connected to a desired conductive path, and the microcomputer and its peripheral circuit elements are arranged in a sealed space formed by the substrate and the case material. Integrated circuit device. 2. The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit substrate. 3. The hybrid integrated circuit device according to claim 1, wherein a copper foil is used as the conductive path. 4. The non-volatile memory is dual in-line type resin molded.
A hybrid integrated circuit device as described. 5. The hybrid integrated circuit device according to claim 1, wherein the hole and the socket are hermetically sealed. 6. The hybrid integrated circuit device according to claim 1, wherein the microcomputer is mounted on the conductive path in a die shape. 7. The hybrid integrated circuit device according to claim 1, wherein a chip resistor and a chip capacitor are used as the peripheral circuit element. 8. The hybrid integrated circuit device according to claim 1, wherein a peripheral end portion of the case material is substantially aligned with a peripheral end portion of the substrate. 9. The hybrid integrated circuit device according to claim 1, wherein the socket is connected to the conductive path. 10. The hybrid integrated circuit device according to claim 1, wherein a sealing material for shading is provided on an upper surface of the non-volatile memory.