JPH0680749B2 - Semiconductor integrated circuit device - Google Patents

Description

The present invention relates to a semiconductor device, and more particularly to a resin-molded semiconductor integrated circuit device.

[Conventional technology]

FIG. 5 is a perspective view showing an example of a conventional resin-molded semiconductor integrated circuit device. In the figure, (1) is a semiconductor integrated circuit chip having a first main surface (upper main surface), a second main surface (lower main surface) and a peripheral side surface which are substantially parallel to each other, (2)
Is a plurality of pads for external connection adhered to the first main surface, (3) is a support plate fixed to the second main surface,
(4) is a plurality of external leads, (5) is a wire connecting the external connection pad (2) and the external lead (4), (6) is (1), (2), (3), (4) , Which is a resin molded member for covering the. FIG. 6 is a sectional view showing an example of a semiconductor integrated circuit chip mounted on a printed wiring board or the like. In the figure, (7) is a printed wiring board, (8) is a wiring conductor wired on the printed wiring board (7), (9) is provided on an external connection pad (2), and the pad and the wiring conductor (8) are provided. )
The protruding electrode (10) for connecting the electrodes is a covering material applied after the electrode (9) is bonded to the wiring (8) in order to protect the chip (1), the pad (2), the electrode (9) and the like. is there.

Now, in the conventional resin-molded semiconductor integrated circuit device as shown in FIG. 5, the integrated circuit chip (1) is fixed by the support plate (3) to maintain the mechanical strength, and the external connection pad (2) is provided.
The external lead (4) is connected to the external lead (4) by a wire (5), so that electric signals can be exchanged between the semiconductor integrated circuit chip (1) and the external circuit. Further, the semiconductor integrated circuit chip (1) has low mechanical strength, and the characteristics of the semiconductor integrated circuit are easily affected by the external atmosphere. Furthermore, the wire (5) usually has a diameter of 20
The mechanical strength is weak because a fine metal wire of gold, aluminum, copper or the like having a thickness of up to 50 μm is used. A resin molding member (6) is covered and molded to protect the mechanical strength of the semiconductor integrated circuit chip and the wires and to protect the characteristics of the semiconductor integrated circuit from the external atmosphere.

Further, in the example as shown in FIG. 6, a semiconductor integrated circuit chip (1) which is not resin-molded is directly projected onto a printed wiring board (7), and an external connection pad (2) is formed without interposing wires or external leads. Since the print is connected to the wiring (8) on the wiring board (7), a bump electrode (9) is provided on the pad (2) and connected by so-called phase down bonding. The chip (1) and the wiring are connected. A covering material (10) (for example, a thermoplastic resin) for protecting the connection between the electrode (8) and the electrode (9)
Are covered. Since this covering material (10) is not molded, the covered shape is not always constant.

[Problems to be solved by the invention]

In the semiconductor integrated circuit as shown in FIG. 5, the semiconductor integrated circuit chip (1), the other supporting plate (3), the external leads (4),
Since the wire (5) is required and is further resin-molded, the assembling process of connecting and molding these is complicated in the assembling process, and a precise assembling technique is required. That is, for assembling such a semiconductor integrated circuit, for example, a semiconductor integrated circuit chip (1) prepared in advance is integrated with a support plate (3) generally called a lead frame and external leads (4), but a support plate (3) Then, the external connection pad (2) and the external lead (4) are connected to each other by a wire (5). This wire usually has a diameter of 20 to 50 as described above.
Very thin as μ, this connection requires extremely precise technology. The number of external connection pads is usually around 10 to 100.
Some of them are more than the above, which requires a lot of trouble. Next, after the whole is resin-molded, unnecessary parts of the lead frame are removed, and molding such as bending of external leads is performed as necessary. As described above, the assembling process requires a large number of steps and requires the external leads (4). Therefore, the completed semiconductor integrated circuit device is much larger than the semiconductor integrated circuit chip (1). The packaging density of is low. Furthermore, stray capacitance and stray inductance due to the wires used for connection also result in delaying the signal processing time of the semiconductor integrated circuit.

The example of FIG. 6 eliminates some of the drawbacks of the example of FIG. For example, since the wire connection is not required, the process of assembling the semiconductor integrated circuit is simplified, and since the semiconductor integrated circuit chip is directly mounted on the printed wiring board of an electronic device, the mounting density is increased and the floating by the connection wire is caused. Since the inductance and stray capacitance are reduced, the signal processing time can be shortened. On the other hand, however, the semiconductor integrated circuit chip has no protective means until it is mounted on the printed wiring board and coated with a covering material, so that the characteristics may be deteriorated by the external atmosphere. Also, semiconductor integrated circuit chips are usually several mm square and have a thickness
Small pieces of about 200 to 500 μm are fragile and easily cracked or chipped during handling. In addition, when a covering material is applied after mounting, it is difficult to make the adhered area and shape on the printed wiring board constant. Furthermore, it is difficult to dissipate heat because it is connected to the printed wiring board by the protruding electrodes.

The present invention has been made to solve the above problems, and protects a semiconductor integrated circuit chip from the external atmosphere, protects it mechanically, is easy to assemble, is small in size, has a high packing density during use, and has a high signal density. It is to provide a semiconductor integrated circuit having a high processing speed.

[Means for solving problems]

A semiconductor integrated circuit device according to the present invention covers a surface and a side surface of a semiconductor integrated circuit chip with a resin molding member having a notch for opening an external connection pad provided on the surface of the semiconductor integrated circuit chip fixed to a support plate. Is.

[Action]

Since the semiconductor integrated circuit device according to the present invention has no external leads, it is small in size, and the main surface and side surface of the semiconductor integrated circuit chip on the side having the pad are covered with molding resin for mechanical protection and influence on the external atmosphere. It is getting harder. Further, since there is no connection by wires, the assembly is simple, and the stray capacitance and stray inductance of the circuit are reduced, and the signal processing time can be shortened. The support plate also enhances heat dissipation of the semiconductor integrated circuit.

Example of Invention

FIG. 1 is a perspective view of a semiconductor integrated circuit device showing an embodiment of the present invention, and (1) to (3) and (6) are the same as those of the conventional device. A plurality of external connection pads (2) are provided on the first main surface (1A) of the semiconductor integrated circuit chip (1), and the second main surface (1B) is fixed to the support plate (3). . First main surface (1) of a semiconductor integrated circuit chip (1)
A), the side surface (1C) is covered with a resin molding member (6), and the resin molding member (6) has the same number of opening notches (11) as the pad (2). (11) exposes each external connection pad (2). The external connection pad (2) is usually made of a good conductor material such as aluminum, but in order to avoid the influence of external atmosphere such as moisture, molybdenum, tungsten, tantalum, titanium, gold or the like weather resistant metal, or It is effective to use the alloy for at least a part thereof.

In the example of FIG. 1, the external connection pad (2) is a single in-line type provided along only one side of the semiconductor integrated circuit chip (1). In such a case, the opening notch (11) is extended from one end side (6A) of the resin molding member (6) to the upper part of each pad (2) in accordance with this, as in the embodiment. Thus, for example, it is possible to provide a projection connected to the external connection pad (2) at a predetermined position of a printed wiring to be mounted, and insert the integrated circuit device according to the present invention therein, and to further increase the mounting density. I can. Further, it goes without saying that the external connection pads (2) are not limited to one side and are provided on each side, and a plurality of semiconductor integrated circuit chips can be molded into one.

In the semiconductor integrated circuit configured as described above, the semiconductor integrated circuit chip (1) has the first main surface (1A) and the side surface (1C) covered and molded with the resin molding member (6) to protect it from the external atmosphere and mechanically. Protected, the external connection pad (2) is exposed to the outside by the opening notch (11) of the resin molding member (6), which enables connection with the external circuit of the semiconductor integrated circuit. .

FIG. 2 is a perspective view showing another embodiment of the present invention, and FIG. 3 is an AB sectional view of the same embodiment. Reference numeral (12) is an adhesive material for adhering the semiconductor integrated circuit chip (1) and the support plate (3). In this embodiment, only a limited part of the upper surface of the external connection pad (2), that is, the central part thereof is exposed,
The peripheral end is covered with a resin molding member. In this embodiment, only a part of the external connection pad is exposed to the external atmosphere,
Since the rest is covered and protected by a resin molding member, it is also excellent in protection from the external atmosphere. Portion (6B) between the edge (6A) of the resin molded member (6) and the external connection pad (2)
When the resin molded member (6) is thinned and mounted on the printed wiring board, the flexible metal electrode member provided on the printed wiring board is connected to the external connection terminal (2) from above this portion (6B). Introduced on top to facilitate pressure contact.

FIG. 4 is a side sectional view of a semiconductor integrated circuit device showing still another embodiment of the present invention. In this embodiment, the surface of the supporting plate (3) fixed to the second main surface (1B) of the semiconductor integrated circuit chip (1) opposite to the surface to which the second main surface (1B) is fixed is a resin molding member. Since it is exposed from (6), the heat dissipation of the support plate (3) can be facilitated.

〔The invention's effect〕

INDUSTRIAL APPLICABILITY As described above, the present invention does not require wire connection in assembling a semiconductor integrated circuit, simplifies the assembling process, makes it possible to provide a cheaper integrated circuit device, and because the size is small, the mounting density is increased, while the resin Since it is covered with the molded member, the mechanical strength can be maintained and the handling becomes easy.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a perspective view showing another embodiment of the present invention, FIG. 3 is a sectional view thereof, and FIG. 4 is a further embodiment. A sectional view, FIG. 5 is a perspective view of a conventional semiconductor integrated circuit, and FIG. 6 is a side sectional view of mounting of another conventional semiconductor integrated circuit. In the figure, (1) is a semiconductor integrated circuit chip, (2) is an external connection pad, (3) is a support plate, (6) is a resin molding member, and (11) is an opening notch.

Claims (2)

[Claims] 1. A first main surface, a second main surface and side surfaces that are substantially parallel to each other, a second main surface side being fixed to a support plate, and a plurality of external connection pads being provided on the first main surface side. A semiconductor integrated circuit chip, comprising a resin molding member covering at least the first main surface side of the chip and a side surface of the chip, wherein a notch for opening the external connection pad is formed in the resin molding member. Integrated circuit device. 2. The semiconductor integrated circuit device according to claim 1, wherein a surface of the supporting plate opposite to the chip fixing surface is exposed from a resin molding member.