JPH0679744A - Die device, die plate and press device - Google Patents

Abstract

PURPOSE:To provide a die device which can be ideally attached to a press device capable of automatically performing a pressure molding process, the press device whic uses the die device and a die plate used on the die device. CONSTITUTION:The subject die device consists of an upper holding plate 28, a die plate and a lower holding plate 37 stacked over each other between a top ram 21a and a bottom ram 21b using a link mechanism, and a press device is composed of this die device. In addition, a die plate 33 incorporated in the die device has an adjacent groove, to an opening where a material for molding is filled, which is formed on the upper surface.

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold device, a mold plate and a mold plate.
For more information on press and press equipment,
It is suitable for loading into the press machine to be manufactured and is dangerous to the operator.
Burrs are used in the manufacture of mold equipment and pressure-molded products that do not have ruggedness.
It is possible to reduce the generation and it is suitable for the mold device.
A mold plate that can be properly loaded and a pressure-molded product
The present invention relates to a press device that can be dynamically manufactured. [0002] Conventional techniques and problems to be solved by the invention
A hot press machine is not used for pressure molding of synthetic resin.
Be done. This hot press machine is placed vertically facing each other
The upper and lower rams are
Is heated to a predetermined temperature by the heating means and is used for pressure molding.
Make sure that the upper ram descends toward the lower ram.
It is configured. In the pressure molding, first, the operator lowers
Place the mold plate on the holding plate. This mold plate has a predetermined shape
For example, a rectangular opening is provided,
When the mold plate is placed on top of the plate, a rectangular recess is formed.
Is made. Thermoplastic resin powder, for example, is placed in this recess.
Fill up. In many cases, thermoplastic resin powder with high bulk specific gravity
When the powder is melted, the melting volume of the thermoplastic resin decreases
In the concave part, so that it is higher than the surface of the mold plate.
, Filled with thermoplastic resin powder to form a heap
Let Next, an upper pressing plate is placed on this mold plate. This
The mold plate on the lower and upper holding plates
And the thermoplastic resin powder in the opening in the mold plate.
To obtain a mold laminate. Next, on the lower ram in the press machine
Place the die stack on the end face and lower the upper ram.
It is lowered and the die stack is pressed. Upper and lower rams are predetermined
Since it is heated to the temperature, heating by the upper and lower rams
Thermoplastics filled in the opening of the mold plate by
Resin powder melts. Also, melting of thermoplastic resin powder
Melted by the gas present between the thermoplastic resin powders
Since bubbles are generated in the thermoplastic resin, pressurize
By slightly reducing the pressure applied by the lower ram,
Remove the bubbles. Then, the pressing force by the upper and lower rams is further specified
The value is increased to the value of
The die stack is heated and pressed by the upper and lower rams. Elapse of a predetermined time
After that, release the pressure from the upper and lower rams, raise the upper ram,
Also, heating by the upper and lower rams is stopped. When the mold laminate has cooled sufficiently,
The upper and lower pressing plates from the die stack of
Thermoplastic peeled from the plate and solidified at the opening in the mold plate
The resin plate is removed from this opening. Thermoplastic isolated
The flexible resin plate is subjected to various inspections, for example. However, such a thermoplastic resin plate
There are the following problems in the production of That is, on the upper end surface of the heated lower ram
The operator touches the upper and lower rams when placing the mold stack
There is a risk of burns. Risk of burns
When removing the mold stack from the lower ram after pressure molding
Also occurs. That is, when cooling for a predetermined time after pressure molding
And remove the mold stack on the upper edge of the lower ram.
Places to look for, work in a hurry, or
What is the heated mold stack and the cooled mold stack?
Since it is indistinguishable, the operator must touch the mold stack at high temperature.
You may touch it. The production of the thermoplastic resin plate as described above was eventually
Since it is done manually by the operator, it takes a lot of time and effort.
There is also the problem of inefficiency. Production of thermoplastic plate
The mold is a mold placed on the lower pressing plate as described above.
The operation of filling thermoplastic resin powder into the openings in the plate
Work, for placing the mold stack on the upper surface of the lower ram, etc.
Do not stop, press the lower pressing plate and the upper pressing after pressure molding.
There is a work such as cleaning the back plate and mold plate, which makes the work extremely complicated.
It Furthermore, for example, a thermoplastic resin manufacturing site
In the case of thermoplastic resin powder,
And then periodically check the quality of the thermoplastic resin.
Due to the need for inspection, automatic inspection equipment is often installed. So
In the case of the
If the plastic resin plate is created by the above-mentioned manual work,
This manual production of the thermoplastic resin plate is the rate-determining step.
In addition, there is also a problem that the inspection efficiency becomes very poor. Therefore, it is possible to link to an automatic inspection device.
As an automatic sample preparation device,
Device is desired. As a sample loaded in an automatic inspection device
The thermoplastic resin plate of
It is required to have a constant thickness. However, as described above, the flat plate
Heat can be applied by using the lower holding plate, upper holding plate, and mold plate.
When you make a plastic plate, you often get a thermoplastic plate.
There is a problem that the thickness of the
Even if the lower pressing plate, the upper pressing plate and the mold plate are
Problems in manual production of thermoplastic resin plates used
It can be said that there is. Moreover, the thermoplastic resin plate created
Not only the problem of uneven thickness, but also the heat
Burrs are generated on the plastic resin plate, and the burrs are cut and removed.
I have to do this, so it will take a lot of time and effort
There is a problem that The present invention has been made based on the above circumstances.
Of. That is, the object of the present invention is to prevent the operator from being burned.
Do not perform dangerous operations such as
To provide a mold device capable of manufacturing a pressure-molded body.
And in. Another object of the present invention is to produce burrs.
There is no pressure, and pressure-molded products with a certain thickness can be easily operated.
Mold plate that can be manufactured and used in the mold device
To provide. Another object of the present invention is to prevent the operator from being burned.
Pressurization can be performed with simple operation without encountering any dangerous eyes.
Providing a press device capable of producing a shape
It is in. [Means for Solving the Problems]
The invention according to claim 1 for the lower pressing plate, for molding
A mold plate having an opening for filling the material, and an upper holding member
The plates are arranged vertically in this order with a space between them,
Press the lower part so that the holding plate separates from the upper holding plate.
The plate is held by the first holding member on the upper holding plate,
The mold plate is pushed upward so that the plate is separated from the upper holding plate.
It is characterized in that it is held by the second holding member on the plate.
The invention according to claim 2 is a mold device for
Even plate, mold plate with openings to fill the molding material,
And hold the upper holding plate up and down in this order with a gap
Holding means and a lower surface of the mold plate on the upper surface of the lower pressing plate.
The pressing means for forcibly adhering the
Forcibly peel off the upper and lower pressing plates from the mold plate.
A mold device comprising:
The invention according to claim 3 is a lower pressing plate and a molding device.
A mold plate having an opening for filling the material and an upper holding plate
And holding the lower pressing plate and
Place the plate between the upper and lower rams and the position retracted from the upper and lower rams.
Both the first holding mechanism for moving and the one for holding the mold plate
Then retract this mold plate from between the upper and lower rams and between the upper and lower rams.
The second holding mechanism for moving to the
Hold the plate and attach this upper holding plate between the upper and lower rams.
Third holding to move to a retracted position from between the upper and lower rams
And a mechanism for driving the first holding mechanism between the upper and lower rams.
Lower holding plate placed between the upper and lower rams by
In addition, by driving the second holding mechanism,
Overlapping the mold plate on the plate and driving the third holding mechanism
The upper pressing plate can be overlaid on the upper surface of the mold plate by
A mold device characterized in that
In the invention according to claim 4, the first holding mechanism is configured so that the upper and lower laths are
Rotatable first rotation provided at a position retracted from the space
It is rotatably supported by the support member and the first rotation support member.
And a first rotation holding member for holding the lower pressing plate.
The second holding mechanism is at the position retracted from the space between the upper and lower rams.
And a second rotatable support member provided on the
The mold plate is rotatably supported by the dynamic support member and
A second rotation holding member that is detachably attached,
The holding mechanism is installed in a position retracted from the space between the upper and lower rams.
A rotatable third rotatable support member and the third rotatable support
It is rotatably supported by the holding member and holds the upper holding plate.
The third rotation holding member to be held, according to claim 3,
According to the invention described in claim 5,
The second holding mechanism works between the upper and lower rams and between the upper and lower rams.
The mold plate can be moved to the retracted position and detachably held.
A movable holding member for holding the first holding mechanism,
A first rotation support body rotatably attached to the movement holding member;
The lower part is rotatably supported by the first rotating support body.
A first rotation holding body for holding the pressing plate,
The holding mechanism is rotatably attached to the moving holding member.
Third pivot support and pivotally supported on the third pivot support
And a third rotation holding body that holds the upper pressing plate and
The mold apparatus according to claim 3, further comprising:
In the invention according to claim 6, the second holding mechanism includes upper and lower laths.
It is possible to move to a retracted position from between the upper and lower rams.
Forming and holding the mold plate detachably
A holding member, wherein the first holding mechanism is the moving holding member.
A first rotary support rotatably attached to the first rotary support and the first rotary support
It is rotatably supported by the support and holds the upper holding plate.
A first rotation holding body for holding the third holding mechanism,
Third rotation support rotatably mounted on the movement holding member
The body and the third rotation supporter are rotatably supported and
A third rotation holding body for holding the upper pressing plate.
The mold device according to claim 3, wherein the mold device according to claim 7.
Of the invention is a lower pressing plate that circulates between the upper and lower rams.
And between the upper and lower rams from the position retracted from the upper and lower rams
Move to above the lower holding plate, and after pressing
A mold plate that moves to a retracted position from between the upper and lower rams, and
It has an upper holding plate that circulates between the lower rams.
The invention according to claim 8, which is a mold apparatus characterized by
Holds a mold plate with openings to fill the molding material
And evacuate between the upper and lower rams and between the upper and lower rams.
Mold plate holding member movable to a fixed position and this mold plate holding portion
It is rotatably attached to one end of the material, and
The upper and lower pressing plates that have been put together and the mold plate
Excessive movement of the holding member in the direction of withdrawal from between the upper and lower rams
The upper and lower pressure plates that are stacked on the mold plate.
Mold equipment characterized by being released sequentially
The invention according to claim 9 is a method of filling a molding material.
And an opening that is formed so as to surround the opening.
A mold plate having a groove,
The invention described in No. 0 is the water sandwiched between the opening and the groove.
Before the flat surface is formed slightly higher than the entire surface
The mold plate according to claim 9, and the mold plate according to claim 11.
According to the invention, a pair of rams arranged above and below, and the above and below la
Between the upper and lower pressing plates,
Any of the above-mentioned claims 1 to 7 arranged so as to be aligned.
And a molding element for supplying molding material.
Between the material feeding device and the upper and lower holding plates
A press device having a cleaning device for cleaning.
It is a place. In general, when pressure molding is performed by a press machine,
A mold plate having an opening for filling a shaping material, and this mold
The lower pressing plate that is attached to the bottom surface of the plate and the top of this mold plate.
It requires an upper holding plate to be attached to the surface. In the invention described in claim 1,
The part holding plate holds the upper holding plate by the first holding member
In addition, the lower holding plate of this first holding member
The lower holding member is held so as to be separated from the plate. Well
Also, the mold plate is pushed upward by the second holding member.
Is held by the upper holding member so that it is separated from the plate.
There is. In the first holding member, the lower pressing plate is
In order to separate it from the part holding plate,
It is better to use members. In addition, in the second holding member, gold
To make the template separate from the upper holding plate,
For example, it is better to use a biasing member. Pressing with a pressing device using this mold device
When manufacturing a molded product, for example, between a pair of upper and lower rams
When this mold device is placed, the ram below is raised
Push up the lower holding plate and lift the lower holding plate from the mold plate.
Stick it to the bottom surface. At this stage, place the lower holding plate on the bottom
It is okay to supply the molding material to the opening of the mold plate that is in close contact.
The lower ram before it rises
Provide the molding material on the surface of the plate that corresponds to the opening of the mold plate.
You may pay. Then either raise the lower ram further,
Alternatively, by processing the upper ram, the mold plate
Attach the upper holding plate to the upper surface. In the opening of the mold plate
Molding material loaded in, for example, resin powder or
Is a laminate of resin sheets that is an upper holding plate and a lower holding plate.
It is pressurized by the upper and lower rams via. The upper and lower rams are usually heated to a predetermined temperature.
Therefore, the molding material in the mold plate is
It is heated and melts. In some cases, in the molding material
Melts bubbles generated by existing gas such as air
The upper and lower rams are to be pulled out from the molten molding material.
The pressure applied by the
Continue pressurization with the diaphragm. After pressurization by the upper and lower rams for a predetermined time,
When the pressure applied by the upper and lower rams is released,
When the back plate separates from the mold plate, the mold plate is mainly the upper holding plate.
Move away from. After completion of the pressure molding, from this mold device,
Remove the mold plate and test the mold plate with the pressure-molded product.
For example, load it into an automatic inspection device for pressure-molded products.
Alternatively, remove the plate-shaped pressure molded product from the mold plate.
Then, load the plate-shaped pressure molded product into the automatic inspection device.
Is also good. This mold device is fixed between a pair of upper and lower rams.
May be arranged in a vertical direction, and between the upper and lower rams
Reciprocating between the ram and the retracted position
It may be configured to be able to. In the mold apparatus according to the second aspect, the storage is
The lower holding plate, mold plate and upper holding plate can be
Is held. This holding means is provided between the pair of upper and lower rams.
It may be fixedly arranged in advance, or the upper and lower rams
Reciprocates between the space and the position retracted from the upper and lower rams.
You may be able to do so. In any case, the pressing means is provided between the upper and lower rams.
The upper surface of the lower holding plate and the lower surface of the mold plate
Let In this case, the molding material should be
The molding material is placed at the position corresponding to the opening of the die on the plate.
May exist, or on the upper surface of the lower holding plate.
Mold the opening of the mold plate after the bottom surface of the mold plate is in close contact
Even if you supply the materials for use. Above the lower holding plate
The surface and the lower surface of the mold plate are in close contact with each other by the pressing means.
Then, the molding material melted at the time of heat and pressure molding described later,
By melting and flowing out between the lower pressing plate and the mold plate
There is no burr. In any case, the upper surface of the lower pressing plate is closely packed.
The state where the molding material is supplied to the opening of the die plate to be worn
Place the upper pressing plate on the upper surface of the mold plate and
The upper and lower rams stack the laminated board, die plate and upper holding plate.
Pressurize. The pressure treatment is described in claim 1.
This is the same as the pressurizing operation in the mold device. After completion of the pressure treatment, it was melted and solidified.
Mold plate, lower pressing plate and upper pressing depending on the molding material
When the plate is in close contact with the mold plate
And the upper holding plate, and the mold plate and the lower holding plate.
Let go. This peeling means peels the mold plate and the upper pressing plate.
It has the function of separating and separating the mold plate and the lower pressing plate.
Various configurations can be adopted as long as
Inserted between the mold plate and the lower press plate that are in close contact
Of the first peeling blade and the closely attached mold plate and upper pressing plate
Can be formed with a second peeling blade inserted between
Wear. In addition, as this peeling means, the mold plate and the lower presser
The first biasing means for elastically separating the plate, the mold plate and the upper pusher.
A second biasing means for elastically separating the plate and the
It can also be done. Mold plate and lower holding plate and upper holding plate
After the separation, the mold device according to claim 1
In the same way as opening, solidified molding material is placed in the opening.
Take the mold plate you have as a sample or remove it from the mold plate.
Using the removed pressure-molded product as a sample, for example, an automatic inspection device
Can be loaded. The mold apparatus according to claim 3 is the first holding machine.
The lower holding plate is held by the structure and the second holding mechanism
The mold plate is held by the third holding mechanism
The board is held. Then, by the first holding mechanism,
The lower holding plate at the position retracted from the upper and lower rams
Transferred between rams. With the second holding mechanism,
The mold plate at the position retracted from the frame is transferred between the upper and lower rams.
To be done. Retracted from the upper and lower rams by the third holding mechanism
The toughened pressure plate in position is transferred between the upper and lower rams. First holding mechanism, second holding mechanism and third holding mechanism
By properly designing the structure of the mechanism,
So that the part holding plate is located on the end face of the lower ram.
The lower pusher that constitutes the holding mechanism and is located on the end face of the lower ram.
Install the second holding mechanism so that the mold plate is located on the upper surface of the plate.
It can be measured. First holding machine designed in this way
For the structure and the second holding mechanism, the metal between the upper and lower rams
Withdraw the upper holding plate from the ram so that it closely contacts the upper surface of the template.
Designed the third holding mechanism to be transferred from the retracted position
You can also use the lower holding plate between the upper and lower rams.
The upper pressing plate is placed on the upper surface of the mold plate that is placed closely on the surface
The second holding mechanism may be designed as described above. Furthermore, at a position retracted from the upper and lower rams
The second holding member is held on the upper surface of the lower holding plate held by the first holding mechanism.
Place the mold plate held on it by the holding mechanism and push it down.
With the mold plate placed on the upper surface of the support plate, the first holding mechanism
And by operating the second holding mechanism in cooperation,
The lower pressing plate between the lower rams and the mold mounted on the upper surface
The plate is moved, and then the upper and lower racks are moved by the third holding mechanism.
The upper holding plate at the position retracted from the upper and lower rams.
It may be transferred in between. The molding material is a metal mold on the upper surface of the lower pressing plate.
The opening of the mold plate of the lower holding plate before the plate is placed
It may be supplied to the position corresponding to
After placing the mold plate on the upper surface of the plate, in the opening of the mold plate,
A molding material may be supplied. After the molding material is supplied, the upper and lower rams
Driving the lower holding plate, the mold plate and the upper pressing plate.
The stack of boards is heated and pressed by the upper and lower rams. This
As a result, the material for molding is heated and pressed. The pressure treatment is described in claim 1.
This is the same as the pressurizing operation in the mold device. After the pressure treatment, the first holding mechanism, the first
The upper and lower rams are driven by driving the second holding mechanism and the third holding mechanism.
Lower press plate, mold plate and upper press plate located between
Moves to a position retracted from between the upper and lower rams. This move
Depending on the movement, from the mold plate to the upper holding plate and the lower holding plate
Is preferably designed to peel off. The upper and lower holding plates have been removed
The mold plate is detached from the second holding mechanism and, for example, automatically detected.
The inspection device is loaded. Alternatively, detachable from the second holding mechanism
Remove the solidified pressure-molded product from the die plate
To be loaded as a sample in, for example, an automatic inspection device.
May be. In the mold apparatus according to claim 4,
The first holding mechanism is retracted from the upper and lower rams.
And a first rotatable support member provided on the table and the first rotatable support member.
It is rotatably supported by the rotation support member and the lower part is pressed down.
It can be formed with a first rotation holding member that holds the plate.
It In this case, the first rotation support member and the first rotation holding member
Form a linkage. In the mold apparatus according to claim 4,
Is installed at a position where the second holding mechanism is retracted from the upper and lower rams.
The second rotatable support member, which is rotatable, and the second rotatable support.
It is rotatably supported by the holding member and holds the mold plate.
It can be formed with the second rotation holding member. in this case
The second rotation supporting member and the second rotation holding member of the link mechanism
To form. The third holding mechanism was retracted from the upper and lower rams.
And a third rotatable support member that is rotatable at a position
It is rotatably supported by the rotation support member and holds the mold plate.
It can be formed with the third rotation holding member held. This
In the case of, the third rotation support member and the third rotation holding member are
Form a mechanism. With this structure, the link mechanism
, Above the lower ram or at the top of the lower ram
The lower pressing plate is arranged on the surface, and on the upper surface of the lower pressing plate,
Alternatively, the mold plate is placed above the lower holding plate and the mold
Place the upper holding plate on the upper surface of the plate or above the mold plate.
Placed. And the lower ram is pressed by the upper and lower rams
The plate, mold plate and upper pressing plate are heated and pressed. The molding material is the same as that described in claims 1 to 3.
Retract from the upper and lower rams, as in the described mold equipment.
The upper surface of the lower holding plate in the
It may be supplied in advance at a position corresponding to the mouth,
Placed closely on the upper surface of the lower holding plate at the position retracted from the
It may be pre-supplied in the opening of the placed mold plate.
Chair, bottom above the ram or on top of the ram
The top surface of the pressing plate that corresponds to the opening of the mold plate.
May be supplied to the ram, or above the ram or on the ram.
It is placed in close contact with the upper surface of the lower holding plate that is placed on the upper end surface of the
It may be supplied into the opening of the molded die plate. In the mold apparatus according to claim 4,
Is a laminate of a lower press plate, a mold plate and an upper press plate.
(Of course, there is molding material in the opening of the mold plate.
It is filled. ) Is pressed by the upper and lower rams.
The same as the pressure treatment operation in the mold device according to claim 1.
It is like. After the pressurizing operation, the above-mentioned claim 3 is applied.
The mold plate is removed by the same operation as kicking, or
The pressure molded product was taken out from the mold plate and
For example, it is used for automatic inspection equipment. According to a fifth aspect of the present invention, there is provided a die device, wherein upper and lower rams are provided.
Move the mold plate to a position retracted from the space and between the rams above and below
Equipped with a movable holding member that holds it detachably
The first holding mechanism for holding the lower holding plate is
The first rotation support body and the first rotation holding body relieve the member.
Form a link mechanism. Similarly, hold the upper holding plate
The third holding mechanism has a third turning support with respect to the moving holding member.
A link mechanism is formed by the holding body and the third rotation holding body. Hold the lower pressing plate at one end of the first rotary holder.
It is held at the other end of the first rotation holding body and can be rotated at the first time.
Cantilever the lower holding plate by connecting to the moving body
Even if it is such a form, it is also
Pair of parallel first pivotal supports pivotally coupled at
The first body rotatably hung on the body and the pair of rotation supports.
You may form a 1st holding | maintenance mechanism with a rotation holding body. This place
In this case, the first rotation holder is supported by the two first rotation supports.
It will be supported in the holding state. In any case, the movable holding member is
The upper and lower rams are not completely retracted from between the rams.
It may be arranged so that it can be moved horizontally between
Between the upper and lower rams and the position retracted from the upper and lower rams
It may be arranged so as to be horizontally movable. According to claim 5, which has such a configuration.
In the mold device, a first rotation support body and a first rotation holding body
Gold held on the moving holding member by the link mechanism with
The upper surface of the lower pressing plate is brought into close contact with the lower surface of the template. In addition,
Before the close contact, the upper surface of the lower pressing plate and the opening of the mold plate
The molding material may be supplied to the position corresponding to
Also, supply the molding material to the opening of the mold plate after the close contact.
You may do it. Then, on the upper surface of the lower pressing plate, mold
The first rotation support body and the first rotation support body while the plates are closely mounted.
Link mechanism for rotation holder, third rotation support, and third rotation
With the link mechanism of the holding body, the moving holding member can be moved horizontally.
By moving, the lower pressing plate and the mold can be
The plate and the upper pressing plate are laminated. This laminated
The lower holding plate, mold plate and upper holding plate in
Heat and pressurize with a rubber. The heat and pressure treatment is described in the above claim 1.
The same as in the above-mentioned mold device. After the heat and pressure treatment, the upper and lower rams are
To move and hold the movable holding member horizontally.
Remove the lower and upper holding plates from the mold plate.
Let go. The mold plate held by the moving holding member is removed.
Removal, or remove the pressure molded product from the mold plate,
In the same manner as in claim 3, a mold plate or a press plate is added.
The press-formed product is subjected to, for example, an automatic inspection device. A mold device according to a seventh aspect of the present invention is a bottom pressing device.
The plate goes around between the upper and lower rams and the upper holding plate
Also, pass between the upper and lower rams and pass above the lower holding plate.
And then patrol. And the mold plate is between the upper and lower rams
From the retracted position, move between the upper and lower rams and then
Move to escape from between the rams. In this mold device, between the upper and lower rams
Before being transferred to the
The molding material is supplied to the position corresponding to the opening of the plate,
The lower hold down before it is transported between the upper and lower rams.
The mold plate is placed closely on the upper surface of the plate, and is placed in the opening of the mold.
A molding material is supplied. In any case, between the upper and lower rams
Then, the lower pressing plate and the mold plate come into close contact, and then the mold plate
The upper holding plate comes into close contact with the upper surface of the. And the upper and lower rams
Lower press plate, mold plate and upper press plate formed between
The upper and lower rams heat and pressurize the laminate. The heat and pressure treatment is described in claim 1.
This is the same as that of the mold device. After the heat and pressure treatment, the upper and lower rams are
Lower plate, mold plate and upper plate retract
It By retracting, from the surface of the mold plate to the lower pressing plate and
The upper holding plate peels off. Without removing the pressure molded product from the mold plate
As a sample, or press-molded product from the opening of the mold plate
Separate and use this as a sample, for example, in an automatic inspection device.
Provide this. The mold apparatus according to claim 8 is a molding material.
Mold plate holding holding a mold plate having an opening for filling
Lower pressing plate and upper pressing plate rotatably at one end of the member
Is installed. And this mold plate holding member itself is
Move between the lower ram and the position retracted from the upper and lower rams.
Between the upper and lower rams, the mold plate and the lower
The pressing plate and the upper pressing plate are stacked,
When the mold device is retracted between the upper and lower rams, the mold plate holding member
Open the upper holding plate from the
The part holding plate opens. In this mold apparatus, the initial state is
The mold unit is in a position retracted from between the upper and lower rams.
Position, the lower holding plate rotates at one end of the mold plate holding member.
Move to expose the lower surface of the mold plate, and the upper holding plate holds the mold plate.
Rotate at one end of the holding member to expose the upper surface of the mold plate.
It has become. Then, the mold device is directed toward the upper and lower rams.
The lower pressing plate rotates as it moves,
Stick to the bottom surface. The lower pressing plate is closely attached to the bottom surface of the mold plate.
In this state, the molding material is supplied to the opening of the mold plate. A mold plate having a molding material loaded in its opening is
The holding mold plate holding member moves further toward the upper and lower rams.
When it moves, the upper holding plate rotates and the upper surface of the mold plate
The pressure plate closes the cover. And lower holding plate, mold plate
And the stack of the upper holding plate is moved between the upper and lower rams.
It is sent and placed between the upper and lower rams. The mold device arranged between the upper and lower rams is
Heated and pressed by the ram below. The heat and pressure treatment is described in claim 1.
The same as in the above-mentioned mold device. After the heating and pressurizing process, the mold device is turned on.
Evacuate between lower rams. Mold plate holding part during evacuation
The upper pressing plate rotates at one end of the material and the upper surface of the mold plate is exposed
State and then move so that the mold device retracts
And the lower pressing plate rotates at one end of the mold holding member
The bottom surface of the plate is exposed. The upper and lower surfaces of the mold plate were exposed
By the way, remove the mold plate from the mold holding member
As a sample, the mold plate itself with
Remove the pressure-molded product from the rui or die plate and press-mold it.
As a sample, supply it to an automatic inspection device
It Mold used in the mold apparatus described above
The plate is usually plate-shaped and has at least one opening on its surface.
A mouth is provided. Molding material filled in the opening of the mold plate
The upper and lower rams through the lower and upper pressure plates.
It is brought into a molten state by being heated and pressurized by. That
Separate the upper and lower rams from the mold assembly or
For molding in a molten state by cooling the mold device
The material is solidified to form a pressure molded product. The mold apparatus according to any one of claims 1 to 8
In addition, make sure that the lower holding plate and the mold plate are firmly attached.
Due to the above, during the heat and pressure treatment, the lower pressing plate and the mold plate
The molten molding material is prevented from leaking into the gap
Be done. Similarly, firmly attach the upper holding plate and the mold plate.
By pressing the top pressing plate
The molten molding material may leak into the gap between the mold and the mold plate.
And are prevented. Is this the gap between the upper holding plate and the mold plate?
More surely the molten molding material flows out from
To prevent, the mold plate as claimed in claim 9,
Groove formed so as to surround the opening for filling the material for use
Is desirable. If a groove is provided, the upper surface of the mold
For molding in a molten state that overflows from the gap between the upper holding plate and
Material is stored in the groove. The upper holding plate and the mold plate are strong
When pressed, the mold plate surface and top between the groove and the opening
The molten molding material is squeezed out between the bottom surface of the holding plate and
The molten molding material that overflowed from the opening
It will be stored in the ditch. The mold plate according to claim 10 has a groove and an opening.
The mold surface between and is slightly smaller than the mold surface outside the groove.
Since it is designed high, the upper holding plate and the mold plate are strong.
When pressed by force, the mold plate surface between the groove and the opening
The molding material in the molten state is more
The layers are squeezed well and the mold plate between the groove and the opening
Between the surface and the lower surface of the upper holding plate
It won't change. In other words, press the molded product and press the upper part
It is possible to prevent the occurrence of burrs due to the shingles. In the pressing device according to the eleventh aspect, cleaning is performed.
Depending on the device, the upper surface of the lower holding plate and the lower side of the upper holding plate
Clean the surface, the surface of the cleaned lower pressing plate,
Supply the molding material to the position corresponding to the opening of the mold plate.
Or a mold plate that is placed closely on the upper surface of the lower holding plate
Supply molding material to the opening of the molding material supply device,
Place the mold plate on the upper surface of the lower holding plate and
The pressure plates are stacked and the upper and lower rams are heated and pressed.
After the heat and pressure treatment, remove the mold plate from the mold device,
The mold plate with the pressure-molded product still loaded in the opening was used as the sample.
Or remove the pressure molded product from the opening of the mold plate.
This is used as a sample, for example, in an automatic inspection device. Embodiments of the present invention will be described with reference to the drawings.
Explain. FIG. 1 is a partial sectional view showing an embodiment of the present invention.
FIG. As shown in FIG. 1, the upper and lower rams 1a, 1a
The mold device 2 is arranged in between. This mold device 2 is
A pressing plate 3, an upper frame 4, a first holding member 5,
Lower frame 6, lower pressing plate 7, and second holding member 8
And a central frame 9 and a mold plate 10. The upper frame 4 has a rectangular frame shape and
Attached to the ram 1b with a mounting member not shown,
The upper pressing plate 3 is mounted in the partial frame 4. First hold
The member 5 is inserted into the through hole formed in the upper frame 4.
And a first support rod for connecting the lower frame 6 to the tip of the rod.
11 and the biasing member that is rotated around the first support rod 11, for example,
And a spring coil 12. This first holding member 5
Can hold the lower frame 6 stably.
4 points of the upper frame 4, for example, the four corners of the rectangle
Is attached to. The lower frame 6 is the same as the upper frame 4.
Shaped like a rectangular frame and hold the lower holding plate 7 inside the frame.
ing. The lower pressing plate 7 is closely attached to the lower surface of the mold plate 10.
It has an upper surface sufficient to be worn. On the other hand, the second holding member 8 is the upper frame 4
Insert it into the through hole provided in the
The second support rod 13 for connecting the boom 9 to the tip and the second support rod
An urging member rotated by the holding rod, for example, a spring coil 14
Have and. The second holding member 8 has the central frame 9
Upper frame 4 so that it can be held stably
Are attached to the four corners of the rectangle, for example.
It . The mold plate 10 is attached to and detached from the central frame 9 by itself.
Currently installed. As the mold plate 10, as shown in FIG.
Has an opening 15 and surrounds the circumference of the opening
Thus, the groove 16 is provided. Further, the mold plate 1 shown in FIG.
At 0, the upper surface sandwiched between the opening 15 and the groove 16 is
Is flush with the upper surface of. The operation of the mold apparatus 2 shown in FIG. 1 will be described. In the mold apparatus 2 shown in FIG.
As shown in Fig. 3, a molding material feeding device (not shown)
The upper surface of the lower pressing plate 7 and the opening of the mold plate 10.
A predetermined amount of molding material such as resin at a position corresponding to 15
Supply the powder. In this case, the gold placed between the upper and lower rams
In the mold device 2, between the mold plate 10 and the lower pressing plate 7.
If the gap is small, it causes no
Resin powder is supplied to the upper surface of the lower pressing plate 7 using
Good to do. Further, the amount of resin powder to be supplied depends on the opening 1
Determined appropriately considering the amount of resin that will be filled in 5
Good to do. As a method of supplying resin powder, as shown in FIG.
Then, lower the ram 1a by raising it.
By bringing the upper surface of the plate 7 into close contact with the lower surface of the mold plate 10,
It is formed by the lower pressing plate 7 and the opening 15 of the mold plate 10.
The resin material is supplied to the recessed part with a molding material supply device.
You may do it. As shown in FIG. 3, on the upper surface of the lower pressing plate 7,
When the resin powder is supplied, after the resin powder is supplied, the lower ram
1a is raised to raise the lower pressing plate 7. This and
At the upper end of the first holding member 5, the biasing member is biased.
The first supporting rod 11 is provided on the upper frame 4 to resist the force.
Ascending through the passage. As the lower ram is raised, the lower presser
The upper surface of the plate 7 is in close contact with the lower surface of the mold plate 10. in this case,
In the second holding member 8, the coil bar is held by the second support rod.
Since it is rotating, this coil spring causes the mold plate 10 to
It will be pressed by the lower pressing plate 7. The lower la
The frame 1a presses the lower pressing plate 7 upward. these
By pressing the lower pressing plate 7 below the mold plate 10
The surfaces are in close contact. When the lower ram is further raised, the mold plate 10
The upper surface of the upper pressing plate 3 comes into close contact with the lower surface of the upper pressing plate 3.
That is, the lower pressing plate 7, the mold plate 10 and the upper pressing plate
The stack of plates 3 being pressed by the upper and lower rams
become. The upper and lower rams are heated to the prescribed high temperature.
Therefore, the resin powder in the opening 15 of the mold plate 10 is melted.
It After continuing pressing by the upper and lower rams for a predetermined time
Slightly loosen the pressure applied by the upper and lower rams. Release pressure
Thereby, bubbles generated in the molten resin are removed. Continue to pressurize with a predetermined pressure by the upper and lower rams.
To do. In the opening 15 of the mold plate 10 while the pressurization is continued.
When the amount of molten resin in the
The molten resin overflows. The upper surface of the mold plate 10 and the upper pressing
The plate 9 is strongly pressed by the upper and lower rams 1a and 1b.
Therefore, the mold plate 1 sandwiched between the opening 15 and the groove 16 is formed.
0 and the lower surface of the upper pressing plate 9 exist in this gap.
The molten resin is squeezed out and overflows into the groove. Cool the ram after a predetermined time, or
Lower pressing plate 7 and mold plate 1 by locking members (not shown)
0 and the upper holding plate 3 are stacked and
The ram is retracted upward and downward, and the ram heats and pressurizes.
Stop and allow the laminate to cool. After the elapse of a predetermined time, for example, not shown.
When the locking by the locking member is released, the first support rod 11 and
By the coil spring that is revolved around the second support rod,
While the upper pressing plate 3 is peeled from the upper surface of the mold plate 10,
The lower pressing plate 7 is separated from the lower surface of the mold plate 10. Peeling off the lower pressing plate 7 and the upper pressing plate 3
After that, the mold plate 10 was removed from the central frame 9 to solidify the tree.
The mold plate 10 having the oil molded body in the opening 15 is tested as it is.
As a material or a resin composition removed from the mold plate 10.
Load the molded product as a sample into the automatic inspection system for resin molded products.
It The mold apparatus shown in FIG. 1 is fixed to the upper ram.
Although it is installed regularly, the mold device is
It is formed so that it can move horizontally in a position retracted from between the rams.
It may be. For example, as shown in FIG.
A mold device that horizontally moves the upper frame by a moving device
You can get it. In the mold device shown in FIG.
To push up the lower frame 6,
A pressing means 17 for pushing up the lower end of 6 is required. This press
The means 17 is a plunger 17 having a pressing portion at its tip.
a and a hydraulic cylinder for moving the plunger 17a up and down
Can be formed with the dar 17b, and also as a mold plate
Alternatively, the one shown in FIG. 5 can be used. In Figure 6
The mold plate 10 shown has a surface portion 1 between the opening 15 and the groove 6.
The height of 0a is slightly smaller than the height of the surface outside the groove 6.
Is set high. Thus, the surface portion 10a
Set the height of the surface slightly higher than the height of other surfaces
And when pressure is applied by the upper and lower rams, the surface portion 1
0a and the lower surface of the upper pressing plate 9 have strong molten resin.
It is squeezed out by force and overflows into the groove 6. Therefore,
The pressure molding eliminates burrs on the resin molded body. FIG. 7 shows a mold apparatus according to an embodiment of the present invention.
1 shows a press device which is an embodiment of the present invention incorporating
You As shown in FIG. 7, this pressing device 20
Can move up and down with the fixed upper ram 21a
Between the lower ram 21b and the upper and lower rams 21a, b
The mold unit 2 arranged on the ram 21a and coupled to the ram 21a
2 and the upper and lower rams 21a and 21b so as to face the gap.
Between the cleaning device 23 and the upper and lower rams 21a and 21b.
So that it is placed on the opposite side of the cleaning device 23.
And the arrangement of the mold attaching / detaching device 24
Molding resin supply device 25 arranged on the same side as
Have and. As shown in FIG. 8, this mold device 22 has
It has a first holding mechanism, a second holding mechanism, and a third holding mechanism.
It The third holding mechanism includes a pair of opposed third horizontal supports.
The holding body 26 and the one end of the third horizontal support 26
The one that is hung between the pair of third horizontal supports 26.
It is fixed to a pair of third holding bodies 27 and this third holding body 27.
And an upper holding plate 28. And this top hold down
The plate 28 is fixed to the lower end surface of the ram 21a. Na
In the case of this press device 20, face the ram 21a.
The ram 21b below the
The pressing is performed by the method in which the other ram 21b presses.
It Each of the ends of one of the third horizontal supports 26
A third vertical support 29 is rotatably connected to
It At the lower ends of the pair of third vertical supports 29, the second horizontal
The support 30 is rotatably connected. The other third water
At each of the end portions of the flat support 26, the other third vertical support is also provided.
29 is rotatably connected. The other of this pair
Also on the lower end of the third vertical support 29, the other second horizontal support 3
0 is rotatably connected. Therefore, one of the third horizontal supports 26
One pair of third vertical supports 29 and one second horizontal support
A square is formed with 30. Of course, the other third water
The flat support 26 and the other pair of third vertical supports 29 and the other
A quadrilateral is also formed with the second horizontal support 30. The third vertical support 29 on the one hand is made up of the first piston.
It is rotated by the ton 31a. Therefore, the first fixie
The third vertical support 29 is rotated in the direction of the arrow in the drawing by
By moving, the quadrilateral becomes a parallelogram.
it can. Each of the pair of second horizontal supports 30 has its own
Guide grooves 32 are formed on the surfaces facing each other. This
By inserting the mold plate 33 into the pair of guide grooves 32 of
Then, the mold plate 33 can be attached to the second horizontal support 30.
You can The mounting position of the mold plate 33 is, for example, the third position.
The upper pressing plate 28 mounted on the horizontal support 26 is
3 On the side opposite to the mounting position on the horizontal support 26,
The support plate 28 is close to one end of the third horizontal support 26.
Then, the mold plate 33 becomes closer to the other side of the third horizontal support 26.
Thus, it is mounted on the second horizontal support 30. Second holding mechanism
Is configured with this second horizontal support 30. The mold plate 33 is shown in FIG. 2 or 6.
The mold plate 10 can be used. Figure 2 or
Using the mold plate 10 shown in FIG. 6, as described above,
It is possible to prevent burrs from being generated in the resin molded body. In the second horizontal support 30 on one side,
At the two connecting points of the third vertical support 29, the first vertical support is provided.
The holding body 34 is rotatably connected. This pair of first
At the lower end of each vertical support 34, a first horizontal support 35
Are rotatably coupled. The other second horizontal support 3
0 at two connecting points of the third vertical support 29.
Also the other first vertical support 34 is rotatably connected.
It The lower end of each of the other pair of first vertical supports 34
Also, the other first horizontal support 35 is rotatably connected to the first horizontal support 35.
ing. The first vertical support 34 is composed of the second piston 31b.
It can be rotated by. Therefore, this second
The first vertical support 34 is rotated by driving the stone 31b.
Thus, the second horizontal support 30 and the pair of first vertical supports
The quadrilateral formed by 34 and the first horizontal support 35 is parallel
Can be a quadrilateral. First pair of parallel arranged opposite to each other
A pair of first holding bodies 36 are hung on the horizontal support body 35.
The lower holding plate 37 is attached to the pair of first holding bodies 36.
Is fixed and attached. In this way, the third holding mechanism operates as the second piston.
Ton 31b, first vertical support 34, first horizontal support 35,
And a first holding body 36. Mold device having such frame structure
In the initial state of 22, the upper pressing plate 28 of the ram 21a
The lower pressing plate 37 is fixed to the lower end surface, and
b, and therefore the lower holding plate 37
The upper and lower holding plates 28 face each other vertically.
The mold plate 33 is placed between the upper and lower rams 21a and 21b.
Is waiting in the retracted position. As shown in FIG. 7, the cleaning device 23 is
Of the rams 21a and 21b of the
The cleaning roller 3 attached to the tip of the retractable arm member
Have eight. This cleaning device 23 is in the initial state.
Toward an upper holding plate 28 in a mold device 22
Extend the arm member and clean the lower surface of the upper holding plate
By rolling the roller 38, the lower part is also pressed down.
The lower holding plate is formed by extending the arm member toward the plate 37.
By rolling the cleaning roller 38 on the upper surface of 37,
The lower surface of the upper pressing plate 28 and the lower pressing plate 37.
The surface can be cleaned. As shown in FIG. 7, a molding resin supply device 2
5 is the cleaning device 23 for the upper and lower rams 21a and 21b.
Move from between the upper and lower rams 21a, b on the side opposite to
The position appropriately set to face the mold plate 33
The resin powder can be dropped from its tip.
It has a possible hopper 39. The mold attaching / detaching device 24 is the second horizontal support member.
The second water which is arranged in the forward direction of 30 and has advanced
Holds the end of the mold plate 33 mounted on the flat support 30
The chuck 40 is provided. Also, this chuck is
It is formed so that it can move forward. The operation of the press device 20 will be described.
It In the initial state described above, the first piston
Driving 31a and the second piston 31b cooperatively.
As shown in Fig. 9, the upper and lower rams 21a and 21b
Also, in the retracted position, the lower pressing plate 37 is attached to the lower surface of the mold plate 33.
Make sure that the top surface of is in contact. The second piston 31
The driving force by b and the first piston 31a is adjusted appropriately.
By doing so, the upper surface of the lower pressing plate 37 and the mold plate 33
It is good to make sufficient contact with the lower surface. Pressed down
The upper surface of the plate 37 and the lower surface of the mold plate 33 are sufficiently adhered to each other.
The lower pressing plate 37 and the lower surface of the mold plate 33.
This is because there is no gap between them. The gap is
When it disappears, the melted resin will be removed from the mold plate 3 as described later.
3 between the lower surface and the upper surface of the lower pressing plate 37.
To prevent the occurrence of burrs on the resin molded product.
You can As shown in FIG. 9, the lower pressing plate 37
The state where the lower surface of the mold plate 33 is in close contact with the upper surface of the
By the molding resin supply device 25.
A predetermined amount of resin powder is supplied to 41. After the supply of the resin powder is completed, the first piston 31
a and the second piston 31b are driven in cooperation with each other.
By rotating the first vertical support 34 and the third vertical support 29.
And the upper surface of the mold plate 33 adheres to the lower surface of the upper pressing plate 28.
To do so. During the movement of the die plate 33, the first
Drives the piston 31a and the second piston 31b in a dynamic manner
The lower pressing plate 37 on the lower surface of the mold plate 33.
Make sure that the top surface of is in close contact. Therefore, the upper surface of the mold plate 33 is pressed upward.
As shown in FIG. 10, when it is in close contact with the lower surface of the plate 28,
In addition, the upper surface of the lower pressing plate 37 is closely packed on the lower surface of the mold plate 33.
You're wearing it. Next, drive the lower ram 21b.
This is lifted by the rams 21a and 21b,
The template 33, the lower pressing plate 37 and the upper pressing plate 28 are added.
Apply heat and pressure. The resin in the opening 41 is heated by the heated ram.
When melted, pressurization by upper and lower rams 21a, 21b
Alleviate. By releasing this pressure, the molten wood
Air bubbles present in the fat can be removed. When this defoaming treatment operation is completed,
Pressurization of rams 21a and 21b is started for a predetermined time
The heating and pressurizing process is continued. After completion of the heating and pressurizing treatment for a predetermined time,
The ram 21b is lowered and the first piston 31a and
By driving the second piston 31b in cooperation,
As shown in 11, the mold device 22 is returned to the initial state. After the mold apparatus 22 is returned to the initial state, it is cleaned.
The cleaning device 23 cleans the lower surface of the upper pressing plate 28 with a cleaning roller.
38 and clean the upper surface of the lower pressing plate 37.
Clean with LA 38. First piston 31a and second piston 31
The second horizontal support 30 is driven by driving b
Is moved toward the mold plate 33 take-out device 24. Money
Mounted on the second horizontal support 30 by the mold detaching device 24
Remove the existing mold plate 33 from the mold device 22, and
With the detaching device 24, the mold plate having the resin molded product
It is loaded into, for example, an automatic inspection device. A press device using the mold device having the above configuration
Makes it possible to produce resin molded products without labor.
Can be made. In addition, this press machine
It can also be combined with a shape automatic inspection device. The press device 50 shown in FIG. 12 can move up and down.
The upper upper ram 51 and the lower ram 51 facing it
Mold equipment mounted on the lower ram 52 and the upper ram 51
And the upper and lower rams 51, 52 as shown in FIG.
The cleaning device 54 arranged so as to face the gap between
The cleaning device should face the gap between the rams 51 and 52.
A mold plate attaching / detaching device 54 arranged on the side opposite to the placing 54;
Arranged on the same side as the side where the mold plate attaching / detaching device 54 is arranged
The molding resin supply device 55 is formed. This mold device 53 is provided under the upper ram 51.
A square upper base 56 attached to the end face and the top of this square
Insert into the through holes provided at the four corners of the base 56.
Attached support rod 57, and is attached to the tip of the support rod 57.
The mold mounting frame 58 and the supporting rod 57.
A biasing member such as a coil spring 59, and
An upper protrusion base 60 provided on the lower surface of the base 56, and
The upper pressing plate 61 attached to the lower surface and the ram 52 below
Lower base 62 provided on the upper end surface of the
The lower protrusion 63 provided on the upper surface of the base 62 and below
The lower pressing plate 64 mounted on the surface of the projection part 63
Have. The coil spring 59 is attached to the mold.
To separate the frame 58 for use from the upper base 56.
I am biased. The die mounting frame 58 has a planar shape.
Shape is U-shaped, and also forms part of the U-shape
Guide grooves 65 are formed on opposite sides. So
Then, the U-shaped mold mounting frame 58 is released.
From the part, the mold plate 66 inserts its end side into the guide groove 65.
It is installed as you would. The cleaning device 54 is attached to the upper and lower rams 51 and 52.
An arm member that can be expanded and contracted while being placed at an appropriate position to face
The cleaning roller 67 is attached to the tip of the. this
The cleaning device 54 is an upper presser of the mold device 53.
The arm member is extended toward the plate 61, and the upper pressing plate is
By rolling the lower surface of the cleaning roller 67,
The arm member toward the lower holding plate 64.
The upper surface of the lower pressing plate 64 with the cleaning roller 67.
By rolling the lower surface of the upper pressing plate 61 and
So that the upper surface of the lower holding plate 64 can be cleaned
Has become. The molding resin supply device 55 is provided with a not-illustrated
The lower pressing plate 64 which has a nozzle and is driven by the nozzle
It is possible to supply resin powder to the upper surface of
It The mold plate attaching / detaching device 54 is a U-shaped mold.
The mold plate is arranged facing the mounting frame 58.
It has a chuck 68 for gripping the end of 66. Also, this
The chuck 68 is formed so that it can move forward and backward. Next, the operation of the press device 50
explain. First, the molding resin supply device 55 is not shown.
The nozzles with the traces as shown by the arrows in the figure.
The lower pressing plate 6 is inserted by inserting the lower pressing plate 6
4 which is the upper surface of the mold plate 66 and corresponds to the opening 69 of the mold plate 66.
A predetermined amount of resin powder is supplied to the table. Then the nozzle up
Evacuate between the lower rams 51 and 52. Frame for mounting mold
A mold plate 66 is inserted into the frame 58 by the mold plate attaching / detaching device 54.
To enter. The upper ram 51 is lowered. Upper ram 51
When is lowered, first, the mold plate is placed on the upper surface of the lower pressing plate 64.
The lower surface of 66 contacts. Further down the upper ram 51
Then, the mold plate 6 is pressed by the urging force of the coil spring 59.
6 is firmly pressed against the upper surface of the lower pressing plate 64. this
By the lower surface of the mold plate 66 and the upper surface of the lower pressing plate 64.
A strong close contact with is realized. The lower surface of the mold plate 66
By firmly adhering to the upper surface of the lower pressing plate 64, resin powder
Even if the molten resin is melted,
It will not soak into the resin molded product, and
It is possible to prevent re-generation. Resisting the urging force of the coil spring 59,
By lowering the upper ram 51 further,
The back plate 61 is brought into contact with the upper surface of the mold plate 66. Upper and lower ram
51, 52, an upper pressing plate 61, a mold plate 66 and a lower part
Pressing the pressing plate 64 and heating the upper and lower rams
At 51 and 52, the resin powder is heated and melted. At this time, as the mold plate 66, as shown in FIG.
The mold plate 10 shown in FIG. 6 can be used. Figure
2 or using the mold plate 10 shown in FIG.
As described above, it is possible to prevent the occurrence of burrs in the resin molded product.
it can. The heating and pressing treatment is shown in FIG.
The same as in the press device 50. That is, the tree
Melting of fat powder, defoaming of molten resin, heating and pressing again
I do. After completion of the heating and pressurizing process, the upper ram 51 is removed.
When it is raised, first, the upper pressing plate 61 is moved to the mold plate 66.
When peeled from the upper surface and the ram 51 above is raised,
The upper surface of the lower pressing plate 64 is separated from the lower surface of the mold plate 66.
It The mold plate 66 is removed from the mold mounting frame 58.
It is removed by the mold plate attaching / detaching device 54. Mold plate detaching device 5
The mold plate 66 held by the chuck 68 in FIG.
For example, it is loaded into an automatic inspection device. Then, the cleaning device 54 presses the upper part.
The surface of the plate 61 and the surface of the lower pressing plate 64 are cleaned. The press device 80 shown in FIG. 14 can move up and down.
Nom upper ram 81 and facing the upper ram 81
A lower ram 82 arranged below and upper and lower rams 81,
82 and the upper and lower rams 81, 82 to a retracted position.
Gap between movable mold device 83 and upper and lower rams 81, 82
Cleaning device 84 arranged to face the upper and lower rams 8
1, the cleaning device 84 so as to face the gap between them.
And the mold plate attachment / detachment device 85 arranged on the same side,
It was arranged on the same side as the side on which the template detaching device 85 was arranged.
And a molding resin supply device 86. Mold device 83 in this press device 80
Is an opening for filling the resin powder, as shown in FIG.
Mold plate holding member for holding a mold plate having a section
Of the mold plate holder 87 and the mold plate holder 87
It is rotatably connected at one end and overlaps with the upper surface of the mold plate.
The upper pressing plate 88 that can be matched and this mold
The upper holding plate 88 of the plate holding body 87 is connected.
At the same end as the
A lower holding plate 89 that can be superposed on the lower surface of the plate
Have and. Design modifications included in the scope of the present invention
As an example, the mold plate holder that holds the mold plate and the top press
The upper holding plate holding body that holds the back plate is
At the same joining end position as joining, with the mold plate holder,
Rotatable with the lower holding plate holder that holds the lower holding plate
The lower holding plate holder, the mold plate holder and the upper part
When the pressure plate is overlapped, the lower pressure plate is
The upper surface is in close contact with the upper surface of the mold plate
To name a mold device having a structure in which the surfaces are in close contact
You can In any case, this mold device 83 is
As shown in Fig. 14, the drive device such as a motor moves forward and backward.
The upper and lower laths are moved by the die driving means 90 having a rod for
Retract from between the upper and lower rams 81 and 82
You can move to different positions. That
The lever die device 83 is operated by the die driving means 90.
This mold device 83 is moved so as to follow a fixed trajectory.
A pair of first guide wheels 91 for guiding the
The upper pressing plate 88 also has a predetermined locus on the pressing plate 88.
The second guide wheel 9 so that it can be exercised according to
2 and the lower holding plate 89 also holds the lower holding
So that the plate 89 can move according to a predetermined trajectory
In addition, the third guide wheel 93 is provided. The die plate holder 87 moves horizontally in a straight line.
So that the third guide wheel 93 can be rolled.
The first linear guide rail that moves the upper and lower rams 81, 82
Extend from the horizontally sandwiched position toward the mold plate attachment / detachment device 85.
It exists (not particularly shown). No. of the upper holding plate 88
The second guide wheel 92 rolls on a second guide rail (not shown).
As a result, the mold device 83 is placed between the upper and lower rams 81 and 82.
When retracted from the upper side, the upper surface of the mold plate holder 87 is pushed upward.
The plate 88 is rotated so as to stand up. And mold attachment
The upper pressing plate 88 is rotatable when the table 83 further advances.
Make sure to bend it back toward the back largely around the connecting point.
Second guide rail (not shown) that guides the second guide wheel 92
Is provided. This mold along the first guide rail
As the device 83 progresses further, it will be sealed on the lower surface of the mold plate until then.
Third guide wheel provided on the lower holding plate 89
93 to guide the lower pressing plate 89 from the lower surface of the mold plate.
The lower pressing plate 89 is rotated and separated from the lower surface of the mold plate.
Guide rail for moving lower pressing plate 89 like
(Not shown) is provided. The cleaning device 84 cleans the upper pressing plate 88.
The upper cleaning device 84a and the lower pressing plate 89 for
Two sets with lower cleaning device 84b for cleaning are provided
ing. In each case, the cleaning arm is attached to the tip of the retractable arm member.
It is equipped with la 94. Then, the upper cleaning device 84 is
It is arranged above in the moving direction of the mold device 83, and the lower cleaning
The sweeping device 84 is arranged downward in the moving direction of the mold device 83.
It is placed. The mold plate attaching / detaching device 85 advances the mold device 83.
It is located at the tip in the row direction and holds the edge of the mold plate.
Have a 95. Also, this chuck 95 can move forward and backward.
Is formed in. The molding resin supply device 86 is a mold device 83.
Whether the upper pressing plate 88 is the upper surface of the mold plate in the traveling direction of
The mold plate from the open position.
It becomes possible to supply a certain amount of resin powder to the mouth.
ing. The initial state of this mold device 83 is as follows.
When the mold device 83 is arranged between the lower rams 81 and 82
The mold plate attaching / detaching device 85 may be attached to the mold device.
Since it may be arranged at a position where 83 faces.
However, for convenience of explanation, the upper and lower rams 8 are set as initial positions.
Initially when the mold device 83 is arranged between the first and second parts
State. Mold equipment located between the upper and lower rams 81, 82.
In the table 83, as described above, the upper surface of the mold plate is
Part pressing plate 88 is overlaid and the lower part of the mold plate is pressed down.
The upper surface of the plate 89 is in close contact. The mold device 83 is moved upward by the mold driving means 90.
Move horizontally to escape from between the lower rams 81 and 82
The second guide rail on which the second guide wheel 92 rolls as it goes
Guided by the upper surface of the mold plate holder 87
The plate 88 rotates, and finally, the upper holding plate 88 almost drops.
Rotate to a straight state. Furthermore, this mold device 83 is horizontal
When the third guide wheel 93 moves, the third guide wheel 93 rolls.
Guides the lower part of the mold plate holder 87 from the lower surface.
Even plate 89 begins to rotate. Also, the upper pressing plate 88
Further rotate. Finally, the mold device 83 is attached and detached by the mold plate.
When reaching the position facing the table 85, the upper holding plate 88 is reversed.
Rotate to the side that warps and hold the lower part
Rotate the plate 89 so that it is almost perpendicular to the bottom surface of the mold plate.
is doing. In this state, the die is held by the die holder.
The mold plate is replaced by the mold plate detaching device 85, and the mold holder
If the mold plate is not attached to the
The mold plate is newly mounted on the mold plate holder 87. Further, the upper cleaning device 84 presses the upper part.
The lower cleaning device 84 cleans the surface of the plate 88 and
The surface of the lower pressing plate 89 is cleaned. In any case, the upper surface of the mold plate holder 87 and
The upper holding plate 88 and the lower holding plate 89 rotate on the upper and lower sides.
Holds the mold plate because it is released due to movement
The mold plate can be easily attached to the body 87. By driving the mold driving means 90,
Move the mold device 83 between the upper and lower rams 81 and 82.
Pull in. The mold plate holder 87 is provided on the upper and lower rams 81, 82.
In the process of moving in between, first press the lower part
The plate 89 is superposed on the lower surface of the mold plate,
The upper surface and the lower surface of the mold plate are brought into close contact with each other. In this state
Further, the mold driving means 90 is used to move the mold device 83 to the upper and lower rams 8.
Pull in between 1,82. Then, as the die device 83 moves horizontally,
The upper holding plate 88 and the lower holding plate.
Mold device 83 is used for molding in a state where 89 and the mold plate are in close contact with each other.
When it arrives below the resin supply device 86, the mold driving device
The movement of the mold device 83 is once stopped. Opening of the mold plate in the stopped mold device 83
A predetermined amount of resin powder is supplied from the molding resin supply device 86 to the mouth.
Be paid. After the supply of the resin powder is completed, the mold driving device is restarted.
This moves the mold device 83 toward the upper and lower rams. So
The upper pressing plate 88 on the upper surface of the mold plate
I'm being asked. The mold device 83 has arrived between the upper and lower rams.
Sometimes, the upper side of the upper pressing plate 88 is already on the upper surface of the mold plate.
The surfaces are overlapped, and the lower pressing plate 89 is attached to the lower surface of the mold plate.
The upper surfaces of are stacked. Thus, the mold plate having the opening filled with the resin powder
The upper holding plate 88 and the lower holding plate 89 are laminated.
In the state, these three are heated and pressed by the upper and lower rams 81 and 82.
To do. Heat pressurization by upper and lower rams 81, 82
The reason is as explained so far. After completion of the heating and pressurizing process, the die unit 83
Follow the reverse procedure and insert the mold from between the upper and lower rams 81 and 82.
It moves toward the plate attaching / detaching device 85, and in the process of the movement.
The upper pressing plate 88 opens from the upper surface of the mold plate,
The lower pressing plate 89 opens from the lower surface of the plate. Mold equipment
83 reaches the final position facing the mold plate detaching device 85.
The upper and lower surfaces of the mold plate holder 87 are completely open.
Therefore, the mold plate can be easily
It can be removed from the template holder 87. Although not shown, the mold plate holder
87 and the lower pressing plate 89 are connected by a biasing member or the like.
The upper surface of the lower pressing plate 89 firmly and closely to the lower surface of the mold plate.
It is good to wear it. The press device 100 shown in FIG. 16 moves up and down.
Possible upper ram 101 and below this upper ram 101
Lower ram 102 disposed below and facing the end face
And then patrol between the upper and lower rams 101 and 102.
Lower pressing plate patrol means 103 and upper and lower rams 101, 1
The mold plate 104 from the position retracted from between
It is transferred between 101 and 102, and the upper and lower rams 101 and 102
A mold plate that transfers the mold plate 104 to a position retracted from the space
Conveying means (not shown) and upper and lower rams 101, 102
An upper holding plate patrol means 105 that patrols through
A shape resin supply device 106 and a plurality of mold plates 104 are housed.
The mold plate supply box 107 and the mold plate supply box 107
Mold plate feeding device for feeding the mold plates 104 one by one
108 and the surface of the circulating upper holding plate 109 are cleaned.
First cleaning device 114 and a lower holding plate 111 that circulates
Second cleaning device 115 for cleaning the surface of the sheet, and heating and pressure treatment
And a storage box 112 for storing the finished mold plate 104,
Transfer device 11 for transferring the mold plate 104 to the container box 112
6 and. In FIG. 16, 113 is a tensioning mechanism.
Is. In this press device 100, the lower push
The support plate circulating means 105 is an endless belt belt.
Provide a plurality of openings on the surface as appropriate, and press the lower part
Even a plate may be attached, or endlessly
The lower part is pressed between a pair of wires that are laid in parallel and stretched in parallel.
It may be configured to attach a cover plate, or a thin metal plate.
It is also possible to adopt a configuration in which the endless circuit is cycled. In this press 100, the mold plate
The carrying means may be replaced by a part of the lower holding plate circulating means.
Be done. That is, the mold plate is fed from the mold plate supply box 107.
The mold plate sent out by the squeezing device 108 circulates the lower pressing plate.
It is placed on the transportation surface of the ring means and transferred. On the way
At the opening of the mold plate by the molding resin supply device 106.
Therefore, a predetermined amount of resin powder is supplied. In this press machine, the mold plate is
A special device is used to separate the holding plate and the upper holding plate.
Bending of the upper holding plate patrol means 105 without the need for installation
The bent part of the part and the lower holding plate patrol means 103
It is dynamically separated. FIG. 17 is a diagram showing another embodiment of the present invention.
It is a schematic explanatory view showing a scanning device. Reference numeral 120 in FIG. 17 indicates an upper line.
, 121 is the lower ram, 121 is gold.
The upper and lower rams are held by the driving means 122 while holding the template.
Mold plate holder that moves to a position retracted from between the upper and lower rams
It is a means of holding. Reference numeral 123 is a mold plate. 124
Shown by is rotatably supported by the first rotating member 125.
It is a first rotation holding member that holds the lower pressing plate.
It Reference numeral 126 indicates that the second rotating member 127 can rotate.
It is a supported second rotation holding member that holds the upper pressing plate.
I have. [0165] A mold device and a press having such a configuration
Device to prevent burrs without risking the operator.
It is possible to manufacture a pressure-molded product with a small thickness and a uniform thickness.
You can According to the present invention, the mold device is manually operated.
Not handled and therefore endangers the operator
Manufactures pressure-molded products without burrs and without burrs
Mold device that can be used and this mold device is used
By doing so, fully automatic press processing can be performed, and
A press that can produce a pressure-molded body without re-generation
A device can be provided. Furthermore, the mold plate of the present invention
When used, it produces less burr and has a uniform thickness.
Providing a mold plate that can repeatedly manufacture pressure-formed products
can do.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic explanatory view showing a mold device showing an embodiment of the present invention. FIG. 2 is a schematic sectional explanatory view showing an example of the mold plate of the present invention. FIG. 3 is a schematic explanatory view for explaining the operation of the mold device shown in FIG. FIG. 4 is a schematic explanatory view for explaining the operation of the mold apparatus shown in FIG. FIG. 5 is a schematic explanatory view showing a mold apparatus according to another embodiment of the present invention. FIG. 6 is a schematic cross-sectional explanatory view showing a mold plate according to another embodiment of the present invention. FIG. 7 is a schematic explanatory view showing a press device according to an embodiment of the present invention. FIG. 8 is a schematic perspective view showing a mold device used in the press device shown in FIG. 7. 9 is a schematic explanatory view showing the operation of the pressing device shown in FIG. FIG. 10 is a schematic explanatory view showing the operation of the press device shown in FIG. 7. FIG. 11 is a schematic explanatory view showing the operation of the pressing device shown in FIG. 7. FIG. 12 is a schematic perspective view showing a pressing device according to another embodiment of the present invention. FIG. 13 is a schematic explanatory view showing a pressing device according to another embodiment of the present invention. FIG. 14 is a schematic perspective view showing a pressing device according to another embodiment of the present invention. FIG. 15 is a schematic side view showing a mold device used in the pressing device shown in FIG. FIG. 16 is a schematic explanatory view showing a pressing device according to another embodiment of the present invention. FIG. 17 is a schematic explanatory view showing a pressing device according to another embodiment of the present invention. [Explanation of reference numerals] 21a Upper ram 21b Lower ram 22 Mold device 23 Cleaning device 24 Mold attaching / detaching device 25 Mold resin supplying device 26 Third horizontal support 27 Third holding body 28 Upper pressing plate 29 Third vertical Support 30 Second horizontal support 31a First piston 31b Second piston 32 Guide groove 33 Mold plate 33 34 First vertical support 35 First horizontal support 36 First holder 37 Lower pressing plate 38 Cleaning roller 39 Hopper 40 chuck

Continued front page    (72) Inventor, Takao Kawamura             3-43-2 Ebisu, Shibuya-ku, Tokyo Nikki             Sozo Co., Ltd. (72) Inventor Takashi Chino             3-43-2 Ebisu, Shibuya-ku, Tokyo Nikki             Sozo Co., Ltd. (72) Inventor Yuji Nogami             3-43-2 Ebisu, Shibuya-ku, Tokyo Nikki             Sozo Co., Ltd.

Claims (1)

Claims: 1. A lower pressing plate, a mold plate having an opening for filling a molding material, and an upper pressing plate are arranged vertically in this order with a space therebetween, and the lower pressing plate is The lower holding plate is held by the first holding member on the upper holding plate so as to be separated from the upper holding plate, and the mold plate is held by the second holding member on the upper holding plate so as to separate the mold plate from the upper holding plate. A mold device characterized by being formed. 2. A lower holding plate, a mold plate having an opening for filling a molding material, and a holding means for holding the upper holding plate vertically with a space provided therebetween, and an upper surface of the lower holding plate and a metal plate. A mold apparatus comprising: a pressing unit for forcibly adhering the lower surface of the mold plate to each other; and a peeling unit for forcibly peeling the upper pressing plate and the lower pressing plate from the mold plate after pressing. 3. A lower pressing plate, a mold plate having an opening for filling a molding material, an upper pressing plate, and a lower pressing plate for holding the lower pressing plate between upper and lower rams and between upper and lower rams. First to move between rams to a retracted position
A holding mechanism, a second holding mechanism that holds the mold plate and moves the mold plate to a position between upper and lower rams and a position retracted from between the upper and lower rams, and holds the upper holding plate and the upper part of the upper holding plate. And a third holding mechanism for moving the pressing plate between the upper and lower rams and a position retracted from the upper and lower rams,
By driving the first holding mechanism between the upper and lower rams, the lower holding plate arranged between the upper and lower rams is driven to overlap the mold plate with the lower holding plate by driving the second holding mechanism. (3) A mold apparatus, wherein an upper pressing plate can be superposed on the upper surface of the mold plate by driving a holding mechanism. 4. The first holding mechanism includes a rotatable first rotation support member provided at a position retracted from between the upper and lower rams, and rotatably supported by the first rotation support member. And a first rotation holding member for holding the lower pressing plate,
The second holding mechanism is provided with a rotatable second rotation support member provided at a position retracted from the space between the upper and lower rams, and is rotatably supported by the second rotation support member and holds the mold plate. A third rotation support member provided at a position retracted from the space between the upper and lower rams, and a second rotation support member detachably attached to the third rotation support member. The mold apparatus according to claim 3, further comprising a third rotation holding member that is rotatably supported by the dynamic support member and that holds the upper pressing plate. 5. The second holding mechanism includes a moving holding member that holds the mold plate movably and detachably between the upper and lower rams and a position retracted from the upper and lower rams. The holding mechanism includes a first turning support body rotatably mounted on the moving holding member, and a first turning support which is rotatably supported by the first turning support body and holds a lower pressing plate. The third holding mechanism is rotatably mounted on the movable holding member, and the third holding mechanism is rotatably supported by the third turning support body and the upper holding plate. The mold apparatus according to claim 3, further comprising a third rotation holding body that holds the. 7. A lower pressing plate that circulates between the upper and lower rams and a lower pressing plate that moves between a position retracted from the upper and lower rams and between the upper and lower rams and above the lower pressing plate. A mold apparatus comprising: a mold plate that moves to a position retracted from between rams; and an upper pressing plate that circulates between upper and lower rams. 8. A mold plate holding member capable of holding a mold plate having an opening for filling a molding material and moving to a position retracted between the upper and lower rams and between the upper and lower rams, and the mold plate. In a process of moving the mold plate holding member, which is rotatably attached to one end of the holding member and is superposed on the mold plate, and the mold plate holding member in the direction of retreating from between the upper and lower rams, A mold apparatus, wherein an upper pressing plate and a lower pressing plate which are stacked on a mold plate are sequentially released. 9. A mold plate having an opening for filling a molding material and a groove formed so as to surround the opening. 10. The mold plate according to claim 9, wherein a horizontal plane portion sandwiched by the opening and the groove is formed slightly higher than the entire surface. 11. A pair of rams arranged above and below, and between the rams above and below, the mold plate and the upper press plate are arranged so as to overlap each other on the lower press plate.
5. A press device comprising: the mold device according to any one of claims 1 to 3, a molding material supply device that supplies a molding material, and a cleaning device that cleans the surfaces of the upper pressing plate and the lower pressing plate.