JPH0679148U - Liquid crystal display - Google Patents

Abstract

(57) [Summary] The semiconductor device 11 having the protruding electrode 25, the connection electrode 15 connected to the protruding electrode, the extraction electrode 17 connected to the connection electrode, the connection electrode, the extraction electrode, and the auxiliary pattern 19 are formed. A substrate 13 having a guide space 21 to be provided and a conductive adhesive 23 for connecting the connection electrode and the protruding electrode are provided. [Effect] The size of the effective conductive adhesive can be reduced by the function of the guide space. Therefore, it is possible to prevent a short circuit between adjacent connection electrodes without increasing the number of processing steps of the liquid crystal display device.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a connection structure in which a protruding electrode formed on a semiconductor device and a connection electrode formed on a substrate are connected using a conductive adhesive, and in particular, a liquid crystal display device is provided with a semiconductor device for driving the liquid crystal display device. Connection structure for implementation.

A conventional example in a so-called chip-on-glass (COG) technique in which a protruding electrode formed on a semiconductor device and a connection electrode formed on a glass substrate are connected using a conductive adhesive is shown in FIG. Will be described with reference to the plan view of FIG. Note that, in FIG. 7, the protruding electrodes are not shown.

As shown in FIG. 7, a plurality of connection electrodes 15 are formed on a substrate at regular intervals. Further, an extraction electrode 17 connected to this connection electrode 15 is provided.

Then, the protruding electrodes formed on the semiconductor device and the connection electrodes are connected using a conductive adhesive 23.

Here, when the amount of the conductive adhesive 23 formed varies and the amount of the conductive adhesive 23 is displaced from the predetermined position, the conductive adhesive 23 is cured as shown by an arrow 37 in FIG. There is a problem in that the connecting electrodes 15 adjacent to each other are short-circuited by the conductive adhesive 23 due to wetting and spreading due to heating at that time.

Therefore, in order to prevent the short circuit phenomenon between the connection electrodes 15, for example, a means described in Japanese Patent Laid-Open No. 5-21521 has been proposed. The mounting structure described in this publication will be described with reference to the sectional view of FIG.

As shown in FIG. 8, the protruding electrode 25 is formed on the electrode pad 29 in the opening of the protective film 31 formed in the semiconductor device 11 via the common electrode film 33.

A connection electrode 15 is provided on the substrate 13, and a frame member 35 having a film thickness larger than that of the connection electrode 15 is provided on the periphery of the connection electrode 15.

Then, the protruding electrode 25 and the connection electrode 15 are connected using the conductive adhesive 23.

[0010]

[Problems to be solved by the device]

 The mounting structure shown in FIG. 8 has an advantage that the frame material 35 can suppress the wetting and spreading of the conductive adhesive 23 and prevent a short circuit between the adjacent connection electrodes 15.

However, in the mounting structure shown in FIG. 8, the frame member 35 must be formed. That is, it is necessary to perform the film formation of the material of the frame material 35 and the patterning process thereof, and there is a problem that the processing steps of the liquid crystal display device increase.

An object of the present invention is to solve the above problems and to provide a mounting structure of a liquid crystal display device in which the number of processing steps of the liquid crystal display device does not increase and a short circuit between adjacent connection electrodes does not occur. Is.

[0013]

[Means for Solving the Problems]

 In order to achieve the above object, the liquid crystal display device of the present invention adopts the following configuration.

A liquid crystal display device according to the present invention is a semiconductor device having a protruding electrode, a connection electrode connected to the protruding electrode, a lead electrode connected to the connection electrode, and a guide space provided by the connection electrode, the lead electrode, and an auxiliary pattern. And a conductive adhesive that connects the connection electrode and the protruding electrode.

The mounting structure of the liquid crystal display device of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a liquid crystal display device of the present invention, and FIG. 2 is a cross-sectional view showing a cross section in a region of a protruding electrode and a connection electrode of the liquid crystal display device of the present invention. The following description will be made by alternately using FIG. 1 and FIG.

A connection electrode 15 is provided on the substrate 13, and a lead-out electrode 17 connected to the connection electrode 15 and having a pattern width dimension smaller than that of the connection electrode 15 is provided.

The connection electrode 15 is connected to the protruding electrode 15 formed on the semiconductor device 11. The extraction electrode 17 is connected to an input terminal or an output terminal of the liquid crystal display device or a display area of the liquid crystal display device, which is not shown.

Further, an auxiliary pattern 19 is further provided in the vicinity of the connection electrode 15 and the extraction electrode 17, and the connection electrode 15, the extraction electrode 17 and the auxiliary pattern 19 form a guide space 21. The width dimension of the guide space 21 is 2 μm to 10 μm.

The semiconductor device 11 is provided with a protective film 31 having an opening so that the electrode pad 29 is exposed, and a protruding electrode 25 is provided on the electrode pad 29 via a common electrode film 33.

Further, a conductive adhesive 23 for connecting the connection electrode 15 and the protruding electrode 25 is provided between the two.

Next, each component of the mounting structure described above will be described in detail including the manufacturing method.

The connection electrode 15, the extraction electrode 17, and the auxiliary pattern 19 provided on the substrate 13 are all made of a transparent conductive film such as indium tin oxide (ITO). Alternatively, the connection electrode 15, the extraction electrode 17, and the auxiliary pattern 19 may be formed of a multilayer of a transparent conductive film and a metal film such as gold (Au) or nickel (Ni).

The connection electrode 15, the extraction electrode 17, and the auxiliary pattern 19 are formed by vacuum vapor deposition to form indium tin oxide on the entire surface of the substrate 13 and then photolithography and etching techniques, so-called photoetching. It is simultaneously formed by patterning indium tin oxide by a technique. Then, in this indium tin oxide patterning process, the guide space 21 is also formed.

A protective film 31 is formed on the electrode pad 29 made of aluminum (Al) formed on the semiconductor device 11, and an opening is formed in the protective film 27 so that the electrode pad 29 is exposed by a photoetching technique. To form a part.

The protective film 31 is made of an inorganic material such as a silicon nitride film or a silicon oxide film containing phosphorus (P) as an impurity, an organic material such as a polyimide film, or these inorganic material film and organic material film. And a laminated film.

After that, a common electrode film 33 made of a metal multilayer film of aluminum, chromium (Cr), copper (Cu), nickel, titanium (Ti) or the like is formed on the entire surface of the semiconductor device 11. The common electrode film 33 is formed by a sputtering method or a vacuum evaporation method.

Further, a plating resist (not shown) made of a photosensitive resin is formed on the common electrode film 33 formed on the semiconductor device 11 to a thickness of about 10 μm by a spin coating method.

After that, using a predetermined photomask, exposure and development processing is performed to provide a plating resist having an opening on the electrode pad 29 in the region where the protruding electrode 25 is formed.

After that, using the common electrode film 33 as an electrode for plating, a protruding electrode 25 made of gold or copper is formed on the common electrode film 33 in the opening of the plating resist.

After that, the unnecessary plating resist is removed, and the common electrode film 33 in the region where the protruding electrode 25 is not formed is removed using the protruding electrode 25 as an etching mask.

The conductive adhesive 23 is composed of a base material, conductive particles, and a curing agent. Then, the main agent, conductive particles, and curing agent are mixed by roll kneading.

The base material is made of an organic material such as epoxy, urethane, or acrylic. Further, as the curing agent, an amine-based or acid anhydride-based material is used. The main agent and the curing agent have an insulating property.

The conductive particles are made of a metal such as gold, silver (Ag), copper, aluminum or nickel, or a conductive material such as carbon. Alternatively, the conductive particles are made of plastic beads made of a copolymer of styrene and divinylbenzene having elasticity, and a metal film of nickel, gold, silver or the like is plated in a single layer or multiple layers to form a conductive thin film. You may use the thing.

The size of the conductive particles is 10 μm or less, and the content of the conductive particles in the entire conductive adhesive 23 is about 50 to 80% by weight.

Next, a method of connecting the semiconductor device 11 having the protruding electrodes 25 formed thereon and the substrate 13 having the connecting electrodes 15 formed thereon will be described.

A conductive adhesive 23 is formed on the tip of the protruding electrode 25 formed on the semiconductor device 11 by a dipping method or a printing method.

After that, the connection electrode 15 formed on the glass substrate 13 and the protruding electrode 25 formed on the semiconductor device 11 are aligned with each other using a binocular microscope.

Then, the semiconductor device 11 is lightly pressed against the substrate 13 to perform heat treatment to cure the conductive adhesive 23.

The curing temperature of the conductive adhesive 23 is set to 100 ° C. to 200 ° C.

Further, an epoxy-based or rubber-based sealing resin (not shown) is injected between the semiconductor device 11 and the substrate 13 and cured at a temperature of 100 ° C. to 150 ° C., as shown in FIG. It becomes a structure.

Next, another embodiment different from the embodiment described with reference to FIGS. 1 and 2 will be described with reference to FIGS. 3 to 6. 3 to 6, only the connection electrode, the extraction electrode, the auxiliary pattern, and the guide space, which are provided on the substrate side of the connection region with the protruding electrode, are shown.

In the embodiment shown in FIGS. 3A and 3B, the guide pattern 21 is provided by forming the auxiliary pattern 19 on the connection electrode corner portion 15a on the side of the connection electrode 15 which faces the connection pattern. The shape of the auxiliary pattern 19 is a V shape so that the opening end of the guide space 21 faces the region between the opposing connection electrodes 15.

In the embodiment shown in FIG. 4, the auxiliary pattern 19 and the connection electrode 15 are integrated, and the guide space 21 is further extended to the region of the connection electrode 15.

In the embodiment shown in FIG. 5, an auxiliary pattern 19 is provided around the connection electrode 15 to provide a guide space 21, and an auxiliary pattern 19 is also provided to the extraction electrode 17 so as to form the guide space 21.

In the embodiment shown in FIG. 6, a guide space 21 is provided substantially at the center between the connection electrode 15 and the extraction electrode 17.

In the present invention, the guide space 21 is formed by the connection electrode 15, the extraction electrode 17, and the auxiliary pattern 19 of the substrate 13, and the guide space 21 suppresses the occurrence of a short circuit between the adjacent connection electrodes 15. ing.

This is because, from the guide space 21 consisting of a gap with a small width dimension, among the constituent elements of the conductive adhesive 23, the main component and the curing agent, in particular, are capillarized by the capillarity phenomenon so that the connection region between the connection electrode 15 and the protruding electrode 25 is connected. The phenomenon that flows out from occurs.

Therefore, even if the conductive adhesive 23 is formed in a large amount due to variations in the formation, the main component of the conductive adhesive 23 and the curing agent flow out through the guide space 21 to provide effective conductivity. The amount of adhesive 23 formed is reduced.

Therefore, it becomes possible to prevent a short circuit between the adjacent connection electrodes 15. The base material and the curing agent of the conductive adhesive 23 flowing out from the connection area have an insulating property as described above, and there is no problem even if they contact each other between the adjacent connection areas.

Further, in the embodiment shown in FIGS. 4, 5, and 6, the guide space 21 is provided up to the center of the connection electrode 15. Therefore, the main component and the curing agent among the component elements of the conductive adhesive 23 also flow out from the central portion of the formed conductive adhesive 23. As a result, the short circuit prevention curing between the adjacent connection electrodes 15 is higher than that of the other embodiments.

[0051]

[Effect of device]

 As is clear from the above description, in the liquid crystal display device mounting structure of the present invention, the size of the effective conductive adhesive can be reduced by the function of the guide space. Therefore, it becomes possible to prevent a short circuit between adjacent connection electrodes without increasing the number of processing steps of the liquid crystal display device.

[Brief description of drawings]

FIG. 1 is a plan view showing a liquid crystal display device according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a liquid crystal display device according to an embodiment of the present invention.

FIG. 3 is a plan view showing a liquid crystal display device according to another embodiment of the present invention.

FIG. 4 is a plan view showing a liquid crystal display device according to another embodiment of the present invention.

FIG. 5 is a plan view showing a liquid crystal display device according to another embodiment of the present invention.

FIG. 6 is a plan view showing a liquid crystal display device according to another embodiment of the present invention.

FIG. 7 is a plan view showing a liquid crystal display device in a conventional example.

FIG. 8 is a cross-sectional view showing a liquid crystal display device in a conventional example.

[Explanation of symbols]

 11 semiconductor device 13 substrate 15 connection electrode 17 extraction electrode 19 auxiliary pattern 21 guide space 23 conductive adhesive

Claims (2)

[Scope of utility model registration request] 1. A substrate having a semiconductor device having a protruding electrode, a connection electrode connected to the protruding electrode, a lead electrode connected to the connection electrode, and a guide space provided by the connection electrode, the lead electrode, and an auxiliary pattern, A liquid crystal display device comprising: a conductive adhesive that connects a connection electrode and a protruding electrode. 2. The liquid crystal display device according to claim 1, wherein the connection electrode, the extraction electrode, and the auxiliary pattern are made of the same material.