JPH0679147U - Integrated circuit device with alignment mark for bonding - Google Patents

Abstract

(57) [Abstract] [Purpose] The area occupied by the bonding alignment mark is reduced, the second pad can be efficiently arranged in a smaller area, and the packaging density of circuit elements is increased. [Structure] The IC chip (1) is mounted on a wiring board (2) on which a conductor pattern (6) is formed.
In an integrated circuit device in which the upper first pad (3) and the second pad (4) on the wiring board (2) are wire-bonded with a thin metal wire (5), they are formed on the wiring board (2) for recognizing the bonding connection position. As the alignment mark used, a shape of a specific second pad (8) is made different from the shapes of the other second pads, and a shape including a portion serving as a reference mark for coordinate recognition is used. Also, the conductor pattern near the second pad (4) can be bent to form the alignment mark (9).

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an integrated circuit device having a bonding alignment mark provided on the side of a second pad for recognizing a bonding position when connecting an IC chip or the like by wire bonding. The present invention relates to a technique for reducing or eliminating a space occupied by a bonding alignment mark by making a shape different from a second pad or a conductor pattern to be identifiable and having a coordinate recognizable shape.

[0002]

[Prior art]

 Conventionally, COB (Chip on Board) has been used as a method for reducing the mounting area of circuit elements in an electronic circuit and increasing the degree of integration of the electronic circuit. In this COB, a circuit element such as an IC chip is directly die-bonded to a wiring board on which a conductor pattern is formed, and an electrode of the circuit element is connected to the conductor pattern by a method such as wire bonding or bump to form an electronic circuit. It was done.

In this wire bonding process, the bonding pad (first pad) formed on the circuit element and the second pad formed on the conductor pattern around the circuit element mounting portion of the wiring board are made of a fine metal wire such as Au or Al. Wire bonding connection is made.

At the time of this connection, the metal thin wire is held by an appropriate jig and moved between the first pad and the second pad and connected to each pad by thermocompression bonding or the like. In order to recognize and accurately control the movement of the jig, an alignment mark serving as a reference for XY coordinates on the wiring board is formed near the bonding pad.

Conventionally, the alignment mark for recognizing the position of the bonding pad has been formed in the vicinity of the bonding pad as a pattern independent of the conductor pattern and the bonding pad forming the electronic circuit.

For example, FIG. 3 is a view of an IC chip mounting portion of a conventional COB before the resin sealing step as seen from above. The IC chip 1 is die-bonded to the wiring board 2. The upper first pad 3 and the second pad 4 on the wiring board 2 are wire-bonded to each other by a fine metal wire 5. Of the plurality of second pads 4, an alignment mark 7 is formed as an independent region near a specific second pad. Each second pad is connected to another circuit via a conductor pattern (not shown) formed inside the wiring board 2.

With such a configuration, during wire bonding, the device that drives the jig that holds the thin metal wire 5 performs coordinate recognition based on the alignment mark 7, and detects the positions of the plurality of second pads 4 and the like. Determine the relationship.

Similarly, also in the conventional COB IC chip mounting portion shown in FIG. 4, the alignment mark 7 is formed as an area independent of the second pad 4 and the conductor pattern 6 connected to the second pad 4. Has been done.

[0009]

[Problems to be solved by the device]

 However, when an element having a large number of bonding pads, such as a digital IC chip, is mounted on a wiring board, the number of second pads arranged around the IC chip mounting portion also becomes large, and high-density wiring is required. However, in order to provide the alignment mark separately from the conductor pattern and the second pad as in the conventional case, the area where the second pad is formed around the IC chip mounting portion has to be sacrificed.

Therefore, the area where the second pad is formed is expanded, which hinders high integration of electronic circuits and miniaturization of COB substrate devices.

In addition, when the conductor pattern is designed to bypass the alignment mark, the conductor pattern becomes complicated.

Therefore, an object of the present invention is to reduce the occupied area of the alignment mark by integrating the bonding pad or the conductor pattern and the alignment mark for bonding position recognition, and to reduce the area around the circuit element of the wiring board. It is to be able to secure a large second pad formation area.

[0013]

[Means for Solving Problems]

 In order to solve the above problems, according to the present invention, a circuit element is mounted on a wiring board on which a conductor pattern is formed, and a bonding pad formed on the circuit element and a second pad formed on the conductor pattern are connected by bonding. In addition, in an integrated circuit device having a bonding alignment mark formed on a wiring board for recognizing a bonding connection position during the bonding connection, a specific second pad and / or a conductor pattern near the second pad is provided. The shape of is different from the shape of the other second pad and / or the conductor pattern in the vicinity of the second pad, and is formed so as to include a portion serving as a reference mark for coordinate recognition.

Further, the alignment mark may have a shape such that a specific second pad has a portion serving as a reference for coordinate recognition so as to be different from the shapes of the other second pads.

In addition, the alignment mark is formed by bending a specific conductor pattern into a shape including a portion serving as a reference for coordinate recognition in the vicinity of the second pad so as to be different from the shapes of other conductor patterns. It can also be formed.

[0016]

In the above structure, since the bonding alignment mark is formed as a part of the second pad or the conductor pattern, a dedicated area for forming an independent pattern is unnecessary. Therefore, a larger area for forming the second pad is secured around the IC chip mounting portion of the wiring board, and the second pad can be efficiently arranged.

Further, unlike the conventional case, it is not necessary to form the conductor pattern so as to bypass the independent alignment mark, so that the conductor pattern can be easily designed.

Furthermore, by forming a specific second pad in a shape having a portion that serves as a reference for coordinate recognition, it is possible to secure a second pad formation area in the peripheral portion of the circuit element and to perform reliable alignment. You can

Further, by forming an alignment mark by bending a specific conductor pattern in the vicinity of the second pad, it becomes possible to dispose only the second pad in the peripheral portion of the circuit element.

[0020]

【Example】

 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the periphery of a bonding alignment mark of an integrated circuit device according to a first embodiment of the present invention. The IC chip 1 is die-bonded to the wiring board 2, and the first pad 3 formed on the periphery of the IC chip 1 and the second pad 4 formed on the periphery of the IC chip 1 mounting portion of the wiring board 2 are made of metal. Wire bonding is performed by a thin wire 5. Of the second pad 4, the shape of the alignment second pad 8 formed on the wiring substrate 2 corresponding to the corner of the IC chip 1 is different from the shapes of the other second pads 4, and a part thereof serves as a reference for coordinate recognition. It is formed in a specific shape having such edge portions 8-1, 8-2, 8-3.

In such a configuration, during wire bonding, the wire bonding device has the edges 8-1, 8-2, 8-3 of the second alignment pad 8 on the wiring board 2 and these edges intersect. Detect points etc. Then, based on these detections, the coordinates on the wiring board 2 are recognized, the positions of the second pads 4 are determined, and the jig for holding the fine metal wires 5 is moved to heat the target second pad. Perform crimping.

Therefore, the wire bonding can be appropriately performed without providing an independent pattern for the alignment mark, and the corners around the IC chip 1 mounting portion of the wiring board 2 can be effectively used. The second pad 4 can be efficiently arranged around the IC chip 1. In addition, since it is not necessary to bypass the wiring pattern to form the alignment mark, the wiring pattern can be easily designed.

FIG. 2 is a plan view showing a peripheral portion of an alignment mark for bonding of an integrated circuit device according to a second embodiment of the present invention. Also in this embodiment, as in the first embodiment, the IC chip 1 is die-bonded to the wiring board 2, and the first pad 3 formed on the peripheral portion of the IC chip 1 and the IC chip of the wiring board 2 are formed. The second pad 4 formed on the periphery of one mounting portion is wire-bonded by the fine metal wire 5. The present embodiment is different from the first embodiment in that the conductor pattern 6 is bent in a specific shape in the vicinity of a specific second pad 4 to serve as a reference for coordinate recognition, thereby forming an alignment deforming portion 9. That is the point.

Even in such a configuration, as in the first embodiment, the wire bonding apparatus detects the specific shape and edge of the conductor pattern in the alignment deforming portion 9 to perform coordinate recognition.

Therefore, since it is not necessary to form the alignment mark independently and to change the shape of the second pad 4, the second pad can be efficiently arranged.

In this embodiment, the bonding alignment mark is formed on the second pad or the conductor pattern at the corner of the second pad formation region, but the position where the alignment mark is formed is not limited to the corner. Instead, it can be provided at a convenient position by arranging a second pad or a conductor pattern.

Further, in the second embodiment, the alignment mark is formed on the conductor pattern connected to the second pad, but the conductor pattern not connected to the second pad is formed on the alignment mark in the vicinity of the second pad formation region. You may form as.

[0028]

[Effect of device]

 As described above, according to the present invention, the specific second pad or the conductor pattern is formed so as to function as the alignment mark, so that the dedicated area for forming the alignment mark is not required, and the circuit of the wiring board is not necessary. Only the second pad can be efficiently arranged around the element mounting portion, and the required number of second pads can be formed in a smaller area to significantly increase the packaging density of circuit elements.

Further, since the alignment mark is not formed as an independent pattern, when designing the second pad or the conductor pattern, there is no need to detour or change the pattern to avoid the alignment mark, which makes the pattern design extremely easy. Become.

[Brief description of drawings]

FIG. 1 is a partially enlarged plan view showing a peripheral portion of a bonding alignment mark of an integrated circuit device according to a first embodiment of the present invention.

FIG. 2 is a partially enlarged plan view showing a peripheral portion of a bonding alignment mark of an integrated circuit device according to a second embodiment of the present invention.

FIG. 3 is a partially enlarged plan view showing a peripheral portion of a bonding alignment mark of a conventional integrated circuit device.

FIG. 4 is a partially enlarged plan view showing a peripheral portion of a bonding alignment mark of a conventional integrated circuit device.

[Explanation of symbols]

 1 IC Chip 2 Wiring Board 3 First Pad 4 Second Pad 5 Metallic Wire 6 Conductor Pattern 7 Alignment Mark 8 Alignment Second Pad 9 Alignment Deformation Section

Claims (3)

[Scope of utility model registration request] 1. A wiring board on which a conductor pattern is formed, a circuit element is mounted, and a bonding pad formed on the circuit element and a second pad formed on the conductor pattern are connected by bonding, and the bonding connection is formed. An integrated circuit device provided with a bonding alignment mark formed on a wiring board for recognizing a bonding connection position at the time of, and a shape of a specific second pad and / or a conductor pattern in the vicinity of the second pad, Integrated circuit having a bonding alignment mark, which is different from the shape of the second pad and / or the conductor pattern in the vicinity of the second pad and includes a portion serving as a reference mark for coordinate recognition. apparatus. 2. The bonding alignment according to claim 1, wherein the shape of the specific second pad is different from the shapes of the other second pads and has a portion serving as a reference for coordinate recognition. Integrated circuit device with marks. 3. The shape of the specific conductor pattern is obtained by bending the conductor pattern in the vicinity of the second pad,
The integrated circuit device having a bonding alignment mark according to claim 1, wherein the integrated circuit device is formed so as to include a portion serving as a reference for coordinate recognition.