JPH0677758A - Surface acoustic wave device and microwave integrated circuit device - Google Patents

Abstract

(57) [Abstract] [Purpose] To make a surface acoustic wave device that does not easily attach dust to the surface. In the surface acoustic wave device, the surface of the piezoelectric substrate 1 on which the lead lines of the input / output electrodes 10 and 14 are present is directed to the package side 3, and the input / output comb-teeth electrode 10 is positioned in the recessed portion of the package. I / O electrode 14
The surface acoustic wave device is characterized in that it contacts the input / output electrodes of the package 3. [Effect] It is possible to prevent the adhesion of dust that causes a short circuit between electrodes and a change in electrical characteristics, and thus the yield can be improved. Moreover, since the electrodes of the piezoelectric substrate are directly attached to the package, the size can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface acoustic wave circuit device or a microwave integrated circuit device, and relates to a method for mounting each circuit in a package.

[0002]

2. Description of the Related Art FIG. 18 shows, for example, JP-A-61-285881.
FIG. 6 is a top view showing a semiconductor mounting of a conventional microwave integrated circuit device corresponding to the first invention disclosed in Japanese Patent Publication No. 5 publication, in which 1 is a piezoelectric substrate, 2 is a cover, and 3 is a package. Reference numeral 4 is an input / output lead wire, 5 is a metal wire, 6 is a non-conductive adhesive, 10 is an input / output comb-teeth electrode, and 14 is an input / output electrode lead wire.

Next, the operation will be described. The electric wave coming from the input lead wire 4a enters the input comb-teeth electrode 10a connected to the input electrode lead-out pattern 14a through the metal wire 5a and propagates as a surface acoustic wave on the piezoelectric substrate 1. After that, the output comb-teeth electrode 10b converts the electric wave into a radio wave, and the output electrode lead-out pattern 14 extends to the metal wire 5b.
Through the output lead 4b. The piezoelectric substrate 1 is attached to the package 3 with a non-conductive adhesive 6. Further, the comb-teeth electrode 10 usually has a narrow pattern width, and the number of the comb-teeth electrodes is hundreds or more. Therefore, in order to avoid dust and prevent corrosion, it is necessary to attach the cover 2 to shut off the outside air.
Also, the sound wave generated by the comb-teeth electrode 10 propagates to both sides,
The sound wave propagating to the end side of the piezoelectric substrate 1 is unnecessary. Part of it is reflected on the edge side of the piezoelectric substrate.

FIG. 19 is a cross-sectional view of a conventional surface acoustic wave circuit device corresponding to the second invention disclosed in, for example, Japanese Patent Laid-Open No. 90805/1990, where 1 is a piezoelectric substrate, 2 is a cover, 3 is a package, 4 is an input / output lead wire, 5 is a metal wire, 6 is a non-conductive substrate, 8 is a through hole, 9 is an input / output electrode, 10 is an input / output comb-teeth electrode, 15 is a substrate, 16 Is an input / output matching circuit.

Next, the operation will be described. The radio wave that has entered the input matching circuit 16a passes through the through hole 8a, and enters the lead wire 4a that is coupled to the through hole 8b from the input electrode 9a. The metal wire 5a is converted into a sound wave by the input comb-teeth electrode 10a and propagates on the surface of the piezoelectric substrate 1. The output comb-teeth electrode 10b converts sound waves into radio waves. Similarly, through the metal wire 5b, the lead wire 4b, through the through hole 8c, and the output electrode 9b.
Thus, it goes out of the output matching circuit through the through hole 8d.
Normally, the piezoelectric substrate 1 does not have impedance matching, so that a matching circuit 16 including an element such as a capacitor is required for input and output. In addition, the comb-teeth electrode 10 of the piezoelectric substrate 1
Since the space between the patterns is very narrow and it is a metal electrode, it is necessary to shut off from the outside in order to suppress corrosion, so it is sealed with the cover 2. The non-conductive adhesive 6 is an adhesive for attaching the piezoelectric substrate 1 to the package 3.

FIG. 20 is a top view of a conventional microwave integrated circuit device corresponding to the third invention disclosed in JP-A-57-88302, for example.
Is a case, 21 is an input connector, 22 is an output connector,
Reference numeral 23 is a carrier, 24 is a microwave integrated circuit, 25 is a coupling wire, and 26 is a spring.

Next, the operation will be described. The radio wave coming from the input connector 21 passes through the coupling line 25a and is processed by the microwave integrated circuit 24a.
5b, the next microwave integrated circuit 24b is processed, and similarly, the coupling wire 25c is similarly transmitted, the next microwave integrated circuit 24c is processed, and a radio wave is emitted from the output connector 22 through the metal wire 25d. Go. The spring 26 is to bring the carriers 23 into contact with each other in order to connect to the ground. In this way, the microwave integrated circuits 24a, 24b, and 24c of 5a, 5b, and 5c are cascaded horizontally.
Since they are arranged side by side, the dimension in that direction becomes longer.

[0008]

In the conventional surface acoustic wave device corresponding to the first aspect of the invention as described above, the wire 5 and the lead wire 4 have a large area because they take an area. Until the cover 2 is covered, the comb-teeth electrode is facing outwards, so the comb-shaped electrode faces the upper surface in particular, so that dust or the like is likely to adhere to the device and the yield deteriorates. In addition, radio waves fly in the air between the input and output. There are problems that the characteristics are deteriorated and the reflection from the end surface of the piezoelectric substrate 1 occurs, so that the electric characteristics are adversely affected.

The first invention is made to solve the above-mentioned problems, and an object thereof is to improve the yield, as well as to obtain a smaller size and higher performance.

In the conventional surface acoustic wave circuit device corresponding to the second invention as described above, the matching circuit 16 is the package 3
Since it is provided on the outside of, it becomes larger by that amount. Further, a floating component is generated by the length of the lead wire 4 and the electrode portion 9.

The second aspect of the present invention has been made to solve the above-mentioned problems. Since an input / output matching circuit is incorporated in a package, a small size and high performance can be obtained. It was done by.

In the conventional microwave integrated circuit device corresponding to the third aspect of the invention as described above, the size of the microwave integrated circuit device becomes longer as the microwave integrated circuits are connected in cascade.

The third invention is made to solve the above problems, and is mainly made to obtain a small-sized one.

[0014]

According to a first aspect of the present invention, there is provided a piezoelectric substrate having at least one pair of input / output electrodes and input / output comb-teeth electrodes formed on one main surface, and at least one piezoelectric substrate provided on one main surface. A step portion having an external electrode is provided at a position corresponding to the input / output electrode, and a package arranged so as to face the main surface provided with the step portion. At this time, the stepped portion may be configured by a part of the package, a thick input / output electrode, and a post made of a conductor.
Further, a stepped portion having a height lower than that of the stepped portion may be provided at a position facing the surface acoustic wave transmission portion between the input comb-teeth electrode and the output comb-teeth electrode. Further, the input / output electrodes may be adhered to each other by a conductive adhesive, a non-conductive adhesive may be applied to the end portion of the piezoelectric substrate, or the stepped portion may be provided on all sides of the piezoelectric substrate. Alternatively, the piezoelectric substrate and the package may be bonded with a non-conductive adhesive.

A surface acoustic wave circuit device according to a second invention is
A multi-layer board package is used to provide a matching circuit between the multi-layer boards. Further, a ground pattern for separation is provided on the upper and lower surfaces between the input and output between the multilayer substrates. Also, a part of the matching circuit is set on the upper surface of the multi-layer substrate and separated from the package. We decided to set the whole matching circuit on the top surface of the multilayer board and separate it from the package. The ground pattern was brought all over the middle of the multi-layer substrate, and the input / output matching circuits and electrodes were brought in through holes on the lower surface.

A microwave integrated circuit device according to a third aspect of the present invention is one in which the periphery of a package is stepped and a microwave integrated circuit is mounted on that portion. At this time,
The signal lines between the layers may be connected by through holes inside the package or may be connected by metal lines outside the package. Further, the circuit surface of the substrate of the microwave integrated circuit is attached so as to face the package.

[0017]

In the surface acoustic wave device according to the first aspect of the invention, since the piezoelectric substrate is mounted on the package side, dust is less likely to adhere, the yield is improved, and the size can be reduced.
Further, since the step portion is composed of a thick input / output electrode or a post made of a conductor, the piezoelectric substrate is brought into close contact with a flat package, which simplifies the package and realizes cost reduction. In particular, when the step portion is a post made of a conductor, the gap is made constant. Further, if a step portion having a height lower than that of the step portion is provided at a position facing the surface acoustic wave transmitting portion between the input comb-teeth electrode and the output comb-teeth electrode, the step is closely contacted with the piezoelectric substrate. Radio waves will be isolated between outputs, and isolation will be achieved, resulting in higher performance. Furthermore, if a conductive adhesive is also applied to the end side of the piezoelectric substrate, unnecessary reflection of sound waves can be suppressed and high performance can be achieved. When a non-conductive adhesive is attached to the end portion or the periphery of the piezoelectric substrate to bond the piezoelectric substrate and the package, the seal becomes unnecessary.

According to the second invention, since the input / output matching circuit is incorporated in the package, the size is reduced and
High performance can be obtained because there are few floating components. Further, since the ground electrode is provided between the input and the output, coupling due to radio waves between the input and output can be prevented, and high performance can be realized. Further, since it is also provided on the outer upper surface of the package, adjustment is possible. Since the input / output electrodes are provided on the outer upper surface of the package, adjustment can be easily performed and connection can be easily performed. Since the ground pattern was brought all over the middle surface of the multilayer substrate and the input / output matching circuits and electrodes were brought in through holes on the bottom surface, the ground electrode was provided in the widest possible area between the input and output, High performance can be achieved because coupling by radio waves can be prevented.

According to the third invention, since the microwave integrated circuits are vertically stacked, the area can be reduced, and the installation is easy because of the stairs. Also, since the signal line is brought to the outside, it is possible to realize miniaturization by connecting each microwave integrated circuit, and by bringing in another device, the original area can be saved. It can be reduced. Further, since the microwave substrate is turned upside down and directly attached to the package, the number of connecting steps can be reduced.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1. An embodiment of the first invention will be described below with reference to the drawings. In FIG. 1, 1 is a piezoelectric substrate, 2 is a cover, 3 is a package, 7 is a conductive adhesive, 8 is a through hole, 9 is an input / output electrode, 10 is an input / output comb-teeth electrode, and 14
Is an input / output electrode lead line.

Next, the operation will be described. Input electrode 9a
The incoming radio wave propagates through the through hole 8a and the input electrode lead-out pattern 14a which is in contact with the conductive adhesive 7a. The radio wave is input to the comb-teeth electrode 10
It is transmitted to a and is converted into a sound wave by the piezoelectric substrate 1. The sound waves are converted into radio waves by the output comb-teeth electrode 10b and output from the output electrode 9b from the output electrode lead-out pattern 14b through the through hole 8b in contact with the conductive adhesive 7b. The conductive adhesive 7 also serves to attach the piezoelectric substrate 1 to the package 3. To prevent the comb-teeth electrode 10 from contacting the package 3, the package 3
It has a hollow. The cover 2 is attached to block the outside air. Since the piezoelectric substrate is fixed to the package side in this way, it is possible to prevent short-circuiting between electrodes and adhesion of dust that causes a change in electrical characteristics, so that the yield can be improved. Moreover, since the electrodes of the piezoelectric substrate are directly attached to the package, the size can be reduced.

Embodiment 2 In addition, although the package 3 is provided with the depression in the above-mentioned Embodiment 1, it is shown in FIG. 2 in order to reduce the radio waves flying in the air between the comb-teeth electrodes 10a and 10b. Thus, the convex portion 12 is provided on the package 3. Therefore, isolation can be taken and high performance can be realized.

Example 3. In the first embodiment, the package 3 was provided with a dimple, but as shown in FIG. 3, the package 3 was formed without a dimple to form a single plate. Instead, the film thickness of the lead-out pattern 14 is increased to increase the comb-teeth electrode 1.
0 did not contact the package 3. Since the flat package was brought into close contact with the piezoelectric substrate in this way, the package can be made into a simple structure in addition to the above performance.
In addition to improving quality, the manufacturing process can be shortened.

Example 4. In the third embodiment, the film thickness of the lead-out pattern 14 is increased so that the comb-teeth electrode 10 does not contact the package 3. However, as shown in FIG. 4, the metal post 11 is provided on the package 3. I did not touch it.

Example 5 In Example 1, the conductive adhesive 7 used for contacting the lead-out pattern 14 and the package 3 was spread to the end side of the piezoelectric substrate 1 as shown in FIG. did. Therefore, unnecessary sound waves can be absorbed and a high-performance one can be obtained.

Embodiment 6 The conductive adhesive 7 used for contacting the lead-out pattern 14 and the package 3 in the above-mentioned Embodiment 5 is adhered to the entire peripheral surface of the piezoelectric substrate 1 as shown in FIGS. 6 and 7. And glued it so that it could be shielded from the outside air. With such a configuration, unnecessary sound waves can be absorbed, a cover is not required, and sealing performance can be obtained.

Embodiment 7 A conductive adhesive 7 is used for contact between the lead-out pattern 14 and the package 3, and another non-conductive adhesive 13 is used for bonding all over the periphery of the piezoelectric substrate 1 to the outside air. I was able to shut off. Since the non-conductive adhesive for fixing the package is adhered to the entire peripheral surface of the piezoelectric substrate as described above, unnecessary sound waves can be absorbed, and a cover is not required, so that sealing performance can be obtained. The quality is improved by separating the steps.

Embodiment 8 An embodiment of the second invention will be described below with reference to the drawings. In FIG. 9, 1 is a piezoelectric substrate and 2 is
Is a cover, 5 is a metal wire, 6 is a non-conductive substrate, 15 is a substrate, 8 is a through hole, 9 is an input / output electrode, 10 is an input / output comb-teeth electrode, 16 is an input / output matching circuit, and 17 is a chip component. .

Next, the operation will be described. Input electrode 9a
The radio waves are processed by the matching circuit 16a that is coupled from the through hole 8 to the through hole 8, and a part of the matching circuits is processed by the matching by the chip parts 17 and the like. Propagates on the surface of the flexible substrate 1.
The output comb-teeth electrode 10b converts sound waves into radio waves. Similarly, a radio wave is processed by the matching circuit 16b through the metal wire 5b, and a radio wave processed by the chip component 17 in some matching circuits goes out from the output electrode 9b through the through hole 8. Usually, the piezoelectric substrate 1 does not have impedance matching, so that a matching circuit 16 including an element 17 such as a capacitor is required for input and output. In addition, the comb-teeth electrode of the piezoelectric substrate 1 is a metal electrode because it has a very narrow space between patterns, and since it is necessary to shield the comb-teeth electrode from the outside in order to prevent corrosion, it is sealed with the cover 2. The non-conductive adhesive 6 is used for the piezoelectric substrate 1
Is an adhesive for attaching to the substrate 15c. With such a configuration, since the input / output matching circuit is incorporated in the package, miniaturization can be realized, and high performance can be obtained because there are few stray components.

Embodiment 9 In Embodiment 8, as shown in FIG. 10, a ground pattern penetrating the upper and lower surfaces is further provided between the input and output of the base multilayer substrate, and the input and output are coupled. The portion of unnecessary radio waves that are generated can be reduced by this earth pattern. Therefore, high performance can be achieved.

Example 10 In the above Example 8, FIG.
As shown in 1, mount the substrate of the surface acoustic wave circuit on the base of the package, bring a part of the matching circuit on the upper surface of the multi-layer substrate, and cover the surface acoustic wave circuit except the matching circuit. By sealing and providing an input / output matching circuit on the central substrate of the base multilayer substrate, the external chip component 17 is changed and the matching circuit 16 is changed.
I decided to change or adjust the electrical performance.

Eleventh Embodiment In the tenth embodiment, as shown in FIG. 12, an earth pattern penetrating the upper and lower surfaces is provided between the input and the output of the base multilayer substrate to prevent the unnecessary radio wave coupling between the input and the output. The part can be reduced by this earth pattern. Moreover, it eliminates the matching circuit between them and reduces man-hours.

Embodiment 12 As shown in FIG. 13, the surface acoustic wave circuit substrate is mounted on the package base, the surface acoustic wave circuit is sealed with a cover, and the next surface of the base of the base multi-layer substrate is grounded. A pattern is provided, a hole is opened in the input / output terminal portion, and a matching circuit is provided by leading to the next intermediate layer of the multilayer substrate. With such a structure, the ground electrode is provided between the input and the output as wide as possible, so that the coupling between the input and the output due to the radio wave can be prevented and high performance can be realized.

Embodiment 13 An embodiment of the third invention will be described below with reference to the drawings. In FIG. 14, 24 is a microwave integrated circuit, 27 is a chip component, 8 is a through hole, 5 is a metal wire for mutual coupling, 91 is an input electrode, 92 is an output electrode, 18 is a ground pattern, 28 is a ground electrode, and 29 is a ground electrode. Is a ground back surface, and 30 is a ceramic package.

Next, the operation will be described. Input electrode 91
Through the through hole 8a, the metal wire 5a is processed by the microwave integrated circuit 24a, and the chip component 27 is mounted on this substrate. The radio wave propagates through the metal wire 5b,
It is transmitted one step down through the through hole 8b. Next, the metal wire 5c similarly enters the microwave integrated circuit 24b, is processed, and is similarly transmitted from the metal wire 5d through the through hole 8d to the stage therebelow. The next microwave integrated circuit 24c enters through the metal wire 5e and is processed.
Radio waves are emitted from the output electrode 92 through the through hole 8f. Here, the earth back surface 29 becomes an earth electrode in the propagation of each microwave. The ground back surface 29c is connected to the ground electrode 28 through the through hole 8. The ground pattern 18 is also provided in each layer to enhance the shield effect. With such a configuration, the microwave integrated circuits are stacked vertically with a gap therebetween, and therefore the dimensions are shorter than in the case where they are arranged side by side.

Embodiment 14 In the above Embodiment 13, as shown in FIG. 15, the input electrode 91 or the output electrode 92 of the microwave integrated circuit is further drawn out to each layer on the outer periphery of the package, and between the electrodes. It is also possible to connect them by connecting them to each other with a metal wire, or, for example, bring another microwave integrated circuit 24b and input it to the input electrode 91b.
And the output electrode 92b can be separately connected. Therefore, the area can be reduced.

Fifteenth Embodiment In the thirteenth embodiment, as shown in FIG. 16, the surface of the substrate of the microwave integrated circuit 24 on which the chip component 27 is mounted is mounted on the base of the package, and the signal line is soldered or the like. I tried to attach it to the package. The ground pattern is the microwave integrated circuit 24 connected to the ground pattern of the package by the ground metal wire 5 as shown in FIG. Since the microwave integrated circuit is turned upside down in this manner, the connection can be omitted and the package layer can be omitted, so that the number of steps can be reduced.

[0038]

As described above, according to the first aspect of the invention, the piezoelectric substrate is fixed to the package side, so that it is possible to prevent short-circuiting between electrodes and adhesion of dust that causes a change in electrical characteristics. Can be improved. Moreover, since the electrodes of the piezoelectric substrate are directly attached to the package, the size can be reduced. Furthermore, since the part of the package is isolated between the input and output electrodes, it is possible to suppress radio waves flying in the air. Since the flat package is brought into close contact with the piezoelectric substrate, in addition to the above performance, the package can have a simple structure, so that the quality can be improved and the manufacturing process can be shortened.
Since the conductive adhesive for fixing the package is attached to the end side of the piezoelectric substrate, unnecessary sound waves can be absorbed and a high-performance one can be obtained. Since the conductive adhesive for fixing the package is attached to the entire peripheral surface of the piezoelectric substrate, unnecessary sound waves can be absorbed, and the cover is not required, so that the sealing property can be obtained. Since the non-conductive adhesive is used to fix the package to the entire peripheral surface of the piezoelectric substrate,
Can absorb unnecessary sound waves and eliminates the need for a cover.
A hermeticity can also be obtained. The quality is improved by separating the steps.

As described above, according to the second aspect of the present invention, since the input / output matching circuit is incorporated in the package, miniaturization can be realized, and the floating component is small, so that high performance can be obtained. Furthermore, since a ground electrode is provided between the input and output, coupling by radio waves between the input and output can be prevented, so high performance can be realized. Since the input / output matching circuit is also provided on the outer top surface of the package, adjustment is possible, and performance changes and high performance can be realized. . Further, according to the present invention, since the ground electrode is provided between the input and the output as wide as possible, it is possible to prevent the coupling between the input and the output due to the radio wave, so that high performance can be realized.

As described above, according to the third aspect of the invention, the microwave integrated circuits are stacked vertically with a gap therebetween, so that the dimensions are shorter than in the case where they are arranged side by side. According to the present invention, the input / output electrodes of the microwave integrated circuit at each stage can be taken out to the outside of the package and the electrodes can be connected to each other by a metal wire. It is also possible to connect the input electrode and the output electrode separately, which contributes to downsizing because the total area can be reduced. Microwave integrated circuit
Since it is turned inside out, the connection can be omitted and the package layer can be omitted, so the man-hours can be reduced.

[Brief description of drawings]

FIG. 1 is a transverse sectional view showing a surface acoustic wave device according to an embodiment of the first invention.

FIG. 2 is a cross-sectional view showing a surface acoustic wave device according to another embodiment of the first invention.

FIG. 3 is a cross-sectional view showing a surface acoustic wave device according to another embodiment of the first invention.

FIG. 4 is a cross-sectional view showing a surface acoustic wave device according to another embodiment of the first invention.

FIG. 5 is a transverse sectional view showing a surface acoustic wave device according to another embodiment of the first invention.

FIG. 6 is a cross-sectional view showing a surface acoustic wave device according to another embodiment of the first invention.

FIG. 7 is a top view showing a surface acoustic wave device according to another embodiment of the first invention.

FIG. 8 is a cross-sectional view showing a surface acoustic wave device according to another embodiment of the first invention.

FIG. 9 is a transverse sectional view showing a surface acoustic wave circuit device according to an embodiment of the second invention.

FIG. 10 is a configuration diagram showing a surface acoustic wave circuit device according to another embodiment of the second invention.

FIG. 11 is a configuration diagram showing a surface acoustic wave circuit device according to another embodiment of the second invention.

FIG. 12 is a configuration diagram showing a surface acoustic wave circuit device according to another embodiment of the second invention.

FIG. 13 is a configuration diagram showing a surface acoustic wave circuit device according to another embodiment of the second invention.

FIG. 14 is a transverse sectional view showing a microwave integrated circuit device according to an embodiment of the third invention.

FIG. 15 is a cross-sectional view showing a microwave integrated circuit device according to another embodiment of the third invention.

FIG. 16 is a cross-sectional view showing a microwave integrated circuit device according to another embodiment of the third invention.

FIG. 17 is a top view showing a microwave integrated circuit device according to another embodiment of the third invention.

FIG. 18 is a transverse sectional view showing a conventional surface acoustic wave device corresponding to the first invention.

FIG. 19 is a cross-sectional view showing a conventional surface acoustic wave device corresponding to the second invention.

FIG. 20 is a configuration diagram showing a conventional microwave integrated circuit corresponding to the third invention.

[Explanation of symbols]

 1 Piezoelectric Substrate 2 Cover 3 Package 4 Input / Output Lead Wire 5 Metal Wire 6 Non-Conductive Adhesive 7 Conductive Adhesive 8 Through Hole 9 Input / Output Electrode 10 Input / Output Comb Electrode 11 Metal Post 12 Package Convex 13 Non-Conductive Adhesive 14 Input / output electrode lead-out pattern 15 Substrate 16 Input / output matching circuit 17 Chip part 18 Earth pattern 19 Metal link 20 Case 21 Input connector 22 Output connector 23 Carrier 24 Microwave integrated circuit 25 Bonding wire 26 Spring 27 Chip part 28 Ground Electrode 29 Ground back surface 30 Ceramic package 91 Input electrode 92 Output electrode

Claims (16)

[Claims] 1. A piezoelectric substrate having at least one pair of input / output electrodes and input / output comb-teeth electrodes formed on one main surface, and an external electrode at a position corresponding to at least the input / output electrodes of the piezoelectric substrate on one main surface. A surface acoustic wave device comprising: a package provided with a step portion having a step, and a main surface on which the step portion is provided faces a main surface of the piezoelectric substrate on which input / output electrodes and the like are formed. 2. The surface acoustic wave device according to claim 1, wherein the step portion is a part of the package. 3. The surface acoustic wave device according to claim 1, wherein the step portion is an input / output electrode having a large film thickness. 4. The surface acoustic wave device according to claim 1, wherein the step portion is a post made of a conductor. 5. A step portion having a height lower than that of the step portion is provided in the package at a position facing the surface acoustic wave transmitting portion between the input comb-teeth electrode and the output comb-teeth electrode. The surface acoustic wave device according to claim 1, 2, 3, or 4. 6. The input / output electrode of the piezoelectric substrate and the input / output electrode of the package are bonded with an adhesive, and the adhesive is also applied to an end portion of the piezoelectric substrate. The surface acoustic wave device according to items 1, 2, 3, 4, and 5. 7. The stepped portion is provided over the four sides of the piezoelectric substrate, and the piezoelectric substrate and the package are adhered by an adhesive agent.
The surface acoustic wave device according to 5, 6. 8. A piezoelectric substrate having at least one pair of input / output electrodes and input / output comb-teeth electrodes formed on one main surface, a multilayer substrate on which the piezoelectric substrate is mounted, and at least one layer between the multilayer substrates. Surface acoustic wave device having a matching circuit for input and output. 9. The surface acoustic wave device according to claim 8, wherein a ground pattern is provided between the input and the output of the multilayer substrate. 10. A cover provided on the multilayer substrate to seal the piezoelectric substrate, wherein the input / output matching circuit is provided on the uppermost surface of the multilayer substrate and outside the cover. The surface acoustic wave device according to claim 8, which is characterized in that. 11. A piezoelectric substrate having at least one pair of input / output electrodes and input / output comb-teeth electrodes formed on one main surface, a multilayer substrate on which the piezoelectric substrate is mounted, and at least one layer between the multilayer substrates. An input / output matching circuit provided on the uppermost surface of the multi-layer substrate and outside the cover via the provided wiring, and connected to the matching circuit, and provided on the uppermost surface of the multi-layer substrate and outside the cover. A surface acoustic wave device having external input / output electrodes. 12. A piezoelectric substrate having at least one pair of input / output electrodes and input / output comb-teeth electrodes formed on one main surface, a multilayer substrate having the piezoelectric substrate mounted thereon and comprising at least three layers, and the multilayer substrate. A surface acoustic wave device comprising: a ground pattern provided between the first substrate and the second substrate; and an input / output matching circuit provided between the second substrate and the third substrate. 13. A microwave integrated circuit device having a microwave integrated circuit board having a chip part and a signal electrode thereof on one main surface, and an earth pattern on the back surface thereof, and a package on which the board is mounted. , The inside of the package is formed in a staircase shape, a wiring pattern is provided on each staircase, and the plurality of substrates are connected to the wiring pattern and the signal electrode or the ground pattern on the staircase, respectively. A microwave integrated circuit device characterized by being arranged. 14. The microwave integrated circuit device according to claim 13, wherein the electrical connection of the wiring pattern provided on each stair is through a through hole in the package. 15. The microwave integrated circuit device according to claim 14, wherein the outside of the package is stepped symmetrically with the inside, and the wiring pattern provided on each step is led to the outside. 16. The microwave integrated circuit device according to claim 13, wherein the chip component of the substrate and the surface of the substrate on which the signal electrode is provided are arranged so as to face the package.