JPH067544B2 - Sample positioning mechanism for double-sided aligner - Google Patents

Sample positioning mechanism for double-sided aligner

Info

Publication number
JPH067544B2
JPH067544B2 JP2099100A JP9910090A JPH067544B2 JP H067544 B2 JPH067544 B2 JP H067544B2 JP 2099100 A JP2099100 A JP 2099100A JP 9910090 A JP9910090 A JP 9910090A JP H067544 B2 JPH067544 B2 JP H067544B2
Authority
JP
Japan
Prior art keywords
sample
axis
positioning mechanism
double
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2099100A
Other languages
Japanese (ja)
Other versions
JPH03296210A (en
Inventor
泰顕 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SOKUEISHA KK
Original Assignee
SOKUEISHA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SOKUEISHA KK filed Critical SOKUEISHA KK
Priority to JP2099100A priority Critical patent/JPH067544B2/en
Publication of JPH03296210A publication Critical patent/JPH03296210A/en
Publication of JPH067544B2 publication Critical patent/JPH067544B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00Microscopes
    • G02B21/24Base structure
    • G02B21/26Stages; Adjusting means therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は試料の両面に対し同時にアライメント、露光等
を行なうための位置決め機構に関し、例えば半導体素
子、パワーIC、水晶振動子等の製造プロセスで使用す
るのに適したものである。
TECHNICAL FIELD The present invention relates to a positioning mechanism for simultaneously performing alignment and exposure on both sides of a sample, for example, in a manufacturing process of semiconductor elements, power ICs, crystal oscillators, etc. It is suitable for use.

(従来の技術) 半導体製造プロセスに於るフォトリソグラフィ工程で
は、互いに直行するX、Y、Zの各軸方向及びZ軸の傾
斜角に関するθ方向へ夫々調節可能に設けられたステー
ジが用いられ、その上に置かれる試料台にシリコン単結
晶板等よりなる試料が吸着手段によって固定され、ステ
ージを前記各方向へ微動させて試料とマスクパターンと
のアライメントが行なわれる。
(Prior Art) In a photolithography process in a semiconductor manufacturing process, a stage provided so as to be adjustable respectively in X-axis, Y-axis and Z-axis directions orthogonal to each other and in a θ-direction with respect to a tilt angle of the Z-axis is used. A sample made of a silicon single crystal plate or the like is fixed to a sample table placed thereon by suction means, and the stage is finely moved in the respective directions to align the sample with the mask pattern.

試料は表裏両面が使用可能であるので、前記のフォトリ
ソグラフィ工程は1個の試料について2度繰返され、そ
のためレジスト膜塗布、アライメント、プリベイク、現
像その他の工程も夫々重複して行なわれる。
Since the sample can be used on both the front and back sides, the photolithography process is repeated twice for one sample, so that the resist film coating, alignment, pre-baking, development and other processes are also repeated.

(技術的課題) フォトリソグラフィ工程の簡素化を図る試みは従来も行
なわれており、精密なアライメントの必要ない1次露光
(アライメントマーク等を入れる工程)のみ両面同時露
光する方法は既に実施されている、しかしそれだけでは
抜本的な解決にならず、なお複雑な工程を繰返さなけれ
ばならない。
(Technical problem) Attempts to simplify the photolithography process have been made in the past, and a method of performing simultaneous double-sided exposure only for primary exposure (the step of inserting alignment marks etc.) that does not require precise alignment has already been implemented. However, that alone does not provide a drastic solution, and the complex process must be repeated.

他方一部の装置には、上下両面同時にアライメント、露
光が可能なものも存在した。その装置は試料を搬送する
搬送ハンドで上下マスク間に試料を挿入するときにアラ
イメントを行なう機構を有し、試料は下マスクとも上マ
スクとも接触することなくステージを兼ねるハンドに保
持されている。そのためアライメント後にハンドの開放
や、マスクの密着が行なわれる際に試料がずれてしまう
おそれが常に存在する。これはアライメントの前後を通
じて試料を固定し続ける手段を持たない以上、避けるこ
とができない欠点である。またこの装置ではハンドステ
ージが大型のため、上下マスクの移動量も大きくなり、
位置ずれが生じ易い問題もある。
On the other hand, some devices were capable of aligning and exposing both upper and lower surfaces simultaneously. The apparatus has a mechanism for performing alignment when the sample is inserted between the upper and lower masks by a transfer hand that transfers the sample, and the sample is held by the hand that also serves as a stage without contacting the lower mask and the upper mask. Therefore, there is always a possibility that the sample will be displaced when the hand is opened or the mask is brought into close contact after alignment. This is an unavoidable drawback as long as there is no means to keep the sample fixed before and after alignment. Also, since the hand stage is large in this device, the amount of movement of the upper and lower masks also increases,
There is also a problem that the positional deviation easily occurs.

本発明は前記のような欠点乃至問題点を解決するもので
その目的は、上下マスクパターン間に於て試料を一対の
支え爪によって挾持、固定することができ、それにより
表裏両面に対するアライメント、露光が同時に行なえ、
かつまたそれらに関連するレジスト膜塗布、プリベー
グ、現像その他の工程も重複が避けられ製造サイクルの
スピードアップ乃至製造コストの低減に寄与する両面ア
ライナ用試料位置決め機構を提供することにある。
The present invention solves the above-mentioned drawbacks and problems, and an object thereof is to be able to hold and fix a sample between upper and lower mask patterns by a pair of supporting claws. Can be done at the same time,
Further, it is another object of the present invention to provide a sample positioning mechanism for a double-sided aligner, which avoids duplication of resist film coating, prebag, development, and other related processes, and contributes to speeding up of the manufacturing cycle and reduction of manufacturing cost.

(技術的手段) 前記目的は、上下に貫通した窓孔1を有し、その上位に
試料Sを置く下マスク2が配置されたステージ本体3
と、X方向又はこれと直交するY方向に沿って窓孔を横
断するように対向的に配置され、夫々の先端により下マ
スク上の試料の縁に当接して試料を支える断面曲状の端
部4、5を有する一対の試料支え爪6、7と、ステージ
本体に設けられ、試料支え爪を取付けた取付部材8、9
を前記X、Y方向へ移動させかつXY平面上で回動させ
るための調節手段とを備えた構成によって達することが
できる。
(Technical Means) The purpose is to provide a stage body 3 having a window hole 1 penetrating vertically and having a lower mask 2 on which a sample S for placing the sample S is arranged.
And an end having a curved cross-section that is arranged so as to cross the window along the X direction or the Y direction orthogonal to the X direction, and that supports the sample by abutting the edges of the sample on the lower mask by their respective tips. A pair of sample supporting claws 6 and 7 having parts 4 and 5, and mounting members 8 and 9 provided on the stage body and mounted with the sample supporting claws.
Can be reached by means of an adjusting means for moving in the X and Y directions and rotating on the XY plane.

(実施例) 以下図面を参照して説明する。本発明に係る両面アライ
ナ用の試料位置決め機構は第1図に例示されており、該
機構は半導体素子の製造に関するもので、後述する半導
体素子製造装置の中心部分に設定された露光部に組込ま
れる。
(Example) Hereinafter, description will be given with reference to the drawings. A sample positioning mechanism for a double-sided aligner according to the present invention is illustrated in FIG. 1, which is related to the manufacture of a semiconductor device, and is incorporated in an exposure unit set in a central portion of a semiconductor device manufacturing apparatus described later. .

ステージ本体3は、X、Y、Zの各軸方向及びZ軸の傾
斜に関するθ方向への調節のために微動可能な構成であ
り、θ方向への調節のための手段として例えば球面座部
11A或いは可撓支持板11B等により支持されている。本
体中心部には、それを上下に貫通した窓孔1が形成さ
れ、本体上側の窓孔周辺部は、試料Sを置く下マスク2
の載置面12になっている。13は窓孔1を囲むように載置
面12に設けられた周溝で、本体内吸引路14、コネクタ15
を経て吸引装置へ通じる。161、162、163は下マスク2
の位置決めピンを示す。なお下マスク2は透明で両面の
精度が良く、一面に罫線その他が記入されたもの或いは
無地のもので、従来と同様ガラス製品が使用できる。
The stage body 3 is configured to be finely movable in the θ direction with respect to the X, Y, and Z axis directions and the inclination of the Z axis, and as a means for the adjustment in the θ direction, for example, a spherical seat portion.
It is supported by 11A or a flexible support plate 11B. A window hole 1 is formed in the center of the main body so as to pass through it vertically, and a peripheral portion of the window on the upper side of the main body has a lower mask 2 on which a sample S is placed.
It is the mounting surface 12 of. Reference numeral 13 is a circumferential groove provided on the mounting surface 12 so as to surround the window hole 1, and includes a suction passage 14 in the main body and a connector 15
Through to the suction device. 16 1 , 16 2 and 16 3 are lower masks 2
Shows the positioning pin of. The lower mask 2 is transparent and has good accuracy on both sides, and has a ruled line or the like on one side or is plain, and glass products can be used as in the conventional case.

ウエハ即ち試料Sは、前記下マスク上に置かれ、それに
対して一対の試料支え爪6、7が左右から試料Sの縁に
当接して挾持により固定する(第8図〜第10図参照)。
爪6、7自体は試料Sの厚味より薄い材厚のばね性を有
する素材により形成され、その先端はZ軸方向へ彎曲状
乃至折曲状に形成した曲状断面の端部4、5となってい
る。この曲状端部4、5の成形により外形上爪先端は厚
さが試料の厚さを越えることもあるが、上マスクパター
ンにより加圧されると試料の厚さまで容易に扁平化す
る。曲状端部4、5の形態は第4図(a)、(b)、(c)に例示
されている。同図(a)は上に開いた円弧からなる曲状、
同図(b)は上向き円弧の左右に下向き円弧がつながった
波形曲状、同図(c)はVの字が3個連続した鋸歯形折曲
状の端部である。このような爪6、7はステンレス、ば
ね鋼、りん青銅等により形成することができる。171、17
2…は各爪に設けた小孔で、3インチ、2インチ等ウエ
ハのサイズに応じて取付装置を変えるために用意され、
取付部材8、9に止め具18、19により夫々止着される。
The wafer, that is, the sample S is placed on the lower mask, and a pair of sample support claws 6 and 7 are brought into contact with the edges of the sample S from the left and right to fix the wafer S by clamping (see FIGS. 8 to 10). .
The claws 6 and 7 themselves are formed of a material having a spring property having a material thickness smaller than that of the sample S, and the tips thereof are curved sections or bent sections in the Z-axis direction. Has become. Although the thickness of the outer upper nail tip may exceed the thickness of the sample due to the formation of the curved end portions 4 and 5, when pressed by the upper mask pattern, it is easily flattened to the thickness of the sample. The shapes of the curved ends 4 and 5 are illustrated in FIGS. 4 (a), (b) and (c). The figure (a) is a curved shape consisting of an arc opened upwards,
The figure (b) shows a wavy curve in which a downward arc is connected to the left and right of an upward arc, and the figure (c) shows a sawtooth-shaped bent end in which three V-shapes are continuous. Such pawls 6 and 7 can be formed of stainless steel, spring steel, phosphor bronze or the like. 17 1 , 17
2 ... is a small hole provided in each claw, such as 3 inches, 2 inches, etc., prepared for changing the mounting device according to the size of the wafer,
It is fixed to the mounting members 8 and 9 by means of stoppers 18 and 19, respectively.

取付部材8、9は試料Sを左右から挾む爪基端を止着す
る部材であるので、試料載置面12の左右に配置され、こ
れを設けたステージ本体3の外周の部分20は各部材8、
9の厚さ程度低い段状になっている。操作部側から見て
左に位置する第1の支え爪6を止着した第1の取付部材
8はY軸方向に延びており、その操作部側端部から載置
面12を囲むようにX方向へ延びたアングル部材21を一体
に有する鉤型に形成されている。該取付部材8は、その
外側(左側)に配置されたアングル状外枠22のY軸方向
の部分に、X軸方向へは外枠22と一体に移動可能であ
り、Y軸方向へは可撓板23、24の撓みにより第1取付部
材8のみ独立して移動可能なように、X軸方向の可撓板
23、24を介して取付けられている。
Since the mounting members 8 and 9 are members that fix the base ends of the claws that sandwich the sample S from the left and right, they are arranged on the left and right of the sample mounting surface 12, and the outer peripheral portion 20 of the stage body 3 in which the sample mounting surface 12 is provided is Member 8,
It has a step shape with a thickness of about 9 lower. The first mounting member 8 to which the first supporting claw 6 located on the left side when viewed from the operation portion side is fixed extends in the Y-axis direction, and the mounting surface 12 is surrounded from the operation portion side end portion. It is formed in a hook shape integrally having an angle member 21 extending in the X direction. The mounting member 8 can be moved integrally with the outer frame 22 in the X-axis direction to the portion in the Y-axis direction of the angled outer frame 22 arranged on the outer side (left side) thereof, and can be moved in the Y-axis direction. A flexible plate in the X-axis direction so that only the first mounting member 8 can be independently moved by the bending of the flexible plates 23 and 24.
It is attached via 23 and 24.

25は第1取付部材8をY軸方向へ押圧するY操作軸で、
本体3の操作部側端辺に設けられた取付台26と螺合する
ねじを持つ先端部25aを有している。27は戻しばねで、
第1取付部材8をY方向操作部側へ加圧するように該部
材8と外枠22との間に設けられている。
25 is a Y operation shaft that presses the first mounting member 8 in the Y axis direction,
The main body 3 has a tip portion 25a having a screw which is screwed with a mounting base 26 provided on the side of the operation portion side. 27 is a return spring,
It is provided between the first mounting member 8 and the outer frame 22 so as to pressurize the first mounting member 8 toward the Y-direction operating portion.

外枠22の操作部側端部には、該枠22と第1取付部材8と
をX軸方向へ移動させるリンク28が取付けられており、
該リンク28はX軸方向へ延びているので、前記Y操作軸
25と同様にX操作軸30をY軸方向へ並び操作し易くする
ため、該軸30の先端の進退動作をX軸方向の動きに変換
するクランク29に連絡している。29aはクランク支軸、
30aは本体3の操作部側端辺に設けられた取付台31と螺
合するねじを持つ先端部を示す。外枠22は載置面12の向
う側でX軸方向で延びた外アングル32を一体に有し、該
アングルの左右両端部に設けられた、Y軸方向の可撓板
33、34を介して本体3に取付けられている。35は戻しば
ねで、該アングル32をX方向反操作側へ加圧するように
外アングル32と本体との間に設けられている。
A link 28 for moving the frame 22 and the first mounting member 8 in the X-axis direction is attached to the end of the outer frame 22 on the side of the operation portion,
Since the link 28 extends in the X-axis direction, the Y operation shaft
Similar to 25, the X operation shaft 30 is arranged in the Y axis direction so as to facilitate the operation, the crank 29 is connected to convert the forward / backward movement of the tip of the shaft 30 into the movement in the X axis direction. 29a is a crank support shaft,
Reference numeral 30a denotes a tip end portion having a screw to be screwed with the mounting base 31 provided on the end side of the main body 3 on the operation portion side. The outer frame 22 integrally has an outer angle 32 extending in the X-axis direction on the side opposite to the mounting surface 12, and is provided on both left and right ends of the angle and is a flexible plate in the Y-axis direction.
It is attached to the main body 3 via 33 and 34. Reference numeral 35 is a return spring, which is provided between the outer angle 32 and the main body so as to press the angle 32 to the opposite side in the X direction.

X軸方向の2部材即ちアングル部材21と外アングル32と
は夫々の端部に於て第1取付部材8と平行な第2取付部
材8に連結されている。該部材9には前述の支え爪6、
7の他方即ち第2の爪7が取付けられているが、第2取
付部材9はY軸方向へ移動可能なように同方向の長孔3
6、37をもって、アングル部材21と外アングル32にリン
クされている。38、39は各長孔36、37を通してアングル
部材21、外アングル32に止着された連結軸であり、該軸
38、39と長孔36、37とはX軸方向へは遊びが無くされ、
かつまたアングル部材21の方向へ第2取付部材9がばね
43によりY方向操作部側へ付勢されている。φ操作軸40
は、その第2取付部材9をY軸方向へ前記戻しばね43に
抗して押圧するために設けられ、長孔36、37により第2
取付部材9の動きは第1の爪6の端部4を中心に試料を
φ方向へ回動させる。φ操作軸40は第1取付部材8のア
ングル部材21に設けられた取付部41と螺合し、軸先端部
40aは第2取付部材9に設けた受け部42に当接する。44
は押し板で、前記受け部42を介して第2取付部材9をX
方向へ加圧するよう、アングル部材21に止着されてい
る。
The two members in the X-axis direction, that is, the angle member 21 and the outer angle 32, are connected to the second mounting member 8 parallel to the first mounting member 8 at their ends. The member 9 has the above-mentioned supporting claws 6,
The other of 7, i.e., the second claw 7, is attached, but the second attachment member 9 has a long hole 3 in the same direction so as to be movable in the Y-axis direction.
6 and 37 are linked to the angle member 21 and the outer angle 32. Reference numerals 38 and 39 denote connecting shafts fixed to the angle member 21 and the outer angle 32 through the long holes 36 and 37, respectively.
There is no play in the X-axis direction between 38 and 39 and long holes 36 and 37,
Moreover, the second mounting member 9 is springed toward the angle member 21.
It is urged toward the operation portion side in the Y direction by 43. φ operation axis 40
Is provided to press the second mounting member 9 in the Y-axis direction against the return spring 43.
The movement of the mounting member 9 rotates the sample in the φ direction about the end 4 of the first claw 6. The φ operation shaft 40 is screwed with a mounting portion 41 provided on the angle member 21 of the first mounting member 8 to form a shaft tip portion.
40a abuts on a receiving portion 42 provided on the second mounting member 9. 44
Is a push plate, and the second mounting member 9
It is fixed to the angle member 21 so as to apply pressure in the direction.

前記構成の試料位置決め機構10が組込まれる半導体製造
装置50は第5図乃至第7図に示されている。各図中、51
は装置本体上面の作業部、52はその中心の露光部、53は
作業部右手に配置された試料供給側エレベータ、54はエ
レベータ53と露光部52との間に配置されたオリエンテー
ションフラット部の検出、方向出し、中心出し機構を有
するプリアライメント部、55はエレベータ53からプリア
ライメント部54へ試料を送るプッシャ等の搬入手段、56
はプリアライメント部54から下マスク2上へ試料を送る
メカニカルハンド等の搬送手段、57は搬出側の同様な搬
送手段、58はプッシャ等の搬出手段、59は収納側エレベ
ータを示す。60は露光部52上のアライメント用顕微鏡、
61はステージ上位の上マスクホルダ、62は同下位のマス
クホルダ、63は上ランプハウス、64は下ランプハウス、
65は制御装置、66、67はランプ電源制御部を示す。また
第3図中、70は上下可動機構に設けられた取付板、71は
回転ガイドのクロスローラベアリング、72は下露光筒、
73は上部下マスク、74はY軸用ボールローラガイド、75
はY軸用微動摘み、76はX軸用微動台、77はX軸用微動
摘み、78は下部基板で、上、中、下部下マスクから成る
XY下マスクが載置されている。
A semiconductor manufacturing apparatus 50 in which the sample positioning mechanism 10 having the above structure is incorporated is shown in FIGS. 51 in each figure
Is a working unit on the upper surface of the apparatus main body, 52 is an exposure unit at the center of the working unit, 53 is a sample supply side elevator arranged on the right side of the working unit, 54 is detection of an orientation flat unit arranged between the elevator 53 and the exposure unit 52 , A pre-alignment unit having a direction and centering mechanism, 55 is a loading means such as a pusher for sending the sample from the elevator 53 to the pre-alignment unit 54, 56
Is a transporting means such as a mechanical hand for sending the sample from the pre-alignment unit 54 to the lower mask 2, 57 is a similar transporting means on the unloading side, 58 is a unloading means such as a pusher, and 59 is a storage side elevator. 60 is an alignment microscope on the exposure unit 52,
61 is an upper mask holder on the upper stage, 62 is a lower mask holder on the same stage, 63 is an upper lamp house, 64 is a lower lamp house,
Reference numeral 65 is a control device, and 66 and 67 are lamp power supply control units. Further, in FIG. 3, 70 is a mounting plate provided on the vertically movable mechanism, 71 is a cross roller bearing of a rotation guide, 72 is a lower exposure cylinder,
73 is an upper lower mask, 74 is a Y-axis ball roller guide, 75
Is a fine movement knob for the Y axis, 76 is a fine movement table for the X axis, 77 is a fine movement knob for the X axis, and 78 is a lower substrate, on which an XY lower mask consisting of upper, middle and lower lower masks is placed.

(作用) 以上の如く構成された本発明の機構により試料両面に対
する同時アライメントを行なうことができる。試料は搬
入側に於るプリアライメント部54によりプリアライメン
トがなされたのち、搬入手段55により中央下マスク2の
上面に搬送載置される。その際試料Sを第1、第2の支
え爪6、7で支えるため第2の取付部材9は押し板44に
抗して外方(第1図中右方)へ若干開くことができ、そ
れにより爪先端の曲状端部4、5が試料の縁に当ってこ
れを左右から挾持固定することができる。
(Operation) The mechanism of the present invention configured as described above enables simultaneous alignment on both surfaces of the sample. The sample is pre-aligned by the pre-alignment unit 54 on the carry-in side, and then carried on the upper surface of the lower central mask 2 by the carry-in means 55. At this time, since the sample S is supported by the first and second supporting claws 6 and 7, the second mounting member 9 can be slightly opened outward (to the right in FIG. 1) against the push plate 44, As a result, the curved end portions 4 and 5 of the tip of the nail hit the edge of the sample and can be held and fixed from the left and right.

この状態に於て、試料Sに向けて上マスクホルダ61を上
マスク2′が試料に接するか接しない程度まで下降させ
る。下マスク2を載置した下マスクホルダ62は下マスク
2の下面所定位置にあり、上、下マスクホルダ61、62は
予めアライメントされた位置に保持されているものとす
る。ここで顕微鏡60により観察を行ない、上下のマスク
2′、2に形成してあるマスクパターン83、84と試料S
のアライメントマーク85、86とを合致させる(第2図参
照)。その際試料Sを微動させるが、X軸及びY軸方向
の移動では、X操作軸31、Y操作軸25を操作すると一対
の支え爪6、7が一体的にX軸方向、Y軸方向へ移動す
る。第1支え爪端部4を中心とした試料のφ方向への回
動が必要ならばφ操作軸を操作する(第8図)。勿論、
第1支え爪6も第2支え爪7と同様にY軸逆方向へ移動
可能とすることも可能である(第9図)。また四角い形
状の試料に対しては、支え爪6、7の曲状端部4、5を
平面的に円弧状としておくことによりφ方向への回動が
より容易になる(第8図〜第10図参照)。
In this state, the upper mask holder 61 is lowered toward the sample S until the upper mask 2'contacts or does not contact the sample. It is assumed that the lower mask holder 62 on which the lower mask 2 is placed is at a predetermined position on the lower surface of the lower mask 2, and the upper and lower mask holders 61 and 62 are held at pre-aligned positions. Observation with a microscope 60 is performed here, and the mask patterns 83 and 84 formed on the upper and lower masks 2'and the sample S
Align the alignment marks 85 and 86 of (see FIG. 2). At that time, the sample S is slightly moved, but in the movements in the X-axis and Y-axis directions, when the X operation shaft 31 and the Y operation shaft 25 are operated, the pair of supporting claws 6 and 7 are integrally moved in the X axis direction and the Y axis direction. Moving. If it is necessary to rotate the sample about the first supporting claw end 4 in the φ direction, the φ operation shaft is operated (FIG. 8). Of course,
Similarly to the second supporting claw 7, the first supporting claw 6 can be movable in the Y-axis reverse direction (FIG. 9). For square samples, the curved ends 4 and 5 of the support claws 6 and 7 are planarly arcuate to facilitate rotation in the φ direction (see FIGS. 8 to 8). (See Figure 10).

アライメントが終了すると、上下マスク2′、2を試料
Sに密着した状態で露光が行なわれる(平行出しは予め
完了しているものとする)。その後支え爪6、7を試料
Sから離す。次いで上マスクホルダ61が上昇し搬出が搬
出手段57によって行なわれ、搬出手段58が中継して収納
側エレベータ59のキャリヤに試料が収められる。
When the alignment is completed, exposure is performed with the upper and lower masks 2 ', 2 in close contact with the sample S (parallel alignment is assumed to be completed in advance). After that, the supporting claws 6 and 7 are separated from the sample S. Next, the upper mask holder 61 rises and the carry-out means 57 carries out the carry-out, and the carry-out means 58 relays and the sample is stored in the carrier of the storage-side elevator 59.

(効果) 従って本発明によれば、上下マスクパターン間に於て試
料のアライメントを行なうに当り、一対の支え爪6、7
に固定させた状態で工程が進められるので、アライメン
ト、露光を通じて試料とマスクパターンの位置関係が固
定されているから、理想的な状態で両面アライメント、
露光等の工程を完了し、これらに関連するレジスト膜塗
布、プリベーク、現像その他の工程を両面について実施
することは容易なので、製造サイクルのスピードアップ
が実現し、製造コストの低減にも寄与するところ大であ
るなど実用上顕著な効果が発揮される。
(Effect) Therefore, according to the present invention, in aligning the sample between the upper and lower mask patterns, the pair of supporting claws 6 and 7 are used.
Since the process proceeds while it is fixed on the substrate, the positional relationship between the sample and the mask pattern is fixed through alignment and exposure.
Since it is easy to complete the steps such as exposure and perform related resist film coating, pre-baking, development and other steps on both sides, speeding up the manufacturing cycle is realized and it also contributes to reducing manufacturing costs. It has a significant effect in practice such as being large.

【図面の簡単な説明】[Brief description of drawings]

図面は本発明機構の実施例を示すもので、第1図は平面
図、第2図は要部を模式的に示す横断面図、第3図は露
光部組込状態の断面図、第4図(a)、(b)、(c)
は曲状端部3種の断面図、第5図は本発明機構が組込ま
れる半導体素子製造装置の正面図、第6図は側面図、第
7図は平面説明図、第8図、第9図、第10図は作用説明
図である。
The drawings show an embodiment of the mechanism of the present invention. FIG. 1 is a plan view, FIG. 2 is a cross-sectional view schematically showing a main portion, and FIG. Figures (a), (b), (c)
Are sectional views of three kinds of curved end portions, FIG. 5 is a front view of a semiconductor device manufacturing apparatus incorporating the mechanism of the present invention, FIG. 6 is a side view, FIG. 7 is an explanatory plan view, FIG. 8 and FIG. FIG. 10 and FIG. 10 are explanatory views of the operation.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】上下に貫通した窓孔1を有し、その上面に
試料Sを置く下マスク2が配置されたステージ本体3
と、X方向又はこれと直交するY方向に沿って窓孔を横
断するように対向的に配置され、夫々の先端により下マ
スク上の試料の縁に当接して試料を支える断面曲状の端
部4、5を有する一対の試料支え爪6、7と、ステージ
本体に設けられ、試料支え爪を取付けた取付部材8、9
を前記X、Y方向へ移動させかつXY平面上で回動させ
るための調節手段とを備えた両面アライナ用試料位置決
め機構。
1. A stage main body 3 having a window hole 1 penetrating vertically and having a lower mask 2 for placing a sample S on the upper surface thereof.
And an end having a curved cross-section that is arranged so as to cross the window along the X direction or the Y direction orthogonal to the X direction, and that supports the sample by abutting the edges of the sample on the lower mask by their respective tips. A pair of sample supporting claws 6 and 7 having parts 4 and 5, and mounting members 8 and 9 provided on the stage body and mounted with the sample supporting claws.
A sample positioning mechanism for a double-sided aligner, which comprises an adjusting means for moving the X-axis in the X and Y directions and rotating the X-axis in the XY plane.
【請求項2】試料支え爪を取付けた取付部材8、9は窓
孔1を挾んで左右両面にY方向に向けて配置されてお
り、第1の取付部材8と第2の取付部材9とは、各々独
立してY方向へ移動可能なように形成されており、また
窓孔1を挾んで前後両側にX方向に向けてアングル部材
21とアングル22とが配置されており、両アングル21、22
によって第1、第2の取付部材8、9がX方向へ一体に
移動可能に連結された構成の調節手段を有する請求項第
1項記載の両面アライナ用試料位置決め機構。
2. The mounting members 8 and 9 to which the sample supporting claws are mounted are arranged on both left and right sides of the window hole 1 in the Y direction, and the first mounting member 8 and the second mounting member 9 are provided. Are independently movable in the Y direction, and the angle member is sandwiched through the window hole 1 toward the front and rear sides in the X direction.
21 and angle 22 are arranged, both angles 21, 22
2. The sample positioning mechanism for a double-sided aligner according to claim 1, further comprising adjusting means configured such that the first and second mounting members 8 and 9 are integrally movably connected in the X direction.
【請求項3】第1、第2取付部材8、9を各々独立にY
方向へ操作するY操作軸25、Z軸回りに回動操作するφ
操作軸40、両部材8、9を一体的にX方向へ操作するX
操作軸30が本体操作部側に設けられた請求項第1項記載
の両面アライナ用試料位置決め機構。
3. The first and second mounting members 8 and 9 are independently Y-shaped.
Y operation axis 25 to be operated in the direction of rotation, φ to be operated around the Z axis
X that integrally operates the operation shaft 40 and both members 8 and 9 in the X direction
The sample positioning mechanism for a double-sided aligner according to claim 1, wherein the operation shaft 30 is provided on the operation side of the main body.
JP2099100A 1990-04-13 1990-04-13 Sample positioning mechanism for double-sided aligner Expired - Fee Related JPH067544B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2099100A JPH067544B2 (en) 1990-04-13 1990-04-13 Sample positioning mechanism for double-sided aligner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2099100A JPH067544B2 (en) 1990-04-13 1990-04-13 Sample positioning mechanism for double-sided aligner

Publications (2)

Publication Number Publication Date
JPH03296210A JPH03296210A (en) 1991-12-26
JPH067544B2 true JPH067544B2 (en) 1994-01-26

Family

ID=14238437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2099100A Expired - Fee Related JPH067544B2 (en) 1990-04-13 1990-04-13 Sample positioning mechanism for double-sided aligner

Country Status (1)

Country Link
JP (1) JPH067544B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100465793C (en) * 2005-03-18 2009-03-04 乐金显示有限公司 Proximity type exposure apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4922071B2 (en) * 2007-05-28 2012-04-25 株式会社オーク製作所 Exposure drawing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100465793C (en) * 2005-03-18 2009-03-04 乐金显示有限公司 Proximity type exposure apparatus

Also Published As

Publication number Publication date
JPH03296210A (en) 1991-12-26

Similar Documents

Publication Publication Date Title
US4116376A (en) Method of mounting integrated circuit chips on a substrate and apparatus for carrying out the method
US4407627A (en) Automatic wafer orienting apparatus
CN107017191A (en) Carrying device, transport method, exposure device and manufacturing method
JPH06198843A (en) Transfer device
JPS6299782A (en) Apparatus and method of matching thin film pattern by shadowmask
JP2649519B2 (en) Flat object transfer positioning device
US4764791A (en) Work alignment apparatus for double-sided exposure of a work
US6247640B1 (en) Conductive particle arranging device and conductive particle transferring method using the same
JPH0667134A (en) Assembling apparatus for liquid crystal cell
JP3943481B2 (en) Electronic component transport head and electronic component mounting apparatus
JPH05182891A (en) Positioning apparatus of substrate
JPH067544B2 (en) Sample positioning mechanism for double-sided aligner
CN102648518B (en) Substrate supporting, conveyance, exposure device, supporting member and manufacturing method
JP2807905B2 (en) Substrate chuck mechanism
JPH07122624A (en) Prealignment equipment for wafer
JPH0369103B2 (en)
JP2007311374A (en) Substrate holder, exposure apparatus and manufacturing method of device
JP2509134B2 (en) Method and apparatus for exposing printed wiring board
JP3146604B2 (en) Screen printing machine
JPH079925B2 (en) Board positioning device
JPH07125838A (en) Positioning table device
JP4017256B2 (en) Solder ball alignment mask
JPH1197327A (en) Mask attaching mechanism of aligner
JPH05182888A (en) Alignment mechanism of upper mask and lower mask in simultaneous aligner of both faces
JPH0541982B2 (en)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080126

Year of fee payment: 14

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090126

Year of fee payment: 15

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090126

Year of fee payment: 15

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100126

Year of fee payment: 16

LAPS Cancellation because of no payment of annual fees