JPH0675008A - Test jig for integrated circuit - Google Patents

Abstract

PURPOSE:To provide a test jig for obtaining correct test results without employing an IC socket accompanying inter-pin parasitic capacitance or inductance of lead having adverse effect on the test results while facilitating maintenance and operation. CONSTITUTION:The test jig for integrated circuit comprises a second board 5 formed with an electrode pattern 6 matching with pin configulation of an integrated circuit to be tested on the surface and a POGO pin contact pattern 7 conducting through the board with the electrode pattern 6 on the rear surface thereof, and a first board 1 mounting external components or circuits for operating the integrated circuit to be tested and having POGO pins 2 coming into contact with the POGO pin contact pattern 7 on the second board 5. The POGO pins 2 on the first board 1 are brought detachably into contact with the POGO pin contact pattern 7 on the second board 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test jig for testing an integrated circuit handling a high frequency linear signal.

[0002]

2. Description of the Related Art When testing an integrated circuit that handles a linear signal, a test jig including a board on which external components for operating the integrated circuit are mounted and a means for mounting the integrated circuit under test on the board. It is common to use ingredients. There are various external parts for integrated circuits. For example, capacitors that prevent oscillation of integrated circuits, capacitors and resistors that determine the time constant of filters, resistors for constant voltage circuits inside integrated circuits, oscillator oscillation frequencies. It is a capacitor that decides. In addition, the test jig is provided with a power supply circuit, an amplifier, a buffer circuit, a relay, and the like as needed.

As shown in the perspective view of FIG. 3, however, the IC socket 13 is mounted on the substrate 11 on which the above-mentioned external parts 3 are mounted so that the integrated circuit under test can be easily attached and detached.
Is widely used.

[0004]

When the IC socket is used to facilitate the attachment and detachment of the integrated circuit under test as described above,
In an IC socket, a parasitic distributed capacitance of several pF usually exists between pins. In addition, the inductance component due to the lead and the pattern length is also parasitic. Therefore, due to the capacitance and the inductance, in the test of the high-frequency integrated circuit by the conventional test jig using the IC socket, the electrical characteristics are greatly affected, and it is difficult to obtain a correct test result. .

Therefore, a test jig as shown in the perspective view of FIG. 4 can be considered. In FIG. 4, an electrode pattern 6 is provided on a substrate 12 on which resistors, capacitors, buffers, external parts such as a power supply circuit, and necessary circuits 3 are mounted in accordance with the terminal arrangement of the integrated circuit under test, By directly contacting the terminals of the integrated circuit with the electrode pattern 6,
The adverse effects of IC socket parasitic capacitance and lead length inductance are eliminated.

However, in the test jig shown in FIG. 4, when the number of contact between the electrode pattern 6 on the substrate 12 and the terminal of the integrated circuit under test becomes large, for example, about tens of thousands of times, the electrode pattern 6 becomes worn. Alternatively, it may become soiled and eventually cause poor contact, making it impossible to carry out a normal test. However, in this case, the test jig must be replaced with a new one. However, there are variations in the external parts of the integrated circuit. For example, ± 1% for resistors and ± 20% for ceramic capacitors are accepted as allowable errors. Therefore, in order to create and replace a new test jig, not only the number of man-hours required to create the jig but also the variation in external parts can be corrected and the correlation between the new jig and the original jig can be corrected. The number of man-hours required for confirmation is required, and there is a drawback that the man-hours for the operation of the test jig increase enormously and the cost increases.

[0007]

In order to solve the above-mentioned problems, according to the present invention, the second substrate provided with the electrode pattern for directly contacting the terminals of the integrated circuit under test is replaced with the first substrate to which external parts are attached. Even if a contact failure occurs due to electrode pattern wear due to multiple tests, the test function can be restored by simply replacing the second board without the need for readjustment of external parts and circuits. ing.

[0008]

The present invention will be described below with reference to the drawings. FIG. 1A is an exploded perspective view of an embodiment of the present invention. In FIG. 1A, the first substrate 1 has a pogo pin 2 as a contact conductor and most of external parts such as a resistor and a capacitor, and a power supply circuit necessary for the test,
A buffer etc. 3 is attached. An electrode pattern 6 is formed on the surface of the second substrate 5 according to the terminal arrangement of the integrated circuit under test. The electrode pattern 6 penetrates through the substrate and is electrically connected to the pogo pin contact pattern 7 as shown in the back view of FIG.
In order to avoid the adverse effects of parasitic capacitance and lead length inductance, external components that need to be installed near the terminals of the integrated circuit under test, such as an oscillation prevention capacitor and a capacitor 4 that determines the oscillation frequency, are directly attached. Has been. Then, the pogo pin contact pattern 7 on the back surface of the second substrate, which is electrically connected to the front surface electrode pattern 6 of the second substrate 5, is brought into contact with the pogo pin 2 of the first substrate 1, and the screw hole 8 is formed.
The second substrate 5 is easily fixed to the first substrate 1 with a fixing screw or the like that has been passed through.

The terminals of the integrated circuit to be tested are brought into contact with the electrode patterns 6 on the second substrate to carry out a necessary test on the integrated circuit to be tested. If it happens, the second substrate is removed from the first substrate and replaced with a new second substrate. In this replacement, since the first substrate 1 is left as it is, the external parts are left as it is, and adjustment by replacement is unnecessary. In addition, since the parasitic capacitance and inductance of the new second substrate are originally small, even if there are changes to them, the test function is not significantly affected.

As shown in the perspective view of FIG. 2, it is possible to efficiently position the integrated circuit under test by providing a positioning guide 9 on the outside of the electrode pattern 6 on the second substrate 5 so as to match the outer shape of the integrated circuit under test. The test can be performed more smoothly, because it can be matched.

[0011]

As described above, in the test jig of the present invention, the electrode pattern is provided on the second substrate according to the terminal arrangement of the integrated circuit under test, and the electrode pattern is directly connected to the pogo pin contact pattern on the back surface of the substrate. Is provided with external parts and pogo pins as a contact conductor corresponding to the second board pogo pin contact pattern are provided on the first board as the pogo pin contact pattern on the second board. Since the connection is made by contact, in the test conducted by bringing the terminal of the integrated circuit under test into contact with the electrode pattern of the second substrate, even if a contact failure occurs by a large number of contacts, the test function is not adversely affected. In addition, since it can be quickly replaced with a new second board, in the case of poor contact, readjustment of external parts can be performed compared to replacing the board with external parts attached as it is. A principal, it is significant savings of jig operation and maintenance man-hours.

[Brief description of drawings]

FIG. 1A is an exploded perspective view of an embodiment of the present invention,
Diagram (B) is a rear view of the second substrate of diagram (A).

FIG. 2 is a perspective view of a second substrate according to the present invention having a positioning guide.

FIG. 3 is a perspective view of a conventional integrated circuit test jig with an IC socket.

FIG. 4 is a perspective view of an integrated circuit test jig including a substrate having an electrode pattern for directly contacting the terminals of the integrated circuit under test.

[Explanation of symbols]

 1 1st board 2 Pogo pin 3 External parts, circuit, etc. 4 Oscillation prevention capacitor 5 2nd board 6 Electrode pattern 7 Pogo pin contact pattern 8 Mounting screw hole 9 Positioning guide

Claims (1)

[Claims] 1. A second substrate on which an electrode pattern is formed according to the terminal arrangement of the integrated circuit under test, an external component for operating the integrated circuit under test, an accessory circuit known to the measurement, etc. are mounted. And a first substrate having a contact conductor provided in accordance with the electrode pattern arrangement of the second substrate, a contact pattern directly connected to the electrode pattern of the second substrate, and a contact conductor of the first substrate. A jig for integrated circuit testing, which comprises a means for removably contacting and connecting, and performing a test by directly contacting a terminal of an integrated circuit under test with an electrode pattern of the second substrate.