JPH0674338U - Thermal head - Google Patents

Thermal head

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Publication number
JPH0674338U
JPH0674338U JP6135291U JP6135291U JPH0674338U JP H0674338 U JPH0674338 U JP H0674338U JP 6135291 U JP6135291 U JP 6135291U JP 6135291 U JP6135291 U JP 6135291U JP H0674338 U JPH0674338 U JP H0674338U
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JP
Japan
Prior art keywords
heating
head
dots
dot
thermal head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6135291U
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Japanese (ja)
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JP2526911Y2 (en
Inventor
友一 川村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP1991061352U priority Critical patent/JP2526911Y2/en
Publication of JPH0674338U publication Critical patent/JPH0674338U/en
Application granted granted Critical
Publication of JP2526911Y2 publication Critical patent/JP2526911Y2/en
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Abstract

(57)【要約】 【目的】 ヘッド基板を複数枚当接接合しているサ−マ
ルヘッドにおいて、接合面近傍の発熱ドットで1ドット
内の左右で発熱温度に差がでないようにして、印字品質
を向上させる。 【構成】 接着剤等で接合されるヘッド基板2の接合
で、発熱ドット4の1ドット分を2分割するようにヘッ
ド基板2上に発熱ドット4を形成する。
(57) [Abstract] [Purpose] In a thermal head in which a plurality of head substrates are in contact with each other, the heat generation dots in the vicinity of the joint surface do not have a difference in heat generation temperature between left and right within one dot, and print quality is improved. Improve. [Structure] When the head substrates 2 are joined by an adhesive or the like, the heating dots 4 are formed on the head substrate 2 so that one dot of the heating dots 4 is divided into two.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、ワ−プロやファクシミリ−受信機等のプリンタとして用いられる感 熱式プリンタ、または熱転写式プリンタのサ−マルヘッドに係わり、特に、記録 領域を大とした大型のサ−マルヘッドの改良に関する。 The present invention relates to a thermal head for a thermal printer or a thermal transfer printer used as a printer for a word processor, a facsimile receiver, or the like, and more particularly to an improvement of a large thermal head having a large recording area. .

【0002】[0002]

【従来の技術】[Prior art]

従来の感熱プリンタ、または熱転写プリンタ等のサ−マルプリンタに搭載され ているサ−マルヘッドは、複数個の発熱抵抗体をヘッド基板上に直線的に整列配 置し、印画情報に従って前記発熱抵抗体を選択的に通電加熱させて、感熱記録紙 に発色記録させるか、あるいはインクリボンのインクを溶融して普通紙に転写記 録させるようになっている。 A thermal head installed in a thermal printer such as a conventional thermal printer or a thermal transfer printer has a plurality of heating resistors linearly arranged on a head substrate, and the heating resistors are printed according to print information. Is selectively energized and heated so that color recording is performed on the thermal recording paper, or the ink of the ink ribbon is melted and transferred and recorded on plain paper.

【0003】 感熱記録紙に用いられる一般的なサ−マルヘッド、図5に示すようにアルミニ ウム等の熱伝導性のよい材料を使った放熱板1上にアルミナ等のヘッド基板2が 取り付けられており、該ヘッド基板2の上には畜熱層として機能する、ガラスか らなるグレ−ズ層3が部分的に形成されており、このグレ−ズ層3は、その発熱 抵抗体形成予定領域に上面の断面が円弧状のものとして形成されている。このグ レ−ズ層3上には、Ta2N等からなる発熱抵抗体4が、蒸着、スパッタリング 等により被着され、この発熱抵抗体4をエッチングすることにより複数の発熱ド ット4Aが直線状に配置されるように形成されている。A general thermal head used for heat-sensitive recording paper, as shown in FIG. 5, a head substrate 2 made of alumina or the like is mounted on a heat dissipation plate 1 made of a material having good thermal conductivity such as aluminum. On the head substrate 2, a glaze layer 3 made of glass, which functions as a heat storage layer, is partially formed. This glaze layer 3 is a region where the heating resistor is to be formed. The cross section of the upper surface is formed in an arc shape. A heating resistor 4 made of Ta2N or the like is deposited on the glaze layer 3 by vapor deposition, sputtering, etc. By etching the heating resistor 4, a plurality of heating dots 4A are linearly formed. It is formed so that it may be arranged.

【0004】 従来から該発熱ドットは、例えば図6に示すように発熱抵抗体4の中央部に、 フォトリソグラフィ技術によるエッチング加工等によりスリット8を形成し、該 発熱ドットを更に細長い形状に2分割したドット4A,4Bを形成する物が多く あった。スリット8のない発熱ドットは、、ドット内の発熱分布がドットの中央 部分に集中し、長方形のドット形状を鮮明に印画しにくい問題がある。この対策 として図6に示すようなスリット8を設け発熱ドットを更に細長い形状に2分割 することによって、発熱抵抗体4内に集中加熱部を2か所に分散することができ 、長方形のドット形状を鮮明に印画できる効果がある。Conventionally, as shown in FIG. 6, for example, the heating dot has a slit 8 formed in the central portion of the heating resistor 4 by etching or the like by photolithography, and the heating dot is further divided into two elongated shapes. There were many things that formed the dots 4A and 4B. The heat-generating dots without the slits 8 have a problem that the heat generation distribution within the dots is concentrated in the central portion of the dots, making it difficult to clearly print a rectangular dot shape. As a countermeasure against this, by providing slits 8 as shown in FIG. 6 and dividing the heating dot into two more elongated shapes, the central heating portion can be dispersed in two positions within the heating resistor 4, and a rectangular dot shape can be obtained. There is an effect that can be printed clearly.

【0005】 該発熱ドット4A,4Bの上には、各発熱ドット4A,4Bに対して給電する ための電極5が積層されている。この電極5は、例えばAe,Cu,Au等から なるもので、蒸着、スパッタリングによって所望形状のパタ−ンに形成され、各 発熱ドット4A,4Bの両側に、一方が共通電極5Aとして、また他方が相互に ギャップ7をもって配設された複数本の個別電極5B,5B・・・としてそれぞ れ導出されている。Electrodes 5 for supplying power to the heating dots 4A and 4B are laminated on the heating dots 4A and 4B. The electrode 5 is made of, for example, Ae, Cu, Au or the like, and is formed into a pattern of a desired shape by vapor deposition or sputtering. One of the electrodes 5 is a common electrode 5A on either side of the heating dots 4A, 4B and the other is Are led out as a plurality of individual electrodes 5B, 5B ... Which are arranged with a gap 7 therebetween.

【0006】 そして、対を成す両電極5A,5B間に電圧を印加することによって発熱ドッ ト4A,4Bが発熱されるようになっている。前述した発熱抵抗体4及び電極5 上には、これらの発熱抵抗体4及び電極5を保護する保護層6が形成されている 。この保護層6は、発熱抵抗体4を酸化による劣化から保護する耐酸化層6Aと 、この耐酸化層6A上に積層され印字用紙等との接触による磨耗から発熱抵抗体 4及び電極5を保護する耐磨耗層6Bとから形成されている。The heating dots 4A and 4B are heated by applying a voltage between the pair of electrodes 5A and 5B. A protective layer 6 for protecting the heating resistor 4 and the electrode 5 is formed on the heating resistor 4 and the electrode 5. The protective layer 6 is an oxidation resistant layer 6A that protects the heating resistor 4 from deterioration caused by oxidation, and is laminated on the oxidation resistant layer 6A to protect the heating resistor 4 and the electrode 5 from abrasion caused by contact with printing paper or the like. And the abrasion resistant layer 6B.

【0007】 以上のような構成のサ−マルヘッドを使った最近のサ−マルプリンタに於いて は、高印字品質の要求が強くなっている。これに伴って、サ−マルヘッドの発熱 抵抗体4の密度が1インチ当り300ドット以上(300DPI)のものが主流 になりつつある。従って、300DPIのサ−マルヘッドでは、印画幅をA4サ イズに設定した場合の発熱抵抗体4のドット数は、2,560ドットになる。In recent thermal printers using the thermal head having the above-mentioned configuration, there is a strong demand for high printing quality. Along with this, the thermal head heating resistors 4 having a density of 300 dots per inch or more (300 DPI) are becoming mainstream. Therefore, in the thermal head of 300 DPI, the number of dots of the heating resistor 4 when the printing width is set to A4 size is 2,560 dots.

【0008】 このような膨大な数の発熱抵抗体4を同一条件で均一に形成することは大変難 しく無理がある。もし長尺のヘッド基板2を一体で形成したサ−マルヘッドにお いて、膨大な数の発熱抵抗体4のうち一カ所だけが不良の場合、その他の発熱ド ットは良品でも、ヘッド基板2を含めたサ−マルヘッド全体が不良になってしま う。そのためサ−マルヘッドの歩留まりが非常に悪くなる問題があった。It is very difficult and impossible to uniformly form such a huge number of heating resistors 4 under the same conditions. In a thermal head in which a long head substrate 2 is integrally formed, if only one of the enormous number of heat generating resistors 4 is defective, the other heat generating dots are good products, but the head substrate 2 The entire thermal head including will be defective. Therefore, there has been a problem that the yield of the thermal head becomes very poor.

【0009】 この対策として、このような長尺のサ−マルヘッドでは、図6に示したように 個別電極5B,5Bに狭持され、かつ発熱抵抗体四十四の間に設けられたギャッ プ7の中央部から切断し、この切断部分を短辺側の端面とするヘッド基板2の前 記端面同士を当接させ、接着剤等により接合面9を接合していた。このような図 6のようにヘッド基板2を接合することによって、長尺のサ−マルヘッドの歩留 まりを向上することができた。As a countermeasure against this, in such a long thermal head, as shown in FIG. 6, a gap between the heating resistors 44 is sandwiched between the individual electrodes 5B and 5B. 7 was cut from the central portion, and the above-mentioned end faces of the head substrate 2 having the cut portion as the end face on the short side were brought into contact with each other, and the joining face 9 was joined by an adhesive or the like. By bonding the head substrates 2 as shown in FIG. 6, the yield of a long thermal head could be improved.

【0010】[0010]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら接合面9に使用する一般的な接着剤は熱伝導性が悪く、複数個の ヘッド基板2を当接し接着剤等で接合した接合面9が断熱層になる。そのために 上記従来のようなギャップ7の中央部分から、ギャップ7を等分するように切断 分割されたヘッド基板2を当接接合すると、接合面9近傍の発熱ドット4A,4 Bにおいて、接合面9に近い発熱ドット4Aのほうが、接合面9から遠い発熱ド ット4Bより蓄熱が大きくなり、1ドットを形成する発熱ドット4A,4Bにお いて発熱温度に差が発生し印字品位が劣化する問題がある。 However, a general adhesive used for the joint surface 9 has poor thermal conductivity, and the joint surface 9 in which a plurality of head substrates 2 are brought into contact with each other and joined with an adhesive or the like serves as a heat insulating layer. Therefore, when the head substrate 2 which is cut and divided so as to divide the gap 7 into equal parts is abutted and joined from the central portion of the gap 7 as in the conventional case described above, in the heating dots 4A and 4B near the joining surface 9, the joining surface is formed. The heat-generating dots 4A closer to 9 store more heat than the heat-generating dots 4B far from the joint surface 9, and the heat-generating dots 4A and 4B forming one dot have a difference in heat-generating temperature, which deteriorates the print quality. There's a problem.

【0011】 例えば図7で説明すると、ヘッド基板の接合面9の近傍の発熱抵抗体4を印字 のために発熱した場合、接合面9に近い発熱ドット4Aの方が接合面9からと遠 い発熱ドット4Bより蓄熱が大きくなり、1ドットの中での発熱ドットの温度の 関係は4A>4Bになり、この状態で印字すると1ドットの中で印字の濃度ムラ が発生し、印字品質が著しく劣化すると共に、階調表現がしにくくなるという問 題が有していた。For example, referring to FIG. 7, when the heating resistor 4 near the bonding surface 9 of the head substrate generates heat for printing, the heating dot 4 A near the bonding surface 9 is farther from the bonding surface 9. The amount of heat stored is larger than that of the heating dot 4B, and the relationship of the temperature of the heating dot within one dot is 4A> 4B. When printing is performed in this state, uneven printing density occurs within one dot, and the printing quality is remarkably high. There was a problem that it deteriorates and it becomes difficult to express gradation.

【0012】 本考案は前述した従来技術の問題点を解決し、ヘッド基板2の接合面9近傍の 発熱ドットでも1ドット内での左右の発熱温度に差がなく、接合面9近傍のドッ トを印字しても印字の濃度のムラが発生しにくいサ−マルヘッドを提供すること を目的とする。The present invention solves the above-mentioned problems of the prior art, and even if a heating dot near the bonding surface 9 of the head substrate 2 has no difference in the heat generation temperature on the left and right within one dot, the dot near the bonding surface 9 is not affected. It is an object of the present invention to provide a thermal head in which unevenness in printing density is less likely to occur even when printing is performed.

【0013】[0013]

【課題を解決するための手段】 上記目的を達成するために本考案は、複数個のヘッド基板上にそれぞれ発熱ド ットを配列形成し、前記複数個のヘッド基板を発熱ヘッドの配列方向に当接接合 させて直線状に配置してなるサ−マルヘッドにおいて、前記ヘッド基板の当接接 合端で発熱ドットの1ドット分を2分割したことを特徴とするものである。Means for Solving the Problems In order to achieve the above object, the present invention forms heating dots in an array on a plurality of head substrates, and arranges the plurality of head substrates in an arrangement direction of the heating heads. In a thermal head which is abutted and joined and arranged linearly, one heating dot is divided into two at the abutting and joining end of the head substrate.

【0014】[0014]

【作用】[Action]

前述した構成からなる本考案によれば、ヘッド基板の当接接合端で発熱ドット の1ドット分を2等分したので、ヘッド基板の接合面に接着剤等を用いた場合に その断熱作用による左右半分ずつの発熱ドットの発熱時の温度差がなくなり、1 ドットの中での印字の濃度ムラが発生しなくなり良好な品質の印字を行うことが できる。 According to the present invention having the above-mentioned configuration, one dot of the heating dot is divided into two equal parts at the abutting joint end of the head substrate. Therefore, when an adhesive or the like is used on the joint surface of the head substrate, the heat insulation effect is obtained. There is no difference in temperature between the left and right halves of the heat-generating dots, and uneven printing density within one dot does not occur, and good quality printing can be performed.

【0015】[0015]

【実施例】【Example】

以下、本考案を図面に示す実施例により説明する。尚、前述した従来のものと 同一ないし相当する構成については、図面中に同一の符号を付して説明する。図 1から図3までは本考案に係るサ−マルヘッドの一実施例を示したものであり、 アルミニウム等の熱伝導性のよい材料を使った放熱板1の上にヘッド基板2が搭 載されており、該ヘッド基板2上には、従来技術で説明した発熱抵抗体4をエッ チング加工等によって、発熱ドットが直線状に配置されるように形成されている 。 Hereinafter, the present invention will be described with reference to the embodiments shown in the drawings. It should be noted that the same or corresponding configurations as those of the above-described conventional one will be described with the same reference numerals in the drawings. 1 to 3 show an embodiment of a thermal head according to the present invention, in which a head substrate 2 is mounted on a heat dissipation plate 1 made of a material having good thermal conductivity such as aluminum. The heating resistors 4 described in the prior art are formed on the head substrate 2 by etching or the like so that the heating dots are linearly arranged.

【0016】 発熱抵抗体4の一方には共通電極5Aが積層されており、また、発熱抵抗体4 の他方には、複数本の個別電極5B,5B・・・がギャップ7をもって積層され ている。これらの共通電極5A及び個別電極5B間において上部が露出してなる 発熱抵抗体の中央部分にスリット8により分割された複数の発熱ドット4A,4 Bが整列状に形成されている。尚、一般的なサ−マルヘッドにおいては、各発熱 抵抗体4,4・・・への通電制御を行うための駆動用半導体が個別電極5Bに接 続されてヘッド基板2上に搭載されているが、本実施例では図示を省略している 。A common electrode 5 A is laminated on one side of the heating resistor 4, and a plurality of individual electrodes 5 B, 5 B ... Are laminated on the other side of the heating resistor 4 with a gap 7. . A plurality of heating dots 4A, 4B divided by a slit 8 are formed in an array in the central portion of the heating resistor whose upper portion is exposed between the common electrode 5A and the individual electrode 5B. In a general thermal head, a driving semiconductor for controlling energization of the heating resistors 4, 4, ... Is mounted on the head substrate 2 while being connected to the individual electrode 5B. However, illustration is omitted in this embodiment.

【0017】 そして本考案においては、図3で示すようにヘッド基板2の発熱抵抗体4の中 央部分に形成された、スリット8の中心線上で切断した切断面をヘッド基板の短 辺側の端面にして、複数個のヘッド基板2の短辺側の端面同士を当接して接合面 9に接着剤等により固着し放熱板1上に搭載して、1本のサ−マルヘッドが形成 されている。放熱板1とヘッド基板2は接着剤等によって固定されている。In the present invention, as shown in FIG. 3, the cut surface formed on the central portion of the heating resistor 4 of the head substrate 2 and cut along the center line of the slit 8 is located on the short side of the head substrate. As the end faces, the end faces on the short side of the plurality of head substrates 2 are brought into contact with each other and fixed to the joint surface 9 with an adhesive or the like, and mounted on the heat dissipation plate 1 to form one thermal head. There is. The heat sink 1 and the head substrate 2 are fixed by an adhesive or the like.

【0018】 本考案の目的である歩留まり向上のためだけならば、ヘッド基板単品の長辺側 の長さを短くして1本の放熱板1上に多数の短尺のヘッド基板を接合すればよい が、多数の短尺ヘッド基板を接合すると、逆にサ−マルヘッドの組立性が悪くな ったり、接合面9の接合精度も悪くなり印字品質に影響が出るので、これらのこ とを考慮してヘッド基板の長さを決めるべきである。A4サイズの記録紙に印字 するためのサ−マルヘッドではヘッド基板を3〜4等分するのが適切である。For the purpose of improving the yield, which is the object of the present invention, the length of the long side of a single head substrate may be shortened and a large number of short head substrates may be bonded onto one heat sink 1. However, if many short head substrates are joined, conversely, the assemblability of the thermal head will deteriorate, and the joint accuracy of the joint surface 9 will also deteriorate, which will affect print quality. The length of the head substrate should be decided. In a thermal head for printing on A4 size recording paper, it is appropriate to divide the head substrate into 3 to 4 equal parts.

【0019】 次に、前述した構成からなる本実施例の作用について説明する。ヘッド基板2 の短辺側の端面同士を当接接合した接合面9は、接着剤層または空気層になって いるので絶縁層になっている。そのため共通電極5A1と5A2、個別電極5B 1と5B2は絶縁されているため、それぞれ別々に同量の電圧を印加することに より発熱ドット4A′,4B′が図4のように同じ温度で発熱する。但し接合面 9に隣接した発熱ドット4A′,4B′は、接合面9から遠い他の発熱ドット4 A,4Bよりも発熱温度は高くなる。Next, the operation of this embodiment having the above-mentioned configuration will be described. The joint surface 9 in which the end surfaces on the short side of the head substrate 2 are contact-joined to each other is an insulating layer because it is an adhesive layer or an air layer. Therefore, since the common electrodes 5A1 and 5A2 and the individual electrodes 5B1 and 5B2 are insulated, by applying the same amount of voltage separately to each other, the heating dots 4A 'and 4B' generate heat at the same temperature as shown in FIG. To do. However, the heating dots 4A 'and 4B' adjacent to the bonding surface 9 have a higher heating temperature than the other heating dots 4A and 4B far from the bonding surface 9.

【0020】 理由は前記従来技術で説明したように、接合面9が断熱層になり発熱ドット4 A′,4B′の放熱性が低下し蓄熱量が他の発熱ドット4A′,4B′よりも大 きくなるためである。しかし通常のサ−マルヘッドは発熱ドット4A′,4B′ の発熱温度が他の発熱ドットよりも発熱温度が高くなることが事前に分かってい れば、前記図示しない各個別電極に接続された通電制御用の駆動用半導体の動き により、他の発熱ドットと同じ発熱温度になるように制御することができる。尚 、本考案は前述した実施例に限定されものではなく、必要に応じて種々の変形が 可能である。例えば、発熱抵抗体4の中央部にスリット8を設けない通常タイプ のサ−マルヘッドであってもよい。As described in the above-mentioned conventional technique, the reason is that the joint surface 9 serves as a heat insulating layer and the heat dissipation of the heat generating dots 4 A ′, 4 B ′ is reduced, so that the heat storage amount is higher than that of the other heat generating dots 4 A ′, 4 B ′. Because it becomes louder. However, if it is known in advance that the heat generation temperature of the heat generation dots 4A 'and 4B' is higher than that of the other heat generation dots in the normal thermal head, the energization control connected to each individual electrode (not shown) is controlled. By controlling the movement of the driving semiconductor, the heating temperature can be controlled to be the same as other heating dots. It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made if necessary. For example, a normal type thermal head in which the slit 8 is not provided in the central portion of the heating resistor 4 may be used.

【0021】[0021]

【考案の効果】[Effect of device]

以上説明したように本考案のサ−マルヘッドによれば、複数個のヘッド基板短 辺側の端面の当接接合面近傍の発熱抵抗体の発熱ドットにおいて1ドット内での 左右の発熱温度の差がなくなり、発熱ドット1ドット内での左右の発熱温度が同 じになり、ヘッド基板接合面近傍の発熱ドット1ドット内での左右の印字の濃淡 の差がなくなり、良好な品質の印字を行うことができるという優れた効果を奏す る。 As described above, according to the thermal head of the present invention, the difference between the left and right heat-generating temperatures within one dot in the heat-generating resistor in the vicinity of the abutting joint surfaces of the end surfaces on the short side of the plurality of head substrates. Is eliminated, the heat generation temperature on the left and right within one dot of heat generation is the same, and there is no difference in the density of left and right printing within one dot of heat generation dots near the head substrate joint surface, and good quality printing is performed. It has an excellent effect of being able to.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本考案の一実施例を示すサ−マルヘッドの正
面図
FIG. 1 is a front view of a thermal head showing an embodiment of the present invention.

【図2】 本考案の一実施例を示すサ−マルヘッドの側
面図
FIG. 2 is a side view of a thermal head showing an embodiment of the present invention.

【図3】 本考案の一実施例の部分詳細図FIG. 3 is a partial detailed view of an embodiment of the present invention.

【図4】 本考案のサ−マルヘッドの発熱状態を示すグ
ラフ
FIG. 4 is a graph showing a heat generation state of the thermal head of the present invention.

【図5】 従来のサ−マルヘッドの部分詳細図FIG. 5 is a partial detailed view of a conventional thermal head.

【図6】 一般的なサ−マルヘッドを示す縦断面図FIG. 6 is a vertical sectional view showing a general thermal head.

【符号の説明】[Explanation of symbols]

4 発熱抵抗体 4A′ 発熱ドット 4B 発熱ドット 5 電極 5A 共通電極 5B1 個別電極 5B2 個別電極 8 スリット 9 接合面 4 Heating resistor 4A 'Heating dot 4B Heating dot 5 Electrode 5A Common electrode 5B1 Individual electrode 5B2 Individual electrode 8 Slit 9 Bonding surface

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成6年3月10日[Submission date] March 10, 1994

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】図7[Name of item to be corrected] Figure 7

【補正方法】追加[Correction method] Added

【補正内容】[Correction content]

【図7】[Figure 7] 従来のサーマルヘッドの発熱状態を示すグラA graph showing the heat generation state of a conventional thermal head.
F

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 複数個のヘッド基板上にそれぞれ発熱ド
ットを配列形成し、前記複数個のヘッド基板を発熱ドッ
トの配列方向に当接接合させて直線状に配置してなるサ
−マルヘッドにおいて、前記ヘッド基板を当接接合端で
発熱ドットの1ドット分を2分割したことを特徴とする
サ−マルヘッド。
1. A thermal head in which heating dots are formed in an array on a plurality of head substrates, and the plurality of head substrates are abutted and joined in the direction of arrangement of the heating dots and arranged linearly. A thermal head in which one dot of a heating dot is divided into two at the abutting joint end of the head substrate.
JP1991061352U 1991-07-09 1991-07-09 Thermal head Expired - Lifetime JP2526911Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991061352U JP2526911Y2 (en) 1991-07-09 1991-07-09 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991061352U JP2526911Y2 (en) 1991-07-09 1991-07-09 Thermal head

Publications (2)

Publication Number Publication Date
JPH0674338U true JPH0674338U (en) 1994-10-21
JP2526911Y2 JP2526911Y2 (en) 1997-02-26

Family

ID=13168666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991061352U Expired - Lifetime JP2526911Y2 (en) 1991-07-09 1991-07-09 Thermal head

Country Status (1)

Country Link
JP (1) JP2526911Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015111520A1 (en) * 2014-01-21 2015-07-30 ローム株式会社 Thermal print head and thermal printer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60127170A (en) * 1983-12-15 1985-07-06 Copal Co Ltd Thermal head
JPS63312169A (en) * 1987-06-15 1988-12-20 Yokogawa Electric Corp Production of line thermal printer head

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60127170A (en) * 1983-12-15 1985-07-06 Copal Co Ltd Thermal head
JPS63312169A (en) * 1987-06-15 1988-12-20 Yokogawa Electric Corp Production of line thermal printer head

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015111520A1 (en) * 2014-01-21 2015-07-30 ローム株式会社 Thermal print head and thermal printer
JP2015136832A (en) * 2014-01-21 2015-07-30 ローム株式会社 Thermal print head and thermal printer
CN106414089A (en) * 2014-01-21 2017-02-15 罗姆股份有限公司 Thermal print head and thermal printer

Also Published As

Publication number Publication date
JP2526911Y2 (en) 1997-02-26

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