JPH0672083A - Ic card - Google Patents

Abstract

PURPOSE:To provide an IC card wherein external force such as bending and twisting is easily reduced and relaxed in a region loaded and built-in with IC chips even when the external force is exerted and a function high in reliability is always given. CONSTITUTION:An IC card is equipped with a flexible wiring circuit board 9 for loading and packaging a necessary IC chip 10 in one principal face, a core sheet 11 and a pair of design plates 12a, 12b. The core sheet 11 is bonded to the face of the flexible wiring circuit board 9 and integrated in a shape wherein the IC chip 10 loaded and packaged on the circuit board 9 are engaged with an aperture part (notch part) 11a and arranged. A pair of design plates 12a, 12b hold and integrate the integrated circuit board 9 and core sheet 11 in the other principal face side. In the IC card, the region of the flexible wiring circuit board corresponding to the notch part of the core sheet 11 is formed into a sagging shape.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card, and more specifically to an IC having a structure in which a bare chip IC or the like is mounted and mounted as an electronic component to improve structural reliability
Regarding cards.

[0002]

2. Description of the Related Art In a computer application, an IC card such as a memory card can be used similarly to a magnetic disk or an optical disk. Moreover, memory I
Compared to magnetic disks, the C card is notable for its compact size and light weight because it does not require a dedicated drive device for accessing data, and has the advantage of being able to shorten access time as well. . In other words, the IC card
Connected to a processing device equipped with central processing means and input / output means, and required information or data (main information / primary information)
While writing / reading, the card attribute information (read-only data such as card type and memory capacity-2
This is because it is possible to easily write and read the following information).

By the way, the IC card is constructed, for example, as shown in FIG. That is, a core sheet 2 having an opening (notch) 2a for arranging and housing an electronic component 1 such as a battery as a driving power source and a memory IC chip, and a core sheet 2 are integrally arranged on one main surface side. Resin sheet layer 3a and the drive circuit pattern 4 printed / formed on the other main surface of the core sheet 2.
And a resin sheet layer 3b integrally arranged on the surface of the drive circuit pattern 4, design plates 5a and 5b for covering the resin sheet layers 3a and 3b, and one end surface side of the core sheet 2 And a connector 6 which is mounted on the drive circuit pattern 4 and serves as an input / output terminal for the drive circuit pattern 4.

An IC card of this type is generally manufactured as follows. In the first method, for example, a vinyl chloride resin sheet (forming a core sheet) 2 having an opening (notch) 2a larger than the size of the IC chip 1 is prepared, and the core sheet (vinyl chloride resin sheet) is prepared. ) 2 is lined with another vinyl chloride resin sheet 3a on one main surface to seal one end of the opening (notch) 2a. Next, the opening 2a of the core sheet 2 with one end sealed
The IC chip 1 is placed and housed with the pad 1a surface thereof as the upper surface, and then the vinyl chloride resin sheets 2 and 3a are plastically deformed and integrated. After that, core sheet 2
Print the conductive paste on the opening 2a side of the
A drive circuit pattern 4 having the arranged IC chip 1 or the like as a circuit element is formed, and a required connector 6 is mounted, while design plates (sheets) 5a, 5b made of vinyl resin on both main surfaces.
Is manufactured by, for example, fusing and unifying with a hot press (JP-A-61-75488).

The second method is to prepare a sheet base material 7 having a recessed portion 7a capable of accommodating, for example, the IC chip 1 as shown in FIG. After the IC chip 1 and the like are aligned and temporarily fixed with the pad 1a surface as the upper surface in the recessed portion 7a of the IC 7,
A conductive paste is printed on the surface of the sheet base material 7 in which the above-mentioned components are housed and arranged to form a drive circuit pattern 4 having the embedded and arranged IC chip 1 as a circuit element, and a required connector is attached. The design plates (sheets) 5a and 5b made of vinyl resin are fused and integrated on both main surfaces by, for example, hot pressing.

In the third method, as schematically shown in FIG. 7 as an embodiment, a photosensitive dry film 7 is arranged on the inner surface of a supporting die (not shown), and the photosensitive dry film is arranged. In the form where the pad 1a surface is in contact with the 7 surface,
After the C chip 1 and the like are aligned and temporarily fixed, a molten resin is injected to form the card base material 8 in which the IC chip 1 and the like are embedded and arranged in the recess. Next, the card substrate 8 is removed from the supporting die, and holes corresponding to the pads 1a of the embedded / arranged IC chip 1 are formed in the photosensitive dry film 7 by photolithography. After that, print the conductive paste on the photosensitive dry film 7 side,
A drive circuit pattern 4 having circuit elements such as the embedded / arranged IC chip 1 is formed, and while a required connector is attached, design plates (sheets) 5a, 5b made of vinyl resin are provided on both main surfaces, For example, it is manufactured by fusing and integrating by hot pressing.

[0007]

However, the IC card having the above-mentioned structure has the following problems. That is, the IC card is often subjected to external force such as bending or twisting during the use process. When an external force such as bending or twisting is applied, the IC chip 1 mounted / installed may be destroyed or the IC chip 1 may be damaged.
There is a problem that disconnection occurs at the connection between the drive circuit pattern 4 and the drive circuit pattern 4, or the surface of the IC chip 1 is peeled off from the coating resin sheet layer or the mold resin layer, and functional damage is likely to occur. Under the current circumstances where the IC card of this kind is being made thinner, the above-mentioned phenomenon becomes a serious problem. That is, as the IC card becomes thinner, the IC chip 1 itself mounted or internally mounted, or the IC chip 1
This is because the stress applied to the peripheral portion becomes large, so that the above-mentioned problem is likely to occur and the reliability is greatly lowered.

The present invention has been made in consideration of the above circumstances, and even when an external force such as bending or twisting is applied, the external force is easily reduced in the area where the IC chip or the like is mounted / installed. -The purpose is to provide an IC card that is relaxed and exhibits a highly reliable function at all times.

[0009]

An IC card according to the present invention has a flexible wiring circuit board on which a required IC chip is mounted and mounted on one main surface, and a flexible wiring circuit board mounted and mounted on the flexible wiring circuit board. A core sheet that is adhered and integrated with the surface of the flexible wiring circuit board in such a manner that the IC chip is fitted and arranged in the opening (notch).
In an IC card comprising the integrated flexible printed circuit board and a pair of design boards that sandwich and integrate the core sheet on the other principal surface side, flexibility corresponding to the cutout portion of the core sheet is provided. It is characterized in that the wiring circuit board region is slackened.

[0010]

According to the present invention, a flexible wiring circuit board is particularly used as a thin wiring circuit board on which a required IC chip (bare chip IC) is mounted and mounted, while it is fitted in the core sheet opening (cutout). In the portion (area) on which the IC chips that are arranged in a general manner are mounted and arranged, the flexible printed circuit board has a slack structure. That is, the portion (area) on which the IC chip is mounted / arranged has a structure that can respond relatively flexibly to an external force without being fixed.
Therefore, even if an external force such as bending or twisting is applied to the mounted / internally mounted IC chip 1 or the peripheral portion of the IC chip 1, the external force (stress) can be easily relieved to prevent damage, disconnection, Phenomena such as peeling are effectively eliminated or avoided, and reliability is greatly improved.

[0011]

Embodiments of the present invention will be described below with reference to FIGS.

FIG. 1 is a cross-sectional view showing an example of the essential structure of an IC card according to the present invention. Reference numeral 9 denotes a flexible structure in which required electronic parts, that is, an IC chip 10 and the like are mounted and mounted on one main surface. A wiring circuit board 11 is bonded and integrated on the surface of the flexible wiring circuit board 9 by fitting and arranging the IC chip 10 mounted and mounted on the flexible wiring circuit board 9 into the opening (cutout) 11a. The core sheets 12a and 12b that have been made into a pair are a pair of design plates that sandwich and integrate the integrated flexible wiring circuit board 9 and core sheet 11 on the other main surface side. And the flexible printed circuit board 9
The IC chip 10 or the like is mounted / mounted on one main surface of the flexible printed circuit board 9 by utilizing the heat fusion property of the thermoplastic resin which is the binder component of the conductive paste circuit pattern. The flexible wiring circuit board 9 and the core sheet 11 are integrated with each other through the adhesive layer 13a, for example. Here, what is important is that when the flexible wiring circuit board 9 and the core sheet 11 are integrated, the area 9a of the flexible wiring circuit board 9 corresponding to the cutout portion 11a of the core sheet 11 is selectively removed. It is necessary to consider and set in the design or manufacturing process so that the shape is loosened and the shape can be retained. Further, the other main surface side of the integrated flexible wiring circuit board 9 and the core sheet 11 is sandwiched.
The pair of design plates 12a and 12b to be integrated is also integrated, for example, via the adhesive layer 13b.

The IC card having the above structure can be manufactured by the following procedure. 2 to 4 are schematic views showing examples of manufacturing embodiments thereof. For example, a conductive paste having a thermoplastic resin as a binder is printed on a surface of a thermoplastic resin sheet such as a polyphenylene sulfide resin to perform required driving. After the circuit pattern is formed and the flexible printed circuit board 9 is obtained, required electronic components such as the IC chip 10 are mounted and arranged in a predetermined area and thermally fused with the drive circuit pattern to electrically Connect and implement. Here, the flexible printed circuit board 9
Is, for example, an IC chip 10 as shown in plan view in FIG.
The region 9a for mounting / mounting is cut on both sides so that it can be loosened selectively, and is made into a band.

A core sheet 11 made of a thermoplastic resin such as polyphenylene sulfide resin is prepared corresponding to the flexible printed circuit board 9 on which the required IC chip 10 is mounted and arranged. This core sheet 11 is
As shown in FIG. 3 (a) in plan view and in FIG. 3 (b) in cross section, I mounted and arranged on the surface of the flexible printed circuit board 9
Regions corresponding to the C chips 10 are selectively opened or cut, and openings (cutouts) 11a into which the IC chips can be fitted and arranged are provided in advance.

Next, as shown in a sectional view in FIG. 4, the IC chip 10 mounted and arranged on the surface of the flexible printed circuit board 9 is
The core sheet 11 is aligned with the corresponding openings (notches) 11a of the core sheet 11 while being aligned with the adhesive 13a.
Through thermocompression bonding or heat fusion. At this time, the slack is maintained in the region 9a of the flexible printed circuit board 9 corresponding to the opening (cutout) 11a of the core sheet 11 on which the IC chip 10 is mounted and mounted. After that, a required connector (not shown) is attached, and a design plate (exterior plate) 12a made of vinyl chloride resin, for example, is attached on both main surface sides with an adhesive 13b,
A desired IC card can be obtained by thermocompression bonding or heat fusion bonding 12b to integrate them. The design plates (exterior plates) 12a and 12b may be bonded and integrated simultaneously in the process of bonding and integrating the flexible printed circuit board 9 and the core sheet 11 together. Prior to the adhesive integration of the plates 12a and 12b, the opening (cutout) 11a in which the IC chip 10 is fitted and arranged may be appropriately filled with a gel-like sealing resin.

Although the flexible printed circuit board 9 is formed of a polyphenylene sulfide resin sheet in the above configuration example, it is formed of a thermoplastic resin sheet of polyethylene isophthalate resin, polyethylene terephthalate resin, polycarbonate resin, vinyl chloride resin or the like. Also, the formation of the drive circuit pattern is not limited to the conductive paste and means illustrated above.

[0017]

As described above, according to the IC card of the present invention, a flexible wiring circuit board is used as a thin wiring circuit board on which a required IC chip (bare chip IC) is mounted and mounted, while a core is used. A flexible wiring circuit board is provided with slack in the portion (area) where the IC chip, which is fitly arranged in the seat opening portion (cutout portion), is mounted and arranged. In other words, with an IC chip
The arranged portion (area) is not mechanically fixed and has a structure capable of relatively flexibly responding to an external force. Therefore, the mounted / incorporated IC chip 1 itself or the IC Even when an external force such as bending or twisting is applied to the peripheral portion of the chip 1, the external force (stress) is easily relieved, and phenomena such as breakage, disconnection, and peeling are effectively eliminated or avoided. Therefore, it becomes possible to always function as an IC card with greatly improved and improved reliability.

[Brief description of drawings]

FIG. 1 is a sectional view showing a configuration example of a main part of an IC card according to the present invention.

FIG. 2 is a plan view showing an example of a flexible printed circuit board that constitutes an IC card according to the present invention.

3A is a plan view showing an example of a core sheet constituting an IC card according to the present invention, and FIG. 3B is a sectional view taken along line AA of FIG. 3A.

FIG. 4 is a sectional view schematically showing an embodiment of an example of manufacturing an IC card according to the present invention.

FIG. 5 is a sectional view showing a configuration example of a main part of a conventional IC card.

FIG. 6 is a sectional view schematically showing an embodiment of a manufacturing example of a conventional IC card.

FIG. 7 is a sectional view schematically showing an embodiment of another manufacturing example of a conventional IC card.

[Explanation of symbols]

1, 10 ... IC chips 1a, 10a ... Pads 2, 11 ... Core sheets 2a, 11a ... Openings (notches) 3a, 3b ...
Resin sheet 4 ... Drive circuit pattern 5a, 5b, 12a, 12
b ... Design board (exterior board) 6 ... Connector 7 ... Photosensitive dry film 8 ... Card base 9 ... Flexible wiring circuit board 9a '... Slack area of flexible wiring circuit board
13a, 13b ... Adhesive layer

Claims (1)

[Claims] 1. A flexible printed circuit board on which a required IC chip is mounted and mounted on one main surface, and an IC chip mounted and mounted on the flexible printed circuit board is fitted and arranged in a notch. Adhere to the flexible wiring circuit board surface with
An IC card comprising an integrated core sheet and a pair of design plates that sandwich and integrate the integrated flexible wiring circuit board and the core sheet on the other main surface side, wherein the cutout of the core sheet An IC card, characterized in that a flexible printed circuit board region corresponding to a portion is slackened.