JPH0669671A - Radiator of electronic parts - Google Patents

Abstract

PURPOSE:To improve mounting efficiency and radiation efficiency by providing rising parts provided with through holes to be passed through by the leads on both sides of a package at the time of mounting while being vertically provided on the flat part and on both sides of the flat part in the relative positions and the radiation parts formed on the upper end sides of the rising parts respectively. CONSTITUTION:A radiator 1 consists of a groove-shaped part 2 having an upwardly opened U-shaped sectional surface and the radiation parts 3 provided on both sides thereof. The groove-shaped part 2 consists of a flat part 7 where its upper surface is closely adhered to a package bottom face of an IC 52 at the time of mounting the IC 52 while its underface contacts and engage with a printed board 5 and the rising part 9 vertically rising from both sides of this flat part 7. The flat part 7 has through holes 12 allowing the leads 51 of both sides of the package of the IC 52 to pass through respectively. The radiation part 3 consists of a large number of fin groups provided in the comb shape respectively on the top and bottom of the part extending from the upper end side of the rising parts 9 in the horizontal direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator for electronic parts.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 5, for example, a plurality of leads 51 are respectively provided from two opposite side surfaces of a package.
DIP (Dual In-line Pac)
As a heat dissipation measure for the (kage) type IC (electronic component) 52, the IC 52 is mounted so that the package bottom surface of the IC 52 is in close contact with the inner bottom surface of the box-shaped radiator 57 fixed on the printed circuit board 55 by the screw 54. There is a heat dissipation structure to be mounted on the printed board 55.

[0003]

However, in the conventional heat dissipation structure described above, the radiator 57 includes the printed circuit board 55.
Since the area on the (counterpart member) is largely occupied, there is a disadvantage that the mounting efficiency of various components on the printed circuit board 55 is lowered. Further, since the IC 52 is completely covered by the inner circumference of the radiator 57, air convection is lacking, which is not preferable for heat radiation.

Therefore, it is an object of the present invention to provide a radiator which is excellent in mounting efficiency and can improve heat radiation efficiency.

[0005]

In order to solve the above problems, the present invention provides an electronic component having a plurality of leads extending in parallel downwardly from two opposite side surfaces of the package, and the electronic component. Is a radiator of an electronic component, which is sandwiched between a mating member to be mounted, and a through hole through which leads on both sides of the package penetrate during mounting, the top surface of which is in close contact with the bottom surface of the package. The lower surface has a flat portion having an area substantially equal to or slightly larger than the bottom surface of the package so as to reduce the area occupied by the mating member, and a large space occupied by the heat radiating portion is secured, and ventilation is improved. So as to promote heat generation from the heat dissipation part, and a rising part that is vertically erected relatively on both sides of the flat part,
A structural feature is that the heat dissipation portion is formed on the upper end side of the rising portion.

[0006]

The area occupied by the flat portion of the radiator can be considerably reduced, and the mounting efficiency is improved. Further, the heat dissipation efficiency is improved due to the effective heat dissipation by the heat dissipation part at the high position.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side view of an embodiment of a radiator for electronic parts according to the present invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a perspective view of a radiator alone. Referring to FIG. 3, the radiator 1 according to the present embodiment is sandwiched between the DIP type IC 52 (electronic component) shown in FIGS. 1 and 2 and a printed circuit board 5 (a mating member) on which the IC 52 is mounted. It is attached and fixed, and basically consists of a groove portion 2 having an open U-shaped cross section and an radiating portion 3 provided on both sides thereof.

The former groove-shaped portion 2 has a flat portion 7 whose upper surface is in close contact with the package bottom surface of the IC 52 and whose lower surface is in contact with and engaged with the printed circuit board 5 when the IC 52 is mounted,
The flat portion 7 includes a rising portion 9 vertically rising from both sides. The flat portion 7 has through holes 12 through which the leads 51 on both sides of the package of the IC 52 can pass. The lower surface of the flat portion 7 has an area that is substantially equal to or slightly larger than the bottom surface of the package so as to reduce the area occupied by the printed circuit board 5. That is, the A dimension (width dimension) is configured to be as small as possible. The rising portions 9 on both sides of the flat portion 7 ensure a large space occupied by the heat radiating portion 3 and improve the ventilation to improve the heat radiating portion 3.
In order to promote heat generation from the flat part 7, the flat part 7 is vertically provided on both sides, that is, the H dimension (height dimension) is as large as possible.

The latter heat radiating portion 3 is composed of a large number of fin groups provided in a comb-teeth shape on the upper and lower surfaces of a portion extending horizontally from the upper end side of the rising portion 9. In the present embodiment, the printed board 5 is assumed to be a printed board unit that is attached to and detached from the backboard 31 (connector 32) as shown in FIGS.

In the radiator 1 of the present embodiment having the above configuration, the area (mounting area) that the radiator 1 occupies on the printed circuit board 5 can be considerably reduced, and the mounting efficiency can be improved. .. Further, effective heat dissipation by the heat dissipation parts (fin groups) 3 on both sides of the radiator 1 can improve heat dissipation efficiency. This makes it possible to sufficiently cope with future high-density mounting as a measure against heat generation.

By the way, as shown in FIG. 4, a commercially available so-called round pin type IC socket 41 has, for example, a compression coil spring 4 at a predetermined position inside a plastic base.
3 is provided, and the through hole 12 provided in the flat portion 7 of the radiator 1 has a size (shape) that allows both side portions of the IC socket 41 to pass through smoothly.
When mounting the IC52 in the C socket 41, the IC5
It is possible to continuously maintain a state in which the bottom surface of the package 2 and the radiator 1 (flat portion 7) are always in elastic contact with each other, and stable and efficient heat radiation can be realized. Moreover, the radiator itself can be easily removed only by pulling out the IC 52 from the IC socket 41. Therefore, for example, the capacitance or the presence or absence of the radiator is unavoidably changed due to the fluctuation of the operation clock of the circuit or the adjustment thereof. In that case, it is extremely convenient because the removal and the like can be performed easily and easily.

[0012]

As described above, according to the present invention, the occupying area of the radiator can be considerably reduced, the mounting efficiency can be improved, and the effective heat radiation by the heat radiating portion at the predetermined height position can be achieved. The heat dissipation efficiency can be improved by the divergence of.

[Brief description of drawings]

FIG. 1 is a side view of an embodiment of a radiator of an electronic component according to the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a perspective view of a radiator alone.

FIG. 4 is a perspective view of an IC socket.

FIG. 5 is a cross-sectional side view of a conventional structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Radiator 3 ... Heat dissipation part 5 ... Printed circuit board 7 ... Flat part 9 ... Rising part 12 ... Through hole 41 ... IC socket 51 ... Lead 52 ... IC

Claims (1)

[Claims] 1. An electronic component (52) having a plurality of leads (51) extending in parallel downward from two opposite side surfaces of the package, and a counterpart member on which the electronic component (52) is mounted. A radiator of an electronic component sandwiched between (5, 41) and (5, 41), having a through hole (12) through which leads (51) on both sides of the package penetrate during mounting, the upper surface of which is the package A flat portion (7) which is in close contact with the bottom surface and whose lower surface has an area substantially equal to or slightly larger than the bottom surface of the package so as to reduce the occupied area of the mating member (5, 41); To secure a large occupied space in (3) and to improve the ventilation to promote heat generation from the heat radiating portion (3),
The flat portion (7) has a rising portion (9) vertically extended relative to each other in a relative position, and a heat radiating portion (3) formed on an upper end side of the rising portion (9). A radiator for electronic parts.