JPH0668918A - Electrical connecting structure between casing and substrate of ic card - Google Patents

Abstract

PURPOSE:To increase mechanical strength by enabling a casing, including a metal cover, and a substrate to be electrically connectable surely, eliminating handling a small spring part, facilitating assembling, and supporting the metallic cover. CONSTITUTION:Plate springs 14 and 15, having electrical potential the same as that of a metallic cover 12, are point-welded to the metal cover 12 (P). Land 13a on a substrate 13 and the metallic cover 12 are electrically connected to the substrate 13 retained by the plate springs 14 and 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connection structure for a case (case) of an IC card and a substrate.

[0002]

2. Description of the Related Art As a conventional electrical (FG) connection structure for making a casing of an IC card and a land of a substrate have the same potential so as to be less susceptible to noise, as shown in FIG. 6 or FIG. A plurality of small coil springs 3 are arranged between the upper and lower metal covers 1 forming a part of the body of the IC card and the lands 2a on the substrate 2 to sandwich the substrate 2 or maintain a distance from the metal cover 1. The structure was common.

[0003]

In such a conventional electric connection structure, since the spring 3 is simply inserted between the metal cover and the substrate, when the metal cover vibrates. , The electrical connection between the metal cover and the substrate becomes uncertain. Further, even during manufacturing, it is difficult to assemble because it is a work to handle a small spring, and it often jumps and disappears during assembly. Further, there is a problem that the metal cover is easily deformed because it has no function of mechanically supporting the metal cover.

The present invention has been made in order to solve the above problems, and ensures electrical connection between a casing including upper and lower metal covers and a substrate, and eliminates the work of handling fine spring parts for assembly. Facilitates, and
An object of the present invention is to provide a structure capable of increasing the mechanical strength of a metal cover.

[0005]

The structure according to the present invention is
A leaf spring member having the same potential as the metal cover is provided so as to project from the metal cover toward the substrate, and the metal cover and the land on the substrate are electrically connected by the spring member.

[0006]

In the structure according to the present invention, since the leaf spring provided so as to project from the metal cover comes into pressure contact with the land on the substrate, the metal cover and the substrate are electrically and reliably connected to each other. The metal cover is mechanically supported because it is sandwiched in the center, increasing the mechanical strength.

[0007]

Embodiment 1 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram of an electric connection structure of Embodiment 1 of the present invention.
2 is a plan view of the C card 10, and FIG. 2 is an enlarged view of the AA cross section of FIG. 1. In FIG. 2, metal covers 12 and 12 are fixed to both end faces of a frame 11 made of polycarbonate, and a land 13a is provided on a substrate 13 on which an electronic circuit such as a memory IC is provided. 14 and 15 are formed by bending a thin plate, and the point P
3 is a leaf spring which is point-welded (spot-welded) to the metal cover 12 in FIG.
By pressing the metal cover 3a, the upper and lower metal covers 12
And the substrate 13 are electrically and securely connected to each other and the substrate 13 is sandwiched. The leaf spring 15 is formed to be bendable, so that dimensional errors and the like are absorbed.

Also, the leaf spring 14 is formed by point welding.
Since the metal cover 15 and the metal cover 12 are physically integrated, it is not necessary to handle small parts such as individual springs, and the assembling work becomes easy. Further, since the spring force is also strong, the metal cover 12 can be reinforced to enhance the mechanical strength.

Embodiment 2 FIG. 4 shows a BB section of Embodiment 2 of the present invention. In the case of this embodiment, an S-shaped bent leaf spring 16 is fixed to the inner surface of the metal cover 12 by point welding at point P, and the tip of the leaf spring 16 is pressed against the land 13a of the substrate 13. This ensures the electrical connection between the metal cover 12 and the substrate 13. In the structure of the present embodiment, the shape of the leaf spring 16 is simpler than that of FIG. 2 and only one type is required. Therefore, the number of types of parts can be reduced and the cost can be reduced.

Third Embodiment FIG. 5 shows a third embodiment of the present invention. In the case of this embodiment, the plate spring portion 17a is formed integrally with the metal cover 17 by partially punching the metal cover 17. The plate spring portion 17a holds the substrate 13 and the metal cover 17 and the substrate 13 are electrically connected. A hole 17b is formed in the metal cover 17, but since this hole 17b is small, there is almost no problem of radio wave radiation, and a sticker 18 can be attached to improve the appearance. Further, by forming the back surface of the seal 18 from a conductive material such as aluminum, there is no radiation and the back surface is transparent and invisible. According to the present embodiment, the process of point-welding the leaf spring portion 17a to the metal cover 17 is unnecessary, so that the cost can be further reduced.

[0011]

As described above, according to the present invention, the plate spring member is provided so as to project from the metal cover and electrically connected to the land on the substrate, so that the casing including the upper and lower metal covers and the substrate. And can be electrically and reliably connected. In addition, since the leaf spring and metal cover are physically integrated and there is no need to handle small parts, assembly is easy, and the structure in which the board is sandwiched in the center mechanically supports the metal cover for strength. Can be increased.

[Brief description of drawings]

FIG. 1 is a plan view of an IC card.

FIG. 2 is an enlarged cross-sectional view of an IC card showing the configuration of the first embodiment of the present invention.

FIG. 3 is an enlarged cross-sectional view of a main part of FIG.

FIG. 4 is an enlarged vertical sectional view showing the configuration of the second embodiment of the present invention.

FIG. 5 is an enlarged vertical sectional view showing the structure of the third embodiment of the present invention.

FIG. 6 is an enlarged sectional view of an essential part showing the structure of Conventional Example 1.

FIG. 7 is an enlarged sectional view of an essential part showing the structure of Conventional Example 2.

[Explanation of symbols]

 10 IC Card 11 Frame 12, 17 Metal Cover 13 Substrate 13a Land 14, 16 Leaf Spring 17a Leaf Spring Part 18 Seal

Claims (1)

[Claims] 1. An IC characterized in that a leaf spring member having the same potential as that of the metal cover is provided so as to project from the metal cover toward the substrate, and the metal cover and the land on the substrate are electrically connected by the spring member. Electrical connection structure between the card case and the substrate.