JPH0666063U - Hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] (Modified) [Configuration] A plurality of terminal leads 3 arranged in rows at the end of the SIL integrated circuit board 1 are provided on both sides of a columnar or plate-shaped insulator 4. It is inserted along the groove 5 and the tip of the terminal lead 3 extending to the lower surface of the insulator 4 is placed on a solder land provided on the mother board side so that soldering can be performed. [Effect] Both boards can be firmly surface-mounted, and noise can be prevented by adopting a ferrite core as an insulator.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a single in-line type hybrid integrated circuit device capable of surface mounting.

[0002]

[Prior art]

 A package type circuit device in which terminal leads are mounted in a row on one side of a hybrid integrated circuit board having a specific function, a so-called single-inline type hybrid integrated circuit device (hereinafter referred to as "SIL integrated circuit device") There is a method of mounting on a hybrid integrated circuit board (hereinafter referred to as "parent board") and electrically connecting the SIL integrated circuit device and the parent board via the terminal leads. This connection method will be described below with reference to FIGS. 5 (a) and 5 (b).

In the SIL integrated circuit device 1, terminal lead solder lands 2 are formed in a line at one end of the main surface thereof, one end of the terminal lead 3 is soldered thereto, and the terminal lead 3 is connected to the circuit device. 1 is derived parallel to the main surface. On the other hand, the parent board 5 has through holes 6 into which the terminal leads 3 of the SIL integrated circuit device 1 are inserted, and after the terminal leads 3 are inserted therein, the terminals are electrically and mechanically formed by a flow soldering method. The SIL integrated circuit device 1 is mounted on the parent board by connecting and fixing the leads. Further, in order to prevent external noise from mixing into the hybrid integrated circuit device or affecting other circuits due to the noise generated from the circuit device itself, the ferrite core 7 is provided with the ferrite core 7 as shown in FIG. 5 (b). It is also practiced to provide a plurality of holes 8, insert the terminal lead 3 into the holes 8 and then mount the terminal lead 3 on the main board 5 to absorb noise.

[0004]

[Problems that the device is trying to solve]

 In recent years, various electronic components mounted on the hybrid integrated circuit board have been more and more manufactured by the surface mounting method. Since this method pre-prints a fixed amount of solder on the solder lands on the above-mentioned board on which electronic components are mounted, there is no bridging between terminals due to excessive solder after reflow, resulting in a reliable hybrid structure. There is an advantage that an integrated circuit can be realized.

However, it is difficult to surface-mount the SIL integrated circuit device on the parent board. For example, FIG. 6 is a conceptual diagram showing a state in which the SIL integrated circuit device is surface-mounted. As is apparent from FIG. 6, when the SIL integrated circuit device 1 is to be surface-mounted, the terminal leads 3 are It needs to be bent. However, as shown in FIG. 6, it is difficult to bend the terminal leads 3 aligned perpendicularly to the main surface of the SIL integrated circuit device 1. If the bending angles are not aligned, the solder lands 9 on the parent substrate 5 can be accurately aligned. Terminal lead 3 cannot be placed. Even if surface mounting is possible by the above-mentioned method, the terminal lead 3 must be protected against some external force, but such protection is substantially difficult.

Further, as shown in FIG. 5B, when the SIL integrated circuit device is mounted on the parent board by taking measures against noise, the terminal leads of the SIL integrated circuit are passed through the ferrite core and then the terminals on the parent board. This is the step of inserting into the lead insertion through hole. Since the mounting work in this case is manual work and automatic mounting cannot be performed, very inefficient mounting work is required. There is also a method of mounting the board surface of the SIL integrated circuit device in a posture parallel to the parent board surface. However, this method has a large area of the SIL integrated circuit device, and therefore the positioning of the solder land provided on the parent board side is performed. Therefore, not only is there a great restriction when creating a circuit pattern on the main board side, but when a terminal lead is provided on one side of the SIL integrated circuit device, a fixing means for reinforcement is provided at the end on the opposite side. Will be needed.

In view of the above-mentioned problems in the prior art, an object of the present invention is to provide a reliable hybrid integrated circuit device capable of surface mounting the SIL integrated circuit device on a parent substrate.

[0008]

[Means for Solving the Problems]

 In order to achieve the above object of the present invention, the present invention provides a circuit device in which a plurality of terminal leads are led out in a row at regular intervals, and at least as many grooves as the number of the terminal leads are formed on both sides. The terminal lead is engaged with and held in the grooves on both sides of the insulator, and the tip end side of the terminal lead is led out to the bottom surface of the insulator. A hybrid integrated circuit device is provided. In this case, the insulator may be made of a magnetic material.

[0009]

[Action]

 According to the present invention, it is possible to mount the SIL integrated circuit device on the parent board, which has been difficult to achieve in the past, and to automatically mount the chip as well as the chip parts. That is, since the terminal leads from the SIL integrated circuit device are engaged with and held in the grooves on both sides of the insulator, the insulator has a function of a holder and the terminal is not affected by external force or vibration. There is no risk of the lead being disconnected. Further, when the terminal lead is bent, the above-mentioned insulator serves as a bending jig, so that the bending process is facilitated and the bending accuracy is improved, which results in higher positioning accuracy when soldering.

Since the terminal lead from the SIL integrated circuit device is bent inward along the groove on the bottom surface of the insulator, the tip of the terminal lead is aligned with the solder land on the mother board, and the bottom surface of the insulator is aligned. If the is mounted on the parent board, reflow can be easily performed. Further, if ferrite is used for the insulator, noise generated from the self circuit or external noise is also absorbed by the ferrite, so that it is not necessary to separately use a ferrite core or the like.

[0011]

【Example】

 Next, an embodiment of the present invention will be described with reference to FIGS. In these drawings, the same symbols as those shown in FIGS. 5 and 6 are designated by the same symbols. As described above, the plurality of terminal lands 3 are soldered in rows to the plurality of solder lands 2 provided at the end of the SIL integrated circuit device 1, respectively. In addition to this, the insulator 10 is prepared in the present proposal. The insulator 10 is a triangular prism whose cross section is an isosceles triangle, and a plurality of grooves 11 are alternately provided on the both sides of the triangle at an interval equal to twice the pitch of the terminal leads 3. The grooves 11 are connected to the bottom surface of the insulator 10. The terminal leads 3 are alternately inserted on both sides along the groove 11, and further bent along the groove 11 to the bottom surface side of the insulator 10.

According to the above configuration, the insulator 10 is sandwiched between the terminal leads 3 and the terminal lead 3 is inserted into the groove 11 of the insulator 10. When both ends are fixed with solder, the structure is of a core type, which solves the problem of disconnection or bending of the terminal lead 3 due to external force or vibration. Further, the insulator 10 can be used as a jig for bending the terminal lead 3, thereby improving the bending accuracy and making the bending angle uniform, so that the surface mounting of the SIL integrated circuit device can be performed more reliably.

In the hybrid integrated circuit device of the present invention, if the insulator 10 is made of a magnetic material such as ferrite in order to avoid the influence of external noise mixed in the circuit or noise generated from the circuit itself, The insulator 10 can be replaced with a conventional ferrite core for noise removal.

FIG. 3 is a view showing another embodiment of the present invention. Here, the insulator 10 has a plate shape, and the grooves 11 are alternately provided at both ends 13 of the insulator 10 with a pitch twice as large as the terminal lead 3 of the SIL hybrid integrated circuit device 1. Then, the terminal lead 3 of the SIL hybrid integrated circuit device 1 is bent along the surface of the plate-shaped insulator 10, and is inserted into the groove 11 on both sides of the insulator 10 as shown in FIG. At the same time, it is bent inward in the groove 11 toward the bottom surface 14 side of the insulator 10. Although not shown, the tip side of the bent terminal lead 3 on the bottom surface 14 side is positioned on a solder land provided on the parent board side, and the SIL integrated circuit device 1 is reflowed. Are surface-mounted on the parent board. By using such a plate-shaped insulator, the height of the SIL integrated circuit device mounted on the parent board can be made low as a whole, and the mechanical stability is further increased.

Although FIGS. 3 and 4 show the case where the groove 11 is provided only on the both side portions 13 of the insulator 10, the groove is provided on the plane portion of the insulator 10 and the terminal lead is engaged therein. You can do it. Needless to say, if the plate-shaped insulator 10 is made of ferrite, it has a noise removing effect in the same manner as described above. Further, the terminal leads 3 are alternately bent on both sides of the insulator 10. For example, the terminal leads 3 may be bent every two or three, or the terminal leads 3 at both ends may be bent at one side and the terminals in the middle thereof may be bent. It goes without saying that the lead 3 can be bent to the other side.

[0016]

[Effect of device]

 As is apparent from the above description, according to the hybrid integrated circuit device of the present invention, when the SIL integrated circuit device is mounted on the parent substrate, the main surface of the insulator is provided with the groove for inserting the terminal lead, and the terminal is formed. Since the leads are configured to sandwich the insulator, the terminal leads are not bent or deformed by external force, and reliable surface mounting between the two substrates can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view illustrating a method of mounting a SIL integrated circuit device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an embodiment of an insulator of the present invention.

FIG. 3 is a view showing another embodiment of the present invention,
(A) is the perspective view, (b) is a side view.

FIG. 4 is a partially enlarged perspective view showing the same embodiment.

5A and 5B are perspective views for explaining a mounting method using a conventional technique, FIG. 5A shows an insertion mounting method, and FIG. 5B shows a case where a ferrite core for noise suppression is used.

FIG. 6 is an explanatory diagram of a case where surface mounting is performed under the conventional technique.

[Explanation of symbols]

 1 SIL Integrated Circuit Device 3 Terminal Lead 5 Parent Board 6 Through Hole 7 Ferrite Core 10 Insulator 11 Groove

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[Procedure amendment]

[Submission date] July 20, 1991

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Correction target item name] All drawings

[Correction method] Change

[Correction content]

[Figure 1]

[Fig. 2]

[Figure 3]

[Figure 4]

[Figure 5]

[Figure 6] ─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] March 14, 1994

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Correction target item name] All drawings

[Correction method] Change

[Correction content]

[Figure 1]

[Fig. 2]

[Figure 3]

[Figure 4]

[Figure 5]

[Figure 6]

Claims (2)

[Reference number] 003003-01 [Claims for utility model registration] 1. A circuit device in which a plurality of terminal leads are led out in a line at regular intervals, and a columnar or plate-shaped insulator having at least the same number of grooves as the number of the terminal leads formed on both sides. A hybrid integrated circuit device, wherein the terminal lead is engaged with and held in grooves on both sides of the insulator and the tip end side of the terminal lead is led to the bottom surface of the insulator. 2. The hybrid integrated circuit device according to claim 1, wherein the insulator is a magnetic body.