JPH0661425A - 誘電体表面の最適化 - Google Patents
誘電体表面の最適化Info
- Publication number
- JPH0661425A JPH0661425A JP5137033A JP13703393A JPH0661425A JP H0661425 A JPH0661425 A JP H0661425A JP 5137033 A JP5137033 A JP 5137033A JP 13703393 A JP13703393 A JP 13703393A JP H0661425 A JPH0661425 A JP H0661425A
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- resistance ratio
- conductor
- layer
- smoothing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H10P74/00—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H1/00—Supports or magazines for piles from which articles are to be separated
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/34—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring roughness or irregularity of surfaces
- G01B7/345—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring roughness or irregularity of surfaces for measuring evenness
-
- H10P95/06—
-
- H10W20/092—
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US89574492A | 1992-06-09 | 1992-06-09 | |
| US895744 | 1992-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0661425A true JPH0661425A (ja) | 1994-03-04 |
Family
ID=25405006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5137033A Withdrawn JPH0661425A (ja) | 1992-06-09 | 1993-06-08 | 誘電体表面の最適化 |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0574179A2 (cg-RX-API-DMAC10.html) |
| JP (1) | JPH0661425A (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569114B (zh) * | 2010-12-17 | 2014-08-27 | 无锡华润上华半导体有限公司 | 一种金属导线尺寸监测方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4571685A (en) * | 1982-06-23 | 1986-02-18 | Nec Corporation | Production system for manufacturing semiconductor devices |
| US5081421A (en) * | 1990-05-01 | 1992-01-14 | At&T Bell Laboratories | In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection |
-
1993
- 1993-06-03 EP EP93304297A patent/EP0574179A2/en not_active Withdrawn
- 1993-06-08 JP JP5137033A patent/JPH0661425A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0574179A3 (cg-RX-API-DMAC10.html) | 1994-04-27 |
| EP0574179A2 (en) | 1993-12-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000905 |