JPH0658619U - Electronic parts - Google Patents

Abstract

(57) [Summary] In an electronic component for hermetically sealing the package member 19 and the lid 15 by anodic bonding, the lid has the conductor film 17 on the joint surface with the package member and on the opposite surface to the joint surface. The conductive film on the bonding surface and the conductive film on the opposite surface are electrically connected to each other. [Effect] The joining of the lid and the package member does not depend on the material of the lid, and the electrode terminal for voltage application for anodic joining can be easily taken out from the lid.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a structure of a lid of an electronic component that applies anodic bonding to hermetically seal a package member and a lid in an electronic component such as a sensor, a crystal unit, or an oscillator.

[0002]

[Prior art]

 The anodic bonding technique is a method for bonding glass and metal using electrical energy, and it is said that the bonding force between the glass and metal is stronger than the original material.

The joining of glass and metal by anodic bonding is extremely simple. As shown in FIG. 2, the glass 23 and the metal 25 are superposed, and the glass 23 and the metal 25 are lower than the softening point and more than the melting point of the metal 25. In a low temperature atmosphere, a relatively high DC voltage may be applied to the metal 25 side for a short time by the DC power supply 21 so that the metal 25 side has a positive potential and a voltage is applied between the glass 23 and the metal 25.

This anodic bonding method has the advantages that it is possible to perform airtight bonding at a low temperature that can endure a thermal cycle, does not require a large pressing force, and is inexpensive.

[0005]

[Problems to be solved by the device]

 In applying this anodic bonding technique as a method for hermetically sealing a package member and a lid in an electronic component such as a sensor, a crystal oscillator, or an oscillator, a method of applying a DC voltage will be described with reference to FIG. As shown in FIG. 3 (a), a method of applying a positive potential to the lid 31 and a negative potential to the package member 33, and as shown in FIG. 3 (b), the reverse of FIG. 3 (a). There are two types of voltage application methods: a method of applying a negative potential to the lid 31 and a method of applying a plus potential to the package member 33.

When the lid 31 shown in FIG. 3A is applied with a positive potential and the package member 33 is applied with a negative potential, the lid 41 and the package member 45 are joined to each other as shown in FIG. 4A. , A method of forming a bonding layer 43 made of a metal thin film or a semiconductor thin film, taking out electrode terminals from the bonding layer 43, and bonding using a DC power supply 47, and a material for the lid 41 as shown in FIG. 4 (b). There is a method in which an electrode terminal is taken out from the lid 41 by using an electric conductor or a semiconductor material and anodically bonded.

In the method of taking out the electrode terminals from the joining layer 43 made of metal or semiconductor and joining them as shown in FIG. 4A, it is difficult to take out the electrodes stably because the joining layer 43 is very thin. Further, in the method of taking out and joining the terminals from the lid 41 that electrically uses a conductor or semiconductor material as shown in FIG. 4 (b), there are restrictions on the material of the lid 41, and insulators such as alumina and glass are not available. , The lid 41 cannot be used.

An object of the present invention is to solve the above problems and, in an electronic component in which a package member and a lid are hermetically sealed by using an anodic bonding technique, the anodic bonding between the lid and the package member is a material for the lid. An object of the present invention is to provide an electronic component having a structure that is not affected by the change and in which the electrode terminal can be easily taken out from the lid.

[0009]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention employs the following configurations.

The electronic component of the present invention is an electronic component in which a package member and a lid are anodically bonded to perform hermetic sealing, and the lid has a conductive film on a bonding surface with the package member and a surface facing the bonding surface. It is provided that the conductor film on the joint surface and the conductor film on the opposite surface are electrically connected to each other.

[0011]

[Action]

 The lid of the present invention comprises a joint surface between the package member and the lid, and a metal thin film made of titanium, aluminum, nickel, tantalum, or the like, or a semiconductor thin film made of silicon, gallium arsenide, or the like on the opposite surface of the joint surface. A conductor film is formed. Therefore, irrespective of the material of the lid, it is possible to apply a DC voltage to the lid with a positive potential and to the package member with a negative potential and to hermetically seal the package member and the lid by the anodic bonding technique.

[0012]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 (e) is a sectional view showing the configuration of the electronic component of the present invention.

As shown in FIG. 1E, it has a package member 19 for accommodating electrical parts such as a sensor, a crystal oscillator, and an oscillator, and a lid 15. Then, the lid 15 is provided with the conductor film 17 on the joint surface between the lid 15 and the package member 19 and on the surface opposite to the joint surface. Here, the conductor film 17 on the joint surface and the conductor film 17 provided on the opposite surface to the joint surface are configured to be electrically conductive.

The conductor film 17 is made of a metal thin film such as titanium, aluminum, nickel or tantalum, or a semiconductor thin film such as silicon or gallium arsenide.

The lid 15 and the package member 19 are made of a material such as glass, alumina or glass ceramics.

When alumina or glass ceramics is used for the package member 19 and the lid 15, it is necessary to provide a glass layer on the bonding surface.

Further, as shown in FIG. 1E, the present invention shows an example in which the lid 15 is provided with a concave portion, but the lid 15 may have a flat plate shape without the concave portion.

In the present invention, the anodic bonding can be performed without being influenced by the material of the lid 15, and in the anodic bonding, the electrode terminals can be directly taken out on the upper surface of the lid 15, and the workability of the anodic bonding is improved. improves.

Next, a manufacturing method for obtaining the configuration of the present invention shown in FIG. 1E will be described with reference to the sectional views of FIGS. 1A to 1E.

First, as shown in FIG. 1A, a resist 13 having a thickness of about 1 μm is formed on a substrate 11 having a good smoothness and a thickness of 0.8 mm by a spin coating method.

Next, as shown in FIG. 1B, exposure and development are performed using a photomask to form a predetermined resist pattern 14 on the substrate 11.

Next, as shown in FIG. 1C, the substrate 11 was etched to a depth of 0.4 mm using a mixed solution of hydrofluoric acid and nitric acid using the resist pattern 14 as a mask to form a recess. The lid 15 is formed.

After that, the resist pattern 14 used as the etching mask is removed, and as shown in FIG. 1D, titanium or tantalum is deposited on the entire upper surface, lower surface, and side surface of the lid 15 by vacuum deposition or sputtering. A conductor film 17 made of a metal thin film of aluminum, nickel, or the like, or a semiconductor thin film of silicon, gallium arsenide, or the like is formed to a thickness of 1 to 2 μm.

Thereafter, as shown in FIG. 1E, the lid 15 having the conductor film 17 formed on the entire surface thereof and the package member 19 made of glass are superposed on each other.

Then, the lid 15 and the package member 19 are heated to a temperature of 400 ° C., the upper surface of the lid 15 is set to a positive potential, the package member 19 is set to a negative potential, and a DC voltage of 400 V is applied by using the DC power supply 18. The voltage is applied for 10 minutes, and the lid 15 and the package member 19 are joined. The positive potential applied to the lid 15 may be applied to the side surface of the lid 15.

As for the conductor film formed on the lid, the conductor film 53 may be formed on the entire surface of the lid 51 as shown in FIG. 5A, but as shown in FIG. The conductor film 53 to be provided is configured such that the joint surface 55 and the surface opposite to the joint surface 55 are electrically connected to each other at the side surface portion 57, and the conductor film between the upper surface which is a DC voltage application portion and the joint surface 55. It suffices that the structure is such that 53 can be electrically connected.

[0027]

[Effect of device]

 As described above, by using the structure of the present invention, when anodic bonding is performed by applying a positive potential to the lid and a negative potential to the package member, the bonding between the lid and the package member depends on the material of the lid. Moreover, the electrode terminal for applying the voltage for anodic bonding can be easily taken out from the lid. Therefore, at the time of anodic bonding, it is possible to take out the terminal from the upper part of the lid by using the structure of the present invention without having to take out the electrode terminal from the joined body composed of a metal thin film or a semiconductor thin film as in the conventional case. A stable voltage can be applied at this point. This can improve the manufacturing yield.

When the lid and the package member are joined by the anodic bonding technique, it is necessary to tightly bond the lid and the package member. In the structure of the present invention, since a voltage can be applied to the upper portion of the lid, the terminal itself can be provided with a pressurizing mechanism for bringing the lid and the package member into close contact with each other for anodic bonding. This also has the effect that the structure of the jig for anodic bonding can be simplified.

Further, by providing the recess on the lid, the internal volume of the package can be increased, and the external dimensions of the electronic component can be reduced.

Furthermore, since the entire lid is covered with the conductive film, it is effective in blocking external noise and a sealing effect can be obtained in the electronic component of the high-frequency vibrator.

From the above, the structure of the present invention can achieve miniaturization and high stability of electronic components.

[Brief description of drawings]

FIG. 1 is a sectional view showing an electronic component according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view for explaining the principle of joining using an anodic joining method.

FIG. 3 is a cross-sectional view showing a method for sealing an electronic component using an anodic bonding technique.

FIG. 4 is a cross-sectional view showing a method of sealing an electronic component using an anodic bonding method in a conventional example.

FIG. 5 is a sectional view showing a structure of a conductor film provided in an electronic component according to the present invention.

[Explanation of symbols]

 11 substrate 15 lid 17 conductor film 18 DC power supply 19 package member

Claims (3)

[Scope of utility model registration request] 1. In an electronic component in which a package member and a lid are anodically bonded to hermetically seal, a lid is provided with a conductor film on a joint surface with the package member and a surface opposite to the joint surface, and a conductor on the joint surface is provided. An electronic component, wherein the film and the conductor film on the opposite surface are electrically connected to each other. 2. The electronic component according to claim 1, wherein the lid has a recess. 3. The electronic component according to claim 1, wherein the conductor film is made of a conductive metal thin film or a semiconductor thin film.