JP2008166997A - Method for manufacturing piezoelectric vibrator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the strength of a container from being reduced, even if the size and the height of the container body are reduced. <P>SOLUTION: A piezoelectric vibrator comprises: a piezoelectric vibration element in which an excitation electrode is mounted on a piezoelectric chip; a frame body made of glass; a substrate body comprising a resin film of which the expansion coefficient is close to that of the glass and provided with an aluminum layer formed, at a position where the substrate body is jointed with the frame body; and a lid body comprising a resin film, of which the expansion coefficient is close to that of the glass and provided with an aluminum layer formed on a position where the lid body is jointed with the frame body, wherein the piezoelectric vibration element is mounted on the substrate body, in a state of being surrounded by the frame body, and the frame body, the substrate body and the lid body are jointed with each other. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a piezoelectric vibrator.

Conventionally, piezoelectric vibrators have been used in electronic devices such as mobile phones. This piezoelectric vibrator is mainly composed of a base body in which a concave portion is formed by a substrate portion and a frame portion, a piezoelectric vibrator, and a lid body. The piezoelectric vibrator is mounted in the concave portion and then the concave portion is closed. In this manner, the lid is joined to the base. Hereinafter, a structure in which a lid is bonded to a base body is referred to as a container body.
Such a piezoelectric vibrator is manufactured in a wafer state. For example, a substrate made of ceramic is arranged in a matrix to form a wafer. A plurality of recesses are formed in a wafer provided with a plurality of substrates, and piezoelectric vibration elements are mounted one by one in the recesses. Thereafter, the recess is closed with a metal lid, and the recess is hermetically sealed (see, for example, Patent Document 1).
The piezoelectric vibrator manufactured as described above is required to have a smaller planar shape, a lower profile, and the like as the electronic equipment is downsized.

JP 2006-186463 A (paragraphs 0020 to 0029, FIG. 3)

  However, when the piezoelectric vibrator is downsized, it is necessary to make the base body and the lid thin, but the base body mainly made of ceramic has a limit in strength. Also, when a metal lid is used, the expansion coefficient differs between the ceramic used for the base and the metal used for the base, so that when the lid is joined to the base, thermal stress remains at the joint. In addition, the strength of the container body may not be maintained.

  Accordingly, an object of the present invention is to provide a method for manufacturing a piezoelectric vibrator that solves the above-described problems and prevents the strength of the container body from being lowered even if the size and height are reduced.

  In order to solve the above problems, a piezoelectric vibrator manufacturing method in which a piezoelectric vibrator is mounted on a substrate body and the piezoelectric vibrator is housed in a recess formed by a lid and a frame, A plurality of openings are formed in glass to form an array frame, and an aluminum layer is formed along a pattern of the array frame on a resin film close to the glass expansion coefficient, and a wiring pattern is placed at a position that fits within the openings. Forming an array substrate body, forming an array cover by forming an aluminum layer on a resin film close to the glass expansion coefficient, and anodically bonding the array cover body and the array frame body to form a recess. An array lid is formed so that the piezoelectric vibration element is mounted on the array substrate body, and the piezoelectric vibration element is housed in the recess in a state where the piezoelectric vibration element is mounted on the array substrate body. Bonded array frame and array substrate The anodically bonded hermetically sealed, the arranging substrate body and sequence frame and the sequence lid, characterized in that singulation while being bonded.

  Moreover, the present invention is characterized in that the array frame body, the array substrate body, and the array lid body are formed simultaneously or separately.

  Further, the present invention is characterized in that after mounting the piezoelectric vibration element on the array substrate body, the array lid body and the array frame body are anodically bonded to form a recess.

  The present invention is also a method for manufacturing a piezoelectric vibrator, wherein the resin film having a coefficient of expansion close to that of the glass is a resin film made of an aramid base material.

  The present invention also relates to a method of manufacturing a piezoelectric vibrator, which is any one of NiCr (nickel chromium), Ni (nickel), Cr (chromium), and Ti (titanium) before forming an aluminum layer on a resin film. One base layer is formed.

  The present invention is also a method of manufacturing a piezoelectric vibrator, wherein the underlayer is formed with a film thickness of 30 to 200 angstroms.

Thus, in the piezoelectric vibrator manufacturing method, since the array frame is made of glass and the array substrate is made of a resin film close to the expansion coefficient of glass, thermal stress at the joint is reduced when joined, and the container body It is possible to prevent a decrease in strength.
Moreover, since the arrangement substrate body is made of an aramid base material, it can be made close to the expansion coefficient of glass, so that it is possible to reduce the influence of thermal stress on the bonded portion during bonding.
Further, by providing any one base layer of NiCr (nickel chromium), Ni (nickel), Cr (chromium), and Ti (titanium) on the array substrate body and the array lid body, The bonding force of can be strengthened.
Moreover, since the film thickness of the underlayer is 30 to 200 angstroms, the bonding state with the aluminum layer can be improved.

  Next, the best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described in detail with reference to the drawings as appropriate. In each embodiment, the same constituent elements are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
FIG. 1 is a cross-sectional view showing an example of a piezoelectric vibrator.

  As shown in FIG. 1, a piezoelectric vibrator 10 according to an embodiment of the present invention mainly includes a piezoelectric vibration element 4, a frame body 2, a substrate body 1, and a lid body 3. The piezoelectric vibrator 10 becomes a container body in a state in which the frame body 2, the substrate body 1, and the lid body 3 are joined.

  The piezoelectric vibration element 4 is provided with excitation electrodes 4B opposed to both main surfaces of a piezoelectric piece 4A made of, for example, a crystal piece, and vibrates at a predetermined frequency. The piezoelectric vibration element 4 is mounted by being electrically bonded by a conductive adhesive D on a mounting pad P provided on a substrate body 1 to be described later. At this time, the piezoelectric vibration element 4 is mounted on the substrate body 1 so as to be surrounded by the frame body 2 when a later-described substrate body 1 and the frame body 2 are joined.

  The frame 2 is made of glass, and is formed in an annular shape that is rectangular in plan view with a predetermined width and thickness.

As the substrate body 1, a resin film close to the expansion coefficient of the glass of the frame body 2 is used. Here, this resin film is described as an aramid base material.
Since this substrate body 1 is an aramid base material, it has an expansion coefficient close to that of glass. Here, an aluminum layer 1A is formed on a portion of one main surface of the substrate body 1 that is bonded to the frame body 2, and the piezoelectric vibration element 4 is mounted inside the aluminum layer 1A. A mounting pattern P is formed, and a wiring pattern H is formed by the mounting pad P, the routing pattern, and the external connection terminal G. Since the aluminum layer 1A is formed on the substrate body 1, it can be easily bonded to the frame body 2 described later by anodic bonding.
The routing pattern is connected to the mounting pad P and the external connection terminal G through a through hole S provided inside the aluminum layer 1A.

As with the substrate body 1, a resin film close to the expansion coefficient of the glass of the frame body 2 is used for the lid 3. Here, this resin film is described as an aramid base material.
Since this lid 3 is an aramid base material, it has an expansion coefficient close to that of glass. Here, the aluminum layer 3 </ b> A is formed on one main surface of the lid 3. Since the aluminum layer 3A is formed on the lid 3, it can be easily joined to the frame 2 described later by anodic bonding. As will be described later, the lid body 3 serves to seal a recess formed by joining the substrate body 1 and the frame portion 2 by being joined to the frame body 2.

  The piezoelectric vibrator 10 according to the first embodiment of the present invention is joined by anodic bonding with the aluminum layer 1A of the substrate body 1 facing the frame body 2, and the aluminum layer 3A of the lid body 3 is joined to the frame body 2. The piezoelectric vibration element 4 is mounted on a mounting pad P provided on the substrate body 1 inside the frame body 2, that is, in a state surrounded by the frame body 2. ing.

As described above, since the piezoelectric vibrator 10 according to the first embodiment of the present invention is configured, it is bonded when the substrate body 1 and the frame body 2 are bonded and when the lid body 3 and the frame body 2 are bonded. Thermal stress is reduced in the part, and a decrease in strength of the container body can be prevented.
In addition, since the substrate body 1 is made of an aramid base material, it can be made close to the expansion coefficient of glass, so that it is possible to reduce the influence of thermal stress on the joint portion at the time of joining.

Next, a method for manufacturing the piezoelectric vibrator according to the first embodiment of the present invention will be described.
FIG. 2 is a perspective view showing an example of an array frame. FIG. 3 is a perspective view showing an example of the array substrate body. FIG. 4 is a perspective view showing an example of the array lid. FIG. 5 is a perspective view showing an example of a state in which the array frame and the array lid are joined. FIG. 6 is a diagram showing an example of an array frame body to which array cover bodies are joined and an array substrate body on which piezoelectric vibration elements are mounted. FIG. 7 is a diagram illustrating an example of a state in which the array frame is joined to the array substrate. FIG. 8 is a diagram illustrating an example of a cut line. FIG. 9 is a perspective view showing an example of a separated state. FIG. 10 is a flowchart showing the manufacturing process of the piezoelectric vibrator.

  First, when manufacturing the piezoelectric vibrator 10 according to the first embodiment of the present invention, the piezoelectric vibration element 4, the array frame W2, the array substrate body W1, and the array lid W3 are prepared. The piezoelectric vibration element 4 is provided with excitation electrodes 4B on both main surfaces of a piezoelectric piece 4A such as a crystal piece.

(Formation of array frame (FIG. 10, S1))
As shown in FIG. 2, the array frame W2 refers to a structure in which the above-described frames 2 are arranged in a matrix and are in a wafer state. This array frame W2 is made of glass, and rectangular openings K are provided in a matrix shape at predetermined intervals on a flat glass plate (FIG. 10, S1) to form the array frame W2 (FIG. 10). , S11). In addition, by cutting between the openings K, the frame body 2 having a rectangular shape in plan view is formed.

(Formation of array substrate body (FIG. 10, S2))
As shown in FIG. 3, the array substrate body W1 refers to a substrate in which the above-described substrate bodies 1 are arrayed in a matrix.
As this array substrate body W1, a resin film having a coefficient of expansion close to that of glass used for the frame body 2 is used. Here, this resin film is described as an aramid base material. Since the array substrate W1 is bonded to the array frame W2 in a wafer state, the aluminum layer 1A is formed on a portion of the array substrate W1 to be bonded to the array frame W2 of the aramid base material. That is, the aluminum layer 1A is formed on the array substrate W1 along the pattern of the array frame W2 (see FIG. 2). The aluminum layer 1A is formed on one main surface of the array substrate body W1 by photolithography. In this way, an array substrate body is formed.

  As shown in FIG. 10, in the manufacture of the array substrate body W1, the wiring pattern H (see FIG. 1) for applying a voltage to the piezoelectric vibration element 4 from the outside is formed before the film formation of the aluminum layer 1A. (S20) is performed. For example, the mounting pad P on which the piezoelectric vibration element 4 is mounted or the mounting pad P so that the aluminum layer 1A of the array substrate W1 is formed and is located in the opening K of the array frame W2. A lead pattern (not shown) or the like connected to is formed of a metal film. Further, the external connection terminal G made of a metal film (see FIG. 1) is a surface opposite to the surface on which the aluminum layer 1A of the array substrate body W1 is formed, and is positioned at the four corners when it is made into individual pieces. ) Is provided. In order to electrically connect the mounting pad P or the routing pattern to the external connection terminal G, a through hole S (see FIG. 1) is formed in the array substrate body W1 by sandblasting (S21). Then, a metal film is formed on the surface of the through hole S (S22), and the mounting pad P or the routing pattern and the external connection terminal G are electrically connected. In this state, the aluminum layer 1A is formed on the surface of the array substrate body W1 on which the mounting pads P and the like are formed by photolithography (S23), and the array substrate body W1 is completed (S24).

(Formation of array lid (FIG. 10, S3))
The array lid W3 refers to a structure in which the above-described lids 3 are arranged in a matrix and are in a wafer state (see FIG. 4).
For the array lid W3, a resin film having a coefficient of expansion close to that of the glass used for the frame 2 is used. Here, this resin film is described as an aramid base material. Since the array lid W3 is bonded to the array frame W2 in a wafer state, an aluminum layer 3A is formed on one main surface of the array lid W3 (S31). That is, the aluminum layer 3A is formed on the array lid W3 along the pattern of the array frame W2 (see FIG. 2). The aluminum layer 3A is formed on one main surface of the array lid W3 by photolithography. In this way, an array lid is formed (S32).

  The array frame body W2, the array substrate body W1, and the array cover body W3 may be formed at the same time, may be formed separately in separate steps, or the array frame body W2 and the array substrate body W1. The order of manufacturing the array lid W3 is not limited (see FIG. 10).

(Join of array lid and array frame (FIG. 10, S4))
As shown in FIG. 5, the array lid W3 and the array frame W2 are overlapped so that the aluminum layer 3A is in contact with the array frame W2, and the array lid W3 and the array frame W2 are joined by anodic bonding. (S4). As a result, as shown in FIGS. 5 and 6, by joining the array lid body W3 and the array frame body W2, each opening K formed in the array frame body W2 becomes a recess.

(Piezoelectric vibration elements are mounted on the array substrate (FIG. 10, S5))
As shown in FIG. 6, the piezoelectric vibrator 4 is mounted on the mounting pad P of the array substrate body W1 (S5). This piezoelectric vibrator 4 is housed in the recess.
In the piezoelectric vibration element 4, a lead pattern led from the excitation electrode 4B to the end of the piezoelectric piece 4A is formed corresponding to the mounting pad P provided on the array substrate body W1. The drawer pattern is mounted by bonding with a conductive adhesive D (see FIG. 1).

  Note that the step of mounting the piezoelectric vibration elements 4 on the array substrate W1 and the step of joining the array lid W3 and the array frame W2 may be performed simultaneously or separately. Further, after the step of mounting the piezoelectric vibration elements 4 on the array substrate W1, the step of joining the array lid W3 and the array frame W2 may be performed, or the array lid W3 and the array frame W2 are joined. After the step of performing, the step of mounting the piezoelectric vibration element 4 on the array substrate W1 may be performed.

(Joining of the arrangement substrate body and the arrangement frame body to which the arrangement lid body is joined (FIG. 10, S6))
As shown in FIGS. 6 and 7, the array substrate body W1 on which the piezoelectric vibration elements 4 are mounted and the array frame body W2 to which the array lid body W3 is bonded are joined by anodic bonding (S6).
When the array frame W2 and the array substrate W1 are bonded, the array frame W2 is formed on the array substrate W1, that is, by performing anodic bonding in a state where the array frame W2 is in contact with the formed aluminum layer 1A. The body W1 and the array frame W2 are joined.
By joining the array substrate W1 to the array frame W2, the recesses are hermetically sealed.

  Here, the array substrate body W1, the array frame body W2, and the array cover body W3 are joined in a wafer state, and the piezoelectric vibrators 10 having the piezoelectric vibration elements 4 mounted therein are arrayed in a matrix. It has become.

(Individualization (FIG. 10, S7))
The array substrate body W1, the array frame body W2, and the array lid body W3 are joined, and the piezoelectric vibrators 10 are separated into individual pieces in a matrix state (S7). The singulation is performed by dicing or the like. This singulation is cut along a cut line as shown in FIG. That is, individual changes are made by cutting between adjacent openings K, K of the array frame W2. Needless to say, the portion to be the piezoelectric vibrator 10 located on the end side cuts the joining margin portion of the array frame W2.
Thereby, the individual change is completed, and the piezoelectric vibrator 10 can be obtained (see FIG. 9).

  In addition, you may perform the leak test | inspection, printing, and various inspections which test | inspect for an airtight leak before individualization. Further, the inspection may be performed even after the separation into individual pieces, and it may be checked before shipping whether the product is a non-defective product.

As described above, since the method for manufacturing the piezoelectric vibrator 10 according to the embodiment of the present invention is configured, when the array substrate body W1 and the array frame W2 are joined, and between the array lid body W3 and the array frame W2. In this case, thermal stress is reduced at the joint, and the strength of the container body can be prevented from decreasing.
Further, since the array substrate body W1 and the array lid body W3 are made of an aramid base material, it can be made close to the expansion coefficient of glass, so that the influence of thermal stress on the joint portion during joining can be reduced.
Further, since the array frame body W2 is made of glass and the array substrate body W1 and the array cover body W3 are made of resin films close to the expansion coefficient of glass, thermal stress at the joint portion is reduced when joined, and the strength of the container body is reduced. Can be prevented. Further, since the array substrate body W1 and the array lid body W3 are made of an aramid base material, it can be made close to the expansion coefficient of glass, so that the influence of thermal stress on the joint portion during joining can be reduced.

Further, since the metal of the aluminum layer 3A is formed on the array lid W3 and the lid 3, even if an aramid base resin film is used, the same confidentiality and moisture resistance as the metal lid can be provided. . Moreover, since glass is used for the array frame W2 and the frame 2, the processing accuracy can be improved as compared with ceramic.
Since the wafers are manufactured in a lump, there are no pockets, and there is no space restriction for adhesive application and mounting of the piezoelectric vibration element, and the degree of freedom in equipment design can be improved. Further, since batch sealing is possible in the state of the wafer, productivity is improved and cost can be reduced.
Furthermore, if the manufacturing method of the piezoelectric vibrator 20 according to the second embodiment of the present invention is used, for example, the thickness of an AT crystal vibrator having a frequency of 24 MHz or more can be set to 0.2 mm at the maximum.

(Second embodiment)
FIG. 11 is a perspective view showing an example of a piezoelectric vibrator according to the second embodiment of the present invention. FIG. 12 is a flowchart showing the manufacturing process of the piezoelectric vibrator according to the second embodiment of the present invention.
As shown in FIG. 11, in the piezoelectric vibrator 20 according to the second embodiment of the present invention, the base layers 1B and 3B are provided before the aluminum layers 1A and 3A are formed on the substrate body 1 and the lid 3. This is different from the first embodiment.

  When the aluminum layer 1A is formed on the substrate body 1, a portion on which the aluminum layer 1A is formed in advance is placed under any one of NiCr (nickel chromium), Ni (nickel), Cr (chromium), and Ti (titanium). The formation 1B (refer FIG. 11) is provided. As shown in FIG. 11, in the piezoelectric vibrator 20 in this case, since the base layer 1B is provided on the substrate body 1, the bond between the base layer 1B and the aluminum layer 1A becomes strong. Bonding with the frame 2 can be strengthened.

  The underlayer 1B is formed at a thickness of 30 to 200 angstroms. When the underlayer 1B is less than 30 angstroms, the underlayer 1B becomes uneven, and uniform bonding with the aluminum layer 1A becomes difficult. In addition, when the base layer 1B exceeds 200 angstroms, the base layer 1B which is excessive when the base layer 1 is bonded to the frame body 2 adheres to the piezoelectric vibration element 4 and changes the vibration characteristics of the piezoelectric vibration element 4. Therefore, it is optimal that the underlayer 1B has a thickness of 30 to 200 angstroms.

  When the aluminum layer 3A is formed on the lid 3, the portion where the aluminum layer 3A is formed in advance is placed under any one of NiCr (nickel chromium), Ni (nickel), Cr (chromium), and Ti (titanium). The formation 3B (see FIG. 11) is provided. As shown in FIG. 11, the piezoelectric vibrator 20 in this case is provided with the base layer 3B on the lid 3, thereby strengthening the coupling between the base layer 3B and the aluminum layer 3A. Bonding with the frame 2 can be strengthened.

  Similarly to the substrate body 1, the underlayer 3B is formed at a thickness of 30 to 200 angstroms. When the underlayer 3B is less than 30 angstroms, the underlayer 3B becomes uneven, and uniform bonding with the aluminum layer 3A becomes difficult. In addition, when the base layer 3B exceeds 200 angstroms, the base layer 3B which is excessive when bonded to the frame 2 adheres to the piezoelectric vibration element 4 and changes the vibration characteristics of the piezoelectric vibration element 4. Therefore, the base layer 3B is optimally 30 to 200 angstroms thick.

Thus, even if it comprises the piezoelectric vibrator 20 which concerns on 2nd embodiment of this invention, there exists an effect similar to 1st embodiment. Further, the substrate 1 and the lid 3 are formed by providing any one of the underlayers 1B and 3B of NiCr (nickel chromium), Ni (nickel), Cr (chromium), and Ti (titanium). The bonding strength with the aluminum layers 1A and 3A can be strengthened.
In addition, since the film thickness of the underlayers 1B and 3B is 30 to 200 angstroms, the bonding state with the aluminum layers 1A and 3A can be improved.

Next, a method for manufacturing the piezoelectric vibrator 20 according to the second embodiment of the present invention will be described.
As shown in FIG. 12, the piezoelectric vibrator 20 according to the second embodiment of the present invention includes NiCr (nickel) at a position where the aluminum layer 1A is formed on the substrate body 1 before the aluminum layer 1A is formed. One base layer 1B (see FIG. 11) of any one of chromium, Ni (nickel), Cr (chromium), and Ti (titanium) is provided (S22-2). After providing the base layer 1B on the array substrate body W1, the aluminum layer 1A is formed (S23), and the array substrate body W1 is formed (S24).

  In addition, as shown in FIG. 12, before the aluminum layer 3A is formed on the lid 3, NiCr (nickel), Ni (nickel), Cr (chromium), Ti are formed at the position where the aluminum layer 3A is formed. Any one base layer 3B (see FIG. 11) of (titanium) is provided (FIG. 12, S30). After the base layer 3B is provided on the array lid W3, the aluminum layer 3A is formed (S31), and the array lid is formed (S32).

  Thus, by providing any one base layer 1B, 3B of NiCr (nickel chromium), Ni (nickel), Cr (chromium), Ti (titanium) on the array substrate body W1 and the array lid body W3, The bonding strength with the aluminum layers 1A and 3A to be formed can be strengthened. In addition, since the film thickness of the underlayers 1B and 3B is 30 to 200 angstroms, the bonding state with the aluminum layers 1A and 3A can be improved.

Further, since the metal of the aluminum layer 3A is formed on the array lid W3 and the lid 3, even if an aramid base resin film is used, the same confidentiality and moisture resistance as the metal lid can be provided. . Moreover, since glass is used for the array frame W2 and the frame 2, the processing accuracy can be improved as compared with ceramic.
Since the wafers are manufactured in a lump, there are no pockets, and there is no space restriction for adhesive application and mounting of the piezoelectric vibration element, and the degree of freedom in equipment design can be improved. Further, since batch sealing is possible in the state of the wafer, productivity is improved and cost can be reduced.
Furthermore, if the manufacturing method of the piezoelectric vibrator 20 according to the second embodiment of the present invention is used, for example, the thickness of an AT crystal vibrator having a frequency of 24 MHz or more can be set to 0.2 mm at the maximum.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment. For example, the arrangement frame body W2, the arrangement substrate body W1, and the arrangement lid body W3 may have n rows and m columns (n and m are integers). Further, when a wafer based on a circular shape is used, the number of the wafers may be reduced in stages on the basis of the diameter direction.
Further, the array lid body W3 and the aluminum layer 3A provided on the lid body 3 may be formed only on a portion of one main surface of the lid body 3 that is joined to the frame body 2.
The manufacture of the piezoelectric vibrator of the present invention is effective when manufacturing a piezoelectric vibrator having a size of 2 mm × 1.6 mm or less.

It is sectional drawing which shows an example of a piezoelectric vibrator. It is a perspective view which shows an example of an arrangement | sequence frame. It is a perspective view which shows an example of an arrangement | sequence board | substrate body. It is a perspective view which shows an example of an arrangement | sequence cover body. It is a perspective view which shows an example of the state which joined the arrangement | sequence frame body and the arrangement | sequence cover body. It is a figure which shows an example of the arrangement | sequence frame body to which the arrangement | sequence cover body was joined, and the arrangement | sequence board | substrate body in which the piezoelectric vibration element was mounted. It is a figure which shows an example of the state which joined the arrangement | sequence frame body to the arrangement | sequence board | substrate body. It is a figure which shows an example of a cut line. It is a perspective view which shows an example of the state separated into pieces. It is a flowchart which shows the manufacturing process of a piezoelectric vibrator. It is a perspective view which shows an example of the piezoelectric vibrator which concerns on 2nd embodiment of this invention. 6 is a flowchart illustrating a manufacturing process of a piezoelectric vibrator according to a second embodiment of the present invention.

Explanation of symbols

10, 20 Piezoelectric vibrator 1 Substrate body 1A, 3A Aluminum layer 1B, 3B Underlayer 2 Frame body 3 Cover body 4 Piezoelectric vibration element 4A Piezoelectric piece 4B Excitation electrode P Mounting pad S Through hole G External connection terminal H Wiring pattern K Opening Part W1 Array substrate W2 Array frame W3 Array lid

Claims (6)

A method of manufacturing a piezoelectric vibrator in which a piezoelectric vibration element is mounted on a substrate body and the piezoelectric vibration element is housed in a recess formed by a lid and a frame,
A plate-like glass is provided with a plurality of openings to form an array frame, and an aluminum layer is formed along a pattern of the array frame on a resin film having a glass expansion coefficient close to the position within the openings. A wiring pattern is formed to form an array substrate body, an aluminum layer is formed on a resin film close to the glass expansion coefficient, and an array lid body is formed.
The array lid and the array frame are anodically bonded to form a recess,
The piezoelectric vibration element is mounted on the array substrate body,
In a state where the piezoelectric vibration element is mounted on the array substrate body, the array frame body to which the array cover body is bonded and the array substrate are anodically bonded so that the piezoelectric vibration element is accommodated in the recess. Tightly sealed,
A method of manufacturing a piezoelectric vibrator, wherein the array substrate body, the array frame body, and the array cover body are separated into individual pieces.   The method for manufacturing a piezoelectric vibrator according to claim 1, wherein the array frame body, the array substrate body, and the array lid body are formed simultaneously or separately.   3. The piezoelectric vibrator according to claim 1, wherein a concave portion is formed by anodically bonding the array lid and the array frame after mounting the piezoelectric vibration element on the array substrate body. Manufacturing method.   4. The method of manufacturing a piezoelectric vibrator according to claim 1, wherein the resin film having a coefficient of expansion close to that of the glass is a resin film made of an aramid base material.   The base layer of any one of NiCr (nickel chromium), Ni (nickel), Cr (chromium), and Ti (titanium) is formed before the aluminum layer is formed on the resin film. The method for manufacturing a piezoelectric vibrator according to any one of claims 1 to 4.   6. The method of manufacturing a piezoelectric vibrator according to claim 5, wherein the underlayer is formed with a film thickness of 30 to 200 angstroms.

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