JPH0656185A - Container for transport of semiconductor wafer - Google Patents

Abstract

PURPOSE:To provide a container for transport of semiconductor wafer, of which the contained wafer holding force is increased, which displays an excellent impact cushioning force, and the adhesion of resin to which is less by improving a wafer holding jig of a wafer case for transport. CONSTITUTION:A storage frame made of P.B.T.(polybutylene terephthalate) is used, a thin piece with an approximately L-shaped cross section is divided into a large number of straps by slits of a specified length, and the thin piece becomes pin parts 23a, 24a the leading ends of which comes into contact with the bottom of the side surface of each U-shaped groove 3, when the pin parts 23a, 24a come into contact with both shoulder edges parts of a wafer 30 in the tangential direction, and recessed parts with which the edge parts of the wafer 30 come into contact are provided on the inner side of the storage frame. By this method, respective pin parts enter the edge parts of the wafer 30 with the U-shaped grooves on the wafer storage frame as a guide, and assuredly hold the outer peripheral part of the wafer, and an elastic body can be spanned between the rear surface of a case lid and the bottom of the side surface of the U-shaped groove. Therefore, the title container can come into contact with and support both shoulder parts of the wafer by a most suitable pressing force, and the pressing force does not vary even by vibration, and the wafer during transport can be totally held.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a resin wafer case for preventing damage and contamination of semiconductor wafers and for safe transportation. Changing to butylene phthalate, a wafer retainer consisting of a thin support piece having a pin part that is attached to the back surface of the case lid and comes into contact with the edge part of the wafer in a tangential direction, the tip part of which contacts the bottom of the U-shaped groove. With the tool, each pin part intrudes using the U-shaped groove of the wafer storage frame as a guide to securely press the outer peripheral part of the wafer,
The present invention relates to a shipping container for semiconductor wafers, which prevents rotation and vibration of stored wafers and reduces contamination during shipping.

[0002]

2. Description of the Related Art In recent years, the demand for semiconductor wafers has increased remarkably due to advances in electronics in all technical fields. Therefore, a large number of wafers are transported, and it is of the utmost importance to prevent damage and contamination of expensive wafers during transportation.

A conventional transport wafer case is disclosed in Japanese Patent Laid-Open No.
As disclosed in Japanese Patent Publication No. 2-33436, Japanese Patent Publication No. 2-39867, and the like, it is composed of a resin wafer storage frame, a case main body for housing the frame, a case lid, and a wafer pressing jig.

The case body accommodates a wafer storage frame in which a large number of U-shaped grooves for individually uprightly supporting a plurality of wafers are provided inside, and the peripheral portion of the case body is large to have strength. A groove or ridge for fitting is provided around the upper edge of the peripheral edge so that the case lid comes into close contact with the upper edge surface, and a concave portion for fixing the case lid to the peripheral edges of both short sides. Is formed.

The case lid is provided with a ridge or groove on its inner peripheral edge portion for fitting with the upper end surface of the peripheral edge of the main body, and is fixed to the storage main body only on both short side sides as described above. A convex portion that fits into the concave portion on the storage body side is provided.

The wafer pressing jig is a so-called inner lid, and is supported by the storage body to prevent the vibration of the wafer and to distribute the external force to the wafer to prevent damage. Therefore, the center of the inner surface of the jig is held. Is provided with two thin-walled support pieces that come into contact with the upper edge of the wafer, and further comes into contact with both upright shoulders of the wafer, and the tip is cut into a V-shape or U-shape in order to securely support this. A large number of elastic support pieces are arranged.

[0007]

Particularly, since the wafer stored in the transportation wafer case is contaminated by hitting each part in the case by vibration or the like, the contact area is kept as small as possible and held so as not to move. There is a need to.

In the conventional wafer case described above,
All of the wafer holding jigs use the elasticity of the resin support piece that is provided so as to be planted on the back surface of the case lid in the required direction.
The wafer stored in each groove of the wafer storage frame is abutted to prevent the wafer from rotating or vibrating.

As described above, the wafer pressing jig has a thin-walled support piece having a V-shaped or U-shaped notch at the tip for securely supporting the wafer, or a support piece having a U-shaped groove formed by further dividing these pieces. A large number of comb-shaped elastic pieces are used. However, although the conventional wafer pressing jig utilizes the elasticity of the resin support piece, its holding power and impact relaxation power have never been satisfactory. Further, when the case lid is covered and closed, the wafer holding jig may not be able to hold the outer peripheral portion of the wafer unless the case body and the case lid are accurately positioned.

Furthermore, the wafer holding jig works effectively, even minimizes vibrations c _d Doha, this oscillation affects not a little c _d Doha, edge portions of c _d Doha a problem that the pressing jig is attached to the polypropylene (P.P) Gaussian _et Haejji portion which is the material of c _d over wafer housing frame rubbing contact is often a.

The present invention is a semiconductor wafer in which the wafer holding jig can easily and reliably hold the outer peripheral portion of the wafer when the case lid is mounted, which enhances the holding force of the stored wafer and exhibits an excellent shock absorbing force. in shipping containers it is aimed more material of c _d over wafer accommodating frame by vibration during transportation adhere to the wafer to provide a shipping container for semiconductor wafers having the structure for preventing as much as possible to contamination.

[0012]

SUMMARY OF THE INVENTION The present invention is directed to a wafer storage frame capable of individually supporting upright a plurality of wafers in a U-shaped groove, a case main body for storing the frame, a case lid, and a wafer mounted on the lid. A container for transporting a semiconductor wafer, which is made of a holding jig and is made of polybutylene phthalate, as a material for at least a wafer storage frame.

Further, according to the present invention, in the above construction, a thin narrow support piece having two notches formed at the center of the back surface of the case lid is provided, and a thin wide support piece is also provided outside each of the thin support pieces. The wide support piece is divided into a number of strips with slits of a required length, and the tip end serves as a pin portion that abuts the bottom of the side surface of each U-shaped groove, and a concave portion that a wafer edge portion abuts is provided inside thereof. It is a container for transporting semiconductor wafers characterized by the above.

[0014]

[Action] We, the shipping container for semiconductor wafers, the results were examined for resin specific c _d Doha, polybutylene terephthalate (P.B.T)
, Polypropylene (PP), polyethylene (PP).
The present invention was completed based on the finding that it is superior to E) in abrasion resistance and that the influence on the wafer is considerably reduced in terms of resin adhesion. In the present invention, the part of the container where polybutylene terephthalate (PBT) is used is at least the wafer storage frame.

The semiconductor wafer transport container according to the present invention has two types of wafer holding jigs in addition to the above structure.
It is characterized by using a thin-walled support piece, and in particular, when the wafer is mounted on the back surface of the case lid and is tangentially contacted with the edge portions of both shoulders of each wafer standing upright, the tip end portion of the side surface of the U-shaped groove is By using the thin support piece having the pin portion that abuts on the bottom, the holding force of the wafer and the impact relaxation force, which make use of the elasticity of the resin support piece, are greatly improved, and damage and contamination during transportation can be prevented.

In the thin wide support piece according to the present invention, each pin portion of the support piece has already been placed in the wafer storage frame U from the beginning of closing the case lid.
Since it penetrates into the V-shaped groove, the U-shaped groove serves as a guide to reliably hold down the outer peripheral portion of the wafer.

In the present invention, the two thin narrow support pieces provided in the central portion on the back surface of the case lid are accommodated in the wafer storage frame with the orientation flat (hereinafter referred to as OF) portion of the wafer facing upward. Any structure can be applied as long as it is a thin plate that abuts against the edge portion and has a V-shaped or U-shaped cut at the tip and can abut against the edge portion.

In the present invention, the thin wide-width support piece tangentially contacting the edge portions of both shoulders of each wafer is provided outside the above-mentioned two thin-width narrow support pieces on the back surface of the case lid. When the wafer is divided into a large number of strips and is tangentially contacted with the edge portions of both shoulders of the wafer, the tip portion is U-shaped.
By contacting the bottom of the side surface of the U-shaped groove, in other words, bridging it between the back surface of the case lid and the bottom of the side surface of the U-shaped groove, it is possible to easily set the optimum pressing force to both shoulders of the wafer. Depending on the dimensions of the wafer and the case, the embedding position of the support piece in the back surface of the case lid, the contact position of the tip pin portion, the thickness of the support piece, the cross-sectional shape, etc. can be appropriately selected.

[0019]

【Example】

Polypropylene is a material of Example 1 c _d Doha housing frame, the two resins of polybutylene terephthalate to U _d Doha forcibly adhere, i.e., by pressing the resin on the mirror-polished surface of the c _d Doha After the resin was reciprocated up and down 30 times to adhere the resin, the adhesion of the resin was observed with a microscope. As a result of the observation, in the case of polybutylene terephthalate, the adhesion of the resin was reduced to about 1/3 as compared with the conventional polypropylene. Further, when the abrasion resistances of the two resins are compared, polypropylene is excellent at 14 mg / 1000 cy and polybutylene terephthalate is excellent at 8 mg / 1000 cy.

Embodiment 2 A semiconductor wafer transport container according to the present invention comprises a case body 1 in which a wafer storage frame 2 capable of individually supporting upright a plurality of wafers 30 in a U-shaped groove 3 is housed, and a case body 1.
The case lid 10 fitted into the upper opening of the above, and a wafer pressing jig attached to the lid. Each member is made of a known synthetic resin having a required low dust generation and a low gas emission property, and is manufactured by a known resin molding method such as injection integral molding or assembly molding of different materials.

The case body 1 contains a wafer storage frame 2 made of polybutylene terephthalate (PBT) in which a large number of U-shaped grooves 3 for individually uprightly supporting a plurality of wafers are provided. The highly rigid upper surface peripheral edge portion 4 formed by bending is provided with a fitting groove portion so that the peripheral edge portion 11 of the case lid 10 described later abuts and closely contacts with the upper end surface thereof. Packing 1 made of required soft material
2 are provided. In addition, the upper surface peripheral portion 4 of the case body 1
In order to fit the locking wing-like member 13 of the case lid 10, a cutout portion 5 is formed at each of the center lower end portions of the four outer surfaces of the peripheral edge portion 4 on the short side and the long side. Further, the projection 6 that fits into the hole of the wing-shaped member 13 is provided.

The case lid 10 is provided with a groove around its inner peripheral edge, which fits into the end face 4 of the upper surface peripheral edge 4 of the case body 1, and has wing-shaped members on the four outer peripheral portions on the short side and the long side. Thirteen
Is provided.

The wafer holding jig 20 is an integral type as shown in FIG. 4, and is constructed by fitting and assembling on the inner back surface of the case lid 10 above the wafer 30 housed in the central portion of the rectangular jig frame. Two thin-walled narrow width support pieces 21 and 22 provided with a large number of V-shaped or U-shaped grooves in the thickness direction are provided so as to abut the OF edge portion. Thin wide support pieces 23, 24
Is the thin thin narrow support piece 2 on the back of the case lid 10.
The thin pieces having a substantially L-shaped cross section, which are provided so as to be located on the outer sides of the first and the second parts 22, are divided into a number of strips by slits of a required length, and are tangentially contacted with both shoulder edge portions of the wafer 30. The tip portions are pin portions 23a and 24a that come into contact with the bottoms of the side surfaces of each U-shaped groove 3, and recesses are provided inside the pin portions 23a and 24a that come into contact with the edge portions of the wafer 30.

A plurality of wafers 30 are placed in the wafer storage frame 2
The case lid 10 is housed in the case body 1
Is mounted, but the peripheral edges 4 and 11 of the case body 1 and the case lid 10 are fitted by concavo-convex fitting, and the holes of the wing-shaped member 13 and the projections 6 in the cutouts 5 are fitted to lock the peripheral edges. Part 4, 1
Uniform and stable airtightness can be maintained over the entire surface of No. 1 and the external air pollution to the wafer 30 is greatly reduced.

The wafer pressing jig 20 incorporated in the back surface of the case lid 10 can press each wafer 30 individually by the thin and narrow support pieces 21 and 22 to press the OF portion from the top toward the bottom of the case body 1. In addition, thin wide support pieces 23, 24
The pin portions 23a and 24a of the tip end abut on the bottom of the side surface of the U-shaped groove 3 and press both shoulders of the wafer 30 from an oblique direction to surely support them. Can be completely prevented, vibration of the wafer in the case during transportation is eliminated, and particle adhesion to the wafer can be significantly reduced.

[0026]

The semiconductor wafer transport container according to the present invention has a polybutylene terephthalate (PBT) which is much more abrasion resistant than the conventional polypropylene at the portion of the container in contact with the wafer. By using, it is possible to prevent fine resin scraps from adhering to the wafer due to vibration when the container is housed, and it is highly effective in reducing contamination on the wafer surface.

The semiconductor wafer transport container according to the present invention is divided into a large number of strips by slits, and the tip portion serves as a pin portion that abuts the bottom of the side surface of each U-shaped groove, and the edge portion of the wafer is inside the pin portion. By using a thin wide supporting piece provided with a concave portion that abuts on the elastic body,
It can be bridged between the bottoms of the side faces of the V-shaped groove, and can be contacted and supported by both shoulders of the wafer with an optimum pressing force, and this pressing force does not change even with the vibration given to the container, The wafer can be completely held, vibration of the wafer is eliminated, and particle adhesion can be greatly reduced. Further, in the thin wide support piece of the present invention, since each pin portion of the support piece has already entered the U-shaped groove of the wafer storage frame from the beginning of closing the case lid, the U-shaped groove serves as a guide surely. There is an advantage that the outer peripheral portion of the wafer can be pressed.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional perspective view of a semiconductor wafer transport container according to the present invention.

FIG. 2 is a vertical sectional front view of a semiconductor wafer transport container according to the present invention.

FIG. 3 is a partial vertical sectional side view of a semiconductor wafer transport container according to the present invention.

FIG. 4 is a vertical cross-sectional perspective view of a wafer storage frame according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Case main body 2 Wafer storage frame 3 U-shaped groove 4 Peripheral part 5 Notch part 6 Protrusion 10 Case lid 11 Peripheral part 12 Packing 13 Wing-shaped member 20 Jig frame 21,22 Thin narrow width supporting piece 23 Thin wide supporting piece 23a, 24a Pin part 30 Wafer

Claims (2)

[Claims] 1. A resin comprising a wafer housing frame capable of individually supporting upright a plurality of wafers in a U-shaped groove, a case body housing the frame, a case lid, and a wafer pressing jig mounted on the lid. A container for transporting semiconductor wafers, characterized in that at least a material of a wafer storage frame is polybutylene phthalate. 2. A thin narrow support piece having two notches formed at the center of the back surface of the case lid is provided, and a thin wide support piece is also provided outside each of the thin support pieces, and the wide support piece has a required length. 7. A slit is divided into a number of strips, the tip of which serves as a pin portion that abuts on the bottom of the side surface of each U-shaped groove, and a concave portion that abuts the edge portion of the wafer is provided inside thereof. 1. A semiconductor wafer transport container according to 1.