JPH0655434A - Polishing carrier for glass wafer and its polishing method - Google Patents

Abstract

PURPOSE:To provide a polishing carrier for glass wafer and its polishing method for polishing the thin glass wafer with good accuracy and in a short time. CONSTITUTION:In a polishing carrier for thin glass wafer having a thickness of up to 1mm and used in a double-face polishing machine, the polishing carrier for glass wafer is characterized in that the gear part of a glass fiber resin-made carrier is of metal-reinforced double structure and the metal-made gear part is thicker than the glass fiber resin by 0.1-0.2mm. This polishing method uses a step-shaped polishing carrier for assuring the strength of its connection part and is used for polishing the glass wafer.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a polishing carrier for glass wafers, particularly a thin glass wafer with high precision,
The present invention also relates to a glass wafer polishing carrier that polishes in a short time and a glass wafer polishing method using the same.

[0002]

2. Description of the Related Art For polishing a glass wafer, a double-sided polishing machine for polishing both sides of the wafer at the same time is used. According to this, the glass wafer can be polished with high accuracy and high productivity. Since both sides are simultaneously polished, the polishing load applied to the wafer becomes large.

Further, when the object to be processed is a glass wafer, it is thin and fragile, and therefore the polishing carrier for polishing it is also extremely thin, but this is because of small scratches on the carrier. Since the glass itself frequently breaks and occurs during polishing, in most cases, the glass wafer as well as the polishing cloth is damaged.

[0004]

The polishing carrier is conventionally made of a vinyl chloride resin or a resin impregnated with glass fiber. However, if the thickness is thin, it can withstand the load required for polishing. Since it is also lightweight, it has the disadvantage that the polishing load and the rotation speed of the platen cannot be increased, which increases the polishing time.

For this reason, it has been proposed that the polishing carrier be made of metal. However, when this polishing carrier comes into contact with the glass wafer, scratches are generated on the end face of the wafer. A method for avoiding contact with the
No. 64, refer to Japanese Patent Laid-Open No. 2-30829), but when the object to be processed is thin, the strength of the cushioning material cannot be obtained, resulting in damage to the wafer. In this case, the weight is large. In addition, there is also a disadvantage that the probability of the wafer popping out and being damaged by inertia during rotation increases.

[0006]

SUMMARY OF THE INVENTION The present invention relates to a glass wafer polishing carrier and a polishing method therefor which have solved such disadvantages. The glass wafer polishing carrier has a thickness of 1 mm or less used in a double-side polishing machine. A polishing carrier for glass wafers, characterized in that the gear part of the glass fiber resin carrier has a double structure reinforced with metal, and the metal gear part is 0.1 to 0.2 mm thicker than the glass fiber resin. This polishing method is characterized in that the glass wafer is polished using a polishing carrier having a stepped shape in order to secure the strength of the bonded portion.

That is, as a result of various investigations by the present inventors to develop a polishing carrier for glass wafers which can solve the above-mentioned disadvantages, the polishing carrier for glass wafers is made of glass fiber resin. If the metal gear part has a double structure and the metal gear part is 0.1 to 0.2 mm thicker than the glass fiber resin, the part where the wafer is loaded is made of glass fiber resin to soften the impact. Therefore, the edge of the wafer is not scratched, and the parts that come into contact with the sun gear and internal gear of this polishing machine are made of metal, so no wear or damage can be seen here, and the friction resistance during rotation It is found that the polishing of the glass wafer can be carried out efficiently as the polishing load is reduced, and this also increases the weight. The present invention has been completed by confirming that the disc rotation speed can be increased and the polishing speed can be increased. This will be described in more detail below.

[0008]

The present invention relates to a polishing carrier for glass wafers and a polishing method therefor. This polishing carrier is a polishing carrier for glass wafers having a thickness of 1 mm or less and used in a double-side polishing machine. Is a metal-reinforced double structure, and the metal gear part is made 0.1 to 0.2 mm thicker than the glass fiber resin.This polishing method is stepped to secure the strength of the joint part. The glass carrier is characterized by polishing the glass wafer with a shaped polishing carrier, which provides an advantage that the glass wafer can be efficiently polished without damage.

The polishing carrier for glass wafers of the present invention has a double structure in which the gear portion of the glass fiber resin carrier is reinforced with metal. For example, as shown in FIG. 1, a substrate provided with a glass wafer charging hole is made of glass fiber resin, and its outer peripheral gear portion is a double gear structure made of a metal gear.

This polishing carrier has a double structure reinforced with metal because the strength analysis of a conventionally known polishing carrier reveals that the gear portion on the outer periphery of the carrier is the most fragile. The present invention finds that when this part is made of a metal having excellent wear resistance and corrosion resistance, for example, stainless steel, aluminum die casting, the tensile strength of the carrier gear part is increased and the carrier is not damaged from the gear part. It is based on new knowledge, but if this whole carrier is made of metal, it is likely to get chips on the end surface of the glass wafer,
The inner peripheral portion into which the glass wafer is charged is made of glass fiber resin that does not damage the end surface of the glass wafer, and the outer gear portion is made of metal.

The glass wafer polishing carrier of the present invention has a double structure in which the gear portion of the glass fiber resin polishing carrier is reinforced with metal as described above. The thickness is 0.1 to 0.2 mm thicker than the glass fiber resin part. If the thickness of this metal gear portion is made thicker than the glass fiber resin portion, the friction resistance with the polishing cloth is reduced because only the contact between the metal gear portion and the cloth is made, not the entire surface of the carrier. The load on the gear is further reduced, thus providing the advantage of increased abrasive load.

In the polishing carrier for glass wafers of the present invention, since the gear portion of the polishing carrier is reinforced by the metal, the weight increases, so that the polishing load and the rotation speed of the platen are increased. Although the polishing time can be shortened to about 1/2 compared with the conventional method by increasing it, if it is made too heavy, there is a disadvantage that chips are generated due to the contact between the carrier and the wafer. It is desirable to use 80% or more of the glass fiber resin.

The polishing of the glass wafer by the polishing carrier for glass wafer of the present invention may be performed by using the above-mentioned polishing carrier for glass wafer. Regarding this polishing carrier, the glass fiber resin and the metal constituting the same are bonded. As shown in FIG. 2, the joint surface between the glass fiber resin and the metal gear may be stepped in order to increase the property, and epoxy resin or the like may be applied to the joint surface to firmly bond the both. Well, according to this, the polishing load can be doubled or more than that of the conventional one, so that there is an advantage that the polishing time can be further shortened.

[0014]

EXAMPLES Next, examples and comparative examples of the present invention will be described. Examples, Comparative Examples A glass wafer having a diameter of 4 inches φ and a thickness of 0.5 mm was polished for 100 minutes with a double-side polishing machine type 12B (trade name, manufactured by Fujikoshi Machine Industry Co., Ltd.). The polishing carrier used at this time was a stainless steel metal gear for the outer peripheral width of 15 mm of glass fiber resin with a diameter of 304 mmφ, but for comparison, this is a glass that is not reinforced with this metal gear. The thing made from fiber resin was used.

In this case, the carrier has a plate thickness of 0.4 μm, the polishing cloth is a primary polish cloth, the concentration of the abrasive slurry is 12.3%, and the polishing load is 2
0, 40, 60, 80g / cm ² , motor speed 500, 800r.pm
As a result of polishing as described above, the results shown in FIG. 3 were obtained for the polishing load and the polishing speed.

Regarding the results of this experiment, the polishing speed based on the motor rotation speed and the polishing load was the result shown in Table 1 in the example, and the result shown in table 2 in the comparative example. The load could be applied up to 80 kg / cm ² , the motor speed could exceed 800 rpm, and the polishing speed could be increased to 0.308 μm / min. Was damaged at 60 kg / cm ² , and the motor rotation speed was 40 kg / cm ² , 800
It was damaged by rpm and the polishing speed was limited to 0.145 μm / min.

[0017]

[Table 1]

[Table 2]

[0018]

INDUSTRIAL APPLICABILITY The present invention relates to a glass wafer polishing carrier and a polishing method therefor. As described above, this is a thin glass wafer polishing carrier having a thickness of 1 mm or less used in a double-side polishing machine. It is characterized by having a double structure in which the gear part of the carrier made of metal is reinforced with metal, and the gear part made of metal is 0.1 to 0.2 mm thicker than the glass fiber resin. Because the strength of the
The platen rotation speed can be increased, and therefore, the polishing time can be reduced to 1/2 or less of that of the conventional method, and further, the destruction rate of the wafer can be reduced, which is advantageous.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a glass wafer polishing gear of the present invention.

FIG. 2 is a vertical sectional view of a polishing gear for a glass wafer according to the present invention.

FIG. 3 is a graph showing a correlation diagram between polishing load and polishing speed in Examples and Comparative Examples of the present invention.

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[Procedure amendment]

[Submission date] August 2, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Title of invention

[Correction method] Change

[Correction content]

Polishing carrier for glass wafer [name of invention] and Migaku Ken method

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Masatoshi Takita 28, Nishi-Fukushima, Chugaku-mura, Nakakubiki-gun, Niigata Prefecture 1 Shin-Etsu Chemical Co., Ltd.

Claims (3)

[Claims] 1. A polishing carrier for a thin glass wafer having a thickness of 1 mm or less, which is used for a double-side polishing machine, has a double structure in which the gear portion of a carrier made of glass fiber resin is reinforced with metal, and the metal gear portion is made of glass. 0.1 to 0.2 mm from fiber resin
A polishing carrier for a glass wafer, which is characterized by being thick. 2. The ratio of the glass fiber resin portion to that of the entire carrier
The polishing carrier for glass wafer according to claim 1, wherein the polishing carrier is 80% or more. 3. A method of polishing a glass wafer, which comprises polishing the glass wafer using the polishing carrier according to claim 1, wherein the bonded portion has a stepped shape for ensuring strength.