JPH065474A - Solid electrolytic capacitor - Google Patents

Solid electrolytic capacitor

Info

Publication number
JPH065474A
JPH065474A JP16082292A JP16082292A JPH065474A JP H065474 A JPH065474 A JP H065474A JP 16082292 A JP16082292 A JP 16082292A JP 16082292 A JP16082292 A JP 16082292A JP H065474 A JPH065474 A JP H065474A
Authority
JP
Japan
Prior art keywords
solid electrolytic
electrolytic capacitor
resin
external connection
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16082292A
Other languages
Japanese (ja)
Other versions
JP3291762B2 (en
Inventor
Naoki Anzai
直樹 安西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemi Con Corp
Original Assignee
Nippon Chemi Con Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp
Priority to JP16082292A priority Critical patent/JP3291762B2/en
Publication of JPH065474A publication Critical patent/JPH065474A/en
Application granted granted Critical
Publication of JP3291762B2 publication Critical patent/JP3291762B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a solid electrolytic capacitor which can be simply manufactured at a low cost and has a terminal structure for external connection capable of preventing defective packaging. CONSTITUTION:A terminal 40 for external connection is constituted of a metal foil layer 44 previously coated with an adhesive agent layer 42 composed of epoxy based resin or the like having large adhesion to sealing resin 16 and a resin case 14, and a weld part 24 of the metal foil 44 and an inner electrode 20 are welded by using laser welding or the like. In this case, the adhesive agent layer 42 of the weld part 24 may be omitted.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、小形電子機器で使用さ
れるプリント基板等への表面実装用に適したリードレス
形の固体電解コンデンサに係り、殊にその外部接続用端
子構造の改良に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a leadless type solid electrolytic capacitor suitable for surface mounting on a printed circuit board or the like used in small electronic equipment, and more particularly to improvement of a terminal structure for external connection thereof. .

【0002】[0002]

【従来の技術】一般に、電子機器の小形化あるいは携帯
化の要望に伴い、これら機器に使用する固体電解コンデ
ンサにおいては、その小形化と表面実装の容易性が要求
される。このため、現在では、従来のリード端子付きの
ものからリードレスのものへと変更されるに至ってい
る。
2. Description of the Related Art Generally, in response to a demand for miniaturization and portability of electronic equipment, solid electrolytic capacitors used in these equipment are required to be compact and easy to be surface-mounted. For this reason, at present, the conventional lead terminal type is changed to the leadless type.

【0003】そこで、この種のリードレス形の固体電解
コンデンサについて簡単に説明すると、図3において、
固体電解コンデンサ10は、コンデンサ素子12(図5
を併せ参照)を樹脂ケース14内に収納し、エポキシ樹
脂等の封口用ポッティング樹脂16で封口した後、この
封口側を切断してその切断面18(図5)にコンデンサ
素子12の内部電極20、20を露出し、次いでこの内
部電極20、20に接続する外部接続用端子22、22
を折曲げ加工して、前記切断面18および前記樹脂ケー
ス14の一側面14aに跨がるよう取着した構成からな
る。なお、内部電極20と外部接続用端子22の切断面
18側折曲片22aとは、通常レーザー溶接24(図
5)により接着される。そして、この固体電解コンデン
サ10は、図4および図5に示されるように、外部接続
用端子22の樹脂ケース14側折曲片22bを、プリン
ト基板26に対接するよう、これに半田付け28して表
面実装される。
A brief description of this type of leadless solid electrolytic capacitor will now be given with reference to FIG.
The solid electrolytic capacitor 10 includes a capacitor element 12 (see FIG.
Is also housed in a resin case 14 and sealed with a potting resin 16 for sealing, such as an epoxy resin, the sealing side is cut, and the cut surface 18 (FIG. 5) is provided with an internal electrode 20 of the capacitor element 12. , 20 exposed and then connected to the internal electrodes 20, 20 for external connection terminals 22, 22
Is bent and attached so as to straddle the cut surface 18 and one side surface 14a of the resin case 14. The internal electrode 20 and the bent piece 22a on the side of the cut surface 18 of the external connection terminal 22 are usually bonded by laser welding 24 (FIG. 5). In this solid electrolytic capacitor 10, as shown in FIGS. 4 and 5, the bent piece 22b on the resin case 14 side of the external connection terminal 22 is soldered 28 to the printed circuit board 26 so as to be in contact with the printed circuit board 26. Surface mounted.

【0004】しかるに、前記従来の固体電解コンデンサ
10は、外部接続用端子22が、その切断面側折曲片2
2aの内部電極20部分においてのみ接着され、樹脂ケ
ース側折曲部分22bはフリーとなっている。このた
め、半田付け28による実装に際し、外部接続用端子2
2に拡開方向の力が作用すると、固体電解コンデンサ1
0が矢印29方向に持ち上げられる(ツームストーン現
象もしくはマンハッタン現象)ばかりではなく、場合に
よつては内部電極20部分のレーザー溶接24が剥離す
る不都合(以下、実装不良という)を生じていた。
In the conventional solid electrolytic capacitor 10, however, the external connection terminal 22 has the cut surface side bent piece 2.
Only the internal electrode 20 of 2a is bonded, and the resin case side bent portion 22b is free. Therefore, when mounting by soldering 28, the external connection terminal 2
When a force in the expanding direction acts on 2, the solid electrolytic capacitor 1
0 is not only lifted in the direction of the arrow 29 (tombstone phenomenon or Manhattan phenomenon), but in some cases, the laser welding 24 at the internal electrode 20 portion peels off (hereinafter referred to as mounting failure).

【0005】そこで、本出願人は、先に、このような実
装不良を防止する新規な技術を開発し、特許出願等を行
った(特願平3−347269号および実願平3−50
928号)。以下、これらの技術について簡単に説明す
ると、前者は、図6に示すように、外部接続用端子22
の樹脂ケース側折曲片22b端部22cを、樹脂ケース
側面14a内に埋込み固定するよう構成した(以下、折
曲片固定手段と称する)ものである。また、後者は、図
7に示すように、基本的には、外部接続用端子22の切
断面側折曲片22aおよび/もしくは樹脂ケース側折曲
片22bを、耐熱性絶縁テープ30で被覆保持するよう
構成した(以下、保持テープ手段と称する)ものでお
る。したがつて、これの技術によれば、半田付け実装に
際し、外部接続用端子22に拡開方向の力が作用して
も、実装不良が発生することはない。
Therefore, the present applicant previously developed a new technique for preventing such a mounting defect and filed a patent application (Japanese Patent Application No. 3-347269 and Japanese Utility Model Application No. 3-50).
928). Hereinafter, these techniques will be briefly described. In the former case, as shown in FIG.
The resin case side bent piece 22b end portion 22c is configured to be embedded and fixed in the resin case side surface 14a (hereinafter, referred to as bent piece fixing means). In the latter, as shown in FIG. 7, basically, the cut surface side bent piece 22a and / or the resin case side bent piece 22b of the external connection terminal 22 are covered and held by the heat resistant insulating tape 30. (Hereinafter, referred to as a holding tape means). Therefore, according to this technique, when soldering and mounting, even if a force in the expanding direction acts on the external connection terminal 22, the mounting failure does not occur.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、前述し
た従来技術には、なお改善されるべき難点を有してい
た。すなわち、先ず、前者の折曲片固定手段は、折曲片
端部を樹脂ケース側面に押圧しながら超音波もしくは熱
を印加することにより、前記端部を樹脂ケース側面内へ
埋込み固定するものであり、また、後者の保持テープ手
段は、耐熱性樹脂テープを切断面(封口樹脂)および樹
脂ケース側面に加熱押圧することにより、前記テープを
切断面および樹脂ケース側面に熱圧着するものである。
しかしながら、これらの操作は、いずれも繁雑かつ多工
程を必要とし、このため製品コストが上昇する難点を有
していた。
However, the above-mentioned conventional techniques still have drawbacks to be improved. That is, first, the former bent piece fixing means is to embed and fix the end of the bent piece by applying ultrasonic waves or heat while pressing the end of the bent piece against the side surface of the resin case. The latter holding tape means heat-presses the heat-resistant resin tape to the cut surface (sealing resin) and the side surface of the resin case, thereby thermocompressing the tape to the cut surface and the side surface of the resin case.
However, all of these operations are complicated and require many steps, which causes a problem of increasing the product cost.

【0007】そこで、本発明の目的は、簡単かつ安価に
製造できると共に、実装不良を確実に防止することがで
きる固体電解コンデンサを提供することにある。
Therefore, an object of the present invention is to provide a solid electrolytic capacitor which can be manufactured easily and inexpensively and which can surely prevent mounting failure.

【0008】[0008]

【課題を解決するための手段】先の目的を達成するため
に、本発明に係わる固体電解コンデンサは、コンデンサ
素子を樹脂ケース内に収納して樹脂で封口した後、この
封口側を切断して前記コンデンサ素子の内部電極を露出
し、次いでこの内部電極に接続する外部接続用端子を折
曲げ加工して前記切断面および前記樹脂ケースの一側面
に跨がるよう取着してなる固体電解コンデンサにおい
て、前記外部接続用端子を、封口樹脂および樹脂ケース
に対して強い接着性を有する接着剤層を予め被覆した金
属箔層により構成し、前記金属箔と前記内部電極との対
接部を溶接するよう構成することを特徴とする。
In order to achieve the above object, a solid electrolytic capacitor according to the present invention is constructed such that a capacitor element is housed in a resin case and sealed with resin, and then the sealing side is cut. A solid electrolytic capacitor in which an internal electrode of the capacitor element is exposed, and then an external connection terminal connected to the internal electrode is bent and attached so as to straddle the cut surface and one side surface of the resin case. In the above, the external connection terminal is constituted by a metal foil layer which is previously coated with an adhesive layer having strong adhesiveness to a sealing resin and a resin case, and a contact portion between the metal foil and the internal electrode is welded. It is characterized in that it is configured to.

【0009】前記の固体電解コンデンサにおいて、接着
剤は、エポキシ系接着剤で構成し、また、金属箔と内部
電極との対接部は、レーザー溶接すると共に前記対接部
分の接着剤層を欠如するように構成することができる。
In the above solid electrolytic capacitor, the adhesive is composed of an epoxy adhesive, and the contact portion between the metal foil and the internal electrode is laser welded and the adhesive layer at the contact portion is absent. Can be configured to.

【0010】[0010]

【作用】本発明の電解コンデンサによれば、外部接続用
端子を、強い接着剤層を有する金属箔層を接着すること
により構成することができる。したがって、製造工程が
簡単となり、安価に製造し得ると共に、封口樹脂および
樹脂ケースに対する接着を強固にして、実装不良を確実
に防止することができる。
According to the electrolytic capacitor of the present invention, the external connection terminal can be formed by bonding the metal foil layer having the strong adhesive layer. Therefore, the manufacturing process can be simplified, the manufacturing can be performed at low cost, and the adhesion to the sealing resin and the resin case can be strengthened to reliably prevent the mounting failure.

【0011】[0011]

【実施例】次に、本発明に係る固体電解コンデンサの実
施例につき、添付図面を参照しながら以下詳細に説明す
る。なお、説明の便宜上、図3乃至図7に示す従来の構
造と同一の構成部分には同一の参照符号を付し、詳細な
説明は省略する。
Embodiments of the solid electrolytic capacitor according to the present invention will be described below in detail with reference to the accompanying drawings. For convenience of explanation, the same components as those of the conventional structure shown in FIGS. 3 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.

【0012】先ず初めに、本発明に係る固体電解コンデ
ンサの構成は、基本的には、前述した従来のそれと同一
である。すなわち、重複するが再び説明すると、図1お
よび図2において、固体電解コンデンサ10は、コンデ
ンサ素子12を樹脂ケース14内に収納し、封口用ポッ
ティング樹脂16で封口した後、この封口側を切断して
その切断面18にコンデンサ素子12の内部電極20、
20を露出し、次いでこの内部電極20、20に接続す
る外部接続用端子40、40を、前記切断面18および
前記樹脂ケース14の側面に跨がるように形成すること
によって構成される。
First, the structure of the solid electrolytic capacitor according to the present invention is basically the same as that of the conventional one described above. That is, although overlapping, it will be explained again. In FIG. 1 and FIG. 2, the solid electrolytic capacitor 10 stores the capacitor element 12 in the resin case 14, seals it with the potting resin 16 for sealing, and then cuts this sealing side. The internal electrode 20 of the capacitor element 12 on the cut surface 18 of the lever,
20 is exposed, and external connection terminals 40, 40 connected to the internal electrodes 20, 20 are formed so as to straddle the cut surface 18 and the side surface of the resin case 14.

【0013】しかるに、本実施例の前記外部接続用端子
40は、封口樹脂16および樹脂ケース14に対して強
い接着性を有する接着剤層42、好ましくは、エポキシ
系樹脂からなる接着剤層を、予め被覆した金属箔層44
により構成する。そして、この金属箔44と内部電極2
0との対接部を、レーザー溶接等により溶接24(図
2)する。なお、この場合、前記対接部分の接着剤層4
2は、欠如させても良い。
However, in the external connection terminal 40 of this embodiment, an adhesive layer 42 having a strong adhesiveness to the sealing resin 16 and the resin case 14, preferably an adhesive layer made of an epoxy resin, is used. Pre-coated metal foil layer 44
It consists of. Then, the metal foil 44 and the internal electrode 2
The contact portion with 0 is welded 24 (FIG. 2) by laser welding or the like. In this case, the adhesive layer 4 at the contact portion
2 may be omitted.

【0014】このように、本発明によれば、外部接続用
端子は、強い接着剤層を有する金属箔層を接着すること
により構成し得るので、製造工程が簡単となり、安価に
製造し得ると共に、封口樹脂および樹脂ケースに対する
接着も強固となり、実装不良を確実に防止することがで
きる。
As described above, according to the present invention, the external connection terminal can be formed by bonding the metal foil layer having the strong adhesive layer, so that the manufacturing process is simplified and the cost can be reduced. Also, the adhesion to the sealing resin and the resin case becomes firm, and the mounting failure can be surely prevented.

【0015】以上、本発明の好適な実施例について説明
したが、本発明は前記実施例に限定されることなく、そ
の精神を逸脱しない範囲内において多くの設計変更が可
能である。
Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and many design changes can be made without departing from the spirit thereof.

【0016】[0016]

【発明の効果】以上説明したように、本発明に係る固体
電解コンデンサは、コンデンサ素子を樹脂ケース内に収
納して樹脂で封口した後、この封口側を切断して前記コ
ンデンサ素子の内部電極を露出し、次いでこの内部電極
に接続する外部接続用端子を折曲げ加工して、前記切断
面および前記樹脂ケースの側面に跨がるよう取着した構
成において、前記外部接続用端子を、前記封口樹脂およ
び前記樹脂ケースに対して強い接着性を有する接着剤層
を予め被覆した金属箔層により構成し、前記金属箔と前
記内部電極との対接部を溶接して構成したことにより、
外部接続用端子を、強い接着剤層を有する金属箔層を接
着することによって製造することができ、したがって製
造工程が簡単となり、安価に製造し得ると共に、封口樹
脂および樹脂ケースに対する接着を強固にして実装不良
を確実に防止することができる。
As described above, in the solid electrolytic capacitor according to the present invention, the capacitor element is housed in the resin case and sealed with resin, and then the sealing side is cut to remove the internal electrode of the capacitor element. In a configuration in which the external connection terminal to be exposed and then connected to the internal electrode is bent and attached so as to straddle the cut surface and the side surface of the resin case, the external connection terminal is connected to the sealing member. An adhesive layer having a strong adhesiveness with respect to the resin and the resin case is constituted by a metal foil layer coated in advance, and the metal foil and the internal electrode are formed by welding the contacting portion.
The external connection terminal can be manufactured by adhering a metal foil layer having a strong adhesive layer, which simplifies the manufacturing process, can be manufactured at low cost, and strengthens the adhesion to the sealing resin and the resin case. It is possible to reliably prevent mounting defects.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る固体電解コンデンサの一実施例を
示す斜視図である。
FIG. 1 is a perspective view showing an embodiment of a solid electrolytic capacitor according to the present invention.

【図2】図1のII−II線断面図である。FIG. 2 is a sectional view taken along line II-II in FIG.

【図3】従来の固体電解コンデンサの外部接続用端子構
造を示す斜視図である。
FIG. 3 is a perspective view showing a structure of a terminal for external connection of a conventional solid electrolytic capacitor.

【図4】図3に示す固体電解コンデンサのプリント基板
上への実装状態を示す斜視図である。
FIG. 4 is a perspective view showing a mounting state of the solid electrolytic capacitor shown in FIG. 3 on a printed board.

【図5】図4のV−V線断面図である。5 is a sectional view taken along line VV of FIG.

【図6】従来の固体電解コンデンサの外部接続用端子構
造の別の構成例を示す斜視図である。
FIG. 6 is a perspective view showing another configuration example of a conventional external connection terminal structure of a solid electrolytic capacitor.

【図7】従来の固体電解コンデンサの外部接続用端子構
造のさらに別の構成例を示す斜視図である。
FIG. 7 is a perspective view showing still another configuration example of the external connection terminal structure of the conventional solid electrolytic capacitor.

【符号の説明】[Explanation of symbols]

10 固体電解コンデンサ 12 コンデンサ
素子 14 樹脂ケース 14a 側面 16 封口樹脂 18 切断面 20 内部電極 24 溶接(対
接)部 26 プリント基板 28 半田付け 30 耐熱性絶縁テープ 40 外部接続用
端子 42 接着剤層 44 金属箔層
10 Solid Electrolytic Capacitor 12 Capacitor Element 14 Resin Case 14a Side 16 Sealing Resin 18 Cut Surface 20 Internal Electrode 24 Welding (Contact) 26 Printed Circuit Board 28 Soldering 30 Heat Resistant Insulation Tape 40 External Connection Terminal 42 Adhesive Layer 44 Metal Foil layer

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 コンデンサ素子を樹脂ケース内に収納し
て樹脂で封口した後、この封口側を切断して前記コンデ
ンサ素子の内部電極を露出し、次いでこの内部電極に接
続する外部接続用端子を折曲げ加工して前記切断面およ
び前記樹脂ケースの一側面に跨がるよう取着してなる固
体電解コンデンサにおいて、前記外部接続用端子を、封
口樹脂および樹脂ケースに対して強い接着性を有する接
着剤層を予め被覆した金属箔層により構成し、前記金属
箔と前記内部電極との対接部を溶接するよう構成するこ
とを特徴とする固体電解コンデンサ。
1. A capacitor element is housed in a resin case and sealed with a resin. Then, the sealing side is cut to expose an internal electrode of the capacitor element, and an external connection terminal for connecting to the internal electrode is then provided. In a solid electrolytic capacitor that is bent and attached so as to straddle the cut surface and one side surface of the resin case, the external connection terminal has strong adhesion to the sealing resin and the resin case. A solid electrolytic capacitor, characterized in that the adhesive layer is composed of a metal foil layer coated in advance, and a contact portion between the metal foil and the internal electrode is welded.
【請求項2】 金属箔層の内部電極との対接部分は、接
着剤層が欠如してなる請求項1記載の固体電解コンデン
サ。
2. The solid electrolytic capacitor according to claim 1, wherein an adhesive layer is absent at a contact portion of the metal foil layer with the internal electrode.
JP16082292A 1992-06-19 1992-06-19 Solid electrolytic capacitors Expired - Fee Related JP3291762B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16082292A JP3291762B2 (en) 1992-06-19 1992-06-19 Solid electrolytic capacitors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16082292A JP3291762B2 (en) 1992-06-19 1992-06-19 Solid electrolytic capacitors

Publications (2)

Publication Number Publication Date
JPH065474A true JPH065474A (en) 1994-01-14
JP3291762B2 JP3291762B2 (en) 2002-06-10

Family

ID=15723166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16082292A Expired - Fee Related JP3291762B2 (en) 1992-06-19 1992-06-19 Solid electrolytic capacitors

Country Status (1)

Country Link
JP (1) JP3291762B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009065140A (en) * 2008-08-08 2009-03-26 Sanyo Electric Co Ltd Solid electrolytic capacitor
JP2009064808A (en) * 2007-09-04 2009-03-26 Sanyo Electric Co Ltd Solid electrolytic capacitor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009064808A (en) * 2007-09-04 2009-03-26 Sanyo Electric Co Ltd Solid electrolytic capacitor
JP2009065140A (en) * 2008-08-08 2009-03-26 Sanyo Electric Co Ltd Solid electrolytic capacitor

Also Published As

Publication number Publication date
JP3291762B2 (en) 2002-06-10

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