JPH0651883A - Mounting structure for electronic parts - Google Patents
Mounting structure for electronic partsInfo
- Publication number
- JPH0651883A JPH0651883A JP4223346A JP22334692A JPH0651883A JP H0651883 A JPH0651883 A JP H0651883A JP 4223346 A JP4223346 A JP 4223346A JP 22334692 A JP22334692 A JP 22334692A JP H0651883 A JPH0651883 A JP H0651883A
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- pin
- mounting structure
- housing
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
- H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
- H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2103/00—Two poles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品の実装構造に
係り、とくにＬＳＩパッケージを実装する電子部品の実
装構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting structure, and more particularly to an electronic component mounting structure for mounting an LSI package.
【０００２】[0002]
【従来の技術】従来の電子部品の実装構造を図５に示
す。図５において、多層のプリント基板５１には、多極
コネクタ５２が実装され、この多極コネクタ５２には、
ＬＳＩ５６が４個実装されたＬＳＩパッケージ５５が実
装されている。このうち、ＬＳＩパッケージ５５には、
下面に複数本のピン５７が突設されている。また、多極
コネクタ５２には、下端にリードが接続されたソケット
コンタクト５３が挿着され、このうち、図５において左
端のソケットコンタクト５３に接続されたリード５４Ａ
はプリント基板５１の電源パターン６１に接続され、中
央のリード５４Ｂはプリント基板５１の信号パターン６
２に接続され、右端のリード５４Ｃはグランドパターン
６３に接続されるとともに、プリント基板５１の下方か
ら挿入されるケーブルコネクタ５８に接続されている。2. Description of the Related Art A conventional mounting structure for electronic components is shown in FIG. In FIG. 5, a multi-pole connector 52 is mounted on the multilayer printed board 51, and the multi-pole connector 52 is
An LSI package 55 in which four LSIs 56 are mounted is mounted. Of these, the LSI package 55
A plurality of pins 57 are provided on the lower surface so as to project. Further, a socket contact 53 having a lead connected to the lower end is inserted into the multipolar connector 52, and a lead 54A connected to the socket contact 53 at the left end in FIG.
Is connected to the power supply pattern 61 of the printed circuit board 51, and the central lead 54B is the signal pattern 6 of the printed circuit board 51.
2, the right end lead 54C is connected to the ground pattern 63, and is also connected to the cable connector 58 inserted from below the printed circuit board 51.
【０００３】このように構成された電子部品の実装構造
においては、ＬＳＩパッケージ５５のピン５７がソケッ
トコンタクト５３に挿入されることで、ＬＳＩパッケー
ジ５５は多極コネクタ５２に固定され、ソケットコンタ
クト５３を介してリード５４Ａ、５４Ｂ、５４Ｃに接続
される。In the electronic component mounting structure thus configured, the pins 57 of the LSI package 55 are inserted into the socket contacts 53, whereby the LSI package 55 is fixed to the multipolar connector 52 and the socket contacts 53 are fixed. It is connected to the leads 54A, 54B, 54C via.
【０００４】また、ＬＳＩパッケージ５５への電源供給
は、プリント基板５１に形成された電源パターン６１と
グランドパターン６３からソッケトコンタクト５３を経
て、ピン５７からＬＳＩ５６に供給される。一方、信号
は、ピン５７からソッケトコンタクト５３を経て、プリ
ント基板５１の信号パターン６２及びケーブルコネクタ
５８に伝送される。Power is supplied to the LSI package 55 from the power pattern 61 and the ground pattern 63 formed on the printed board 51 through the socket contacts 53, and from the pins 57 to the LSI 56. On the other hand, the signal is transmitted from the pin 57 through the socket contact 53 to the signal pattern 62 of the printed circuit board 51 and the cable connector 58.
【０００５】ところで、近年、ＬＳＩパッケージに搭載
されるＬＳＩがますます高集積化されるに伴ない、消費
電力も増える傾向にある。By the way, in recent years, as the LSI mounted in the LSI package has become more highly integrated, the power consumption tends to increase.
【０００６】[0006]
【発明が解決しようとする課題】ところが、このように
構成された電子部品の実装構造においては、次のような
問題がある。 （１）消費電力の増加に伴ないプリント基板の電源パタ
ーンやグランドパターンの層数を増やす必要があり、す
ると、アスペクト比（板厚／スルーホール径）が増え、
プリント基板の製造が難しくなる。 （２）電流通過パスがプリント基板５１、多極コネクタ
５２、ピン５７と長くなり、電圧降下が増える。 （３）信号伝送の面から見ると、伝送路はピン５７、ソ
ケットコンタクト５３、リード５４、ケーブルコネクタ
５８となり、非常に長い伝送路となるだけでなく、多極
コネクタ５２を経由するため、インピーダンスの不連続
を発生す ることにより、高速伝送には適さない。However, the electronic component mounting structure thus configured has the following problems. (1) It is necessary to increase the number of layers of the power supply pattern and the ground pattern of the printed circuit board as the power consumption increases. Then, the aspect ratio (plate thickness / through hole diameter) increases,
Manufacturing of printed circuit boards becomes difficult. (2) The current passing path becomes longer with the printed circuit board 51, the multi-pole connector 52, and the pin 57, and the voltage drop increases. (3) From a signal transmission point of view, the transmission path is the pin 57, the socket contact 53, the lead 54, and the cable connector 58, and not only the transmission path is very long, but also the multi-pole connector 52 is passed, so that the impedance is high. It is not suitable for high-speed transmission due to the discontinuity of.
【０００７】そこで、本発明の目的は、信号の高速伝送
が可能で、電源回路の電圧降下を減らすことのできる電
子部品の実装構造を得ることである。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to obtain a mounting structure of an electronic component capable of high-speed signal transmission and reducing the voltage drop of a power supply circuit.
【０００８】[0008]
【課題を解決するための手段】本発明は、ＬＳＩパッケ
ージのピン側に格子状の電源バスを設け、この電源バス
の格子内に電源パターンと接地パターンを備えたフレキ
シブル基板を設け、このフレキシブル基板の下面にハウ
ジングを設け、このハウジングにＬＳＩのピンに嵌合す
るケーブルコネクタを挿着してなる電子部品の実装構造
である。According to the present invention, a grid-shaped power supply bus is provided on the pin side of an LSI package, and a flexible board having a power supply pattern and a ground pattern is provided in the grid of the power supply bus. Is a mounting structure of an electronic component in which a housing is provided on the lower surface of the device, and a cable connector that fits into a pin of the LSI is inserted into the housing.
【０００９】[0009]
【作用】ＬＳＩパッケージの各ピンはフレキシブル基板
の各パターンに接続され、フレキシブル基板の電源パタ
ーンは格子状の電源バスから分岐した電流経路で給電さ
れる。Each pin of the LSI package is connected to each pattern of the flexible board, and the power supply pattern of the flexible board is supplied with power through a current path branched from the grid-shaped power supply bus.
【００１０】[0010]
【実施例】以下、本発明の一実施例について図面を参照
して説明する。図１は、本発明の電子部品の実装構造を
示す断面図、図２は図１のＡ部の拡大詳細図、図３は図
２のＢ部拡大詳細図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 is a sectional view showing a mounting structure of an electronic component of the present invention, FIG. 2 is an enlarged detailed view of an A portion of FIG. 1, and FIG. 3 is an enlarged detailed view of a B portion of FIG.
【００１１】図１、図２及び図３において、ＬＳＩパッ
ケージ１は、セラミック板１０に複数個のＬＳＩ１１を
実装し、裏面には複数本のピン８が実装されている。ま
た、セラミック板１０の周囲には、フランジ１２が固定
され、このフランジ１２には、絶縁体１３を介して格子
状の給電バス２が固定されている。この給電バス２は、
図２に示すように中央部にインシュレータ２ａを備え、
このインシュレータの両面にそれぞれグランドバス７、
電源バス６を備えた積層構造で、各バスの格子の各辺に
は複数本のピン９が固定されている。1, 2, and 3, the LSI package 1 has a plurality of LSIs 11 mounted on a ceramic plate 10 and a plurality of pins 8 mounted on the back surface. A flange 12 is fixed around the ceramic plate 10, and a grid-shaped power supply bus 2 is fixed to the flange 12 via an insulator 13. This power supply bus 2 is
As shown in FIG. 2, an insulator 2a is provided at the center,
On both sides of this insulator, the grand bus 7,
In the laminated structure including the power supply buses 6, a plurality of pins 9 are fixed to each side of the grid of each bus.
【００１２】ピン８とピン９には、多層のフレキシブル
プリント基板３が実装され、このフレキシブルプリント
基板３には、グランドパターン３ａ、電源パターン３
ｂ、スルーホール３ｃを有し、このスルーホール３ｃの
電源及びグランド用のスルーホールには、ピン９と電源
及びグランド用のピン８に嵌合するソケットコンタクト
２１がはんだ付けされている。A multilayer flexible printed circuit board 3 is mounted on the pins 8 and 9, and the ground pattern 3a and the power supply pattern 3 are mounted on the flexible printed circuit board 3.
b, a through hole 3c, and a socket 9 for fitting the pin 9 and the power and ground pin 8 is soldered to the through hole for power and ground of the through hole 3c.
【００１３】各フレキシブルプリント板３の下面には、
枠４２に固定されたハウジング４が実装され、このハウ
ジング４は、導電材で構成され、且つ複数個の穴４ａを
有しており、この穴４ａの一端からピン８の先端部が挿
入され、信号用のピン８には他端部からケーブルコネク
タ５が挿入されている。このケーブルコネクタ５は、同
軸線５ａを有し、この同軸線５ａの図示しない中心導体
は、チューリップコンタクト状の中心コンタクト５ｂに
結線されている。また、同軸線５ａの図示しないシール
ド導体は、筒状の外部導体５ｃに結線され、この外部導
体５ｃの外周には、ばね板状の外部コンタクト５ｄを有
し、ハウジング４に接続されている。On the lower surface of each flexible printed board 3,
The housing 4 fixed to the frame 42 is mounted. The housing 4 is made of a conductive material and has a plurality of holes 4a. The tip of the pin 8 is inserted from one end of the hole 4a. The cable connector 5 is inserted from the other end into the signal pin 8. The cable connector 5 has a coaxial wire 5a, and a central conductor (not shown) of the coaxial wire 5a is connected to a tulip contact-shaped central contact 5b. The shield conductor (not shown) of the coaxial wire 5a is connected to a cylindrical outer conductor 5c, and a spring plate-shaped outer contact 5d is provided on the outer periphery of the outer conductor 5c and is connected to the housing 4.
【００１４】グランド用のピン８に位置するハウジング
４の穴４ａには、グランドコンタクト３２が実装され、
このグランドコンタクト３２には、内部にグランド用の
ピン８に接触するグランド用中心コンタクト３２ａと外
部にグランド用コンタクト３２ａに接続されたグランド
用外部導体３２ｂを有し、このグランド用外部導体３２
ｂの外周には、ハウジング４と接触するばね板のグラン
ド用外部コンタクト３２ｃを有している。電源用のピン
８に位置するハウジング４の穴４ａには、導電材料で製
作されたハウジング４と電源用のピン８との接触を防ぐ
ために、絶縁材料で断面Ｕ字状に形成されたキヤップ３
３が実装されている。A ground contact 32 is mounted in a hole 4a of the housing 4 located on the ground pin 8.
The ground contact 32 includes a ground center contact 32a that contacts the ground pin 8 and a ground outer conductor 32b that is connected to the ground contact 32a.
An outer contact 32c for a ground of a spring plate that contacts the housing 4 is provided on the outer periphery of b. In the hole 4a of the housing 4 located on the power supply pin 8, a cap 3 made of an insulating material and having a U-shaped cross section is provided in order to prevent contact between the housing 4 made of a conductive material and the power supply pin 8.
3 has been implemented.
【００１５】複数個のハウジング４を固定した枠４２
は、フレーム４３に固定されている。電源供給パスは、
給電バス２からフレキシブルプリント基板３を経てピン
８に供給される。給電バス２は、大型化を図ることがで
き、メイン電流の通路はこの給電バス２を通って各フレ
キシブルプリント基板３に給電され、フレキシブルプリ
ント基板３は、複数の給電バス２から分岐する電流経路
で給電される。信号はピン８より直接、ケーブルコネク
タ５に伝送される。A frame 42 to which a plurality of housings 4 are fixed
Are fixed to the frame 43. The power supply path is
It is supplied from the power supply bus 2 to the pin 8 via the flexible printed circuit board 3. The power supply bus 2 can be increased in size, and the main current path is fed to each flexible printed circuit board 3 through the power supply bus 2. The flexible printed circuit board 3 is a current path branched from the plurality of power supply buses 2. Powered by. The signal is transmitted to the cable connector 5 directly from the pin 8.
【００１６】次に、図４は、本発明の電子部品の実装構
造の他の実施例を示す図で、図３に対応する図である。
図４においては、フレキシブルプリント基板３のスルー
ホール３ｃにピン８、ピン９をはんだ付けして構成す
る。Next, FIG. 4 is a view showing another embodiment of the mounting structure of the electronic component of the present invention and corresponds to FIG.
In FIG. 4, the pins 8 and 9 are soldered to the through holes 3c of the flexible printed board 3.
【００１７】尚、本発明のハウジングは、導電性であ
り、同軸線のシールド導体をピン８のグランドピンに接
続する必要があるが、この導電部の形成方式としては、
全体を金属材料で作る方法、又は、プラスチックスの表
面に導電体を蒸着する方法、又は、プラスチックス製の
内部に金属片を内蔵する方法がある。The housing of the present invention is electrically conductive, and it is necessary to connect the shield conductor of the coaxial line to the ground pin of the pin 8. The method of forming this electrically conductive portion is as follows.
There are a method of making the whole with a metal material, a method of vapor-depositing a conductor on the surface of plastics, and a method of incorporating a metal piece inside the plastics.
【００１８】[0018]
【発明の効果】以上、本発明によれば、ＬＳＩパッケー
ジのピン側に格子状の電源バスを設け、この電源バスの
格子内に電源パターンと接地パターンを備えたフレキシ
ブル基板を設け、このフレキシブル基板の下面にハウジ
ングを設け、このハウジングにＬＳＩのピンに嵌合する
ケーブルコネクタを挿着することで、ＬＳＩパッケージ
の各ピンをフレキシブル基板の各パターンに接続し、Ｌ
ＳＩパッケージの電源用のピンもフレキシブル基板の電
源パターンを経て格子状の電源バスから分岐した電力供
給路に接続したので、信号の高速伝達が可能で、電源回
路の電圧降下を減らすことのできる電子部品の実装構造
を得ることができる。As described above, according to the present invention, a grid-shaped power supply bus is provided on the pin side of an LSI package, and a flexible board having a power supply pattern and a ground pattern is provided in the grid of the power supply bus. A housing is provided on the lower surface of the LSI, and a cable connector that fits the pins of the LSI is inserted into the housing to connect each pin of the LSI package to each pattern of the flexible substrate,
The SI package power supply pins are also connected to the power supply path branched from the grid-shaped power supply bus via the power supply pattern of the flexible board, so high-speed signal transmission is possible and the voltage drop of the power supply circuit can be reduced. A mounting structure of parts can be obtained.
【図１】本発明の電子部品の実装構造の一実施例を示す
図。FIG. 1 is a diagram showing an embodiment of a mounting structure of an electronic component of the present invention.
【図２】本発明の電子部品の実装構造の部分拡大詳細
図。FIG. 2 is a partially enlarged detailed view of a mounting structure of an electronic component of the present invention.
【図３】図２のＢ部拡大詳細図。FIG. 3 is an enlarged detailed view of a B part in FIG.
【図４】本発明の電子部品の実装構造の他の実施例を示
す部分拡大詳細図。FIG. 4 is a partially enlarged detailed view showing another embodiment of the electronic component mounting structure of the present invention.
【図５】従来の電子部品の実装構造を示す図。FIG. 5 is a diagram showing a conventional electronic component mounting structure.
１ ＬＳＩパッケージ ２ 給電バス ３ フレキシブルプリント基板 ４ ハウジング ５ ケーブルコネクタ ６ 電源バス ７ グランドバス ８，９ ピン １０ セラミック板 １１ ＬＳＩ 1 LSI Package 2 Power Supply Bus 3 Flexible Printed Circuit Board 4 Housing 5 Cable Connector 6 Power Bus 7 Ground Bus 8, 9 Pins 10 Ceramic Board 11 LSI
Claims (1)
源バスを設け、この電源バスの格子内に電源パターンと
接地パターンを備えたフレキシブル基板を設け、このフ
レキシブル基板の下面にハウジングを設け、このハウジ
ングに前記ＬＳＩのピンに嵌合するケーブルコネクタを
挿着してなる電子部品の実装構造。1. A grid-shaped power supply bus is provided on the pin side of an LSI package, a flexible board having a power supply pattern and a ground pattern is provided in the grid of the power supply bus, and a housing is provided on the lower surface of the flexible board. A mounting structure for an electronic component, which is obtained by inserting a cable connector that fits into the pins of the LSI into a housing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4223346A JP2758787B2 (en) | 1992-07-30 | 1992-07-30 | Electronic component mounting structure |
| US08/098,771 US5327326A (en) | 1992-07-30 | 1993-07-29 | Large scale integrated package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4223346A JP2758787B2 (en) | 1992-07-30 | 1992-07-30 | Electronic component mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0651883A true JPH0651883A (en) | 1994-02-25 |
| JP2758787B2 JP2758787B2 (en) | 1998-05-28 |
Family
ID=16796726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4223346A Expired - Lifetime JP2758787B2 (en) | 1992-07-30 | 1992-07-30 | Electronic component mounting structure |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US5327326A (en) |
| JP (1) | JP2758787B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5487673A (en) * | 1993-12-13 | 1996-01-30 | Rockwell International Corporation | Package, socket, and connector for integrated circuit |
| EP0677897A3 (en) * | 1994-04-14 | 1996-09-11 | Siemens Ag | Circuit board arrangement for connectors. |
| US5671121A (en) * | 1994-09-29 | 1997-09-23 | Intel Corporation | Kangaroo multi-package interconnection concept |
| US5562498A (en) * | 1994-12-21 | 1996-10-08 | Delco Electronics Corp. | Flexible capacitor filter |
| EP0887737B1 (en) * | 1997-06-26 | 2003-01-22 | Hewlett-Packard Company, A Delaware Corporation | Reversible connectors |
| US7167499B2 (en) * | 2001-04-18 | 2007-01-23 | Tcz Pte. Ltd. | Very high energy, high stability gas discharge laser surface treatment system |
| US7052288B1 (en) * | 2004-11-12 | 2006-05-30 | Fci Americas Technology, Inc. | Two piece mid-plane |
| US9406457B2 (en) * | 2011-05-19 | 2016-08-02 | Black & Decker Inc. | Electronic switching module for a power tool |
| FR3021490B1 (en) * | 2014-05-23 | 2017-08-11 | Radiall Sa | ASSEMBLY COMPRISING A HYPERFREQUENCY COMPONENT AND A PRINTED CIRCUIT |
| US10608501B2 (en) | 2017-05-24 | 2020-03-31 | Black & Decker Inc. | Variable-speed input unit having segmented pads for a power tool |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB934627A (en) * | 1959-03-17 | 1963-08-21 | Sealectro Corp | Improvements in or relating to electric-circuit selectors |
| FR2223937B1 (en) * | 1973-03-29 | 1978-03-24 | Telemecanique Electrique | |
| US4567654A (en) * | 1984-04-02 | 1986-02-04 | Emhart Industries, Inc. | Bussing block |
| US5073124A (en) * | 1990-07-20 | 1991-12-17 | Amp Incorporated | Electrical interconnection system utilizing fluid pressure deformed tubular contact |
-
1992
- 1992-07-30 JP JP4223346A patent/JP2758787B2/en not_active Expired - Lifetime
-
1993
- 1993-07-29 US US08/098,771 patent/US5327326A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US5327326A (en) | 1994-07-05 |
| JP2758787B2 (en) | 1998-05-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980219 |