JPH0649360A - Aqueous polyamic acid solution - Google Patents

Abstract

PURPOSE:To obtain an aqueous polyamic acid solution being moldable at low temperatures, having excellent adhesive strength and not polluting the working environment by mixing a specified amount of a specified polyamic acid with a basic compound. CONSTITUTION:2-40wt.% polyamic acid of the formula (wherein X is -CO- or -SO2-; and R is a tetravalent group selected from among a 2 C or higher aliphatic group, a cycloaliphatic group, a monocyclic aromatic group, a fused polycyclic aromatic group and a nonfused polycyclic aromatic group consisting of aromatic groups bonded to each other directly or through bridging members) is mixed with a basic compound (e.g. ammonia) desirably in an amounts satisfying the relationship: 0.5Ma<=Mb<=5Ma (wherein Ma is the carboxyl equivalent of the polyamic acid; and Mb is the base equivalent of the basic compound).

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to an aqueous solution of polyamic acid. More specifically, it relates to an aqueous solution of a polyamic acid having good moldability.

[0002]

2. Description of the Related Art Polyimides obtained by dehydration reaction of polyamic acid conventionally obtained by reaction of tetracarboxylic dianhydride and diamine compound have high heat resistance, mechanical strength, dimensional stability, flame retardancy, It has excellent electrical insulation properties and is used in the fields of electrical and electronic equipment, aerospace equipment, transportation equipment, etc., and is expected to be widely used in the fields where heat resistance is required.

Conventionally, once polyimide is imidized, it does not dissolve in an ordinary organic solvent, and even if it is heated, its melting point is close to the decomposition temperature of the polymer, so that it cannot be melt-molded. . The present inventors previously described the general formula (1)
A melt-moldable polyimide synthesized by dehydrating the polyamic acid represented by
018419).

However, there is a drawback that extremely high temperature is required for melt molding the above polyimide. Therefore, in the use of polyimide, for example, when used as an electric wire varnish, a coverlay or an adhesive, as a solution of an organic solvent in the state of a polyamic acid which is a precursor of polyimide, after applying it on a coating object, A method is employed in which heat treatment is performed at a high temperature to perform desolvation imidization. Also in the production of the film, for example, a method of casting a polyamic acid solution on a steel belt and subjecting it to heat treatment at a high temperature for desolvation and imidization is adopted.

However, the above-mentioned organic solvent generally has a high boiling point, and therefore requires a high temperature at the time of desolvation, and further, the toxicity of the solvent causes a problem that the evaporated solvent pollutes the working environment.

[0006]

DISCLOSURE OF THE INVENTION The present invention provides an aqueous solution of polyamic acid which can be molded at a low temperature and has a very low contamination of the working environment due to evaporation of an organic solvent during processing.

[0007]

Means for Solving the Problems The inventors of the present invention have conducted extensive studies to solve the above problems, and found that an aqueous solution of polyamic acid can be obtained by blending a specific basic compound, The present invention has been completed. That is, the present invention provides the compound represented by the general formula (1)

[0008]

[Chemical 2] [In the formula, X represents a divalent group of —CO— or —SO ₂ —, R represents an aliphatic group having 2 or more carbon atoms, a cycloaliphatic group, a monocyclic aromatic group, a condensed polycyclic group. It represents a tetravalent group selected from the group consisting of aromatic groups and non-condensed polycyclic aromatic groups in which aromatic groups are linked directly or by a bridging member. ] 2 to 40% by weight of a polyamic acid represented by the formula and a basic compound are contained, and a polyamic acid carboxyl represented by the general formula (1) When the group equivalent is Ma and the equivalent of the basic compound is Mb,

[0009]

(2) 0.5 Ma ≦ Mb ≦ 5 Ma

It is an aqueous solution of a polyamic acid characterized by containing a basic compound in the range of.

The feature of the present invention is that it can be formed at a low temperature.
In addition, the present invention relates to an aqueous solution of polyamic acid, which has extremely low contamination of the working environment due to evaporation of an organic solvent during processing.

The polyamic acid represented by the general formula (1) (Chemical Formula 2) of the present invention is obtained by reacting a diamine compound and a tetracarboxylic dianhydride in an organic solvent and then mixing them with a poor solvent to form a polyamide. It can be obtained by either a method of precipitating and separating an acid and then removing the solvent by drying, or a method of removing the organic solvent by evaporative drying.

As the diamine compound used in the present invention, bis (3-aminophenyl) sulfone or 3,
3′-diaminobenzophenone, and other known diamines, for example, ethylenediamine, and aliphatic diamines represented by 1,2-propylenediamine or 1,3-
It is also possible to use any one kind or a mixture of two or more kinds of aromatic diamines represented by phenylenediamine and 4,4′-diaminodiphenyl ether.

The tetracarboxylic acid dianhydride used in the present invention is, for example, ethanetetracarboxylic acid dianhydride, butanetetracarboxylic acid dianhydride, cyclopentanetetracarboxylic acid dianhydride, 3,3 '. , 4, 4'-
Benzophenone tetracarboxylic dianhydride, 2,2 ',
3,3′-benzophenone tetracarboxylic acid dianhydride,
3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 2,2 ′, 3,3′-biphenyltetracarboxylic dianhydride, 2,2′-bis (3,4-dicarboxyphenyl ) Propane dianhydride, 2,2'-bis (2,3-
Dicarboxyphenyl) propane dianhydride, 2,2-bis (3,4-dicarboxyphenyl) -1,1,1,
3,3,3-hexafluoropropane dianhydride, 2,2
-Bis (2,3-dicarboxyphenyl) -1,1,
1,3,3,3-hexafluoropropane dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, bis (2,3-dicarboxyphenyl) ether dianhydride, bis (3,4 -Dicarboxyphenyl) sulfone dianhydride, bis (2,3-dicarboxyphenyl) sulfone dianhydride, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride, bis (2,3- Dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, 4,4 ′-(p-phenylenedioxy) diphthalic acid dianhydride, 4,4 ′-(m
-Phenylenedioxy) diphthalic acid dianhydride, 2,3
6,7-naphthalenetetracarboxylic dianhydride, 1,
4,5,8-naphthalenetetracarboxylic dianhydride,
1,2,5,6-naphthalenetetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, pyromellitic dianhydride, 3,4,9,10-perylenetetracarboxylic acid Acid dianhydride, 2,3,6,7-anthracene tetracarboxylic acid dianhydride, 1,2,7,8-
Examples thereof include phenanthrene tetracarboxylic dianhydride, and these tetracarboxylic dianhydrides may be used alone or
Used as a mixture of two or more species.

When the diamine compound and the tetracarboxylic acid dianhydride are reacted in an organic solvent, the diamine compound should be used in an amount equal to or more than the equivalent of the tetracarboxylic acid dianhydride and used in combination with the dicarboxylic acid monoanhydride. Is also possible.

Examples of the dicarboxylic acid monoanhydride include phthalic anhydride, 2,3-benzophenone dicarboxylic acid anhydride, 3,4-benzophenone dicarboxylic acid anhydride, 2,3-dicarboxyphenyl phenyl ether anhydride, 3,4-dicarboxyphenyl phenyl
Ether anhydride, 2,3-biphenyldicarboxylic acid anhydride, 3,4-biphenyldicarboxylic acid anhydride, 2,3-
Dicarboxyphenyl phenyl sulfone anhydride, 3,
4-dicarboxyphenyl phenyl sulfone anhydride, 2,3-dicarboxyphenyl phenyl sulfide anhydride, 3,4-dicarboxyphenyl phenyl sulfide anhydride, 1,2-naphthalenedicarboxylic acid anhydride, 2,3-naphthalenedicarboxylic acid Acid anhydride, 1,
8-naphthalenedicarboxylic acid anhydride, 1,2-anthracene dicarboxylic acid anhydride, 2,3-anthracene dicarboxylic acid anhydride, 1,8-anthracene dicarboxylic acid anhydride and the like can be mentioned, and these can be used alone or in combination of two or more. Used.

In the present invention, even if a part of the polyimide obtained by the dehydration ring closure of the polyamic acid is contained in the polyamic acid, there is no problem as long as the effects of the present invention are not impaired.

The organic solvent used in the reaction of the tetracarboxylic dianhydride and the diamine compound in the present invention includes N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone and N.
Amides represented by methylcaprolactam, tetrahydrofuran, 1,4-dioxane, ethers represented by diethylene glycol dimethyl ether, pyridine, pyridines represented by γ-picoline, phenol, m-cresol, o-chlorophenol Typical examples thereof include phenols, dimethyl sulfoxide, sulfoxides represented by diphenyl sulfoxide, sulfones represented by dimethyl sulfone and diphenyl sulfone, and these may be used alone or in combination.

The reaction temperature for obtaining the polyamic acid solution is
It is usually 10 to 100 ° C, preferably 30 to 80 ° C.
If the reaction temperature is too low, it takes time to reach the desired degree of polymerization, which is not practical. On the other hand, if the reaction temperature is too high, imidization proceeds too much, the solubility of the resulting polyamic acid in water containing the basic compound deteriorates, and the polyamic acid aqueous solution of the present invention cannot be obtained.

The reaction pressure for obtaining the polyamic acid solution is not particularly limited, and it can be carried out at normal pressure. The reaction time varies depending on the solvent used for the reaction and the reaction temperature, but is carried out until the production of the polyamic acid is completed and the desired degree of polymerization is reached. Usually 30 minutes to 10 hours is sufficient.

The synthesis of polyamic acid is generally carried out by dissolving a diamine compound in an organic solvent and then adding tetracarboxylic acid dianhydride (US Pat. No. 4).
065345, etc.).

As the poor solvent to be mixed when the polyamic acid is precipitated from the polyamic acid solution, a known solvent that does not substantially dissolve the polyamic acid can be used.
Hydroxyl group-containing compounds represented by water, methanol, ethanol and isopropyl alcohol, aliphatic hydrocarbon compounds represented by hexane, cyclohexane and octane, aromatic hydrocarbon compounds represented by benzene, toluene and xylene, acetone It is also possible to use any one kind or a mixture of two or more kinds such as ketones typified by methyl ethyl ketone.

The poor solvent is mixed with the polyamic acid solution by using a homomixer, a static mixer or the like. However, even if the poor solvent is added to the polyamic acid solution and mixed, or the polyamic acid solution is added to the poor solvent. You can mix them by mixing. Such mixing is usually performed at room temperature, but even if the temperature rises due to frictional heat due to stirring or heat of solvent mixing,
There is no problem if the temperature is 0 ° C or lower. After mixing with a poor solvent, the polyamic acid is separated by centrifugation or filtration and dried, the temperature is 10 to 100 ° C., preferably 3
It is performed in the range of 0 to 80 ° C. If the temperature is lower than 10 ° C, it takes a long time to dry, which is not practical, and if the temperature exceeds 100 ° C, the polyamic acid thus obtained is imidized to have poor solubility in water containing a basic compound to obtain the aqueous solution of the present invention. I can't.

In the method of obtaining the polyamic acid powder by evaporating and removing the organic solvent from the polyamic acid solution,
A polyamic acid powder is obtained by heating and evaporating the solvent under reduced pressure by a spray drying method or the like, but the heating and drying temperature is 10 to 100 ° C. in order to prevent a decrease in solubility due to partial imidization of the obtained polyamic acid. , Preferably 30-
Perform in the range of 80 ° C. If the temperature is lower than 10 ° C, it takes a long time to dry, which is not practical.

The polyamic acid of the present invention has a molecular weight of 0.05 to 1.0 dl / logarithmic viscosity (measured in N, N-dimethylformamide solvent at 35 ° C. and a concentration of 0.5 g / dl).
g, preferably in the range of 0.2 to 0.8 dl / g.
When the logarithmic viscosity is less than 0.05, the strength of the obtained molded product is weak and it is not practical. Further, those having a logarithmic viscosity of more than 1.0 are difficult to dissolve in water containing a basic compound.

The content of polyamic acid in the polyamic acid aqueous solution is 2 to 40% by weight. When the content of the polyamic acid is less than 2% by weight, the content of the polyamic acid is too small to be practical. Further, if it exceeds 40% by weight, the solubility of the polyamic acid is deteriorated and a uniform aqueous solution cannot be obtained.

As the basic compound used in the present invention,
Examples thereof include alkali metal compounds, alkaline earth metal compounds and nitrogen-containing compounds. Specifically, examples of the alkali metal compound or the alkaline earth metal compound include alkali or alkaline earth metal hydroxides such as sodium hydroxide, potassium hydroxide and magnesium hydroxide; sodium oxide, magnesium oxide, Oxides of alkali or alkaline earth metals such as calcium oxide;
Alkali or alkaline earth metal carbonates such as sodium carbonate and barium carbonate; alkali metal hydrogencarbonates such as potassium hydrogencarbonate and sodium hydrogencarbonate; alkali metal alcoholates such as sodium methylate and potassium t-butoxide; Alkali or alkaline earth metal salts of carboxylic acids such as sodium acetate and barium formate; Alkali metal salts of carboxylic acids such as sodium carboxylic acid,
Furthermore, alkali or alkaline earth metals represented by the chemical formulas Al (OH) ₃ NaHCO ₃ , Mg ₆ Al ₂ (OH) ₁₆ CO ₃ 4H ₂ O, Mg _4.5 Al ₂ (OH) ₁₃ CO ₃ 3.5H ₂ O, etc. There is a complex salt of, and one or more of these may be used in combination.

Further, the nitrogen-containing compound used in the present invention is a compound having a basic nitrogen atom, for example, ammonia, t-butylamine, cyclohexylamine, aniline, diethylamine, piperidine, triethylamine, tri-n-butylamine, Amines such as pyridine;
Hydroxyamines such as N, N-dimethylethanolamine and N, N-dimethylhydroxyamine; hydrazines such as hydrazine and 1,2-dimethylhydrazine; formamide, acetamide, N, N-dimethylacetamide and N-methylpyrrolidone Amides; urethanes such as ethyl carbamate and methyl N-methylcarbamate; ureas such as urea and diacetylurea. Of these, one kind or two or more kinds may be used in combination. Further, one or more alkaline earth metal compounds or one or more alkaline earth metal compounds may be used in combination with one or more nitrogen-containing compounds.

The aqueous solution of polyamic acid according to the present invention is usually obtained by dissolving polyamic acid in water containing a basic compound in advance. The temperature at which the polyamic acid is dissolved is usually 10 to 80 ° C., preferably 30 to
It is in the range of 60 ° C. If the temperature is lower than 10 ° C, the dissolution rate of the polyamic acid is slow and it is not practical. On the other hand, if the temperature exceeds 80 ° C., the molecular weight is lowered due to hydrolysis of the polyamic acid, and the strength of the obtained molded product becomes weak, which is not practical.

The amount of the basic compound contained to dissolve the polyamic acid in water is in the range of 0.5 to 5 times equivalent, preferably 0.8 to 3 times equivalent of the carboxyl group equivalent Ma of the polyamic acid. Is. If it is less than 0.5 times the equivalent, the solubility of the polyamic acid will be poor, and if it exceeds 5 times the equivalent, the proportion of the free basic compound will increase, which is not practical.

The aqueous solution of polyamic acid thus obtained is used as a film, a wire coating material, a paint, an adhesive,
Alternatively, it can be used in various fields such as the use of fiber reinforced plastics such as glass fiber and carbon fiber as a matrix resin. At that time, it is also possible to disperse and use a powder of a known thermoplastic resin such as a thermoplastic polyimide resin. When used for the above-mentioned purposes, an aqueous solution of polyamic acid is heated to 100 to 350 ° C. and dehydrated and imidized before use.

[0032]

EXAMPLES The present invention will be described in detail below with reference to examples and comparative examples. Synthesis Example 1 3,3′-diaminobenzophenone 2 was added to a glass reactor equipped with a reflux condenser, a nitrogen inlet tube, a thermometer and a stirrer.
12 g (1.0 mol) and N-methyl-2-pyrrolidone 2
140 g was charged and the temperature was raised to 30 ° C. to dissolve the diamine. 320 g (0.99) of 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride under nitrogen atmosphere
(5 mol) was added over 3 hours while maintaining the temperature of 30 ° C., and stirring was continued at 30 ° C. for 12 hours. The solution viscosity at that time was 1,700 centipoise (25 ° C., measured by Tokyo Keiki E-type viscometer, the same applies hereinafter), logarithmic viscosity (N, N
-Measured in a dimethylacetamide solvent at a concentration of 0.5 g / dl at 35 [deg.] C, the same hereinafter) was 0.53 dl / g Further, 4 g (0.03 mol) of phthalic anhydride was added and stirred at 30 ° C. for 6 hours to obtain a polyamic acid solution having a solution viscosity of 1,600 centipoise and an inherent viscosity of 0.51 dl / g. Charge 1000 g of water into the homomixer, and add 200
The above polyamic acid, N-methyl-2-, was stirred at 0 rpm.
Charge 200 g of pyrrolidone solution over 5 minutes, then add 5 more
Stirring was continued for a minute. The precipitate was separated by vacuum filtration, washed with 5000 g of water, and then washed at 60 ° C. and 10 torr for 14
After vacuum drying for 39 hours, 39 g of polyamic acid powder A was obtained. The polyamic acid powder A had an inherent viscosity of 0.38 dl / g, and absorption of an imide group (1780 cm ^-1 ) was not observed at all in the measurement of infrared absorption spectrum.

Example 1 A glass reactor equipped with a reflux condenser, a thermometer and a stirrer was charged with 895 g of water and 25 g of 25% by weight ammonia water, and the synthesis example was carried out for 4 hours while maintaining the temperature at 40 ° C. 80 g of polyamic acid powder A obtained in 1 was charged, and further 50
Stirring was continued for 2 hours at 0 ° C., and the mixture was dissolved to obtain 1000 g of polyamic acid aqueous solution A. Cold rolled steel was adhered using an aqueous solution A of polyamic acid, and the adhesive strength was measured. Adhesion was performed by heating in a dryer under the conditions shown in Table 1, and the tensile shear adhesive strength was measured according to the method of JIS K6850. As an adhesion test piece, JIS
The adhesive surface of the G3141 (SPCC-SD) iron plate was degreased with acetone before use. The measurement results of the adhesive strength are also shown in Table 1. No evaporation of N-methyl-2-pyrrolidone was observed during heat bonding in the dryer, and the inside of the dryer was not contaminated at all.

Comparative Example 1 A glass reactor equipped with a reflux condenser, a thermometer and a stirrer was charged with 895 g of water and 9 g of 25% by weight aqueous ammonia, and a synthesis example was carried out for 4 hours while maintaining the temperature at 40 ° C. 80 g of polyamic acid powder A obtained in 1 was charged, and further 50 ° C.
Although the stirring was continued for 2 hours, the polyamic acid powder A was not completely dissolved and a uniform aqueous solution of polyamic acid could not be obtained.

Comparative Example 2 Except that the N-methyl-2-pyrrolidone solution of the polyamic acid prepared in Synthesis Example 1 was used as it was, the adhesion was carried out in the same manner as in Example 1 and the tensile shear adhesive strength was measured.
The adhesion conditions and the measurement results are also shown in Table 1. Evaporation of N-methyl-2-pyrrolidone was observed during heat bonding in the dryer, and the working environment of the dryer and the like was significantly polluted.

Example 2 A glass reactor equipped with a reflux condenser, a thermometer and a stirrer was charged with 830 g of water and 50 g of sodium hydrogen carbonate,
While maintaining the temperature of 40 ° C., 150 g of the polyamic acid powder A obtained in Synthesis Example 1 was charged over 4 hours, and the mixture was further stirred at 50 ° C. for 2 hours to be dissolved to obtain 1000 g of a 15 wt% aqueous solution of polyamic acid. It was Adhesion was performed in the same manner as in Example 1 using this aqueous solution of polyamic acid, and the tensile shear adhesive strength was measured. The adhesion conditions and the measurement results are also shown in Table 1.

Comparative Example 3 A glass reactor equipped with a reflux condenser, a thermometer and a stirrer was charged with 830 g of water and 20 g of sodium hydrogen carbonate,
While maintaining the temperature at 40 ° C., 150 g of the polyamic acid powder A obtained in Synthesis Example 1 was charged over 4 hours, and stirring was continued at 50 ° C. for 2 hours, but the polyamic acid powder A was not completely dissolved. Therefore, a uniform aqueous solution of polyamic acid could not be obtained.

[0038]

[Table 1]

[0039]

As is clear from the results shown in Table 1,
The aqueous solution of the polyamic acid according to the method of the present invention that can be molded at a relatively low temperature, when used as an adhesive, for example, can obtain a high adhesive strength by heating at a relatively low temperature for a short time, and further when heated. It is industrially useful because it does not pollute the work environment due to evaporation of the solvent.

Claims (2)

[Claims] 1. General formula (1) (Chemical formula 1) [In the formula, X represents a divalent group of —CO— or —SO ₂ —, R represents an aliphatic group having 2 or more carbon atoms, a cycloaliphatic group, a monocyclic aromatic group, a condensed polycyclic group. It represents a tetravalent group selected from the group consisting of aromatic groups and non-condensed polycyclic aromatic groups in which aromatic groups are linked directly or by a bridging member. ] The polyamic acid represented by these 2-40 weight% and a basic compound are contained, The aqueous solution of the polyamic acid characterized by the above-mentioned. 2. The general formula (1) (formula 1) according to claim 1.
The carboxyl group equivalent of the polyamic acid represented by
An aqueous solution of a polyamic acid containing a basic compound in the range of 0.5 Ma ≦ Mb ≦ 5 Ma, where Mb is the equivalent of the basic compound.