JP2831867B2 - Polyamic acid copolymer, polyimide copolymer comprising the same, polyimide film, and methods for producing them - Google Patents

Polyamic acid copolymer, polyimide copolymer comprising the same, polyimide film, and methods for producing them

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Publication number
JP2831867B2
JP2831867B2 JP3244493A JP24449391A JP2831867B2 JP 2831867 B2 JP2831867 B2 JP 2831867B2 JP 3244493 A JP3244493 A JP 3244493A JP 24449391 A JP24449391 A JP 24449391A JP 2831867 B2 JP2831867 B2 JP 2831867B2
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Japan
Prior art keywords
polyamic acid
acid copolymer
producing
equivalent
diamine
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JP3244493A
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Japanese (ja)
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JPH0559173A (en
Inventor
好史 岡田
仁志 野尻
卓 伊藤
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Kanegafuchi Chemical Industry Co Ltd
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Kanegafuchi Chemical Industry Co Ltd
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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、耐熱性に優れ、高弾
性、低熱膨張性、低吸湿性であるポリイミドフィルムを
与えるポリアミック酸共重合体、それからなるポリイミ
ド共重合体及びポリイミドフィルム並びにそれらの製造
方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyamic acid copolymer which gives a polyimide film having excellent heat resistance, high elasticity, low thermal expansion and low moisture absorption, a polyimide copolymer comprising the same, a polyimide film and a polyimide film thereof. It relates to a manufacturing method.

【0002】[0002]

【従来の技術】従来、ポリイミド樹脂は優れた耐熱性と
ともに電気絶縁性にも優れ、電気機器を初めとして、広
く工業材料として用いられている。ポリイミド樹脂は、
このように他のポリマーに比べ種々の優れた特性を持つ
が、技術の進歩とともに、ポリイミド樹脂に求められる
要求特性も高度なものとなり、用途に応じて種々の性能
を合わせ持つことが望まれている。
2. Description of the Related Art Hitherto, a polyimide resin has excellent electrical insulation as well as excellent heat resistance, and is widely used as an industrial material including electric equipment. Polyimide resin is
In this way, it has various superior properties compared to other polymers, but with the advancement of technology, the required properties required for polyimide resin also become advanced, and it is desired to have various performances depending on the application. I have.

【0003】電気機器用途として考える場合、吸湿性が
高ければ電気絶縁性が低下したり、イオン性の不純物の
混入の危険性が増え、材料としての信頼性が低下するの
で好ましくない。よって、低吸湿性であることが望まれ
る。また、材料としての強度という点からは、高弾性で
あるということが望ましい。温度変化に対しても寸法変
化が小さいことが好ましいので、低熱膨張性であること
が要求される。
[0003] When it is considered to be used for electric equipment, if the hygroscopicity is high, the electrical insulation is reduced, and the risk of contamination with ionic impurities is increased, and the reliability as a material is undesirably reduced. Therefore, low moisture absorption is desired. Further, from the viewpoint of strength as a material, it is desirable that the material has high elasticity. Since it is preferable that the dimensional change is small with respect to the temperature change, low thermal expansion is required.

【0004】例えば、ピロメリット酸無水物とパラフェ
ニレンジアミンといった剛直鎖のみを用いれば、高弾性
を有するポリイミドを合成することができる。しかし、
この構造では、非常に脆く、吸湿性が高いフィルムしか
得ることはできない。また、ポリイミドは、イミド環内
のカルボニル基と窒素原子の分極が大きいために、一般
的に吸水性が比較的高い樹脂である。かくして、高弾性
と低吸湿性及び適度な柔軟性という物性を充分に満足す
るポリイミドが求められている。
[0004] For example, if only a rigid straight chain such as pyromellitic anhydride and paraphenylenediamine is used, a polyimide having high elasticity can be synthesized. But,
With this structure, only films that are very brittle and have high hygroscopicity can be obtained. In addition, polyimide is generally a resin having relatively high water absorption due to large polarization of a carbonyl group and a nitrogen atom in an imide ring. Thus, there is a need for a polyimide that sufficiently satisfies the physical properties of high elasticity, low moisture absorption, and appropriate flexibility.

【0005】[0005]

【発明が解決しようとする課題】本発明は、耐熱性に優
れ、高弾性、低熱膨張係数、低吸湿性などの優れた特性
を与えるポリアミック酸共重合体、それからなるポリイ
ミド共重合体及びポリイミドフィルム並びにそれらの製
造方法を提供することを目的とする。
DISCLOSURE OF THE INVENTION The present invention relates to a polyamic acid copolymer which is excellent in heat resistance and gives excellent properties such as high elasticity, low coefficient of thermal expansion and low moisture absorption, a polyimide copolymer and a polyimide film comprising the same. It is another object of the present invention to provide a method for producing them.

【0006】[0006]

【課題を解決するための手段】上記の問題を解決するた
めに、本発明者らは鋭意検討の結果、本発明を完成し
た。即ち、本発明の第1は、下記式
Means for Solving the Problems In order to solve the above problems, the present inventors have made intensive studies and completed the present invention. That is, the first aspect of the present invention is as follows:

【0007】[0007]

【化9】 Embedded image

【0008】(ただし、R、Rは下記の基(Where R 2 and R 4 are the following groups)

【0009】[0009]

【化10】 Embedded image

【0010】(ただし、XはF,Cl,Br,CH
CHO,CFを示す。)の中から選ばれる、エーテ
ル結合等の屈曲基を含まず、2つの窒素原子を結ぶ直線
とジアミンの主鎖方向が一致する構造を有する直線性ジ
アミン(以下、直線性ジアミンと記す)残基、Rは下
記の基
(Where X is F, Cl, Br, CH 3 ,
CH 3 O and CF 3 are shown. A) a linear diamine (hereinafter, referred to as a linear diamine) residue having a structure in which the main chain direction of the diamine does not include a straight line connecting two nitrogen atoms and does not include a bending group such as an ether bond selected from the above. And R 6 are the following groups

【0011】[0011]

【化11】 Embedded image

【0012】の中から選ばれる、主鎖中にエーテル結合
やカルボニル基等の屈曲基を含む構造を有する屈曲性ジ
アミン(以下、屈曲性ジアミンと記す)残基、R、R
はピロメリット酸二無水物残基を示し、Rは下記の
A flexible diamine (hereinafter, referred to as a flexible diamine) residue having a structure containing a bending group such as an ether bond or a carbonyl group in the main chain, R 1 , R 2
5 represents a pyromellitic dianhydride residue, and R 3 represents the following group

【0013】[0013]

【化12】 Embedded image

【0014】の中から選ばれたものである。)で表され
るポリアミック酸共重合体を、
[0014] It is selected from the following. ), The polyamic acid copolymer represented by

【0015】上記ポリアミック酸共重合体を製造するた
めの本発明の第2は、上記本発明の第1で規定する直線
性ジアミンの少なくとも1種2当量に、下記の構造式
A second aspect of the present invention for producing the above-mentioned polyamic acid copolymer is that at least one equivalent of the linear diamine defined in the first aspect of the present invention has the following structural formula:

【0016】[0016]

【化13】 Embedded image

【0017】の中から選ばれるテトラカルボン酸二無水
物1当量を加え、次いで、ピロメリット酸二無水物2当
量を加えた後、上記本発明の第1で規定する屈曲性ジア
ミン1当量加えることを特徴とするポリアミック酸共重
合体の製造方法を、
After adding 1 equivalent of a tetracarboxylic dianhydride selected from the above, then adding 2 equivalents of pyromellitic dianhydride, and then adding 1 equivalent of the flexible diamine specified in the first item of the present invention. A method for producing a polyamic acid copolymer,

【0018】上記ポリアミック酸共重合体を製造するた
めの本発明の第3は、上記本発明の第1で規定する屈曲
性ジアミン1当量に、ピロメリット酸二無水物2当量を
加えた後、上記本発明の第1で規定する直線性ジアミン
2当量を加え、下記の構造式
A third aspect of the present invention for producing the above polyamic acid copolymer is that after adding 2 equivalents of pyromellitic dianhydride to 1 equivalent of the flexible diamine specified in the first aspect of the present invention, 2 equivalents of the linear diamine specified in the first aspect of the present invention were added, and the following structural formula was added.

【0019】[0019]

【化14】 Embedded image

【0020】の中から選ばれるテトラカルボン酸二無水
物1当量を加えることを特徴とするポリアミック酸共重
合体の製造方法を、
A method for producing a polyamic acid copolymer, which comprises adding 1 equivalent of a tetracarboxylic dianhydride selected from the group consisting of:

【0021】上記ポリアミック酸共重合体を製造するた
めの本発明の第4は、下記の構造式
A fourth aspect of the present invention for producing the above polyamic acid copolymer is the following structural formula:

【0022】[0022]

【化15】 Embedded image

【0023】の中から選ばれるテトラカルボン酸二無水
物1当量に上記本発明の第1で規定する直線性ジアミン
2当量を加え、次いで、ピロメリット酸二無水物2当量
を加えた後、上記本発明の第1で規定する屈曲性ジアミ
ン1当量加えることを特徴とするポリアミック酸共重合
体の製造方法を、
To one equivalent of a tetracarboxylic dianhydride selected from the above, 2 equivalents of the linear diamine specified in the first aspect of the present invention and then 2 equivalents of pyromellitic dianhydride are added. A method for producing a polyamic acid copolymer, characterized by adding 1 equivalent of the flexible diamine specified in the first aspect of the present invention,

【0024】また上記ポリアミック酸共重合体を製造す
るための本発明の第5は、ピロメリット酸二無水物2当
量に上記本発明の第1で規定する屈曲性ジアミン1当量
を加えた後、上記本発明の第1で規定する直線性ジアミ
ン2当量を加え、下記の構造式
A fifth aspect of the present invention for producing the above polyamic acid copolymer is to add 2 equivalents of pyromellitic dianhydride and 1 equivalent of the flexible diamine specified in the first aspect of the present invention. 2 equivalents of the linear diamine specified in the first aspect of the present invention were added, and the following structural formula was added.

【0025】[0025]

【化16】 Embedded image

【0026】の中から選ばれるテトラカルボン酸二無水
物1当量加えることを特徴とするポリアミック酸共重合
体の製造方法を、
A method for producing a polyamic acid copolymer characterized by adding 1 equivalent of a tetracarboxylic dianhydride selected from the group consisting of:

【0027】本発明の第6は、上記第1発明のポリアミ
ック酸共重合体を脱水閉環してなるポリイミド共重合体
を、
A sixth aspect of the present invention is to provide a polyimide copolymer obtained by dehydrating and cyclizing the polyamic acid copolymer of the first aspect,

【0028】本発明の第7は、上記第2発明で得られた
ポリアミック酸共重合体を脱水閉環することを特徴とす
るポリイミド共重合体の製造方法を、
According to a seventh aspect of the present invention, there is provided a method for producing a polyimide copolymer, comprising dehydrating and cyclizing the polyamic acid copolymer obtained in the second aspect of the present invention.

【0029】本発明の第8は、上記第3発明で得られた
ポリアミック酸共重合体を脱水閉環することを特徴とす
るポリイミド共重合体の製造方法を、
An eighth aspect of the present invention is a method for producing a polyimide copolymer, comprising dehydrating and cyclizing the polyamic acid copolymer obtained in the third aspect of the present invention.

【0030】本発明の第9は、上記第4発明で得られた
ポリアミック酸共重合体を脱水閉環することを特徴とす
るポリイミド共重合体の製造方法を、
A ninth aspect of the present invention is a method for producing a polyimide copolymer, comprising dehydrating and cyclizing the polyamic acid copolymer obtained in the fourth aspect of the present invention.

【0031】本発明の第10は、上記第5発明で得られ
たポリアミック酸共重合体を脱水閉環することを特徴と
するポリイミド共重合体の製造方法を、
According to a tenth aspect of the present invention, there is provided a method for producing a polyimide copolymer, comprising dehydrating and cyclizing the polyamic acid copolymer obtained in the fifth aspect of the present invention.

【0032】本発明の第11は、上記第1発明のポリア
ミック酸共重合体を脱水閉環してなるポリイミドフイル
ムを、
An eleventh aspect of the present invention provides a polyimide film obtained by dehydration-closing the polyamic acid copolymer of the first aspect,

【0033】本発明の第12は、上記第2発明で得られ
るポリアミック酸共重合体を支持体上に流延塗布して脱
水閉環することを特徴とするポリイミドフィルムの製造
方法を、
A twelfth aspect of the present invention is a method for producing a polyimide film, comprising casting the polyamic acid copolymer obtained in the second aspect on a support and dehydrating and ring-closing the same.

【0034】本発明の第13は、上記第3発明で得られ
るポリアミック酸共重合体を支持体上に流延塗布して脱
水閉環することを特徴とするポリイミドフィルムの製造
方法を、
According to a thirteenth aspect of the present invention, there is provided a method for producing a polyimide film, comprising casting the polyamic acid copolymer obtained in the third aspect on a support and subjecting it to dehydration ring closure.

【0035】本発明の第14は、上記第4発明で得られ
るポリアミック酸共重合体を支持体上に流延塗布して脱
水閉環することを特徴とするポリイミドフィルムの製造
方法を、
A fourteenth aspect of the present invention is a method for producing a polyimide film, comprising casting the polyamic acid copolymer obtained in the fourth aspect on a support and dehydrating and ring-closing the polyimide film.

【0036】本発明の第15は、上記第5発明で得られ
るポリアミック酸共重合体を支持体上に流延塗布して脱
水閉環することを特徴とするポリイミドフィルムの製造
方法を、それぞれ内容とするものである。
A fifteenth aspect of the present invention relates to a method for producing a polyimide film, comprising casting the polyamic acid copolymer obtained in the fifth aspect on a support and dehydrating and ring-closing the polyimide film. Is what you do.

【0037】以下、本発明を詳細に説明する。本発明の
中で用いる直線性ジアミンとは、エーテル結合等の屈曲
基を含まず、2つの窒素原子を結ぶ直線とジアミンの主
鎖方向が一致するような構造を有するジアミン化合物を
指す。例えば、
Hereinafter, the present invention will be described in detail. The linear diamine used in the present invention refers to a diamine compound having a structure that does not include a bending group such as an ether bond and has a structure in which a main chain direction of a diamine matches a straight line connecting two nitrogen atoms. For example,

【0038】[0038]

【化17】 Embedded image

【0039】(ただし、XはF,Cl,Br,CH
CHO,CFを示す。)等のジアミンを例示するこ
とができ、これらは単独又は2種以上組み合わせて用い
られる。
(Where X is F, Cl, Br, CH 3 ,
CH 3 O and CF 3 are shown. And the like, and these can be used alone or in combination of two or more.

【0040】一方、屈曲性ジアミンとは、主鎖中に、エ
ーテル結合やカルボニル基等の屈曲基を含むような構造
を指し、例えば
On the other hand, a flexible diamine refers to a structure in which a main chain contains a bending group such as an ether bond or a carbonyl group.

【0041】[0041]

【化18】 Embedded image

【0042】等のジアミンを例示することができ、これ
らは単独又は2種以上組み合わせて用いられる。また、
屈曲性ジアミン残基(R)に長鎖のジアミンを用いれ
ば、より低い吸湿性を実現することができる。
And the like. These can be used alone or in combination of two or more. Also,
If a long-chain diamine is used for the flexible diamine residue (R 6 ), lower hygroscopicity can be realized.

【0043】本発明のポリアミック酸共重合体は、上記
構造単位の様な順序で各構成単位が規則的に並んでいる
ことが重要であり、これを実現するためには以下の様な
合成法を用いる。ポリアミック酸共重合体溶液は、酸無
水物とジアミン成分を実質等モル使用し有機極性溶媒中
で重合して得られる。
It is important that the constituent units of the polyamic acid copolymer of the present invention are regularly arranged in the same order as the above structural units. In order to realize this, the following synthesis method is used. Is used. The polyamic acid copolymer solution is obtained by polymerizing in an organic polar solvent using substantially equimolar amounts of an acid anhydride and a diamine component.

【0044】ここで該ポリアミック酸共重合体の生成反
応に使用される有機極性溶媒としては、例えば、ジメチ
ルスルホキシド、ジエチルスルホキシド等のスルホキシ
ド系溶媒、N,N−ジメチルホルムアミド、N,N−ジ
エチルホルムアミド等のホルムアミド系溶媒、N,N−
ジメチルアセトアミド、N,N−ジエチルアセトアミド
等のアセトアミド系溶媒、N−メチル−2−ピロリド
ン、N−ビニル−2−ピロリドン等のピロリドン系溶
媒、フェノール、o−、m−、またはp−クレゾール、
キシレノール、ハロゲン化フェノール、カテコール等の
フェノール系溶媒、あるいはヘキサメチルホスホルアミ
ド、γ−ブチロラクトン等を挙げることができ、これら
を単独または混合物として用いるのが望ましいが、更に
はキシレン、トルエンのような芳香族炭化水素の一部使
用も可能である。
The organic polar solvent used in the reaction for producing the polyamic acid copolymer includes, for example, sulfoxide solvents such as dimethyl sulfoxide and diethyl sulfoxide, N, N-dimethylformamide, N, N-diethylformamide N, N-
Acetamide solvents such as dimethylacetamide and N, N-diethylacetamide; pyrrolidone solvents such as N-methyl-2-pyrrolidone and N-vinyl-2-pyrrolidone; phenol, o-, m- or p-cresol;
Xylenol, halogenated phenols, phenolic solvents such as catechol, or hexamethylphosphoramide, γ-butyrolactone, and the like can be mentioned, and it is preferable to use these alone or as a mixture, and further, xylene, toluene, etc. Partial use of aromatic hydrocarbons is also possible.

【0045】具体的にポリアミック酸共重合体溶液の合
成法を示す。 合成法1 容器に、有機極性溶媒と直線性ジアミンの少なくとも
1種を2当量とり、冷却攪拌する。 下記3種から選ばれるテトラカルボン酸二無水物の少
なくとも1種の1当量を加え、好ましくは20分以上冷
却攪拌する。
A method for synthesizing a polyamic acid copolymer solution will be specifically described. Synthesis Method 1 At least one equivalent of an organic polar solvent and a linear diamine is placed in a vessel in an amount of 2 equivalents, and the mixture is stirred under cooling. One equivalent of at least one of tetracarboxylic dianhydrides selected from the following three is added, and the mixture is cooled and stirred for preferably 20 minutes or more.

【0046】[0046]

【化19】 Embedded image

【0047】 ピロメリット酸二無水物2当量を上記混合液に加え、
好ましくは20分以上冷却攪拌する。 屈曲性ジアミンの少なくとも1種の1当量を有機極性
溶媒に溶かし、徐々に冷却攪拌しながら加え、該ポリア
ミック酸共重合体溶液を得る。
Add 2 equivalents of pyromellitic dianhydride to the above mixture,
Preferably, the mixture is cooled and stirred for at least 20 minutes. One equivalent of at least one flexible diamine is dissolved in an organic polar solvent and gradually added with cooling and stirring to obtain the polyamic acid copolymer solution.

【0048】合成法2 容器に、有機極性溶媒と屈曲性ジアミンの少なくとも
1種を1当量とり、冷却攪拌する。 ピロメリット酸二無水物2当量を加え、好ましくは2
0分以上冷却攪拌する。 直線性ジアミンの少なくとも1種の2当量加え、好ま
しくは20分以上冷却攪拌する。 上記3種から選ばれるテトラカルボン酸二無水物を1
種もしくは2種以上の1当量を上記混合液に加え、該ポ
リアミック酸共重合体溶液を得ることができる。
Synthesis Method 2 At least one equivalent of an organic polar solvent and a flexible diamine is placed in a container in an amount of 1 equivalent, and cooled and stirred. Add 2 equivalents of pyromellitic dianhydride, preferably 2
Cool and stir for 0 minutes or more. Two equivalents of at least one linear diamine are added, and the mixture is cooled and stirred for preferably 20 minutes or more. The tetracarboxylic dianhydride selected from the above three is 1
One or more equivalents of one or more species are added to the above mixed solution to obtain the polyamic acid copolymer solution.

【0049】合成法3 容器に、有機極性溶媒と上記3種から選ばれるテトラ
カルボン酸二無水物の1種もしくは2種以上の1当量を
とり、冷却攪拌する。 直線性ジアミンの少なくとも1種を2当量加え、好ま
しくは20分以上冷却攪拌する。 ピロメリット酸二無水物2当量を上記混合液に加え、
好ましくは20分以上冷却攪拌する。 屈曲性ジアミンの少なくとも1種の1当量を有機極性
溶媒に溶かし、徐々に冷却攪拌しながら加え、該ポリア
ミック酸共重合体を得ることができる。
Synthesis Method 3 One or more equivalents of an organic polar solvent and one or more tetracarboxylic dianhydrides selected from the above three are placed in a vessel and cooled and stirred. Two equivalents of at least one linear diamine are added, and the mixture is cooled and stirred for preferably 20 minutes or more. Add 2 equivalents of pyromellitic dianhydride to the above mixture,
Preferably, the mixture is cooled and stirred for at least 20 minutes. One equivalent of at least one kind of flexible diamine is dissolved in an organic polar solvent, and the solution is gradually added with cooling and stirring to obtain the polyamic acid copolymer.

【0050】合成法4 容器に、有機極性溶媒とピロメリット酸二無水物2当
量をとり、冷却攪拌する。 屈曲性ジアミンの少なくとも1種を1当量加え、好ま
しくは20分以上冷却攪拌する。 直線性ジアミンの少なくとも1種の2当量加え、好ま
しくは20分以上冷却攪拌する。 上記3種から選ばれるテトラカルボン酸二無水物の少
なくとも1種の1当量を上記混合液に加え、該ポリアミ
ック酸共重合体溶液を得ることができる。上記の如くし
て得られたポリアミック酸共重合体は、各々前記の有機
極性溶媒中に5〜40重量%、好ましくは10〜30重
量%溶解されているのが取扱いの面からも望ましい。
Synthesis Method 4 An organic polar solvent and 2 equivalents of pyromellitic dianhydride are placed in a vessel, and the mixture is cooled and stirred. One equivalent of at least one flexible diamine is added, and the mixture is preferably cooled and stirred for at least 20 minutes. Two equivalents of at least one linear diamine are added, and the mixture is cooled and stirred for preferably 20 minutes or more. One equivalent of at least one of the tetracarboxylic dianhydrides selected from the above three is added to the above mixed solution to obtain the polyamic acid copolymer solution. The polyamic acid copolymer obtained as described above is preferably dissolved in the organic polar solvent in an amount of 5 to 40% by weight, preferably 10 to 30% by weight, from the viewpoint of handling.

【0051】この芳香族ポリアミック酸共重合体溶液か
ら下記式
From this aromatic polyamic acid copolymer solution, the following formula

【0052】[0052]

【化20】 Embedded image

【0053】(ただし、R〜Rは前記と同じ)で表
される反復構造単位を有する本発明のポリイミド共重合
体及びポリイミドフィルムを得るためには、熱的に脱水
する熱的方法、脱水剤を用いる化学的方法のいずれを用
いてもよいが、化学的方法によると生成するポリイミド
フィルムの伸びや引張強度等の機械特性がすぐれたもの
になるので好ましい。以下に、ポリイミドフィルムの作
成方法の一例について説明する。
(Where R 1 to R 6 are the same as those described above). In order to obtain the polyimide copolymer and the polyimide film of the present invention having a repeating structural unit represented by the following formula, Any of the chemical methods using a dehydrating agent may be used, but the chemical method is preferred because the resulting polyimide film has excellent mechanical properties such as elongation and tensile strength. Hereinafter, an example of a method for producing a polyimide film will be described.

【0054】上記ポリアミック酸重合体またはその溶液
に化学量論以上の脱水剤と触媒量の第3級アミンを加え
た溶液をドラム或いはエンドレスベルト上に流延又は塗
布して膜状とし、その膜を150℃以下の温度で約5〜
90分間乾燥し、自己支持性のポリアミック酸の膜を得
る。ついで、これを支持体より引き剥し端部を固定す
る。その後約100〜500℃まで徐々に加熱すること
によりイミド化し、冷却後ドラム又はエンドレスベルト
より取り外し本発明のポリイミドフィルムを得る。ここ
で言う脱水剤としては、例えば無水酢酸等の脂肪族酸無
水物、芳香族酸無水物などが挙げられる。また触媒とし
ては、例えばトリエチルアミンなどの脂肪族第3級アミ
ン類、ジメチルアニリン等の芳香族第3級アミン類、ピ
リジン、ピコリン、イソキノリン等の複素環式第3級ア
ミン類などが挙げられる。
A solution obtained by adding a dehydrating agent having a stoichiometric amount or more and a catalytic amount of a tertiary amine to the polyamic acid polymer or a solution thereof is cast or coated on a drum or an endless belt to form a film. At a temperature of 150 ° C. or less for about 5
After drying for 90 minutes, a self-supporting polyamic acid film is obtained. Next, this is peeled off from the support and the end is fixed. Thereafter, the polyimide film is gradually heated to about 100 to 500 ° C. to be imidized, and after cooling, is removed from a drum or an endless belt to obtain a polyimide film of the present invention. Examples of the dehydrating agent mentioned here include aliphatic acid anhydrides such as acetic anhydride, aromatic acid anhydrides, and the like. Examples of the catalyst include aliphatic tertiary amines such as triethylamine, aromatic tertiary amines such as dimethylaniline, and heterocyclic tertiary amines such as pyridine, picoline and isoquinoline.

【0055】[0055]

【実施例】以下、実施例により本発明を具体的に説明す
るが、本発明はこれら実施例のみに限定されるものでは
ない。実施例中、ODAは4,4′−ジアミノジフェニ
ルエーテル、BAPBは4,4′−ビス(アミノフェノ
キシフェニル)ビフェニル、BAPPは4,4′−ビス
(アミノフェノキシフェニル)プロパン、p−PDAは
パラフェニレンジアミン、TPE−Qは1,4−ビス
(4−アミノフェノキシ)ベンゼン、PMDAは無水ピ
ロメリット酸、BTDAはベンゾフェノンテトラカルボ
ン酸二無水物、BPDAはビフェニルテトラカルボン酸
二無水物、DMFはジメチルホルムアミドを表す。
EXAMPLES The present invention will be described below in more detail with reference to examples, but the present invention is not limited to these examples. In the examples, ODA is 4,4'-diaminodiphenyl ether, BAPB is 4,4'-bis (aminophenoxyphenyl) biphenyl, BAPP is 4,4'-bis (aminophenoxyphenyl) propane, and p-PDA is paraphenylene. Diamine, TPE-Q is 1,4-bis (4-aminophenoxy) benzene, PMDA is pyromellitic anhydride, BTDA is benzophenonetetracarboxylic dianhydride, BPDA is biphenyltetracarboxylic dianhydride, DMF is dimethylformamide Represents

【0056】実施例1 2リットルのセパラブルフラスコにDMFとp−PDA
を2当量とり、ジアミノ化合物が完全に溶解するまで室
温でよく混合しその後、氷で冷却しながら攪拌した。次
に、BTDA1当量を一気に加え、40分冷却攪拌し
た。そして、PMDA2当量を一気に加え、40分冷却
攪拌した。ODA1当量をDMFに溶かし、徐々に加
え、このあと1時間冷却攪拌し、ポリアミック酸のDM
F溶液を得た。なおDMFの使用量は、ジアミノ化合物
および芳香族テトラカルボン酸化合物のモノマー仕込濃
度が18重量%となるようにした。ポリアミック酸溶液
をガラス板上に流延塗布し、約100℃に約30分間乾
燥後、ポリアミック酸塗膜をガラス板より剥し、その塗
膜を支持枠に固定し、その後約100℃で約30分間、
約200℃で約60分間、約300℃で約60分間加熱
し、脱水閉環乾燥し、約25ミクロンのポリイミドフィ
ルムを得た。得られたポリイミドフィルムの物性を表1
に示した。
Example 1 DMF and p-PDA were placed in a 2-liter separable flask.
Was taken, and mixed well at room temperature until the diamino compound was completely dissolved, and then stirred while cooling with ice. Next, 1 equivalent of BTDA was added at once, and the mixture was cooled and stirred for 40 minutes. Then, 2 equivalents of PMDA were added at once, and the mixture was cooled and stirred for 40 minutes. One equivalent of ODA was dissolved in DMF, and the solution was gradually added, followed by cooling and stirring for 1 hour.
An F solution was obtained. The amount of DMF used was such that the concentration of charged monomers of the diamino compound and the aromatic tetracarboxylic acid compound was 18% by weight. The polyamic acid solution was applied on a glass plate by casting and dried at about 100 ° C. for about 30 minutes. Thereafter, the polyamic acid coating film was peeled off from the glass plate, and the coating film was fixed on a support frame. Minutes,
Heating was performed at about 200 ° C. for about 60 minutes and at about 300 ° C. for about 60 minutes, followed by dehydration ring-closing and drying to obtain a polyimide film of about 25 μm. Table 1 shows the physical properties of the obtained polyimide film.
It was shown to.

【0057】実施例2 2リットルのセパラブルフラスコにDMFとp−PDA
を2当量とり、ジアミノ化合物が完全に溶解するまで室
温でよく混合しその後、氷で冷却しながら攪拌した。次
に、BTDA1当量を加え、40分冷却攪拌した。そし
て、PMDA2当量を一気に加え、40分冷却攪拌し
た。TPE−Q1当量をDMFに溶かし、徐々に加え、
このあと1時間冷却攪拌し、ポリアミック酸のDMF溶
液を得た。実施例1と同様の方法で焼成し、ポリイミド
フィルムを得た。得られたポリイミドフィルムの物性を
表1に示した。
Example 2 DMF and p-PDA were placed in a 2-liter separable flask.
Was taken, and mixed well at room temperature until the diamino compound was completely dissolved, and then stirred while cooling with ice. Next, 1 equivalent of BTDA was added, and the mixture was cooled and stirred for 40 minutes. Then, 2 equivalents of PMDA were added at once, and the mixture was cooled and stirred for 40 minutes. Dissolve 1 equivalent of TPE-Q in DMF and slowly add
Thereafter, the mixture was cooled and stirred for 1 hour to obtain a polyamic acid DMF solution. It was fired in the same manner as in Example 1 to obtain a polyimide film. Table 1 shows the physical properties of the obtained polyimide film.

【0058】実施例3 2リットルのセパラブルフラスコにDMFとp−PDA
を2当量とり、ジアミノ化合物が完全に溶解するまで室
温でよく混合しその後、氷で冷却しながら攪拌した。次
に、BTDA1当量を加え、40分冷却攪拌した。そし
て、PMDA2当量を一気に加え、40分冷却攪拌し
た。BAPB1当量をDMFに溶かし、徐々に加え、こ
のあと1時間冷却攪拌し、ポリアミック酸のDMF溶液
を得た。実施例1と同様の方法で焼成し、ポリイミドフ
ィルムを得た。得られたポリイミドフィルムの物性を表
1に示した。
Example 3 DMF and p-PDA were placed in a 2-liter separable flask.
Was taken, and mixed well at room temperature until the diamino compound was completely dissolved, and then stirred while cooling with ice. Next, 1 equivalent of BTDA was added, and the mixture was cooled and stirred for 40 minutes. Then, 2 equivalents of PMDA were added at once, and the mixture was cooled and stirred for 40 minutes. One equivalent of BAPB was dissolved in DMF, added gradually, and then cooled and stirred for 1 hour to obtain a polyamic acid DMF solution. It was fired in the same manner as in Example 1 to obtain a polyimide film. Table 1 shows the physical properties of the obtained polyimide film.

【0059】実施例4 2リットルのセパラブルフラスコにDMFとp−PDA
を2当量とり、ジアミノ化合物が完全に溶解するまで室
温でよく混合しその後、氷で冷却しながら攪拌した。次
に、BTDA1当量を加え、40分冷却攪拌した。そし
て、PMDA2当量を一気に加え、40分冷却攪拌し
た。BAPP1当量をDMFに溶かし、徐々に加え、こ
のあと1時間冷却攪拌し、ポリアミック酸のDMF溶液
を得た。実施例1と同様の方法で焼成し、ポリイミドフ
ィルムを得た。得られたポリイミドフィルムの物性を表
1に示した。
Example 4 DMF and p-PDA were placed in a 2-liter separable flask.
Was taken, and mixed well at room temperature until the diamino compound was completely dissolved, and then stirred while cooling with ice. Next, 1 equivalent of BTDA was added, and the mixture was cooled and stirred for 40 minutes. Then, 2 equivalents of PMDA were added at once, and the mixture was cooled and stirred for 40 minutes. One equivalent of BAPP was dissolved in DMF, added gradually, and then cooled and stirred for 1 hour to obtain a DMF solution of polyamic acid. It was fired in the same manner as in Example 1 to obtain a polyimide film. Table 1 shows the physical properties of the obtained polyimide film.

【0060】実施例5 2リットルのセパラブルフラスコにDMFとp−PDA
を2当量とり、ジアミノ化合物が完全に溶解するまで室
温でよく混合しその後、氷で冷却しながら攪拌した。次
に、BPDA1当量を加え、40分冷却攪拌した。そし
て、PMDA2当量を一気に加え、40分冷却攪拌し
た。BAPB1当量をDMFに溶かし、徐々に加え、こ
のあと1時間冷却攪拌し、ポリアミック酸のDMF溶液
を得た。実施例1と同様の方法で焼成し、ポリイミドフ
ィルムを得た。得られたポリイミドフィルムの物性を表
1に示した。
Example 5 DMF and p-PDA were placed in a 2-liter separable flask.
Was taken, and mixed well at room temperature until the diamino compound was completely dissolved, and then stirred while cooling with ice. Next, 1 equivalent of BPDA was added, and the mixture was cooled and stirred for 40 minutes. Then, 2 equivalents of PMDA were added at once, and the mixture was cooled and stirred for 40 minutes. One equivalent of BAPB was dissolved in DMF, added gradually, and then cooled and stirred for 1 hour to obtain a polyamic acid DMF solution. It was fired in the same manner as in Example 1 to obtain a polyimide film. Table 1 shows the physical properties of the obtained polyimide film.

【0061】比較例1 実施例1と同様の方法により、PMDAとODAを等モ
ルずつ用いて、ポリイミドフィルムを得た。得られたポ
リイミドフィルムの物性を表1に示した。
Comparative Example 1 In the same manner as in Example 1, a polyimide film was obtained using PMDA and ODA in equimolar amounts. Table 1 shows the physical properties of the obtained polyimide film.

【0062】比較例2 2リットルのセパラブルフラスコにDMF、p−PDA
を2当量と、ODA1当量をとり、ジアミノ化合物が完
全に溶解するまで室温でよく混合しその後、氷で冷却し
ながら攪拌した。次に、PMDA2当量とBTDA1当
量を徐々に加え、このあと1時間冷却攪拌し、ポリアミ
ック酸のDMF溶液を得た。実施例1と同様の方法で焼
成し、ポリイミドフィルムを得た。得られたポリイミド
フィルムの物性を表1に示した。
Comparative Example 2 DMF and p-PDA were placed in a 2-liter separable flask.
And 2 equivalents of ODA and 1 equivalent of ODA were mixed well at room temperature until the diamino compound was completely dissolved, and then stirred while cooling with ice. Next, 2 equivalents of PMDA and 1 equivalent of BTDA were gradually added, followed by cooling and stirring for 1 hour to obtain a polyamic acid DMF solution. It was fired in the same manner as in Example 1 to obtain a polyimide film. Table 1 shows the physical properties of the obtained polyimide film.

【0063】[0063]

【表1】 [Table 1]

【0064】[0064]

【発明の効果】叙上の通り、本発明によれば、耐熱性に
優れ、高弾性、低熱膨張性及び低吸湿性のポリイミドフ
ィルムが得られる。
As described above, according to the present invention, a polyimide film having excellent heat resistance, high elasticity, low thermal expansion and low moisture absorption can be obtained.

フロントページの続き (56)参考文献 特開 平5−51453(JP,A) 特開 平5−25273(JP,A) 特開 平4−335028(JP,A) 特開 平4−320422(JP,A) 特開 昭64−20238(JP,A) 特開 昭64−16832(JP,A) 特開 平1−282218(JP,A) 特開 昭63−254131(JP,A) 特開 昭60−210894(JP,A) 特開 昭63−314242(JP,A) 特開 昭63−166287(JP,A) (58)調査した分野(Int.Cl.6,DB名) C08G 73/00 - 73/26Continuation of front page (56) References JP-A-5-51453 (JP, A) JP-A-5-25273 (JP, A) JP-A-4-335028 (JP, A) JP-A-4-320422 (JP) JP-A-64-20238 (JP, A) JP-A-64-16832 (JP, A) JP-A-1-282218 (JP, A) JP-A-63-254131 (JP, A) 60-210894 (JP, A) JP-A-63-314242 (JP, A) JP-A-63-166287 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) C08G 73/00 -73/26

Claims (15)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 下記式 【化1】 (ただし、R、Rは下記の基 【化2】 (ただし、XはF,Cl,Br,CH,CHO,C
を示す。)の中から選ばれる、エーテル結合等の屈
曲基を含まず、2つの窒素原子を結ぶ直線とジアミンの
主鎖方向が一致する構造を有する直線性ジアミン(以
下、直線性ジアミンと記す)残基、Rは下記の基 【化3】 の中から選ばれる、主鎖中にエーテル結合やカルボニル
基等の屈曲基を含む構造を有する屈曲性ジアミン(以
下、屈曲性ジアミンと記す)残基、R、Rはピロメ
リット酸二無水物残基を示し、Rは下記の基 【化4】 の中から選ばれたものである。)で表されるポリアミッ
ク酸共重合体。
[Claim 1] The following formula: (However, R 2 and R 4 represent the following groups: (Where X is F, Cl, Br, CH 3 , CH 3 O, C
Shows the F 3. A) a linear diamine (hereinafter, referred to as a linear diamine) residue having a structure in which the main chain direction of the diamine does not include a straight line connecting two nitrogen atoms and does not include a bending group such as an ether bond selected from the above. , R 6 are the following groups: And a flexible diamine (hereinafter, referred to as a flexible diamine) residue having a structure containing a bending group such as an ether bond or a carbonyl group in a main chain thereof, and R 1 and R 5 are pyromellitic dianhydrides. R 3 represents the following group: It was chosen from among A) a polyamic acid copolymer represented by
【請求項2】 請求項1で規定する直線性ジアミン2当
量に、下記の構造式 【化5】 の中から選ばれるテトラカルボン酸二無水物1当量を加
え、次いで、ピロメリット酸二無水物2当量を加えた
後、請求項1で規定する屈曲性ジアミン1当量加えるこ
とを特徴とするポリアミック酸共重合体の製造方法。
2. The equivalent of the linear diamine defined in claim 1 to 2 equivalents of the following structural formula: A polyamic acid characterized by adding 1 equivalent of a tetracarboxylic dianhydride selected from the following, then adding 2 equivalents of pyromellitic dianhydride, and then adding 1 equivalent of a flexible diamine specified in claim 1. A method for producing a copolymer.
【請求項3】 請求項1で規定する屈曲性ジアミン1当
量に、ピロメリット酸二無水物2当量を加えた後、請求
項1で規定する直線性ジアミン2当量を加え、下記の構
造式 【化6】 の中から選ばれるテトラカルボン酸二無水物1当量を加
えることを特徴とするポリアミック酸共重合体の製造方
法。
3. After adding 2 equivalents of pyromellitic dianhydride to 1 equivalent of the flexible diamine specified in claim 1, 2 equivalents of the linear diamine specified in claim 1 are added, and the following structural formula: Formula 6 A method for producing a polyamic acid copolymer, comprising adding 1 equivalent of a tetracarboxylic dianhydride selected from the group consisting of:
【請求項4】 下記の構造式 【化7】 の中から選ばれるテトラカルボン酸二無水物1当量に請
求項1で規定する直線性ジアミン2当量を加え、次い
で、ピロメリット酸二無水物2当量を加えた後、請求項
1で規定する屈曲性ジアミン1当量加えることを特徴と
するポリアミック酸共重合体の製造方法。
4. The following structural formula: After adding 2 equivalents of the linear diamine specified in claim 1 to 1 equivalent of a tetracarboxylic dianhydride selected from the following, and then adding 2 equivalents of pyromellitic dianhydride, the bending defined in claim 1 A method for producing a polyamic acid copolymer, comprising adding 1 equivalent of a reactive diamine.
【請求項5】 ピロメリット酸二無水物2当量に請求項
1で規定する屈曲性ジアミン1当量を加えた後、請求項
1で規定する直線性ジアミン2当量を加え、下記の構造
式 【化8】 の中から選ばれるテトラカルボン酸二無水物1当量加え
ることを特徴とするポリアミック酸共重合体の製造方
法。
5. An addition of 2 equivalents of pyromellitic dianhydride to 1 equivalent of a flexible diamine as defined in claim 1 and 2 equivalents of a linear diamine as defined in claim 1 to give the following structural formula: 8] A method for producing a polyamic acid copolymer, comprising adding 1 equivalent of a tetracarboxylic dianhydride selected from the group consisting of:
【請求項6】 請求項1記載のポリアミック酸共重合体
を脱水閉環してなるポリイミド共重合体。
6. A polyimide copolymer obtained by subjecting the polyamic acid copolymer according to claim 1 to dehydration ring closure.
【請求項7】 請求項2記載の製造方法において得られ
るポリアミック酸共重合体を脱水閉環することを特徴と
するポリイミド共重合体の製造方法。
7. A method for producing a polyimide copolymer, wherein the polyamic acid copolymer obtained in the production method according to claim 2 is subjected to dehydration ring closure.
【請求項8】 請求項3記載の製造方法において得られ
るポリアミック酸共重合体を脱水閉環することを特徴と
するポリイミド共重合体の製造方法。
8. A method for producing a polyimide copolymer, comprising subjecting the polyamic acid copolymer obtained in the production method according to claim 3 to dehydration ring closure.
【請求項9】 請求項4記載の製造方法において得られ
るポリアミック酸共重合体を脱水閉環することを特徴と
するポリイミド共重合体の製造方法。
9. A method for producing a polyimide copolymer, wherein the polyamic acid copolymer obtained in the production method according to claim 4 is subjected to dehydration ring closure.
【請求項10】 請求項5記載の製造方法において得ら
れるポリアミック酸共重合体を脱水閉環することを特徴
とするポリイミド共重合体の製造方法。
10. A method for producing a polyimide copolymer, comprising subjecting the polyamic acid copolymer obtained in the method according to claim 5 to dehydration and ring closure.
【請求項11】 請求項1記載のポリアミック酸共重合
体を脱水閉環してなるポリイミドフィルム。
11. A polyimide film obtained by dehydrating and ring-closing the polyamic acid copolymer according to claim 1.
【請求項12】 請求項2記載の製造方法において得ら
れるポリアミック酸共重合体を支持体上に流延塗布して
脱水閉環することを特徴とするポリイミドフィルムの製
造方法。
12. A method for producing a polyimide film, comprising casting the polyamic acid copolymer obtained in the production method according to claim 2 on a support and dehydrating and ring-closing the polyimide film.
【請求項13】 請求項3記載の製造方法において得ら
れるポリアミック酸共重合体を支持体上に流延塗布して
脱水閉環することを特徴とするポリイミドフィルムの製
造方法。
13. A method for producing a polyimide film, comprising casting the polyamic acid copolymer obtained in the production method according to claim 3 onto a support and subjecting it to dehydration ring closure.
【請求項14】 請求項4記載の製造方法において得ら
れるポリアミック酸共重合体を支持体上に流延塗布して
脱水閉環することを特徴とするポリイミドフィルムの製
造方法。
14. A method for producing a polyimide film, comprising casting the polyamic acid copolymer obtained in the production method according to claim 4 onto a support and dehydrating and ring-closing the polyimide film.
【請求項15】 請求項5記載の製造方法において得ら
れるポリアミック酸共重合体を支持体上に流延塗布して
脱水閉環することを特徴とするポリイミドフィルムの製
造方法。
15. A method for producing a polyimide film, comprising casting the polyamic acid copolymer obtained in the production method according to claim 5 on a support and dehydrating and ring-closing.
JP3244493A 1991-08-28 1991-08-28 Polyamic acid copolymer, polyimide copolymer comprising the same, polyimide film, and methods for producing them Expired - Lifetime JP2831867B2 (en)

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CN101098909B (en) * 2005-01-18 2010-07-28 株式会社钟化 Novel polyimide film with improved adhesiveness
JP5162379B2 (en) * 2008-08-29 2013-03-13 株式会社有沢製作所 Polyamic acid and non-thermoplastic polyimide resin
JP2010202729A (en) * 2009-03-02 2010-09-16 Hitachi Chemical Dupont Microsystems Ltd Polyimide precursor resin composition for flexible device substrates and method for producing flexible device using the same, and flexible device
JP5632426B2 (en) * 2012-07-31 2014-11-26 株式会社有沢製作所 Polyamic acid and non-thermoplastic polyimide resin

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JPS60210894A (en) * 1984-04-04 1985-10-23 日立化成工業株式会社 Method of producing substrate for flexible printed circuit board
JPS63166287A (en) * 1986-12-27 1988-07-09 住友ベークライト株式会社 Manufacture of flexible printed circuit substrate
JPS63254131A (en) * 1987-04-10 1988-10-20 Mitsubishi Electric Corp Production of aromatic polyimide
JP2809396B2 (en) * 1987-06-17 1998-10-08 鐘淵化学工業株式会社 Method for producing polyimide copolymer film
JPS6416832A (en) * 1987-07-10 1989-01-20 Kanegafuchi Chemical Ind Production of polyamic acid copolymer
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