JPH0648862Y2 - Ｌｓｉの実装構造 - Google Patents

Ｌｓｉの実装構造

Info

Publication number
JPH0648862Y2
JPH0648862Y2 JP1989085933U JP8593389U JPH0648862Y2 JP H0648862 Y2 JPH0648862 Y2 JP H0648862Y2 JP 1989085933 U JP1989085933 U JP 1989085933U JP 8593389 U JP8593389 U JP 8593389U JP H0648862 Y2 JPH0648862 Y2 JP H0648862Y2
Authority
JP
Japan
Prior art keywords
lsi
metal
stud
hole
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989085933U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0325246U (enrdf_load_stackoverflow
Inventor
泰一 武田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1989085933U priority Critical patent/JPH0648862Y2/ja
Publication of JPH0325246U publication Critical patent/JPH0325246U/ja
Application granted granted Critical
Publication of JPH0648862Y2 publication Critical patent/JPH0648862Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989085933U 1989-07-20 1989-07-20 Ｌｓｉの実装構造 Expired - Lifetime JPH0648862Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989085933U JPH0648862Y2 (ja) 1989-07-20 1989-07-20 Ｌｓｉの実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989085933U JPH0648862Y2 (ja) 1989-07-20 1989-07-20 Ｌｓｉの実装構造

Publications (2)

Publication Number Publication Date
JPH0325246U JPH0325246U (enrdf_load_stackoverflow) 1991-03-15
JPH0648862Y2 true JPH0648862Y2 (ja) 1994-12-12

Family

ID=31635307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989085933U Expired - Lifetime JPH0648862Y2 (ja) 1989-07-20 1989-07-20 Ｌｓｉの実装構造

Country Status (1)

Country Link
JP (1) JPH0648862Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0325246U (enrdf_load_stackoverflow) 1991-03-15

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